JP5173175B2 - 蒸着装置 - Google Patents

蒸着装置 Download PDF

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Publication number
JP5173175B2
JP5173175B2 JP2006269085A JP2006269085A JP5173175B2 JP 5173175 B2 JP5173175 B2 JP 5173175B2 JP 2006269085 A JP2006269085 A JP 2006269085A JP 2006269085 A JP2006269085 A JP 2006269085A JP 5173175 B2 JP5173175 B2 JP 5173175B2
Authority
JP
Japan
Prior art keywords
vapor
vapor deposition
film forming
chamber
forming material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006269085A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008088489A5 (https=
JP2008088489A (ja
Inventor
伸吾 渡辺
裕司 小野
孝祐 長谷川
正浩 小川
晃一 本田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2006269085A priority Critical patent/JP5173175B2/ja
Priority to TW096136640A priority patent/TW200835796A/zh
Priority to PCT/JP2007/069187 priority patent/WO2008041671A1/ja
Priority to DE112007002217T priority patent/DE112007002217T5/de
Priority to KR1020097005687A priority patent/KR101075130B1/ko
Priority to US12/441,934 priority patent/US20100071623A1/en
Publication of JP2008088489A publication Critical patent/JP2008088489A/ja
Publication of JP2008088489A5 publication Critical patent/JP2008088489A5/ja
Application granted granted Critical
Publication of JP5173175B2 publication Critical patent/JP5173175B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K41/00—Spindle sealings
    • F16K41/10—Spindle sealings with diaphragm, e.g. shaped as bellows or tube
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2006269085A 2006-09-29 2006-09-29 蒸着装置 Expired - Fee Related JP5173175B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2006269085A JP5173175B2 (ja) 2006-09-29 2006-09-29 蒸着装置
TW096136640A TW200835796A (en) 2006-09-29 2007-09-29 Vapor-deposition apparatus
DE112007002217T DE112007002217T5 (de) 2006-09-29 2007-10-01 Bedampfungsvorrichtung
KR1020097005687A KR101075130B1 (ko) 2006-09-29 2007-10-01 증착 장치
PCT/JP2007/069187 WO2008041671A1 (fr) 2006-09-29 2007-10-01 Appareil de dépôt par évaporation
US12/441,934 US20100071623A1 (en) 2006-09-29 2007-10-01 Evaporating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006269085A JP5173175B2 (ja) 2006-09-29 2006-09-29 蒸着装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011236147A Division JP5511767B2 (ja) 2011-10-27 2011-10-27 蒸着装置

Publications (3)

Publication Number Publication Date
JP2008088489A JP2008088489A (ja) 2008-04-17
JP2008088489A5 JP2008088489A5 (https=) 2011-12-08
JP5173175B2 true JP5173175B2 (ja) 2013-03-27

Family

ID=39268526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006269085A Expired - Fee Related JP5173175B2 (ja) 2006-09-29 2006-09-29 蒸着装置

Country Status (6)

Country Link
US (1) US20100071623A1 (https=)
JP (1) JP5173175B2 (https=)
KR (1) KR101075130B1 (https=)
DE (1) DE112007002217T5 (https=)
TW (1) TW200835796A (https=)
WO (1) WO2008041671A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5020650B2 (ja) * 2007-02-01 2012-09-05 東京エレクトロン株式会社 蒸着装置、蒸着方法および蒸着装置の製造方法
JP4847496B2 (ja) * 2008-07-29 2011-12-28 東京エレクトロン株式会社 蒸着源ユニット、蒸着方法、蒸着源ユニットの制御装置および成膜装置
EP2168644B1 (en) * 2008-09-29 2014-11-05 Applied Materials, Inc. Evaporator for organic materials and method for evaporating organic materials
DE112009002374T5 (de) * 2008-09-30 2012-11-29 Tokyo Electron Ltd. Abscheidevorrichtung, Abscheideverfahren sowie Speichermedium mit hierin gespeichertem Programm
DE102010041380A1 (de) 2009-09-25 2011-04-28 Von Ardenne Anlagentechnik Gmbh Verdampfereinrichtung für eine Beschichtungsanlage
JP5452178B2 (ja) * 2009-11-12 2014-03-26 株式会社日立ハイテクノロジーズ 真空蒸着装置、真空蒸着方法、および、有機ｅｌ表示装置の製造方法
JP5473675B2 (ja) * 2010-03-01 2014-04-16 株式会社アルバック 薄膜形成装置
JP2014095131A (ja) * 2012-11-09 2014-05-22 Tokyo Electron Ltd 成膜装置
US20160281212A1 (en) 2015-03-24 2016-09-29 Siva Power, Inc. Thermal management of evaporation sources
US10593967B2 (en) * 2016-06-30 2020-03-17 Honeywell International Inc. Modulated thermal conductance thermal enclosure
KR102609612B1 (ko) * 2018-07-30 2023-12-05 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3671484D1 (de) * 1985-08-01 1990-06-28 American Cyanamid Co Sprudelzylindervorrichtung.
JP3734239B2 (ja) 1999-04-02 2006-01-11 キヤノン株式会社 有機膜真空蒸着用マスク再生方法及び装置
JP2002322556A (ja) 2001-02-21 2002-11-08 Semiconductor Energy Lab Co Ltd 成膜方法及び成膜装置
JP3705237B2 (ja) * 2001-09-05 2005-10-12 ソニー株式会社 有機電界発光素子を用いた表示装置の製造システムおよび製造方法
JP2004059992A (ja) * 2002-07-29 2004-02-26 Sony Corp 有機薄膜形成装置
JP4013859B2 (ja) * 2003-07-17 2007-11-28 富士電機ホールディングス株式会社 有機薄膜の製造装置
JP2005203248A (ja) * 2004-01-16 2005-07-28 Sony Corp 蒸着方法及び蒸着装置
US7364772B2 (en) 2004-03-22 2008-04-29 Eastman Kodak Company Method for coating an organic layer onto a substrate in a vacuum chamber
JP2006104497A (ja) * 2004-10-01 2006-04-20 Hitachi Zosen Corp 蒸着装置
JP4535908B2 (ja) * 2005-03-14 2010-09-01 日立造船株式会社 蒸着装置

Also Published As

Publication number Publication date
US20100071623A1 (en) 2010-03-25
TW200835796A (en) 2008-09-01
DE112007002217T5 (de) 2009-09-10
KR20090045356A (ko) 2009-05-07
JP2008088489A (ja) 2008-04-17
WO2008041671A1 (fr) 2008-04-10
KR101075130B1 (ko) 2011-10-19

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