TW200832504A - Flexible substrate with electronic devices and traces - Google Patents

Flexible substrate with electronic devices and traces Download PDF

Info

Publication number
TW200832504A
TW200832504A TW096136915A TW96136915A TW200832504A TW 200832504 A TW200832504 A TW 200832504A TW 096136915 A TW096136915 A TW 096136915A TW 96136915 A TW96136915 A TW 96136915A TW 200832504 A TW200832504 A TW 200832504A
Authority
TW
Taiwan
Prior art keywords
substrate
electronic device
forming
particulate material
layer
Prior art date
Application number
TW096136915A
Other languages
English (en)
Chinese (zh)
Inventor
Timothy J Tredwell
Roger S Kerr
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of TW200832504A publication Critical patent/TW200832504A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Thin Film Transistor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW096136915A 2006-10-03 2007-10-02 Flexible substrate with electronic devices and traces TW200832504A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/538,173 US7977170B2 (en) 2006-10-03 2006-10-03 Flexible substrate with electronic devices and traces

Publications (1)

Publication Number Publication Date
TW200832504A true TW200832504A (en) 2008-08-01

Family

ID=39268951

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096136915A TW200832504A (en) 2006-10-03 2007-10-02 Flexible substrate with electronic devices and traces

Country Status (5)

Country Link
US (3) US7977170B2 (https=)
EP (1) EP2070124A2 (https=)
JP (1) JP2010506400A (https=)
TW (1) TW200832504A (https=)
WO (1) WO2008042110A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387138B (zh) * 2009-07-10 2013-02-21 Ind Tech Res Inst 磁性發光元件、磁性發光裝置以及氮化物半導體模板
TWI393928B (zh) * 2008-11-19 2013-04-21 Ind Tech Res Inst 光波導結構及其製造方法
US8502259B2 (en) 2008-01-11 2013-08-06 Industrial Technology Research Institute Light emitting device
TWI649440B (zh) * 2017-09-20 2019-02-01 永恒光實業股份有限公司 可撓式基板結構及其製造方法

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101257851B1 (ko) * 2007-03-13 2013-04-24 삼성전자주식회사 디스플레용 박막 트랜지스터 및 그 제조 방법
US9013367B2 (en) 2008-01-04 2015-04-21 Nanolumens Acquisition Inc. Flexible display
US9330589B2 (en) 2011-11-16 2016-05-03 Nanolumens Acquisition, Inc. Systems for facilitating virtual presence
US9071809B2 (en) 2008-01-04 2015-06-30 Nanolumens Acquisition, Inc. Mobile, personsize display system and method of use
US9655267B2 (en) 2008-01-04 2017-05-16 Nanolumens Acquisition, Inc. Retractable display system and method of use
US8800138B2 (en) * 2008-02-08 2014-08-12 Carestream Health, Inc. Method for conditioning a substrate surface for forming an electronic device thereon and resultant device
KR20110050580A (ko) * 2008-08-04 2011-05-16 파나소닉 주식회사 플렉시블 반도체 장치 및 그 제조 방법
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US8074349B2 (en) * 2009-04-16 2011-12-13 Carestream Health, Inc. Magnetic hold-down for foil substrate processing
JP2011009704A (ja) * 2009-05-26 2011-01-13 Seiko Epson Corp 薄膜装置、薄膜装置を備えた可撓性回路基板、及び薄膜装置の製造方法
TW201117262A (en) 2009-05-29 2011-05-16 Univ Arizona Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
KR101084230B1 (ko) * 2009-11-16 2011-11-16 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
KR101793180B1 (ko) * 2010-02-03 2017-11-02 존슨 콘트롤즈 오토모티브 일렉트로닉스 게엠베하 디스플레이 장치
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) * 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
US8896015B2 (en) * 2010-06-25 2014-11-25 Axlen, Inc. LED package and method of making the same
DE102010051959A1 (de) * 2010-11-19 2012-05-24 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
JP2012119532A (ja) 2010-12-01 2012-06-21 Seiko Epson Corp 薄膜トランジスタ形成用基板、半導体装置、電気装置
JP2012181445A (ja) 2011-03-02 2012-09-20 Seiko Epson Corp 電気装置
US8963895B2 (en) 2011-09-22 2015-02-24 Nano Lumens Acquisition Inc. Ubiquitously mountable image display system
US10261370B2 (en) 2011-10-05 2019-04-16 Apple Inc. Displays with minimized border regions having an apertured TFT layer for signal conductors
US9286826B2 (en) 2011-10-28 2016-03-15 Apple Inc. Display with vias for concealed printed circuit and component attachment
US8937285B2 (en) 2012-06-18 2015-01-20 General Electric Company Methods and systems for signal communication in gamma ray detectors
US9226347B2 (en) 2012-06-25 2015-12-29 Apple Inc. Displays with vias
US9214507B2 (en) 2012-08-17 2015-12-15 Apple Inc. Narrow border organic light-emitting diode display
US9454025B2 (en) 2012-08-31 2016-09-27 Apple Inc. Displays with reduced driver circuit ledges
US9477354B2 (en) 2012-11-16 2016-10-25 3M Innovative Properties Company Conductive trace hiding materials, articles, and methods
JP5819345B2 (ja) * 2013-05-01 2015-11-24 大日本印刷株式会社 タッチパネルセンサ、タッチパネルセンサを作製するための積層体、および、タッチパネルセンサの製造方法
KR102107456B1 (ko) * 2013-12-10 2020-05-08 삼성디스플레이 주식회사 플렉시블 표시 장치 및 이의 제조 방법
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
KR102466741B1 (ko) 2014-05-13 2022-11-15 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 전자 디바이스를 제공하는 방법
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
US9279573B1 (en) 2015-02-09 2016-03-08 Nanolumens Acquisition, Inc. Front serviceable mounting apparatus and methods
US9326620B1 (en) 2015-03-12 2016-05-03 Nanolumens Acquisition, Inc. Modular display system and methods
US10170711B2 (en) 2015-05-05 2019-01-01 Apple Inc. Display with vias to access driver circuitry
US9830885B2 (en) 2015-10-26 2017-11-28 Nanolumens Acquisition, Inc. Modular flexible display system and methods
US9924604B2 (en) 2015-11-04 2018-03-20 Nanolumens Acquisition, Inc. Modular flexible convex display system and methods
US10217440B2 (en) 2016-03-17 2019-02-26 Nanolumens Acquisition, Inc. In-situ display monitoring and calibration system and methods
US10667709B2 (en) 2016-05-27 2020-06-02 Board Of Trustees Of Michigan State University Hybrid diamond-polymer thin film sensors and fabrication method
CN106773384A (zh) * 2016-12-20 2017-05-31 深圳市华星光电技术有限公司 Goa电路结构
JP2019121734A (ja) * 2018-01-10 2019-07-22 株式会社Ｊｏｌｅｄ 半導体装置および表示装置
US10892256B2 (en) 2018-01-31 2021-01-12 Nanolumens Acquisition, Inc. Light emitting display system having improved fire performance
US11217566B2 (en) 2018-12-19 2022-01-04 Nanolumens Acquisition, Inc. Light emitting display with improved wide angle color viewing
USD950110S1 (en) 2019-05-29 2022-04-26 Nanolumens Acquisition, Inc. Light emitting display module with diffusely reflective facade
US11631703B2 (en) * 2020-06-18 2023-04-18 Barco Nv System and method for display panel
US20220136141A1 (en) * 2020-11-04 2022-05-05 Elena Dimova Barakova Cowan Fabric for garments and items providing electromagnetic radiation protection
US11737216B2 (en) 2021-01-22 2023-08-22 Xerox Corporation Metal drop ejecting three-dimensional (3D) object printer
CN114823716B (zh) * 2021-01-29 2024-08-13 京东方科技集团股份有限公司 一种驱动背板、显示面板及显示装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2114169A (en) 1933-10-07 1938-04-12 Briggs Mfg Co Refrigerator cabinet
JPH07504764A (ja) * 1992-03-13 1995-05-25 コピン・コーポレーシヨン 頭部取り付け表示系
US5817550A (en) * 1996-03-05 1998-10-06 Regents Of The University Of California Method for formation of thin film transistors on plastic substrates
US6061243A (en) * 1997-11-06 2000-05-09 Lockheed Martin Corporation Modular and multifunctional structure
US6451191B1 (en) * 1999-11-18 2002-09-17 3M Innovative Properties Company Film based addressable programmable electronic matrix articles and methods of manufacturing and using the same
US6418267B1 (en) * 2000-01-13 2002-07-09 Mediapull, Inc. Micro-display driven tiled electro-optic display apparatus
US6492026B1 (en) * 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
DE10059498A1 (de) * 2000-11-30 2002-06-13 Infineon Technologies Ag Substrat mit einer halbleitenden Schicht, elektronisches Bauelement mit diesem Substrat, elektronische Schaltung mit mindestens einem solchen elektronischen Bauelement, druckbare Zusammensetzung sowie Verfahren zur Herstellung eines Substrats
US6762124B2 (en) * 2001-02-14 2004-07-13 Avery Dennison Corporation Method for patterning a multilayered conductor/substrate structure
SG115456A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
US6943056B2 (en) * 2002-04-16 2005-09-13 Renesas Technology Corp. Semiconductor device manufacturing method and electronic equipment using same
US7462857B2 (en) * 2002-09-19 2008-12-09 Sharp Kabushiki Kaisha Memory device including resistance-changing function body
JP2004191734A (ja) * 2002-12-12 2004-07-08 Sharp Corp プラスチック基板およびそれを備える液晶表示装置
TWI330269B (en) * 2002-12-27 2010-09-11 Semiconductor Energy Lab Separating method
US20060214169A1 (en) * 2003-08-11 2006-09-28 Virtualblue, Llc Active Matrix Display Backplane
US6812949B1 (en) * 2003-08-14 2004-11-02 Eastman Kodak Company Imaging apparatus and method for exposing a photosensitive material
JP2005140980A (ja) * 2003-11-06 2005-06-02 Nitto Denko Corp 積層フィルム
EP1687670B1 (en) * 2003-11-19 2014-03-12 University of Florida Research Foundation, Inc. A method to contact patterned electrodes on porous substrates and devices thereby
JP2005153273A (ja) * 2003-11-25 2005-06-16 Nitto Denko Corp 樹脂シート、液晶セル基板、液晶表示装置、エレクトロルミネッセンス表示装置用基板、エレクトロルミネッセンス表示装置および太陽電池用基板
US20050163968A1 (en) * 2004-01-20 2005-07-28 Hanket Gregory M. Microfiller-reinforced polymer film
JP4566794B2 (ja) * 2004-03-26 2010-10-20 株式会社半導体エネルギー研究所 半導体装置
US7791700B2 (en) * 2005-09-16 2010-09-07 Kent Displays Incorporated Liquid crystal display on a printed circuit board
US7678701B2 (en) * 2006-07-31 2010-03-16 Eastman Kodak Company Flexible substrate with electronic devices formed thereon

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8502259B2 (en) 2008-01-11 2013-08-06 Industrial Technology Research Institute Light emitting device
TWI393928B (zh) * 2008-11-19 2013-04-21 Ind Tech Res Inst 光波導結構及其製造方法
TWI387138B (zh) * 2009-07-10 2013-02-21 Ind Tech Res Inst 磁性發光元件、磁性發光裝置以及氮化物半導體模板
TWI649440B (zh) * 2017-09-20 2019-02-01 永恒光實業股份有限公司 可撓式基板結構及其製造方法

Also Published As

Publication number Publication date
WO2008042110A2 (en) 2008-04-10
JP2010506400A (ja) 2010-02-25
US8288214B2 (en) 2012-10-16
US7977170B2 (en) 2011-07-12
US20110212555A1 (en) 2011-09-01
US20080090338A1 (en) 2008-04-17
WO2008042110A3 (en) 2008-07-31
EP2070124A2 (en) 2009-06-17
US20110220610A1 (en) 2011-09-15

Similar Documents

Publication Publication Date Title
TW200832504A (en) Flexible substrate with electronic devices and traces
US7964507B2 (en) Flexible substrate with electronic devices formed thereon
TWI258175B (en) Wiring board, method of manufacturing the same, and semiconductor device
TWI377646B (en) Substrate structures applied in flexible electrical devices and fabrication method thereof
US20070069393A1 (en) Wiring board embedded with spherical semiconductor element
US20140355931A1 (en) Glass-Polymer Optical Interposer
US6820332B2 (en) Laminate circuit structure and method of fabricating
CN102169960B (zh) 一种柔性电子器件薄膜晶体管的制备方法
TWI296492B (en) Un-symmetric circuit board and method for fabricating the same
WO2012005236A1 (ja) 積層配線基板及びその製造方法
CN111816638B (zh) 包括双层结构的部件承载件及制造和使用双层结构的方法
TW201230222A (en) Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
TW201216457A (en) Encapsulation substrate for organic light emitting diode display and method of manufacturing the encapsulation substrate
CN102683220A (zh) 一种制作多层有机液晶聚合物基板结构的方法
CN109863835A (zh) 部件承载件中用于散热的高导热介电结构
US20210195761A1 (en) Manufacturing method of package structure
JP2008262955A (ja) 半導体装置とその製造方法
US8161634B2 (en) Method of fabricating a printed circuit board
US20250112163A1 (en) Through-glass via liners for integrated circuit device packages
US9627420B2 (en) Method for forming an electronic device on a flexible substrate supported by a detachable carrier
TW200819003A (en) Device carrying an integrated circuit/components and method of producing the same
TW200904282A (en) Board having buried patterns and manufacturing method thereof
CN1180461C (zh) 复合高密度构装基板与其形成方法
TW202005076A (zh) 結合高溫與低溫元件形成的系統與方法
CN114477779B (zh) 一种基于异质键合的多层玻璃基板工艺和结构