KR101328722B1 - substrate cleaning apparatus - Google Patents

Abstract

A substrate cleaning apparatus capable of cleaning a substrate for a flat panel display panel by mixing and spraying two kinds of cleaning fluids (gas and liquid) is disclosed.

Such a substrate cleaning apparatus includes a first fluid supply having a gas chamber for supplying a cleaning gas, and a second fluid supply having a liquid chamber for supplying a cleaning liquid and coupled in a posture facing the first fluid supply. And a first flow path means which is integrally formed on one side of the first fluid supply part so that a cleaning gas is injected between the first fluid supply part and the second fluid supply part, and is injected through the first flow path means. And a second flow path means integrally formed on one side of the second fluid supply part such that the cleaning liquid is mixed and injected into the cleaning gas.

Of flat panel display panel, cleaning operation, two kinds of fluid mixture injection, cleaning gas, cleaning liquid, first fluid supply part, second fluid supply part, first flow path means, second flow path means, flow path Improved durability, preventing corrosion fatigue and deformation of the inner surface of the flow path

Description

Substrate cleaning apparatus

1 and 2 are views for explaining the overall structure of the substrate cleaning apparatus according to an embodiment of the present invention.

3 is a view for explaining the structure and operation of the first flow path means and the second flow path means of the substrate cleaning apparatus according to an embodiment of the present invention.

4 is a cross-sectional view for describing a detailed structure of the first flow path means and the second flow path means of the substrate cleaning apparatus according to the embodiment of the present invention.

5 is a view for explaining the structure of the first and second flow path means of FIG.

DESCRIPTION OF THE REFERENCE NUMERALS

 2: cleaning tank 4: transfer means 6: first fluid supply part

 8: second fluid supply part 10: first flow path means 12: second flow path means

 G: Substrate W1: Cleaning Gas W2: Cleaning Liquid

 W: Substrate Cleaning Liquid C1: Gas Chamber C2: Liquid Chamber

 E1: gas flow path E2: liquid flow path

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus, and more particularly, to cleaning a substrate for a flat panel display panel by mixing and spraying two types of cleaning fluids (gas and liquid). The present invention relates to a substrate cleaning apparatus capable of reducing corrosion-fatigue or deformation of a spray passage that may be generated.

Generally, the manufacturing process of the board | substrate for flat panel displays includes a washing | cleaning operation. This cleaning operation is widely known as a method of removing various foreign substances, chemical liquids, and the like from the substrate for a flat panel display by using a substrate cleaning apparatus for injecting a cleaning fluid.

The substrate cleaning apparatus includes a substrate cleaning apparatus of Patent No. 591475, filed and registered by the applicant on March 23, 2004.

The substrate cleaning apparatus of Patent No. 591475 has a plurality of injection holes (liquid flow paths and gas flow paths) located at a plurality of points along a rectangular fluid injection section. Branches are formed by combining a plurality of sheets (etching plates) in an overlapping state.

That is, as the divided flow path grooves are connected by the combination of the thin plates, injection holes having a liquid flow path and a gas flow path are respectively formed, and two types of cleaning fluids (gas and liquid) are mixed in the flow path section of the injection ports. Is sprayed on.

However, in the substrate cleaning apparatus of Patent No. 591475 having such a spray structure, the following problems may occur when the cleaning operation of the substrate for a flat panel display panel is performed.

First, durability of the flow path can be lowered early due to the fluid pressure acting when the cleaning fluid is injected at high speed.

For example, when the cleaning fluid passes through the flow path section, not only the flow path grooves (thin plates) can be deformed by the vibration generated when the flow paths collide with the step faces (slits) at the points where the flow path grooves are divided. It can be a factor that causes corrosion-fatigue.

In addition, when the cleaning fluid is injected, friction may occur when the flow path grooves collide with the stepped surfaces (gaps) at the point where the flow path grooves are divided, thereby decreasing the fluid flow.

In particular, when vibration or friction is generated in the flow path as described above, various particles may be generated on the flat panel panel side while the cleaning fluid is unevenly sprayed during the cleaning operation.

In addition, since the substrate cleaning apparatus of Patent No. 591475 is manufactured through a process of combining and setting a plurality of sheets, the process is complicated and excessive time may be required for bonding and setting the sheets.

Moreover, the method of forming a flow path in the state where several sheets of thin sheets overlap is difficult to miniaturize the size of the device because the thin plates occupy more space by the combined spacing.

Therefore, the substrate cleaning apparatus of Patent No. 591475 can easily form a flow path for injecting a cleaning fluid by using a plurality of thin plates, but the above problems by forming a flow path while the plurality of thin plates are combined. Can cause them.

The present invention has been made to solve the conventional problems as described above, the object of the present invention is not only a simple structure of the injection flow path for injecting the cleaning fluid, but also significantly improved durability against the fluid pressure substrate It is to provide a cleaning device.

In order to realize the object of the present invention as described above,

A first fluid supply unit having a gas chamber for supplying a cleaning gas;

A second fluid supply part coupled to the first fluid supply part and having a liquid chamber for supplying a cleaning liquid;

First flow path means integrally formed on one side of the first fluid supply part to allow a cleaning gas to be injected between the first fluid supply part and the second fluid supply part;

Second flow path means integrally formed on one side of the second fluid supply part such that a cleaning liquid is mixed and injected into the cleaning gas injected through the first flow path means;

It provides a substrate cleaning apparatus comprising a.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiments of the present invention are described to the extent that those of ordinary skill in the art can practice the present invention.

Therefore, since the embodiments of the present invention may be modified in various other forms, the claims of the present invention are not limited to the embodiments described below.

1 and 2 are views for explaining the structure of a substrate cleaning apparatus according to an embodiment of the present invention, 2 denotes a cleaning tank.

The cleaning tank 2 is formed in the form of a normal box provided with a working space S for carrying out the cleaning operation of the flat panel display panel substrate G (hereinafter referred to as "substrate").

And, the transport means 4 is located in the working space (S). The conveying means 4 may be a conventional roller conveyor composed of a plurality of conveying rollers (R).

Although not shown in the drawings, the transfer rollers R are rotated by receiving power from a motor in a conventional manner.

Thus, when referring to FIG. 2, one side of both sides of the substrate G may be transferred from the left side to the right side along the working space S while being placed horizontally so as to face upward.

Meanwhile, the first fluid supply part 6 and the second fluid supply part 8 for supplying the cleaning gas W1 and the cleaning liquid W2 are located in the working space S, respectively.

First, the first fluid supply part 6 has a rectangular box shape in which a gas chamber C1 for supplying the cleaning gas W1 is provided therein.

The gas chamber C1 is connected to a conventional gas supply device M1 or a storage tank by a tubular body L1, and receives the cleaning gas W1 through the tubular body L1 (see FIG. 2).

As the cleaning gas W1, a normal clean dry air (CDA) is used, and the cleaning gas W1 is supplied from the gas supply device M1 to the gas chamber C1 at a predetermined pressure through the pipe L1.

The second fluid supply part 8 is provided with a liquid chamber C2 for supplying the cleaning liquid W2 therein, and has a rectangular box shape in the same manner as the first fluid supply part 6. .

The first fluid supply part 6 and the second fluid supply part 8 are made of metal boxes having excellent durability, corrosion resistance, and the like.

As shown in FIG. 2, the second fluid supply part 8 is connected to the liquid supply device M2 or the storage tank by a tube L2 to receive the cleaning liquid W2 from the liquid supply device M2.

As the cleaning liquid W2, a conventional DI water (Deionized Water) widely used for the cleaning operation of the substrate G is used.

The first fluid supply part 6 and the second fluid supply part 8 are referred to as two coupling surfaces F1 and F2 or less as “engagement surfaces” as shown in FIG. 3 while the fastening members B such as bolts are fastened. .) Is fixedly coupled in the facing state.

In addition, the first fluid supply part 6 and the second fluid supply part 8 are located in the cleaning tank 2 in the state above the transfer means 4 as shown in FIG. 1. It is arranged in the direction crossing the conveying direction.

On the other hand, the substrate cleaning apparatus according to an embodiment of the present invention, the first flow path means 10 and the second flow path means 12 for mixing and spraying the cleaning gas (W1) and the cleaning liquid (W2) Include.

The first flow path means 10 sprays the cleaning gas W1 of the gas chamber C1 between the coupling surfaces F1 and F2 of the first fluid supply part 6 and the second fluid supply part 8. Is made possible.

To this end, in the present embodiment, as shown in FIG. 4, gas flow paths E1 are formed on the coupling surface F1 of the first fluid supply part 6 to face the two coupling surfaces F1 and F2 below. W1) is to be injected.

The gas flow path E1 is formed at a plurality of points at a predetermined interval on the engaging surface F1 of the first fluid supply part 6 as shown in FIG. 3.

Each of the gas flow paths E1 is gradually discharged downward while the cleaning gas W1 of the gas chamber C1 is discharged through the coupling surface F1 of the first fluid supply part 6.

In addition, the gas flow paths E1 are formed to have a flow path section of a normal bottle-neck shape at the coupling surface F1 of the first fluid supply part 6.

For example, each gas flow path (E1), as shown in Figure 5, the upper point is a passage width length so as to have a bottleneck section (N) while proceeding downward while being opened to communicate with the gas chamber (C1) It becomes gradually narrowing and then widening again.

This structure has a flow path atmosphere in which the flow rate can be increased while the pressure is lowered by the so-called Bernoulli-effect when the cleaning gas W1 passes through the bottleneck section N of the gas flow path E1. Can be formed.

 Therefore, the injection force of the cleaning gas W1 injected through the first flow path means 10 can be improved.

The second flow path means 12 is capable of mixed injection of the cleaning liquid W2 in the same manner as a conventional venturi tube when the cleaning gas W1 is injected from the gas flow path E1. It is done.

To this end, in the present embodiment, as shown in FIG. 3, liquid flow paths E2 are formed on the mating surface F2 of the second fluid supply part 8 so that the cleaning gas W1 is injected through the gas flow paths E1. The cleaning liquid W2 is mixed and sprayed.

The liquid flow paths E2 may be opened in an ellipse or a circular shape at the coupling surface F2 of the second fluid supply part 8, and have the same spacing as the gas flow paths E1 as shown in FIG. 3. It is formed at a plurality of points on the surface F2.

In addition, the liquid flow paths E2 are formed to be positioned as shown in the figure below the bottleneck section N of the respective gas flow paths E1 as shown in FIG. 5.

This structure allows the cleaning gas W1 to pass from the liquid chamber C2 through the respective liquid flow paths E2 by a normal venturi tube action when the cleaning gas W1 passes through the bottleneck section N of the gas flow paths E1. The cleaning liquid W2 may be smoothly discharged.

That is, when the cleaning gas W1 is injected along the gas flow path E1 as shown in FIG. 3, the cleaning flow is performed from the liquid flow path E2 by the flow pressure of the cleaning gas W1 as shown in the drawing. The liquid W2 is discharged.

Therefore, two types of cleaning fluids W1 and W2 are injected through the first flow path means 10 and the second flow path means 12.

In addition, the first flow path means 10 and the second flow path means 12 are directions crossing the advancing direction of the substrate G between the first fluid supply part 6 and the second fluid supply part 8. The rectangular fluid injection section can be formed.

Therefore, the substrate cleaning apparatus according to the embodiment of the present invention is provided by the first flow path means 10 and the second flow path means 12 toward the top surface of the substrate G as shown in FIG. 3. The cleaning operation can be performed by spraying the substrate cleaning liquid W in which the cleaning fluids W1 and W2 are mixed.

In addition, the gas flow path E1 and the liquid flow path E2 are coupled surfaces F1 and F2 of the first fluid supply part 6 and the second fluid supply part 8 by a normal etching process. It is formed integrally with.

That is, the first flow path means 10 and the second flow path means 12 occupy a space between the coupling surfaces F1 and F2 of the first fluid supply part 6 and the second fluid supply part 8. It is formed in a state that does not.

Such an integrated flow path structure can be reduced in size, for example, compared to a structure in which flow paths are formed by stacking a plurality of thin plates (etching plates) having flow path grooves between a gas supply chamber and a liquid supply chamber.

In addition, as well as vibration or friction that may be generated by the injection pressure of the fluid in the passage section, and it is possible to improve the corrosion fatigue phenomenon.

The gas flow paths E1 and the liquid flow paths E2 are formed in a state where the gaps between the flow paths E1 and E2 are narrowed as much as possible when they are formed at a plurality of points along the longitudinal direction of the coupling surfaces F1 and F2. do.

This structure is idle due to the gap between the gas and liquid flow paths E1 and E2 when the cleaning operation is performed while the substrate G is moved by the transfer means 4. Space can be reduced.

In addition, the etching operation for forming the respective flow paths E1 and E2 may include non-etching areas other than the area for the respective flow paths E1 and E2 to be etched in the coupling surfaces F1 and F2. By the masked state. Thus, when the etching operation is performed, the non-etched region can be prevented from being etched.

In addition, each of the flow paths E1 and E2 may be formed through a typical multiple etching operation, that is, several etching processes.

As described above, the present invention includes a flow path means for injecting two types of cleaning fluids, such as gas and liquid, in a conventional venturi-tube principle to clean the substrate by injecting the mixed cleaning liquid. You can work on it.

In particular, the flow path means has an integral flow path structure formed directly on the coupling surface of the chambers so as not to occupy an integral space between the coupling points of the gas and liquid chambers.

Such an integrated flow path structure, for example, is easy to assemble and can be reduced in size as compared to the structure and method of forming the injection flow path while combining a plurality of sheets overlapping between two chambers.

In addition, it is possible to improve vibration, friction, and corrosion-fatigue that may occur when passing through a flow path section formed by connecting a plurality of sheets.

Therefore, the present invention not only enables uniform spraying of the cleaning fluid when the substrate cleaning operation is performed, but also ensures improved durability.

Claims (5)

A first fluid supply unit having a gas chamber for supplying a cleaning gas; A second fluid supply part coupled to the first fluid supply part and having a liquid chamber for supplying a cleaning liquid; First flow path means integrally formed on one side of the first fluid supply part to allow a cleaning gas to be injected between the first fluid supply part and the second fluid supply part; Second flow path means integrally formed on one side of the second fluid supply part such that a cleaning liquid is mixed and injected into the cleaning gas injected through the first flow path means; / RTI > The first flow path means, Composed of a plurality of gas flow paths formed at a plurality of points at regular intervals from the coupling surface of the first fluid supply portion facing the second fluid supply, The gas flow paths have a bottle-neck section in which the flow path width gradually narrows and then widens again, and the gas flow paths are formed to allow the cleaning gas to be injected from the gas chamber. The method according to claim 1, The first fluid supply part and the second fluid supply part, And a gaseous chamber and a liquid chamber in the form of a box having a rectangular shape. delete The method according to claim 1, The second flow path means, Consists of a plurality of liquid flow paths formed at a plurality of points at a predetermined interval from the coupling surface of the second fluid supply portion facing the first fluid supply, And the liquid flow paths are formed such that the cleaning liquid is sucked from the liquid chamber by the injection pressure of the cleaning gas injected through the gas flow paths in correspondence with the gas flow paths so that the liquid flow paths can be mixed and injected. The method according to claim 1, The first flow path means and the second flow path means, And the first flow path means is integrally formed on the first fluid supply part side by one or more etching processes, and the second flow path means is integrally formed on the second fluid supply part side.

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