200830399 九、發明說明： 【發明所屬之技術領域】 本發明涉及-種基板清洗裝置，尤其涉及一種用於、主 洗平板顯示面㈣基板的清洗裝置，㈣是以對基板均= =兩㈣合“的清洗㈣㈣行清洗㈣的基板清洗 【先前技術】200830399 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate cleaning apparatus, and more particularly to a cleaning apparatus for a main wash flat display surface (four) substrate, and (4) a pair of substrates == two (four) "Cleaning (4) (4) Line Cleaning (4) Substrate Cleaning [Prior Art]
通常，在製造平板顯示面板用基板時，爲去除基板上 的各種雜質和藥液要進行清洗作業。 在所述清洗作業中使用以噴射清洗流體的方式除去枯 在基板上的各種雜質和藥液的基板清洗裝置。 由本申請人於2_年3月23日提出申請，並被授予 專利權的f 591475號專利公報所公開的基板清洗裝置就 是所述基板清洗裝置。 然而，所述專利第591475號專利公報所公開的基板清 洗裝置’在具有長方體狀流體喷射區域的喷射裝置的排出 部分上相隔預定距離處形成有多個喷射口。 因此’在各噴射口之間存在噴射閒置區域，從而在進 行清洗作業時可能引起如下問題。 首先’在長方體狀流體喷射區域内，由於閒置區域不 會喷射流體，因而可能出現流體斷流現象，而這種流體斷 流現象可能降低基板清洗效果。 例如’對基板噴射清洗流體時，沒有被流體噴射到的 基板表面會留下波紋狀痕跡。 5 200830399 與小面積的基板相比在清洗大面積的基板時 紋：痕跡可能出現得更爲嚴重，因此這種裝置报難適應: 逐漸大面積化的基板製造形勢。 μ、 爲解決上述問題，沿著基板輸送方向配置多個嘴射裂 置’並且以所述裝置噴射口的間距大小使噴射裝置相互： 開排列’而在此狀態下進行清洗作t。然而這種裝置不^ 使整體結構過於複雜m能引起清洗液消耗過 一問題。 ^因此，在長方體狀喷射區域内之用於喷射清洗流體的 A射口之間，存在於閒置區域的狀態下很難從根本上解決 上述基板清洗作業中出現的問題。 【發明内容】 本發明係鑒於上述問題而作的，其目的在於提供一種 在對基板噴射清洗流體時，於在長方體狀流體喷射區域内 沒有閑置區域的狀態下，進行清洗作業的基板清洗裝置。 爲實現上述目的，本發明提供一種基板清洗裝置，其 包括： 清洗槽，其用於提供作業空間； 氣體供給裝置，其位於所述清洗槽内部，且用於供給 清洗氣體； 液體供給裝置，其與所述氣體供給裝置相面對地結合， 並且用於供給清洗液體； 第一噴射裝置，其在所述氣體供給裝置和液體供給裝 置之間形成長方體狀流體噴射區域，並在所述流體噴射區 6 200830399 域内相隔預定距離形成 所述第一喷孔具有 只扎，所无 用於混合喷射清洗氣體和清洗液體的流路，· 弟一嘴射裝置’其在所述楚一 + 喷射裝置的多個篱一嗜 孔之間形成多個第二噴孔，所述第二 、 射清洗氣體和清洗液體的流路。 、一有用於混合噴 兩種流體（氣體及液體） 因此能夠容易去除粘在 本發明使用具備用於混合噴射 的多個噴孔的長方體狀喷射裝置， 基板上的各異物和藥液。In general, when manufacturing a substrate for a flat panel display panel, cleaning operations are performed to remove various impurities and chemical liquid on the substrate. In the cleaning operation, a substrate cleaning device that removes various impurities and chemical liquids on the substrate by spraying the cleaning fluid is used. The substrate cleaning apparatus disclosed in the patent publication No. 591475, which is filed by the present applicant, which is filed on March 23, 2011, is the substrate cleaning apparatus. However, the substrate cleaning apparatus disclosed in Japanese Patent No. 591475 has a plurality of ejection openings formed at a predetermined distance apart from the discharge portion of the ejection device having a rectangular parallelepiped fluid ejection region. Therefore, there is a spray idle area between the respective ejection ports, which may cause the following problems when performing a cleaning operation. First, in the cuboid fluid ejection region, fluid leakage may occur due to the fact that the idle region does not eject fluid, and this fluid interruption may reduce the substrate cleaning effect. For example, when the cleaning fluid is sprayed onto the substrate, the surface of the substrate which is not sprayed by the fluid leaves a corrugated mark. 5 200830399 Compared with small-area substrates, when cleaning large-area substrates, the traces may appear more serious, so this device is difficult to adapt: the substrate manufacturing situation is gradually increasing. In order to solve the above problem, a plurality of nozzle ruptures are disposed along the substrate transporting direction and the ejection devices are arranged in an open state by the pitch of the ejection openings of the device, and cleaning is performed in this state. However, such a device does not make the overall structure too complicated, which can cause a problem of consumption of the cleaning liquid. Therefore, it is difficult to fundamentally solve the problems occurring in the above-described substrate cleaning operation in the state where the A-outlet for ejecting the cleaning fluid in the cuboid-shaped ejection region exists in the idle region. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the invention is to provide a substrate cleaning apparatus that performs a cleaning operation in a state where an empty area is not present in a rectangular parallelepiped fluid ejection region when a cleaning fluid is ejected to a substrate. In order to achieve the above object, the present invention provides a substrate cleaning apparatus comprising: a cleaning tank for providing a working space; a gas supply device located inside the cleaning tank for supplying a cleaning gas; and a liquid supply device Cooperating with the gas supply device, and for supplying a cleaning liquid; a first injection device forming a cuboid fluid ejection region between the gas supply device and the liquid supply device, and injecting the fluid Zone 6 200830399 The first injection hole is formed in the domain with a predetermined distance apart, and there is no flow path for mixing the jet cleaning gas and the cleaning liquid, and the other one is in the Chuyi+ injection device. A plurality of second orifices are formed between the barrier and the pores, and the second is a flow path for the cleaning gas and the cleaning liquid. In the present invention, it is possible to easily remove the two fluids (gas and liquid), and it is possible to easily remove the foreign matter and the chemical liquid on the substrate by using a rectangular parallelepiped ejection device having a plurality of injection holes for mixed injection.
特別是，所述各噴射裳置設置爲以下結構：即任何一 個喷射裝置的喷孔之間分別設有另—個噴射裝置的喷孔， =设置可以使長方體狀流體噴射區域内不出現流體斷流 現象’從而能夠均句地喷射清洗流體。這種結構解決了使 用現有噴射裝置來進行作業時，即使用存在嘴射閑置區域 =方㈣噴射裝置時，由於在整個噴射區域内出現流體 區域而在基板表面留下波紋等痕迹的問題。 步提高工作效率 因此，在進行基板清洗作業時可進一 和清洗質量。 【實施方式】 下面，簽照附圖詳細說明本發明的較佳實施例，並在 所屬技術領域的技術人員能夠實施本發明的範圍内進行說 明。 w 由於本發明的實施例可以採用多種方式實施，因此本 發明的申請專利範圍並不侷限於下述實施例。 圖1及圖2是本發明之一實施例中的基板清洗裝置整 7 200830399 體及内部結構圖，圖中元件符號2表示清洗槽。 所述清洗槽2爲常規的箱體結構，其内部設有作業空 間S可進行用於製造平面顯示面板用基板g (以下簡稱基 板）的清洗作業。 所述清洗槽2内部設有用於輸送基板〇的輸送裝置4。 所述輸运裝置4是由多個輸送輥R構成的，為一般的輥輪 式輸送器結構。 所述輸送輥R經由一般的方法從電機（未圖示）接收 籲動力以進仃方疋轉，並以基板G的一面朝上的狀態承載所述 基板G，且如圖2所示地在所述作業空間s上從左向右輸 送基板G。 所述清洗槽2内設置有氣體供給裝置6。如圖i所示， 所述氣體供給裝置6中設置有用於使清洗氣體wi通過的 内部空間S1 ’該氣體供給裝置6之形狀爲長方體狀箱體。 如圖2所示，所述氣體供給裝置6與管體ρι相連， 並從所述管體P 1接收清洗氣體W1。In particular, each of the jet skirts is configured to have an injection hole of another injection device between the injection holes of any one of the injection devices, and the setting is such that no fluid break occurs in the cuboid fluid injection region. The flow phenomenon' thus enables the cleaning fluid to be sprayed uniformly. This configuration solves the problem of using a conventional ejection device for performing work, that is, when there is a nozzle-dissipating area = square (four) ejection device, a problem such as a ripple or the like is left on the surface of the substrate due to the occurrence of a fluid region in the entire ejection region. Steps to increase work efficiency Therefore, the quality of cleaning and cleaning can be improved during substrate cleaning. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in the scope of the invention. Since the embodiments of the present invention can be implemented in various ways, the scope of the present invention is not limited to the following embodiments. 1 and 2 are views showing the structure and internal structure of a substrate cleaning apparatus according to an embodiment of the present invention, and the symbol 2 in the figure indicates a cleaning tank. The cleaning tank 2 is a conventional cabinet structure, and a working space S is provided therein to perform a cleaning operation for manufacturing a substrate g for a flat display panel (hereinafter referred to as a substrate). A conveying device 4 for conveying the substrate raft is provided inside the cleaning tank 2. The transport device 4 is composed of a plurality of transport rollers R and is a general roller conveyor structure. The conveying roller R receives the power of the motor from a motor (not shown) by a general method to rotate the yoke, and carries the substrate G with the side of the substrate G facing upward, and as shown in FIG. 2 The substrate G is transported from left to right on the work space s. A gas supply device 6 is disposed in the cleaning tank 2. As shown in Fig. 1, the gas supply device 6 is provided with an internal space S1' for passing the cleaning gas wi. The gas supply device 6 has a rectangular parallelepiped shape. As shown in Fig. 2, the gas supply device 6 is connected to the pipe body ρι, and receives the cleaning gas W1 from the pipe body P1.
所述清洗氣體W1❹—般的清潔壓縮空氣（cda: Clean Dry Ak)，如圖2所示，冑潔壓縮空氣在儲存於存 儲容器τι的狀態下，以預定壓力通過上述管體ρι供給到 所述氣體供給裝置6中。 如圖3所示，所述氣體供給裝置6之-側形成有氣體 排出口 m’所述氣體排出口 H1具有通道的作用，以使清 洗氣體W1經過所述内部空間s 1向外部排出。 如圖1所示，在所述清洗槽2内設有與所述氣體供給 8 200830399 裝置6相面對的液體供給裝置8。 所述液體供給裝置8具有用於使清洗液體W2通過的 内部空間S2，並由與所述氣體供給裝置6相同的長方體狀 箱體構成。 如圖2所示，所述液體供給裝置8通過管體P2與液 體儲存容器T2相連。雖然未圖示，所述液體供給裝置8 通過一般流體泵的泵送接收經所述管體P2供給的清洗液 體W2。 _ 所述清洗液體W 2使用一般的去離子水等純水，並與 所述清洗氣體W1混合而進行清洗基板G的作業。 如圖3所示’所述液體供給裝置8的一側形成有液體 排出口 H2。 所述液體排出口 H2作爲通道，將從所述液體存儲容 器T2供給的清洗液體W2經所述内部空間S2向外部排出。 而且，如圖3所示，所述氣體供給裝置6和所述液體 « 供給裝置8的内部空間SI、S2,可以通過另設的蓋罩 外部開放。 根據本發明一實施例的基板清洗裝置包括第一噴射裝 單-，爪峪早兀丨〇和第二流路 ^U構成，以便在喷射清洗氣體^時，使所述清 體W2混合在所述清洗氣體中後噴射 如圖 4所示，所述第一流路單元1〇由多 構成，而在所述第一薄板L1上相 溥板U 上相隔預疋距離形成有多個 9 200830399 第一氣體流路孔VI。 如圖3所示，當所述多個第—薄板L1相面對地結合 時，所述多個第-氣體流路孔V1互相重疊，從而分別:多 成用於從所述氣體供給裝置6噴射出之清洗氣體wi的第 一氣體流路K1。 通過所述多個第一氣體流 即，所述第一氣體流路Κι 路孔V1以預定距離分割形成。 氣體流路K1可使所述 氣體排出槽Η1向外部The cleaning gas W1 cleans the compressed air (cda: Clean Dry Ak). As shown in FIG. 2, the clean compressed air is supplied to the storage body through the pipe body at a predetermined pressure in a state of being stored in the storage container τι. In the gas supply device 6. As shown in Fig. 3, a side of the gas supply device 6 is formed with a gas discharge port m'. The gas discharge port H1 functions as a passage for discharging the purge gas W1 to the outside through the internal space s1. As shown in Fig. 1, a liquid supply device 8 facing the gas supply 8 200830399 device 6 is provided in the cleaning tank 2. The liquid supply device 8 has an internal space S2 through which the cleaning liquid W2 passes, and is constituted by the same rectangular parallelepiped casing as the gas supply device 6. As shown in Fig. 2, the liquid supply device 8 is connected to the liquid storage container T2 through the pipe body P2. Although not shown, the liquid supply device 8 receives the cleaning liquid W2 supplied through the pipe body P2 by pumping by a general fluid pump. The cleaning liquid W 2 is pure water such as general deionized water, and is mixed with the cleaning gas W1 to perform the operation of cleaning the substrate G. A liquid discharge port H2 is formed at one side of the liquid supply device 8 as shown in Fig. 3 . The liquid discharge port H2 serves as a passage, and the cleaning liquid W2 supplied from the liquid storage container T2 is discharged to the outside through the internal space S2. Further, as shown in Fig. 3, the gas supply means 6 and the internal spaces SI, S2 of the liquid « supply means 8 can be opened outside by a separate cover. A substrate cleaning apparatus according to an embodiment of the present invention includes a first jet package-, a pawl 峪 and a second flow path, so that the cleaning body W2 is mixed while the cleaning gas is sprayed. In the cleaning gas, the post-injection is as shown in FIG. 4, and the first flow path unit 1 is composed of a plurality of, and a plurality of 9 are formed on the first plate L1 with a predetermined distance from each other on the first plate L1. Gas flow path hole VI. As shown in FIG. 3, when the plurality of first sheets L1 are joined face to face, the plurality of first gas passage holes V1 overlap each other, so that a plurality of them are used for the gas supply device 6 respectively. The first gas flow path K1 of the purge gas wi is ejected. The first gas flow path Vι hole V1 is divided by the predetermined distance by the plurality of first gas streams. The gas flow path K1 allows the gas to be discharged to the outside of the tank 1
而且，如圖3所示，所述第— 氣體供給裝置6的清洗氣體wi經 排出後逐漸向下喷射。 _ ^ m 7ηι ^ vi 〇r a 接所述氣體供給裝置6的任何一 圓孔，而在另-個第一薄板L1上貝丨’反U上形成 的“ n，，字形孔。 上則可以形成爲底部開 字形的第一氣體流路 逐漸向裏變窄再逐漸 另外’如圖5所示，所述“ 〇，， 孔vi具有在第一薄板L1的底部朝上 向外變寬的一般瓶頸結構。 通過所述第一氣體流路κ W1時，上述钍Μ轵媸^預疋壓力噴射清洗J 上遮結構根據伯努利 孔VI的瓶預位罟、 在所述第一氣體访' 旳瓶，員位置上使氣體流逮加 # 低於大氣壓，從而產生吸？丨力。、、’使巩體壓力ϋ 所述第二流路單元12由且 個第二薄板L2構成。 /、有弟-液體流路孔V2的 如圖4所示，在多個第_ 一，寻板L2相面對地結合時 10 200830399 所述多個第一液體流路孔V2互相重疊而形成用於嗔射生 洗液體W2的第一液體流路K2 (參照圖3 ) 〇 月 所述多個第一液體流路孔V2可在所述第二薄板 形成爲圓形，並如圖5所示，其等與形成於所述第—— 缚板 L1 一側的第一氣體流路孔VI瓶頸部分相對應。 而且，如圖6所示，所述第一氣體流路Kl t μ \1和所述第 一液體流路Κ2，其排出端部互相連通而在由所钟、错 处弟—流路 皁元10和弟二流路早元12所形成的長方體狀流體+ 一貧射區 域D中形成多個第一喷孔N1。 根據清洗氣體W1經過所述第一氣體流路 μ n i的瓶頸 位置時壓力下降的現象，清洗液體W2經所诚楚 1 1弟—液體流 路K2被吸入後兩種流體（即氣體wi和液體W2 )相π 一 所述第一喷孔Ν1喷射這種混合流體。 Ό ° 由此’如圖3所示，可對基板G喷射清洗氣體^口 清洗液體W2的混合清洗流體W。 和 另外，貫通形成所述氣體供給裝置6和液體供 8的氣體排出孔Η1及液體排出孔Η2，以便向所述:衣置 體流路孔VI和第一液體流路孔V2通暢地供认生 弟一氣 〜、、口 /月洗軋體Wi 和清洗液體W2。 1 所述第一流路單元ίο和所述第二流路單元i2 ^ 薄板L1和第二薄板L2可使用金屬薄板，而所述第一=一 流路孔VI和第一液體流路孔V2可經由一般的蝕 虱體 來形成。 X寺程序 如上所述’若以多個薄板L1和多個薄板L2形 少成第一 11 200830399 流路單元10和第二流路單元12，則以分割形成方式，可 易於製造出用於使清洗氣體W1和清洗液體W2通過的微 細流路K1和流路K2區域，而且能夠提高整體或局部的維 修保養性能。 另外，如圖4所示，根據本發明一實施例的基板清洗 裝置包括第二噴射裝置J2，第二噴射裝置J2由第三流路 單元I4和第四流路單元16構成。 所述第三流路單元14具有用於噴射清洗氣體W1的第 -~氣體流路孔V 3。 所述第二氣體流路孔V3形成在第三薄板L3上，其等 之开> 狀爲向第三薄板L3下側開放的“门，，字形。 所述第三薄板L3與第一薄板L1相面對地結合時，如 圖7所示，所述第二氣體流路孔V3設置在所述第一薄板 L1上的多個第一氣體流路孔vi之間。Further, as shown in Fig. 3, the cleaning gas wi of the first gas supply means 6 is gradually discharged downward after being discharged. _ ^ m 7ηι ^ vi 〇ra is connected to any one of the circular holes of the gas supply device 6, and on the other first thin plate L1, the "n," shaped hole formed on the upper U-turn U can be formed as The first gas flow path of the bottom open shape gradually narrows inwardly and then gradually becomes 'as shown in FIG. 5, the hole vi has a general bottleneck structure which widens upwards and outwards at the bottom of the first thin plate L1. . When the first gas flow path κ W1 is passed, the 疋 疋 pre-pressure jet blasting cleaning J is covered by the bottle according to the bottle pre-position of the Bernoulli hole VI, in the first gas access bottle, At the position of the person, the gas flow is increased by # lower than atmospheric pressure, resulting in suction?丨力. And, the second flow path unit 12 is constituted by the second thin plates L2. /, the younger-liquid flow path hole V2 is as shown in FIG. 4, and when a plurality of first ones are found, the plurality of first liquid flow path holes V2 are overlapped with each other. a first liquid flow path K2 for spraying the raw liquid W2 (refer to FIG. 3). The plurality of first liquid flow path holes V2 may be formed in a circular shape on the second thin plate, and as shown in FIG. It is shown that it corresponds to the bottle neck portion of the first gas flow path hole VI formed on the side of the first binding plate L1. Moreover, as shown in FIG. 6, the first gas flow path K1 t μ \1 and the first liquid flow path ,2 have their discharge ends communicating with each other, and the clock-flowing soap element 10 A plurality of first injection holes N1 are formed in the cuboid fluid + the lean region D formed by the second passage of the second stream. According to the phenomenon that the pressure of the cleaning gas W1 passes through the bottleneck position of the first gas flow path μ ni, the cleaning liquid W2 is sucked into the two fluids (ie, the gas wi and the liquid through the channel 1). W2) Phase π - The first orifice Ν 1 sprays the mixed fluid. Ό ° Thus, as shown in Fig. 3, the mixed cleaning fluid W of the cleaning gas W2 can be ejected to the substrate G. And further, the gas discharge port 1 and the liquid discharge port 2 forming the gas supply device 6 and the liquid supply 8 are formed to smoothly confiscate the clothing flow path hole VI and the first liquid flow path hole V2. The younger one is ~, the mouth/month washing body Wi and the cleaning liquid W2. 1 the first flow path unit ίο and the second flow path unit i2 ^ the thin plate L1 and the second thin plate L2 may use a thin metal plate, and the first = first-class road hole VI and the first liquid flow path hole V2 may be General etched bodies are formed. As described above, the X temple program is reduced to the first 11 200830399 flow path unit 10 and the second flow path unit 12 by a plurality of thin plates L1 and a plurality of thin plates L2, and can be easily manufactured in a divided manner. The area of the fine flow path K1 and the flow path K2 through which the cleaning gas W1 and the cleaning liquid W2 pass, and the overall or partial maintenance performance can be improved. Further, as shown in Fig. 4, a substrate cleaning apparatus according to an embodiment of the present invention includes a second ejection device J2, which is constituted by a third flow path unit I4 and a fourth flow path unit 16. The third flow path unit 14 has a first to a gas flow path hole V 3 for ejecting the cleaning gas W1. The second gas flow path hole V3 is formed on the third thin plate L3, and the like is a "door", which is open to the lower side of the third thin plate L3. The third thin plate L3 and the first thin plate When the L1 phases are coupled face to face, as shown in FIG. 7, the second gas flow path holes V3 are disposed between the plurality of first gas flow path holes vi on the first thin plate L1.
即，如圖5所示，在所述多個第一氣體流路孔νι之 間没置所述第二氣體流路孔V3的狀態下相結合。 此時’如圖5所示’所述第二氣體流路孔v3和所述 第-氣體流路1 V1的上部’其一部分互相連通，從而可 接收由所述氣體供給部6的氣體排出。m供給的清洗氣 如圖8所示，當所述第三薄 一 ，寻板L3與弟一薄板L1及第 一涛板L2相面對地結合時，诵 通過所述弟二氣體流路孔V3 I成弟一氣體流路K3。 而且，所述弟四流路單元1 6具有用於噴射清洗液體 12 200830399 W2的第二液體流路孔V4。 如圖4及圖7所示，所述第二液體流路孔V4在形成 有所返第二流路單元12的多個第二薄板L2上，穿設於所 述多個第一液體流路孔V2之間。 如圖8所示，所述多個第二液體流路孔V4經由所述 夕個第一薄板L2的結合，形成可從所述液體供給裝置8 供給清洗液體W2的第二液體流路K4。 如圖6所示，所述第二氣體流路Κ3和所述第二液體 μ路Κ4的排出端部互相連通，從而在所述多個第一噴孔 N1之間分別形成第二喷孔Ν2。 所述第二噴孔N2通過進行與所述第一噴孔N1相同的 操作’而喷射清洗流體W。 即’經所述第二氣體流路K3喷射清洗氣體W1時， 通過所述氣體W1的流動壓力，所述清洗液體〜2經第二 液體流路K4被吸入後和氣體一起混合喷射。 _ 由此，如圖9所示，通過所述第一喷孔N1和所述第 二喷孔N2，在長方體狀的整個流體喷射區域D内，可均 勻喷射清洗氣體W1和清洗液體W2的混合清洗流體w。 所述結構，可防止使用現有長方形喷嘴來進行清洗作 業時，因喷射口之間的喷射閒置區域引起的流體斷流現 象。 所述第一流路單元1 〇和所述第二流路單元i 2以及所 述第三流路單元14和所述第四流路單元16在所述氣體供 給I置6和所述液體供給裝置8之間，通過螺絲等連接部 13 200830399 件以一般方法予以連接固定。 根據本發明一實施例的基板清洗裝置還可包括固定銷 B 〇 如圖3及圖4所示，所述固定銷B貫通形成於薄板、 、 上的導槽的方向上插入並掛在氣體裝置6及液體供 給裝置8的一側面。 所述固定銷B不僅引導多個薄板L1、l2、L3結合時 的位置，還防止因清洗流體w的壓力或外力導致結合位置 改變的現象。 【圖式簡單說明】 圖1是本發明一實施例的基板清洗裝置的整體結構 圖2是本發明一實施例的基板清洗裝置内部結構示意 圖。 圖3是用於說明本發明一實施例的基板清洗裝置中第 一喷射裝置的剖視圖。 圖4是圖3所示本發明一實施例的基板清洗裝置中第 一喷射裝置的立體分解圖。 圖5是本發明一實施例的基板清洗裝置中第一氣體流 路孔及第二氣體流路孔的結構示意圖。 圖6是本發明一實施例的基板清洗裝置中第一噴孔和 弟二育孔的排列狀態示意圖。 圖7是本發明一實施例的基板清洗裝置中第二噴射袭 置的結構示意圖。 200830399 圖8是本發明一實施例的基板清洗裝置中第二喷射裝 置的剖視圖。 圖9是本發明一實施例的基板清洗裝置中第一喷射裝 置和第二噴射裝置的作用示意圖。That is, as shown in Fig. 5, the second gas flow path holes V3 are not joined between the plurality of first gas flow path holes νι. At this time, as shown in Fig. 5, a part of the second gas flow path hole v3 and the upper portion of the first gas flow path 1 V1 communicate with each other, so that the gas discharged from the gas supply unit 6 can be received. The cleaning gas supplied by m is as shown in FIG. 8. When the third thin one is formed, the slab L3 is combined with the thin plate L1 and the first slab L2, and the sputum passes through the second gas flow path hole. V3 I becomes a gas flow path K3. Further, the fourth flow path unit 16 has a second liquid flow path hole V4 for ejecting the cleaning liquid 12 200830399 W2. As shown in FIG. 4 and FIG. 7, the second liquid flow path hole V4 is formed in the plurality of first liquid flow paths on the plurality of second thin plates L2 on which the second flow path unit 12 is formed. Between holes V2. As shown in Fig. 8, the plurality of second liquid flow path holes V4 form a second liquid flow path K4 through which the cleaning liquid W2 can be supplied from the liquid supply device 8 via the combination of the first thin plates L2. As shown in FIG. 6, the discharge ends of the second gas flow path Κ3 and the second liquid Κ路4 are in communication with each other, so that a second injection hole Ν2 is formed between the plurality of first injection holes N1, respectively. . The second injection hole N2 ejects the cleaning fluid W by performing the same operation as the first injection hole N1. That is, when the cleaning gas W1 is ejected through the second gas flow path K3, the cleaning liquid 〜2 is sucked by the second liquid flow path K4 by the flow pressure of the gas W1, and is mixed and ejected together with the gas. _ Thus, as shown in FIG. 9, through the first injection hole N1 and the second injection hole N2, the mixture of the cleaning gas W1 and the cleaning liquid W2 can be uniformly sprayed in the entire fluid ejection region D having a rectangular parallelepiped shape. Wash fluid w. The structure prevents the fluid from being broken due to the spray idle area between the injection ports when the conventional rectangular nozzle is used for the cleaning operation. The first flow path unit 1 and the second flow path unit i 2 and the third flow path unit 14 and the fourth flow path unit 16 are disposed at the gas supply I and the liquid supply device Between 8 and 8 , the connecting parts 13 200830399 are connected and fixed in a general manner. The substrate cleaning apparatus according to an embodiment of the present invention may further include a fixing pin B. As shown in FIGS. 3 and 4, the fixing pin B is inserted and hung in the direction of the guide groove formed on the thin plate and the gas device. 6 and a side of the liquid supply device 8. The fixing pin B not only guides the position at which the plurality of thin plates L1, L2, L3 are joined, but also prevents the bonding position from being changed due to the pressure or external force of the cleaning fluid w. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall configuration of a substrate cleaning apparatus according to an embodiment of the present invention. FIG. 2 is a schematic view showing the internal structure of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 3 is a cross-sectional view showing a first ejecting apparatus in the substrate cleaning apparatus according to the embodiment of the present invention. Fig. 4 is an exploded perspective view showing the first ejecting apparatus in the substrate cleaning apparatus of the embodiment of the present invention shown in Fig. 3. Fig. 5 is a view showing the configuration of a first gas flow path hole and a second gas flow path hole in a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 6 is a view showing the arrangement state of the first orifice and the second orifice in the substrate cleaning apparatus according to the embodiment of the present invention. Fig. 7 is a view showing the structure of a second jetting action in the substrate cleaning apparatus according to the embodiment of the present invention. 200830399 Fig. 8 is a cross-sectional view showing a second ejecting apparatus in the substrate cleaning apparatus according to the embodiment of the present invention. Fig. 9 is a view showing the operation of the first ejecting apparatus and the second ejecting apparatus in the substrate cleaning apparatus according to the embodiment of the present invention.
【主要元件符號說明】 2 清洗槽 4 輸送裝置 6 氣體供給單元 8 液體供給單元 10 第一流路單元 12 第二流路單元 14 第三流路單元 16 第四流路單元 B 固定銷 C 蓋罩 G 基板 H1 氣體排出口 H2 液體排出口 J1 第一喷射裝置 J2 第二喷射裝置 K1 第一氣體流路 K2 第一液體流路 K3 第二氣體流路 K4 第二液體流路 15 200830399 LI、L2、L3 薄板 N1 第一噴孔 N2 第二喷孔 PI 管體 R 輸送輥輪 SI 内部空間 S2 内部空間 T1 存儲容器 VI 第一氣體流路孔 V2 第一液體流路孔 V3 第二氣體流路孔 V4 第二液體流路孔 w 清洗流體 W1 清洗氣體 W2 清洗液體[Main component symbol description] 2 Cleaning tank 4 Conveying device 6 Gas supply unit 8 Liquid supply unit 10 First flow path unit 12 Second flow path unit 14 Third flow path unit 16 Fourth flow path unit B Fixed pin C Cover G Substrate H1 gas discharge port H2 liquid discharge port J1 first injection device J2 second injection device K1 first gas flow path K2 first liquid flow path K3 second gas flow path K4 second liquid flow path 15 200830399 LI, L2, L3 Thin plate N1 First injection hole N2 Second injection hole PI Tube R Transport roller S1 Internal space S2 Internal space T1 Storage container VI First gas flow path hole V2 First liquid flow path hole V3 Second gas flow path hole V4 Two liquid flow path holes w cleaning fluid W1 cleaning gas W2 cleaning liquid
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