TW200833596A - Conveyance tool and conveyance method for substrate assembling device - Google Patents
Conveyance tool and conveyance method for substrate assembling deviceInfo
- Publication number
- TW200833596A TW200833596A TW096141621A TW96141621A TW200833596A TW 200833596 A TW200833596 A TW 200833596A TW 096141621 A TW096141621 A TW 096141621A TW 96141621 A TW96141621 A TW 96141621A TW 200833596 A TW200833596 A TW 200833596A
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber unit
- conveyance
- tool
- assembling device
- upper chamber
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/02—Assembly jigs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Conveying And Assembling Of Building Elements In Situ (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Automatic Assembly (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006304685A JP4961957B2 (ja) | 2006-11-10 | 2006-11-10 | 基板組立装置の搬送方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200833596A true TW200833596A (en) | 2008-08-16 |
TWI333932B TWI333932B (zh) | 2010-12-01 |
Family
ID=39404810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096141621A TW200833596A (en) | 2006-11-10 | 2007-11-05 | Conveyance tool and conveyance method for substrate assembling device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4961957B2 (zh) |
KR (1) | KR100894944B1 (zh) |
CN (1) | CN101178500B (zh) |
TW (1) | TW200833596A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5186501B2 (ja) * | 2007-08-28 | 2013-04-17 | 株式会社アルバック | ステージ装置 |
KR101490451B1 (ko) * | 2008-07-29 | 2015-02-09 | 주성엔지니어링(주) | 기판처리장치용 지그 및 이를 이용한 유지보수 방법 |
JP5386238B2 (ja) * | 2009-06-04 | 2014-01-15 | 株式会社日立ハイテクノロジーズ | パネル基板搬送装置および表示パネルモジュール組立装置 |
JP5419581B2 (ja) * | 2009-07-31 | 2014-02-19 | 東京エレクトロン株式会社 | 搬送機構の組み立て方法および搬送室 |
KR102500323B1 (ko) * | 2021-10-27 | 2023-02-16 | 주식회사 이에스엘 | 진공롤러유닛을 이용한 디스플레이 패널용 글라스 이송장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE373811B (zh) * | 1972-05-19 | 1975-02-17 | Volvo Ab | |
JPH0355190A (ja) * | 1989-07-20 | 1991-03-08 | Mitsubishi Electric Corp | 産業ロボツト用把持装置 |
JPH0464508A (ja) * | 1990-07-03 | 1992-02-28 | Honda Motor Co Ltd | 自動二輪車の吊り下げ搬送方法および吊り下げ搬送装置 |
JP4222717B2 (ja) * | 2000-11-27 | 2009-02-12 | 株式会社小松製作所 | 大型建設機械の出荷方法とその牽引式搬送治具 |
JP4099628B2 (ja) * | 2001-10-29 | 2008-06-11 | 株式会社安川電機 | 産業用ロボット |
JP3906753B2 (ja) * | 2002-07-01 | 2007-04-18 | 株式会社日立プラントテクノロジー | 基板組立て装置 |
JP3694691B2 (ja) | 2003-01-29 | 2005-09-14 | 株式会社 日立インダストリイズ | 大型基板の組立装置及び組立方法 |
CN100361010C (zh) * | 2005-01-28 | 2008-01-09 | 广辉电子股份有限公司 | 基板组装方法及其装置 |
JP4078487B2 (ja) * | 2005-05-25 | 2008-04-23 | 株式会社日立プラントテクノロジー | 基板組立装置及び方法 |
-
2006
- 2006-11-10 JP JP2006304685A patent/JP4961957B2/ja not_active Expired - Fee Related
-
2007
- 2007-11-05 TW TW096141621A patent/TW200833596A/zh not_active IP Right Cessation
- 2007-11-07 CN CN2007101698133A patent/CN101178500B/zh not_active Expired - Fee Related
- 2007-11-09 KR KR1020070114153A patent/KR100894944B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2008120500A (ja) | 2008-05-29 |
JP4961957B2 (ja) | 2012-06-27 |
CN101178500B (zh) | 2011-01-19 |
CN101178500A (zh) | 2008-05-14 |
KR100894944B1 (ko) | 2009-04-27 |
TWI333932B (zh) | 2010-12-01 |
KR20080042738A (ko) | 2008-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |