JP4330565B2 - Substrate cleaning nozzle and substrate cleaning apparatus - Google Patents

Substrate cleaning nozzle and substrate cleaning apparatus Download PDF

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JP4330565B2
JP4330565B2 JP2005232474A JP2005232474A JP4330565B2 JP 4330565 B2 JP4330565 B2 JP 4330565B2 JP 2005232474 A JP2005232474 A JP 2005232474A JP 2005232474 A JP2005232474 A JP 2005232474A JP 4330565 B2 JP4330565 B2 JP 4330565B2
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cleaning liquid
substrate
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孝光 田寺
善二郎 山下
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シャープ株式会社
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本発明は、基板洗浄ノズルおよび基板洗浄装置に関する。   The present invention relates to a substrate cleaning nozzle and a substrate cleaning apparatus.
液晶ディスプレイ、プラズマディスプレイ(PDP)などのフラットパネルディスプレイに用いられるガラス基板、電子部品などに利用されるシリコン基板などは、それぞれの用途に要求される性能、耐久性および電気絶縁的な信頼性を一層向上させるために、高い清浄度が必要とされる。したがって、フラットパネルディスプレイ、電子部品などの製造工程では、ガラス基板、シリコン基板などを清浄化するための洗浄工程が必要不可欠である。   Glass substrates used for flat panel displays such as liquid crystal displays and plasma displays (PDPs), silicon substrates used for electronic components, etc. have the performance, durability and electrical insulation reliability required for each application. In order to improve further, high cleanliness is required. Therefore, in the manufacturing process of flat panel displays, electronic components, etc., a cleaning process for cleaning glass substrates, silicon substrates, etc. is indispensable.
また、ガラス基板、シリコン基板などの製造に際しては、生産性向上のために多面取りが採用され、基板の大型化が進み、対角2mを超えるような大型基板も製造されるので、洗浄工程も基板の大型化に対応し得ることが要求される。さらに、最近においては、フラットパネルディスプレイの表示品位の高密度高精細化への要求は増すばかりであり、前述のように基板の大型化が進む中で、基板の洗浄に際しては、基板を均一に洗浄するだけでなく、洗浄力を高め、サブミクロンレベルのパーティクルをも除去することが必要になっている。   Also, when manufacturing glass substrates, silicon substrates, etc., multi-chamfering has been adopted to improve productivity, the substrate has been increased in size, and large substrates exceeding 2 m diagonal are also manufactured. It is required to be able to cope with the increase in size of the substrate. Furthermore, recently, the demand for high-density and high-definition display quality of flat panel displays is increasing. As the size of the substrate is increasing as described above, the substrate must be made uniform when cleaning the substrate. In addition to cleaning, it is necessary to increase cleaning power and remove particles at sub-micron level.
ガラス基板、シリコン基板などの洗浄には、主に、洗浄液を満たした洗浄槽に基板を浸漬させるバッチ方式、搬送下にある基板の被洗浄面に洗浄液を噴射する枚葉方式などがある。この中でも、枚葉方式は、基板の清浄度を高めるだけでなく、バッチ式に比べ装置を大型化することなく、基板の大型化に対応でき、コストも低いという利点を持つので、基板洗浄の主流である。枚葉方式による基板の洗浄は、具体的には、搬送路に載置される基板に、搬送路を介して対向配置される少なくとも一対の基板洗浄ノズルから洗浄液を噴射することにより行われる。ここで、基板全面を均一に洗浄するためには、基板洗浄ノズルから基板全面に洗浄液を均一に噴射する必要がある。この時、洗浄液のノズルへの供給圧を高め、洗浄液の基板への噴射圧を高めることによって、サブミクロンレベルのパーティクルを除去しようとしている。   For cleaning glass substrates, silicon substrates, etc., there are mainly a batch method in which the substrate is immersed in a cleaning tank filled with a cleaning solution, and a single wafer method in which the cleaning solution is sprayed onto the surface to be cleaned of the substrate under conveyance. Among these, the single wafer method not only increases the cleanliness of the substrate, but also has the advantage that it can cope with an increase in the size of the substrate without increasing the size of the apparatus compared with the batch method, and has a low cost. Mainstream. Specifically, the cleaning of the substrate by the single wafer method is performed by spraying the cleaning liquid onto the substrate placed on the transport path from at least a pair of substrate cleaning nozzles arranged to face each other via the transport path. Here, in order to uniformly clean the entire surface of the substrate, it is necessary to spray the cleaning liquid uniformly from the substrate cleaning nozzle to the entire surface of the substrate. At this time, by increasing the supply pressure of the cleaning liquid to the nozzle and increasing the spraying pressure of the cleaning liquid onto the substrate, particles of submicron level are being removed.
従来、枚葉方式に用いられる基板洗浄ノズルとしては、一対の板状部材を所定の間隔を開けて接合し、長手方向にスリット状の開口部が形成されたスリットタイプのものが用いられる。洗浄液は、このノズル内に加圧下に供給され、スリット状の開口部から噴射される。スリットタイプのノズルは、洗浄水の圧力によりノズル両端が狭く中央が広く開口部が変形するため、開口部の両端部から噴射される洗浄液量が、開口部の中央部から噴射される洗浄液量よりも少なくなり、洗浄液を基板全面に均一に供給できないという欠点を有する。この欠点によって、基板が大型化するほど洗浄が不均一になり、洗浄後の基板の品質が著しく低下する。このような欠点は、たとえば、開口部の長手方向の寸法をさらに大きくすれば、ある程度は解決できるけれども、それによってノズルが徒らに大型化し、枚葉方式の利点が損なわれる。   Conventionally, as a substrate cleaning nozzle used in a single wafer method, a slit type nozzle in which a pair of plate-like members are joined at a predetermined interval and a slit-like opening is formed in the longitudinal direction is used. The cleaning liquid is supplied into the nozzle under pressure and is ejected from the slit-shaped opening. The slit type nozzle has a narrow nozzle end and a wide center due to the pressure of the cleaning water, and the opening is deformed. Therefore, the amount of cleaning liquid sprayed from both ends of the opening is larger than the amount of cleaning liquid sprayed from the center of the opening. And there is a disadvantage that the cleaning liquid cannot be uniformly supplied to the entire surface of the substrate. Due to this defect, the larger the substrate, the more uneven the cleaning, and the quality of the substrate after cleaning is significantly reduced. Such a defect can be solved to some extent by, for example, further increasing the length of the opening in the longitudinal direction. However, the nozzle is increased in size, and the advantages of the single wafer method are impaired.
上記の問題に徴し、スリット状開口部を有する基板洗浄ノズルにおいて、開口部の長手方向の両端部から噴射される洗浄液量が減少するのを防止した基板洗浄ノズルが提案されている(たとえば、特許文献1参照)。図5は、特許文献1に開示の基板洗浄ノズル110および該ノズル110を含む基板洗浄装置140の構成を概略的に示す断面図である。基板洗浄装置140は、基板洗浄ノズル110と、洗浄液供給手段120と、基板搬送手段130とを含んで構成される。   In view of the above problems, there has been proposed a substrate cleaning nozzle that has a slit-shaped opening and prevents the amount of cleaning liquid sprayed from both ends in the longitudinal direction of the opening from decreasing (for example, a patent) Reference 1). FIG. 5 is a cross-sectional view schematically showing a configuration of a substrate cleaning nozzle 110 disclosed in Patent Document 1 and a substrate cleaning apparatus 140 including the nozzle 110. The substrate cleaning apparatus 140 includes a substrate cleaning nozzle 110, a cleaning liquid supply unit 120, and a substrate transport unit 130.
基板洗浄ノズル110は、該ノズル110の内方に向かう面に凹所116が形成される第1の板状部材111と、第2の板状部材112とを、クシ型スペーサ113,114を介して接合したものである。第1の板状部材111と第2の板状部材112との接合は、第1の板状部材111の厚さ方向に形成される孔にネジ115を挿通し、該ネジ115を第2の板状部材112の厚さ方向に形成される雌ネジ部に螺合させることによって行われる。このノズル110は、図5の紙面に向かって前後方向に長手方向を有して延びるほぼ直方体形状に形成される。また、第2の板状部材112には、第1の板状部材111と第2の板状部材112との接合により、上記凹所116で形成される空間部117に対応するように、洗浄液受入口118がノズル110の長手方向に複数(不図示)形成される。これらの洗浄液受入口118は、空間部117に連通する。また、スペーサ114には、ノズル110の長手方向に所定の間隔を開けて図示しないスリットが形成される。ノズル110は、基板131の被洗浄面131aの上方に、該被洗浄面131aに対向するように配置される。ノズル110は、空間部117を形成し、かつスペーサ114にスリットを形成し、その内部における洗浄液の流れを整流し、洗浄液の流過圧力をほぼ均一にすることによって、洗浄液量を一定化しようとするものである。ノズル110においては、洗浄液受入口118からその内部に供給される洗浄液がこの空間部117およびスペーサ114に形成されるスリットにより整流を受けた後、スリット状開口部である洗浄液噴射孔119から基板131の被洗浄面131aに向けて噴射される。   The substrate cleaning nozzle 110 includes a first plate member 111 having a recess 116 formed on an inward surface of the nozzle 110 and a second plate member 112 via comb-type spacers 113 and 114. Are joined together. The first plate-like member 111 and the second plate-like member 112 are joined by inserting a screw 115 through a hole formed in the thickness direction of the first plate-like member 111 and inserting the screw 115 into the second plate-like member. This is performed by screwing into a female screw portion formed in the thickness direction of the plate-like member 112. This nozzle 110 is formed in a substantially rectangular parallelepiped shape extending in the longitudinal direction in the front-rear direction toward the paper surface of FIG. In addition, the second plate-like member 112 has a cleaning liquid so as to correspond to the space 117 formed by the recess 116 by joining the first plate-like member 111 and the second plate-like member 112. A plurality (not shown) of receiving ports 118 are formed in the longitudinal direction of the nozzle 110. These cleaning liquid inlets 118 communicate with the space 117. In addition, a slit (not shown) is formed in the spacer 114 at a predetermined interval in the longitudinal direction of the nozzle 110. The nozzle 110 is disposed above the surface to be cleaned 131a of the substrate 131 so as to face the surface to be cleaned 131a. The nozzle 110 forms a space 117 and forms a slit in the spacer 114, rectifies the flow of the cleaning liquid in the interior thereof, and attempts to make the amount of the cleaning liquid constant by making the cleaning liquid flow pressure almost uniform. To do. In the nozzle 110, the cleaning liquid supplied from the cleaning liquid inlet 118 is rectified by the slits formed in the space 117 and the spacer 114, and then the cleaning liquid injection hole 119 which is a slit-shaped opening from the substrate 131. Sprayed toward the surface to be cleaned 131a.
洗浄液供給手段120は、洗浄液を貯留する洗浄液貯留槽121と、洗浄液を基板洗浄ノズル110に供給する洗浄液供給管122と、洗浄液を洗浄液貯留槽121から揚液し、洗浄液を洗浄液供給管122に流過させる高圧ポンプ123とを含んで構成される。なお、洗浄液供給管122は、図示しない接続リング(押圧部材)を介して、ノズル110の洗浄液受入口118に接続される。洗浄液貯留槽121に貯留される洗浄液は、高圧ポンプ123によって洗浄液供給管122を流過し、ノズル110の洗浄液受入口118から空間部117に供給される。   The cleaning liquid supply means 120 includes a cleaning liquid storage tank 121 that stores the cleaning liquid, a cleaning liquid supply pipe 122 that supplies the cleaning liquid to the substrate cleaning nozzle 110, and a cleaning liquid that is pumped from the cleaning liquid storage tank 121 and flows to the cleaning liquid supply pipe 122. And a high-pressure pump 123 to be passed. The cleaning liquid supply pipe 122 is connected to the cleaning liquid inlet 118 of the nozzle 110 via a connection ring (pressing member) (not shown). The cleaning liquid stored in the cleaning liquid storage tank 121 flows through the cleaning liquid supply pipe 122 by the high-pressure pump 123 and is supplied from the cleaning liquid receiving port 118 of the nozzle 110 to the space 117.
基板搬送手段130は、基板131を載置しかつ搬送する基板搬送ローラ132、紙面垂直方向に複数の基板搬送ローラ132が固定された搬送シャフト133と、基板搬送ローラ132を矢符135の方向に回転させるため搬送シャフト133をその軸線回りに回転させる図示しない動力伝達機構および動力装置とを含んで構成される。基板131は、被洗浄面131aを上にして基板搬送ローラ132に載置され、搬送シャフト133の回転ひいては基板搬送ローラ132の回転駆動に伴って、矢符135の方向へ移動し、ノズル110の直下に搬送され、ノズル110からの洗浄液の噴射により、洗浄された後、さらに矢符135の方向に搬送され、次の工程に供される。   The substrate transport means 130 includes a substrate transport roller 132 on which the substrate 131 is placed and transported, a transport shaft 133 in which a plurality of substrate transport rollers 132 are fixed in the direction perpendicular to the paper surface, and the substrate transport roller 132 in the direction of the arrow 135. A power transmission mechanism and a power device (not shown) are configured to rotate the transport shaft 133 about its axis for rotation. The substrate 131 is placed on the substrate transport roller 132 with the surface to be cleaned 131a facing upward, and moves in the direction of the arrow 135 with the rotation of the transport shaft 133 and the rotation of the substrate transport roller 132. After being transported directly below and cleaned by spraying the cleaning liquid from the nozzle 110, it is further transported in the direction of the arrow 135 and provided for the next step.
基板洗浄装置140によれば、洗浄液が洗浄液貯留槽121からノズル110に供給されるのに同期して、基板131がノズル110の直下に搬送され、洗浄液136がノズル110から噴射され、基板131の被洗浄面131aには洗浄液の液流137が発生し、被洗浄面131aが洗浄される。   According to the substrate cleaning apparatus 140, the substrate 131 is transported directly below the nozzle 110 in synchronization with the supply of the cleaning solution from the cleaning solution storage tank 121 to the nozzle 110, and the cleaning solution 136 is sprayed from the nozzle 110, A liquid flow 137 of the cleaning liquid is generated on the surface 131a to be cleaned, and the surface 131a to be cleaned is cleaned.
基板洗浄装置140において、基板131上のサブミクロンレベルのパーティクルを除去するためには、ノズル110への洗浄液136の供給圧を上げて噴射流速を高める必要がある。しかしながら、ノズル110は2つの板状部材111,112でクシ型スペーサ113、114を挟んで接合したものであるため、ノズル110の内圧が上がると洗浄液噴射孔119の長手方向中央部が膨らみ、ノズル110の全幅において均一な噴射にならない。また、洗浄液136の使用量を減らすために、スリットのギャップを小さくする必要があるけれども、その場合には、クシ型スペーサ113,114のない部分からのみの噴射となり、やはり全幅における均一な噴射は得られない。したがって、ノズル110は、基板の大型化および基板に対する洗浄力の向上への要求を充分に満足できるものではない。   In order to remove the submicron level particles on the substrate 131 in the substrate cleaning apparatus 140, it is necessary to increase the spray flow rate by increasing the supply pressure of the cleaning liquid 136 to the nozzle 110. However, since the nozzle 110 is joined by sandwiching the comb spacers 113 and 114 between the two plate-like members 111 and 112, the central portion in the longitudinal direction of the cleaning liquid injection hole 119 swells when the internal pressure of the nozzle 110 rises, and the nozzle There is no uniform injection over the entire width of 110. Further, in order to reduce the amount of the cleaning liquid 136 used, it is necessary to reduce the slit gap. In that case, however, the injection is performed only from the portion without the comb-shaped spacers 113 and 114, and the uniform injection over the entire width is also performed. I can't get it. Therefore, the nozzle 110 cannot fully satisfy the demands for increasing the size of the substrate and improving the cleaning power for the substrate.
特開2000−94325号公報JP 2000-94325 A
本発明の目的は、基板の大型化および洗浄力の向上要求に対応できるスリットタイプの噴射開口部を有する基板洗浄ノズルであって、大型基板を洗浄する場合でも、該基板全面に均一に洗浄液を供給でき、しかも洗浄力を上げるために洗浄液の供給圧を高めても膨れなど変形を起こすことなく、噴射開口部の長手方向のどの部位でも、常にほぼ一定の噴射液量を維持することができる基板洗浄ノズルおよびそれを含む基板洗浄装置を提供することである。   An object of the present invention is a substrate cleaning nozzle having a slit-type injection opening that can meet the demand for an increase in substrate size and cleaning power, and even when cleaning a large substrate, the cleaning liquid is uniformly applied to the entire surface of the substrate. Even if the supply pressure of the cleaning liquid is increased in order to increase the cleaning power, it is possible to maintain a substantially constant amount of the injection liquid at any part in the longitudinal direction of the injection opening without causing deformation such as swelling. A substrate cleaning nozzle and a substrate cleaning apparatus including the same are provided.
本発明は、
略直方体形状を有し、長手方向の一端部から一端部に対向する他端部に向けて延びる凹所が形成される面を少なくとも1つ有する第1の構成部材と、
略直方体形状を有し、かつ第1の構成部材における凹所が形成される面に対して接合される面を有し、第1の構成部材と接合されることによって、前記凹所を洗浄液が流過する流路と成し、凹所が延びる方向に対して直交する方向の一側端部において、第1の構成部材の一側端部とともに外方に向けて開口する噴射開口部を形成する第2の構成部材と、
第1の構成部材と第2の構成部材との接合体における前記一端部と他端部とにおいて凹所が形成する開口部を閉塞するように設けられる第3の構成部材とを含み、
第1の構成部材の凹所は、第2の構成部材に対向する底面が、噴射開口部から噴射される洗浄液噴射方向に対する傾斜角度および/または傾斜長さが異なる2つ以上の傾斜面を有するように形成され、
第1の構成部材における凹所が形成される面に対して接合される第2の構成部材の面は、1つの段差を有して互いに平行に形成される2つの第1平面部と第2平面部とから成り、
第1の構成部材には、凹所が延びる方向に予め定める間隔をあけて第2の構成部材の第1平面部または第2平面部まで延びる柱状部が凹所内に複数形成され、
第1の構成部材と第2の構成部材とは、第1平面部が第1の構成部材の凹所が形成される面と当接し、第2平面部が第1の構成部材の凹所が形成される面と間隔を有するようにして、柱状部において接合され、
洗浄液を流過させる流路は、
第1の構成部材の凹所底面における傾斜面よりも洗浄液噴射方向の下流側において、第1の構成部材の凹所が形成される面と第2の構成部材の第2平面部とが平行に離隔して形成される洗浄液噴射路と、
洗浄液噴射路の洗浄液噴射方向の先端部において、洗浄液噴射路が外方に向けて開口する噴射開口部とを含み、
第2の構成部材の第1平面部を洗浄液噴射方向に延長した仮想平面と、洗浄液噴射路を形成する第1の構成部材の凹所が形成される面との洗浄液噴射方向に直交する方向の離隔距離は、前記仮想平面と、洗浄液噴射路を形成する第2の構成部材の第2平面部との洗浄液噴射方向に直交する方向の離隔距離と同じであることを特徴とする基板洗浄ノズルである。
The present invention
A first component member having a substantially rectangular parallelepiped shape and having at least one surface formed with a recess extending from one end in the longitudinal direction toward the other end facing the one end;
It has a substantially rectangular parallelepiped shape and has a surface bonded to the surface where the recess in the first component member is formed, and the cleaning liquid is removed from the recess by being bonded to the first component member. Formed as a flow channel that flows through and at one side end in a direction orthogonal to the direction in which the recess extends, an injection opening that opens outward together with the one side end of the first component member is formed A second component to
A third component provided to close an opening formed by a recess in the one end and the other end of the joined body of the first component and the second component;
In the recess of the first component member, the bottom surface facing the second component member has two or more inclined surfaces having different inclination angles and / or inclination lengths with respect to the cleaning liquid injection direction injected from the injection opening. Formed as
The surface of the second component member joined to the surface where the recess in the first component member is formed has two first flat portions and a second one formed in parallel with each other with one step. It consists of a plane part,
In the first component member, a plurality of columnar portions extending to the first plane portion or the second plane portion of the second component member with a predetermined interval in the direction in which the recess extends are formed in the recess.
The first component member and the second component member are such that the first flat surface portion is in contact with the surface on which the recess of the first component member is formed, and the second flat surface portion is the recess of the first component member. Joined at the columnar part so as to have a gap with the surface to be formed,
The flow path through which the cleaning liquid flows is
The surface on which the recess of the first component member is formed and the second flat surface portion of the second component member are parallel to the downstream side of the inclined surface on the bottom surface of the recess of the first component member in the cleaning liquid ejection direction. A cleaning liquid injection path formed at a distance;
A cleaning liquid injection path at the tip end in the cleaning liquid injection direction, the cleaning liquid injection path includes an injection opening that opens outward;
A direction perpendicular to the cleaning liquid ejection direction between a virtual plane obtained by extending the first planar portion of the second structural member in the cleaning liquid ejection direction and a surface on which the recess of the first structural member forming the cleaning liquid ejection path is formed. The substrate cleaning nozzle is characterized in that the separation distance is the same as the separation distance in the direction perpendicular to the cleaning liquid ejection direction between the virtual plane and the second plane portion of the second component member forming the cleaning liquid ejection path. is there.
さらに本発明の基板洗浄ノズルは、
噴射開口部に最も近接する傾斜面が、洗浄液噴射方向に対して傾斜角度15°以下および傾斜長さ10mm以下であることを特徴とする。
Furthermore, the substrate cleaning nozzle of the present invention is
The inclined surface closest to the injection opening is characterized by having an inclination angle of 15 ° or less and an inclination length of 10 mm or less with respect to the cleaning liquid injection direction.
さらに本発明の基板洗浄ノズルは、
洗浄液噴射路が、洗浄液噴射方向において1mm以上、5mm以下の長さを有することを特徴とする。
Furthermore, the substrate cleaning nozzle of the present invention is
The cleaning liquid ejection path has a length of 1 mm or more and 5 mm or less in the cleaning liquid ejection direction.
さらに本発明の基板洗浄ノズルは、
洗浄液噴射路における第1および第2の構成部材の洗浄液との接触面が、表面粗度Rmax 1μm以下であることを特徴とする。
Furthermore, the substrate cleaning nozzle of the present invention is
The contact surface of the first and second constituent members with the cleaning liquid in the cleaning liquid ejection path has a surface roughness Rmax of 1 μm or less.
さらに本発明の基板洗浄ノズルは、
第2の構成部材の第2平面部における噴射開口部から洗浄液噴射方向とは反対方向への長さが、噴射開口部の短辺長さの1000倍以上であることを特徴とする。
Furthermore, the substrate cleaning nozzle of the present invention is
The length of the second component member in the second flat portion from the injection opening in the direction opposite to the cleaning liquid injection direction is 1000 times or more the short side length of the injection opening.
さらに本発明の基板洗浄ノズルは、噴射開口部の短辺長さが50μm以下であることを特徴とする。   Furthermore, the substrate cleaning nozzle of the present invention is characterized in that the short side length of the ejection opening is 50 μm or less.
また本発明は、
前述のいずれか1つの基板洗浄ノズルと、
基板洗浄ノズルに高圧洗浄液を供給する洗浄液供給手段と、
被洗浄基板を載置して搬送する基板搬送手段とを含み、
浄液供給手段から供給される高圧洗浄液を、基板搬送手段により搬送される被洗浄基板の被洗浄面に対して傾斜させ、かつ、被洗浄基板の搬送方向下流側から上流側に向けて基板洗浄ノズルから噴射することによって被洗浄基板を洗浄することを特徴とする基板洗浄装置である。
The present invention also provides
Any one of the aforementioned substrate cleaning nozzles;
Cleaning liquid supply means for supplying a high-pressure cleaning liquid to the substrate cleaning nozzle;
Including substrate transport means for placing and transporting the substrate to be cleaned,
The high-pressure washing liquid supplied from the wash solution supply means, is inclined with respect cleaned surface of the substrate to be cleaned being conveyed by the substrate conveying means, and, toward the upstream side from the downstream side of the substrate to be cleaned substrate A substrate cleaning apparatus for cleaning a substrate to be cleaned by spraying from a cleaning nozzle.
本発明によれば、略直方体形状を有し、長手方向の一端部からそれに対向する他端部に向けて延びる凹所が形成される面(以後特に断らない限り「凹所形成面」と称す)を少なくとも1つ有する第1の構成部材と、第1の構成部材の凹所形成面に接合される面を有し、第1の構成部材と接合することによって洗浄液の流路とスリット状噴射開口部とを形成する第2の構成部材と、第1の構成部材と第2の構成部材との接合体の両端部において凹所が形成する開口部を閉塞する第3の構成部材とを含み、第1の構成部材の凹所形成面に接合される第2の構成部材の面が、段差を有して互いに平行に形成される第1平面部と第2平面部とから成り、第1平面部と凹所形成面とが当接しかつ第2平面部と凹所形成面とが離隔するように第1の構成部材と第2の構成部材とを接合して基板洗浄ノズルを形成することによって、第1の構成部材および第2の構成部材を加工する際に、それぞれの接合面を基準にして主要部の加工を比較的容易に実行でき、加工精度を向上させ得る。したがって、スリット状噴射開口部のギャップ量を所望の値に調整することが容易であり、しかも長手方向において均一にかつ精度良く形成できる。また、前記の構成によって、基板洗浄ノズル内部での流路抵抗を小さくすることができるので、洗浄液の噴射圧を高めても、膨れなどの変形が極めて生じ難く、噴射開口部の長手方向中央部および端部のいずれでも洗浄液噴射量がほぼ等量になる。したがって、洗浄液噴射圧を高め、基板表面における洗浄液の均一な高速せん断流を形成できるので、基板洗浄力が一層向上し、被洗浄面の微細なパーティクルも容易に除去できる。また、洗浄液が被洗浄面に均一に噴射されるので、従来のスリットノズルより洗浄液の噴射量を減らすことも可能であり、洗浄液の消費量を削減できる。   According to the present invention, a surface having a substantially rectangular parallelepiped shape and formed with a recess extending from one end portion in the longitudinal direction toward the other end portion facing it (hereinafter referred to as a “recess formation surface” unless otherwise specified). ) And a surface bonded to the recess forming surface of the first component, and the flow path of the cleaning liquid and the slit-shaped injection by bonding to the first component A second constituent member that forms the opening, and a third constituent member that closes the opening formed by the recess at both ends of the joined body of the first constituent member and the second constituent member. The surface of the second component member joined to the recess forming surface of the first component member includes a first plane portion and a second plane portion formed in parallel with each other with a step, The first component portion so that the flat surface portion and the recess forming surface are in contact with each other and the second flat surface portion and the recess forming surface are separated from each other. When the first component member and the second component member are processed, the main portion is processed with reference to the respective bonding surfaces. It can be executed relatively easily, and the processing accuracy can be improved. Therefore, it is easy to adjust the gap amount of the slit-shaped injection opening to a desired value, and it can be formed uniformly and accurately in the longitudinal direction. In addition, since the flow path resistance inside the substrate cleaning nozzle can be reduced by the above-described configuration, even if the cleaning liquid spray pressure is increased, deformation such as swelling is hardly caused, and the central portion in the longitudinal direction of the spray opening portion. The cleaning liquid injection amount is almost equal at both the end portion and the end portion. Accordingly, since the cleaning liquid jet pressure can be increased and a uniform high-speed shear flow of the cleaning liquid on the substrate surface can be formed, the substrate cleaning power can be further improved and fine particles on the surface to be cleaned can be easily removed. Further, since the cleaning liquid is uniformly sprayed onto the surface to be cleaned, it is possible to reduce the amount of cleaning liquid sprayed from the conventional slit nozzle, and the consumption of the cleaning liquid can be reduced.
したがって、本発明の基板洗浄ノズルは、基板の大型化および洗浄力の向上要求に充分対応可能であり、特に枚葉方式により基板を洗浄する際に、非常に好適に使用できる。
また、第1の構成部材に形成される凹所の第2の構成部材に対向する底面を、洗浄液噴射方向に対する傾斜角度および/または傾斜長さが異なる2つ以上の傾斜面を有するように形成することによって、スリット状噴射開口部のギャップ量が小さく、そのギャップ量に合わせるために基板洗浄ノズル内で流路のギャップを短い流路長で絞っても、圧力損失を低減させ、高圧洗浄液の円滑な噴射を実現できる。
また、洗浄液流路が、第1の構成部材の凹所底面における傾斜面よりも洗浄液噴射方向の下流側において、第1の構成部材の凹所形成面と第2の構成部材の第2平面部とが平行に離隔して形成される洗浄液噴射路と、洗浄液噴射路が外方に向けて開口する噴射開口部とを含む構成を採ることによって、洗浄液のノズル外方への噴射方向が一層均一化し、基板の被洗浄面を一層均一に洗浄できる。
また、洗浄液噴射路において、第2の構成部材の第1平面部を洗浄液噴射方向に延長した仮想平面と、洗浄液噴射路を形成する第1の構成部材の凹所形成面および第2の構成部材の第2平面部との、洗浄液噴射方向に直交する方向のそれぞれの離隔距離が同じになるような構成を採ることによって、第1および第2の構成部材を研削盤で仕上げ加工することが可能になり、これらの構成部材を精度良く作製できる。
また、第1の構成部材の凹所内に、凹所が延びる方向に適切な間隔をあけて第2の構成部材の第1平面部または第2平面部まで延びる柱状部を複数形成し、この柱状部において第1の構成部材と第2の構成部材とを接合する構成を採ることによって、噴射開口部の近傍にて第1の構成部材と第2の構成部材とが接合されるので、流路内での洗浄液の圧力が高くなっても、噴射開口部の膨れなどの変形、洗浄液漏れなどがさらに起こり難くなり、基板洗浄ノズルの長手方向全幅において噴射開口部のギャップ量を均一に保持できる。
Therefore, the substrate cleaning nozzle of the present invention can sufficiently meet the demands for increasing the size of the substrate and improving the cleaning power, and can be used particularly suitably when cleaning a substrate by a single wafer method.
Further, the bottom surface facing the second constituent member of the recess formed in the first constituent member is formed to have two or more inclined surfaces having different inclination angles and / or inclination lengths with respect to the cleaning liquid ejection direction. As a result, the gap amount of the slit-like injection opening is small, and even if the gap of the flow path is narrowed with a short flow path length in the substrate cleaning nozzle in order to match the gap amount, the pressure loss is reduced, and the high-pressure cleaning liquid Smooth injection can be realized.
In addition, the cleaning liquid flow path is located downstream of the inclined surface of the bottom surface of the recess of the first component member in the cleaning liquid ejection direction, and the second flat surface portion of the second component member and the recess forming surface of the first component member. The cleaning liquid ejection path is formed in parallel with the cleaning liquid ejection path, and the cleaning liquid ejection path is configured to include an ejection opening that opens outward. And the surface to be cleaned of the substrate can be more uniformly cleaned.
Further, in the cleaning liquid ejection path, a virtual plane obtained by extending the first planar portion of the second component member in the cleaning liquid ejection direction, a recess forming surface of the first component member that forms the cleaning liquid ejection path, and the second component member It is possible to finish the first and second constituent members with a grinding machine by adopting a configuration in which the respective separation distances in the direction perpendicular to the cleaning liquid injection direction are the same with the second flat surface portion Thus, these constituent members can be produced with high accuracy.
In addition, a plurality of columnar portions extending to the first plane portion or the second plane portion of the second component member are formed in the recesses of the first component member at appropriate intervals in the direction in which the recesses extend. Since the first constituent member and the second constituent member are joined in the vicinity of the injection opening by adopting a construction in which the first constituent member and the second constituent member are joined in the section, the flow path Even when the pressure of the cleaning liquid in the chamber increases, deformation such as swelling of the spray opening and leakage of the cleaning liquid are less likely to occur, and the gap amount of the spray opening can be kept uniform over the entire longitudinal width of the substrate cleaning nozzle.
本発明によれば、噴射開口部に最も近接する傾斜面を、傾斜角度15°以下および傾斜長さ10mm以下に形成することによって、圧力損失が著しく低減化され、基板洗浄ノズルの洗浄力向上が顕著である。 According to the present invention, an inclined surface which is closest to the jetting opening, by forming the following tilt angles greater than 15 ° and inclined length 10 mm, pressure loss is significantly reduced, improving detergency substrate cleaning nozzle Is remarkable.
本発明によれば、洗浄液噴射路の洗浄液噴射方向の長さを1mm以上、5mm以下にすることによって、洗浄液噴射路内で整流効果が高まり、洗浄液を基板洗浄ノズルの長手方向全幅において均一な液膜として噴射でき、膜切れを起こすこともない。   According to the present invention, by setting the length of the cleaning liquid ejection path in the cleaning liquid ejection direction to 1 mm or more and 5 mm or less, the rectifying effect is enhanced in the cleaning liquid ejection path, and the cleaning liquid is uniformly liquid over the entire width in the longitudinal direction of the substrate cleaning nozzle. Can be sprayed as a film without causing film breakage.
本発明によれば、洗浄液噴射路における第1および第2の構成部材の洗浄液との接触面を表面粗度Rmax=1μm以下となるように構成することによって、接触面に1μm以上の突起物が存在しないことになり、突起物が原因になる膜切れが一層起こり難くなる。   According to the present invention, the contact surface with the cleaning liquid of the first and second constituent members in the cleaning liquid ejection path is configured so that the surface roughness Rmax = 1 μm or less, whereby protrusions of 1 μm or more are formed on the contact surface. It will not exist, and film breakage caused by protrusions will be less likely to occur.
本発明によれば、第2の構成部材における第2平面の、噴射開口部から洗浄液噴射方向とは反対方向への長さを、噴射開口部の短辺長さの1000倍以上にする構成を採ることによって、第1平面部と第2平面部との段差による流路抵抗をさらに小さくすることができる。   According to the present invention, the length of the second plane of the second component member from the injection opening to the direction opposite to the cleaning liquid injection direction is set to be 1000 times or more the short side length of the injection opening. By adopting, the flow path resistance due to the step between the first plane part and the second plane part can be further reduced.
本発明によれば、噴射開口部の短辺長さを50μm以下にする構成を採ることによって、ミクロンオーダーのギャップ量を有する噴射開口部を精度良くかつ容易に形成することができ、液膜の薄い洗浄液膜を噴射することが可能になる。これは、洗浄能力の向上および洗浄液使用量の低減化に寄与する。   According to the present invention, by adopting a configuration in which the short side length of the injection opening is set to 50 μm or less, the injection opening having a gap amount of micron order can be accurately and easily formed. A thin cleaning liquid film can be ejected. This contributes to an improvement in cleaning capability and a reduction in the amount of cleaning liquid used.
本発明によれば、前述のいずれか1つの基板洗浄ノズルと、洗浄液供給手段と、基板搬送手段とを含む基板洗浄装置が提供される。そして、洗浄液供給手段から供給される高圧洗浄液を、基板搬送手段により搬送される被洗浄基板の被洗浄面に対して傾斜させ、かつ、被洗浄基板の搬送方向下流側から上流側に向けて基板洗浄ノズルから噴射することによって被洗浄基板を洗浄する。本発明の基板洗浄装置によれば、基板搬送手段によって搬送される基板の被洗浄面全幅に対して均一で高速な洗浄液流を噴射し、その衝突の際の衝撃力で被洗浄面上のパーティクルを浮き上がらせ、被洗浄面上に形成される洗浄液のせん断流でパーティクルを押し流すことによって被洗浄面の全面を均一に洗浄できる。本発明の基板洗浄装置は、被洗浄基板の大型化および洗浄能力の向上要求に容易に応えることができ、特に枚葉式の基板洗浄に好適に使用できる。 According to the present invention, there is provided a substrate cleaning apparatus including any one of the above-described substrate cleaning nozzles, a cleaning liquid supply unit, and a substrate transfer unit. Then, the high-pressure cleaning liquid supplied from the cleaning liquid supply unit is inclined with respect to the surface to be cleaned of the substrate to be cleaned conveyed by the substrate conveying unit, and the substrate is directed from the downstream side to the upstream side in the conveyance direction of the substrate to be cleaned. The substrate to be cleaned is cleaned by spraying from the cleaning nozzle. According to the substrate cleaning apparatus of the present invention, a uniform and high-speed cleaning liquid flow is ejected over the entire width of the surface to be cleaned transported by the substrate transport means, and particles on the surface to be cleaned are generated by the impact force at the time of the collision. The entire surface to be cleaned can be cleaned uniformly by lifting the particles and pushing away the particles with the shearing flow of the cleaning liquid formed on the surface to be cleaned. The substrate cleaning apparatus of the present invention can easily meet the demand for an increase in the size of a substrate to be cleaned and an improvement in cleaning capability, and can be suitably used particularly for single wafer cleaning.
図1は、本発明の実施の第1形態である基板洗浄装置1の構成を模式的に示す断面図である。図2は、図1に示す基板洗浄ノズル2の外観を示す斜視図である。図3(a)、(b)および(c)は、それぞれ、図2に示す切断面線I−I、II−IIおよびIII−IIIから見た断面図である。図4は、図1に示す基板洗浄ノズル2の吐出部周辺を拡大して示す断面図である。   FIG. 1 is a cross-sectional view schematically showing a configuration of a substrate cleaning apparatus 1 according to a first embodiment of the present invention. FIG. 2 is a perspective view showing an appearance of the substrate cleaning nozzle 2 shown in FIG. FIGS. 3A, 3B, and 3C are cross-sectional views taken along section lines II, II-II, and III-III shown in FIG. 2, respectively. 4 is an enlarged cross-sectional view showing the periphery of the discharge portion of the substrate cleaning nozzle 2 shown in FIG.
基板洗浄装置1は、基板洗浄ノズル2と、基板搬送手段30と、洗浄液供給手段31とを含んで構成される。   The substrate cleaning apparatus 1 includes a substrate cleaning nozzle 2, a substrate transport unit 30, and a cleaning liquid supply unit 31.
基板洗浄ノズル2は、スリット状の噴射開口部11が基板3の被洗浄面3aを臨んで基板3の上方に配置され、その長手方向が、被洗浄面3aにおける基板搬送方向34に対して垂直な方向(以後「基板3の幅方向」と称す)に延びる。基板洗浄ノズル2の長手方向の寸法は、基板3の幅方向の寸法よりも長く形成される。   The substrate cleaning nozzle 2 is arranged above the substrate 3 with the slit-shaped ejection opening 11 facing the surface to be cleaned 3a of the substrate 3, and its longitudinal direction is perpendicular to the substrate transport direction 34 on the surface to be cleaned 3a. Extending in a certain direction (hereinafter referred to as the “width direction of the substrate 3”). The dimension of the substrate cleaning nozzle 2 in the longitudinal direction is longer than the dimension of the substrate 3 in the width direction.
基板洗浄ノズル2は、第1の構成部材5と、第2の構成部材6と、ボルト7,8と、第3の構成部材9a,9bと、シール部材10a,10bとを含んで構成される。   The substrate cleaning nozzle 2 includes a first component member 5, a second component member 6, bolts 7 and 8, third component members 9a and 9b, and seal members 10a and 10b. .
いずれも略直方体状の第1の構成部材5と第2の構成部材6との接合により、第1の構成部材5の第2構成部材6との接合面(凹所形成面12)に形成される凹所13を洗浄液4が流過する流路19が形成され、さらに、第1の構成部材5および第2の構成部材6の凹所13が延びる方向(第1の構成部材5の長手方向)に直交する方向のそれぞれの一側端部により、流路19が外方に向けて開口する噴射開口部11が形成される。   Both are formed on the joint surface (recess forming surface 12) of the first component member 5 with the second component member 6 by joining the first component member 5 and the second component member 6 having a substantially rectangular parallelepiped shape. The flow path 19 through which the cleaning liquid 4 flows through the recess 13 is formed, and the direction in which the recess 13 of the first component member 5 and the second component member 6 extends (the longitudinal direction of the first component member 5). ) To form an ejection opening 11 in which the flow path 19 opens outward.
第1の構成部材5は略直方体形状を有し、長手方向の一端部から該一端部に対向する他端部に向けて延びる凹所13が形成され、第2の構成部材6における所定の面と当接される凹所形成面12を有する。   The first component member 5 has a substantially rectangular parallelepiped shape, and is formed with a recess 13 extending from one end portion in the longitudinal direction toward the other end portion facing the one end portion, and a predetermined surface of the second component member 6 And has a recess-forming surface 12 to be brought into contact with.
凹所13は、噴射開口部11から最も離反し、第2の構成部材6に対向する底面13aが第2の構成部材6の対向面に対して平行に形成される凹所13xと、凹所13xに連続して噴射開口部11から噴射される洗浄液噴射方向(噴射開口部11に近接する方向、以後単に「洗浄液噴射方向」と称す)に、第2の構成部材6に対向する底面13bが第2の構成部材6の対向面に対して平行に形成され、洗浄液噴射方向に垂直な方向における凹所形成面12から底面13bまでの間隔である凹所深さが凹所13xよりも小さい凹所13yと、凹所13yに連続して洗浄液噴射方向に、第2の構成部材6に対向する底面13cが洗浄液噴射方向に対する傾斜角度および/または傾斜長さが異なる2つ以上の傾斜面を有するように形成される凹所13zとを含んで構成される。凹所13zにおいては、その底面13cは、凹所13yに隣接する部分では洗浄液噴射方向に対する傾斜角度(以後単に「傾斜角度」という)が比較的ゆるやかになるように形成され、そこから噴射開口部11に近接するほど傾斜角度が鋭角になり、噴射開口部11に近接するほど、第2の構成部材6の対向面にも近接するように形成される。底面13cの傾斜角度を鋭角にするほど圧力損失を小さくできるけれども、その反面凹所13zの洗浄液噴射方向の長さが大きくなり、それによって後述する洗浄液供給口18から噴射開口部11までの距離が長くなり、基板洗浄ノズル2が大型化するという弊害が発生する。そこで、凹所13zの洗浄液噴射方向の長さを短く保持したまま、圧力損失を小さくするために、底面13cの傾斜角度を鈍角から鋭角まで多段階で変化させる。すなわち、凹所13yに隣接する部分では流路19を急激に絞り、噴射開口部11に近接するほど流路19の絞りが緩やかになるように底面13cの傾斜角度を変化させる。凹所13yに隣接する部分における流路19の絞りは急激であるけれども、洗浄液噴射方向に垂直な方向における流路19の断面積を1/10程度に縮小する絞りであるので、圧力損失は小さい。凹所13zの底面13cの噴射開口部11に最も近接する傾斜面は傾斜角度15°以下および傾斜長さ10mm以下に形成されるのが好ましい。本実施の形態では、底面13cの凹所13yに隣接する傾斜面の傾斜角度を45°、底面13cの噴射開口部11に最も近接する傾斜面の傾斜角度を10°とし、噴射開口部11のギャップ量を0.015mmとすることによって、洗浄液4を60m/sの流速で噴射することができ、基板洗浄を効果的に実施できる。   The recess 13 is farthest from the injection opening 11, and the bottom surface 13 a facing the second component member 6 is formed in parallel with the facing surface of the second component member 6. A bottom surface 13b that faces the second component member 6 in a cleaning liquid spraying direction (a direction close to the spraying opening 11 and hereinafter simply referred to as a “cleaning liquid spraying direction”) sprayed from the spraying opening 11 continuously to 13x. A recess formed parallel to the opposing surface of the second component 6 and having a recess depth smaller than the recess 13x, which is the distance from the recess forming surface 12 to the bottom surface 13b in the direction perpendicular to the cleaning liquid ejection direction. The bottom surface 13c facing the second component member 6 has two or more inclined surfaces with different inclination angles and / or inclination lengths with respect to the cleaning liquid injection direction in the cleaning liquid injection direction continuously to the location 13y and the recess 13y. Recess 1 formed like Configured to include a and z. In the recess 13z, the bottom surface 13c is formed so that the inclination angle with respect to the cleaning liquid injection direction (hereinafter simply referred to as “inclination angle”) is relatively gentle in the portion adjacent to the recess 13y, from which the injection opening portion is formed. 11 is formed so as to be closer to the opposing surface of the second component member 6 as it is closer to the ejection opening 11. Although the pressure loss can be reduced as the inclination angle of the bottom surface 13c becomes sharper, the length of the recess 13z in the cleaning liquid injection direction is increased, and the distance from the cleaning liquid supply port 18 to the injection opening 11 described later is thereby increased. As a result, the length of the substrate cleaning nozzle 2 is increased. Therefore, the inclination angle of the bottom surface 13c is changed in multiple steps from an obtuse angle to an acute angle in order to reduce the pressure loss while keeping the length of the recess 13z in the cleaning liquid ejection direction short. That is, the flow path 19 is rapidly throttled at a portion adjacent to the recess 13y, and the inclination angle of the bottom surface 13c is changed so that the throttle of the flow path 19 becomes gentler as it comes closer to the injection opening 11. Although the restriction of the flow path 19 in the portion adjacent to the recess 13y is abrupt, the pressure loss is small because the restriction reduces the cross-sectional area of the flow path 19 in the direction perpendicular to the cleaning liquid injection direction to about 1/10. . It is preferable that the inclined surface closest to the injection opening 11 of the bottom surface 13c of the recess 13z is formed with an inclination angle of 15 ° or less and an inclination length of 10 mm or less. In the present embodiment, the inclination angle of the inclined surface adjacent to the recess 13y of the bottom surface 13c is 45 °, the inclination angle of the inclined surface closest to the injection opening 11 of the bottom surface 13c is 10 °, and the injection opening 11 By setting the gap amount to 0.015 mm, the cleaning liquid 4 can be sprayed at a flow rate of 60 m / s, and substrate cleaning can be performed effectively.
さらに、凹所13xと凹所13yとの境目および凹所13yと凹所13zとの境目には、それぞれ、凹所13が延びる方向に予め定める間隔をあけて、第2の構成部材6の対向面まで延びる支持部14a,14bが形成され、凹所13の高圧洗浄液4に対する耐久性などを向上させる。   Further, the boundary between the recess 13x and the recess 13y and the boundary between the recess 13y and the recess 13z are opposed to the second component member 6 with predetermined intervals in the extending direction of the recess 13, respectively. Support portions 14a and 14b extending to the surface are formed, and durability of the recess 13 with respect to the high-pressure cleaning liquid 4 is improved.
また、凹所13内には、凹所13が延びる方向に予め定める間隔をあけて第2の構成部材6の対向面(後述する第1平面部20aまたは第2平面部20b)まで延びる柱状部16が形成される。この柱状部16を利用して、第1の構成部材5の凹所形成面12に対向する面5aから柱状部16の第2の構成部材6との当接面に向けて、洗浄液噴射方向に垂直な方向に第1の構成部材5を貫通するようにボルト挿入孔7aが形成される。ボルト挿入孔7aを臨む、柱状部16を含む第1の構成部材5の内壁には、雌ねじが刻設され、第1の構成部材5と第2の構成部材6とを接合するためボルト7が挿入される。   Further, in the recess 13, a columnar portion that extends to a facing surface (a first flat surface portion 20 a or a second flat surface portion 20 b described later) of the second component member 6 with a predetermined interval in the extending direction of the recess 13. 16 is formed. Using this columnar portion 16, in the cleaning liquid ejection direction from the surface 5 a facing the recess forming surface 12 of the first component member 5 toward the contact surface with the second component member 6 of the columnar portion 16. A bolt insertion hole 7a is formed so as to penetrate the first component member 5 in the vertical direction. An internal thread is engraved on the inner wall of the first component member 5 including the columnar portion 16 facing the bolt insertion hole 7a, and the bolt 7 is used to join the first component member 5 and the second component member 6 together. Inserted.
また、第1の構成部材5には、第1の構成部材5の長手方向において所定の間隔をあけて、面5aから凹所形成面12に向けて、洗浄液噴射方向に垂直な方向に、第1の構成部材5を貫通するように、第1の構成部材5と第2の構成部材6とを接合するためのボルト8を挿入するボルト挿入孔8aと、第1の構成部材5と第2の構成部材6とを接合する際の位置決め用ピン17を挿入するためのピン挿入孔17aとが形成される。ボルト挿入孔8aを臨む第1の構成部材5の内壁には、雌ねじが刻設される。   In addition, the first component member 5 is provided with a predetermined interval in the longitudinal direction of the first component member 5, in a direction perpendicular to the cleaning liquid injection direction from the surface 5 a toward the recess forming surface 12. A bolt insertion hole 8a for inserting a bolt 8 for joining the first component member 5 and the second component member 6 so as to penetrate the first component member 5, and the first component member 5 and the second component member 5 The pin insertion hole 17a for inserting the positioning pin 17 when joining the component member 6 is formed. An internal thread is engraved on the inner wall of the first component 5 facing the bolt insertion hole 8a.
また、第1の構成部材5は、面5aにおいて長手方向に所定の間隔をあけて外方に開口しかつ凹所13xに連通する洗浄液供給口18が1または2以上形成される。洗浄液供給口18は、洗浄液供給手段31の洗浄液供給管37に接続される。洗浄液供給手段31については後述する。   Further, the first component member 5 is formed with one or more cleaning liquid supply ports 18 which open outwardly at a predetermined interval in the longitudinal direction on the surface 5a and communicate with the recess 13x. The cleaning liquid supply port 18 is connected to a cleaning liquid supply pipe 37 of the cleaning liquid supply means 31. The cleaning liquid supply means 31 will be described later.
第1の構成部材5は、たとえば、その凹所形成面12において研削加工により凹所13を形成し、仕上げ加工の際に、凹所形成面12における、凹所13以外の部分である面12a,12b,12cを同時加工することにより、これらの面が1つの仮想平面内に含まれるように高い精度で加工される。面12a,12b,12cの加工には、たとえば、研削盤が用いられる。そのためには、第1の構成部材5の短手方向における断面形状を、研削盤による仕上げが可能な形状にしておく必要がある。特に、仕上げが必要な部分に対して、同一の砥石で加工できるように、仕上げが必要な面(ここでは面12a,12b,12c)から突起を設けない断面形状とするのが好ましい。   The first component member 5 is formed, for example, by forming a recess 13 in the recess forming surface 12 by grinding, and a surface 12a that is a portion other than the recess 13 in the recess forming surface 12 in the finishing process. , 12b, and 12c are processed with high accuracy so that these surfaces are included in one virtual plane. For example, a grinding machine is used for processing the surfaces 12a, 12b, and 12c. For this purpose, the cross-sectional shape of the first component member 5 in the short direction needs to be a shape that can be finished by a grinding machine. In particular, it is preferable to form a cross-sectional shape in which no protrusion is provided from the surfaces that need to be finished (here, the surfaces 12a, 12b, and 12c) so that the portions that need to be finished can be processed with the same grindstone.
略直方体形状の部材である第2の構成部材6において、第1の構成部材5の凹所形成面12に対して接合される接合面20は、1つの段差を有して互いに平行に形成される第1平面部20aと、第2平面部20bとからなる。第1平面部20aおよび第2平面部20bは第2の構成部材6を加工形成する際に同時に加工されるので、それぞれが高い平面度を有し、かつ2つの面の平行度が高い精度を有するように仕上げられる。   In the second component member 6 which is a substantially rectangular parallelepiped member, the joint surfaces 20 to be joined to the recess forming surface 12 of the first component member 5 are formed in parallel to each other with one step. The first plane portion 20a and the second plane portion 20b. Since the first flat surface portion 20a and the second flat surface portion 20b are processed at the same time when the second component member 6 is processed and formed, each has high flatness and high parallelism between the two surfaces. Finished to have.
第1の構成部材5と第2の構成部材6との接合体において、第1平面部20aは少なくともその一部が凹所形成面12に当接する。また、該接合体において、第2平面部20bと凹所形成面12、特に面12cとは平行に離隔し、これによって、洗浄液噴射路19aと、洗浄液噴射路19aの洗浄液噴射方向の先端部において、洗浄液噴射路19aが外方に向けて開口する噴射開口部11とが形成される。ここで、第1の構成部材5の面12cおよび第2の構成部材6の第2平面部20bは、前述のように、いずれも高い平面度を有し、高い精度で仕上げられるので、面12cと第2平面部20bとの間隔を高精度で管理でき、洗浄液噴射方向に直交する方向の長さが均一な洗浄液噴射路19aを形成できる。洗浄液噴射路19aは流路19の一部を成す。洗浄液噴射路19aの洗浄液噴射方向の長さは1mm以上、5mm以下であることが好ましい。また洗浄液噴射路19aにおいて、第1の構成部材5の面12cおよび第2の構成部材6の第2平面部20bにおける少なくとも洗浄液4と接触する部分は、表面粗度Rmax=1μm以下になるように形成するのが好ましい。面12cおよび第2平面部20bを前記表面粗度になるように形成してもよい。また、洗浄液噴射路19aにおいて、第2の構成部材6の第1平面部20aを洗浄液噴射方向に延長した仮想平面と、面12cおよび第2平面部20bとの洗浄液噴射方向に直交する方向の離隔距離が同じであるように洗浄液噴射路19aが形成される。 In the joined body of the first component member 5 and the second component member 6, at least a part of the first plane portion 20 a abuts on the recess forming surface 12. Further, in the joined body, the second flat surface portion 20b and the recess forming surface 12, particularly the surface 12c, are separated in parallel, and thereby the cleaning liquid ejection path 19a and the cleaning liquid ejection path 19a at the front end in the cleaning liquid ejection direction. Then, the ejection opening portion 11 in which the cleaning liquid ejection path 19a opens outward is formed. Here, as described above, the surface 12c of the first component member 5 and the second planar portion 20b of the second component member 6 both have high flatness and are finished with high accuracy. And the second flat surface portion 20b can be managed with high accuracy, and the cleaning liquid ejection path 19a having a uniform length in the direction orthogonal to the cleaning liquid ejection direction can be formed. The cleaning liquid ejection path 19 a forms part of the flow path 19. The length of the cleaning liquid ejection path 19a in the cleaning liquid ejection direction is preferably 1 mm or more and 5 mm or less. In the cleaning liquid ejection path 19a, at least a portion of the surface 12c of the first component member 5 and the second flat surface portion 20b of the second component member 6 that is in contact with the cleaning solution 4 has a surface roughness Rmax = 1 μm or less. Preferably formed. You may form the surface 12c and the 2nd plane part 20b so that it may become the said surface roughness. Further, in the cleaning liquid ejection path 19a, a virtual plane obtained by extending the first planar portion 20a of the second component member 6 in the cleaning liquid ejection direction, and a separation in a direction perpendicular to the cleaning liquid ejection direction between the surface 12c and the second planar portion 20b. distance Ru are cleaning solution injection path 19a is formed to be the same.
また、接合面20には、第1の構成部材5のボルト挿入孔7a,8aおよび位置決め用ピン挿入孔17aに対応する位置に、ボルト挿入孔7b,8bおよび位置決めようピン挿入孔17bが形成される。ボルト挿入孔7b,8bを臨む第2の構成部材6の内壁には、雌ねじが刻設される。また、ボルト挿入孔7b,8bは、接合面19から第2の構成部材6における接合面19に対向する面6aに向けて、洗浄液噴射方向に直交する方向に形成されるけれども、第2の構成部材6を前記の方向に貫通しないように形成される。一方、ピン挿入孔17bは、洗浄液噴射方向に直交する方向において、接合面19から面6aに向けて第2の構成部材6を貫通するように形成される。   Further, bolt insertion holes 7b, 8b and a pin insertion hole 17b for positioning are formed in the joint surface 20 at positions corresponding to the bolt insertion holes 7a, 8a and the positioning pin insertion hole 17a of the first component member 5. The On the inner wall of the second component member 6 facing the bolt insertion holes 7b, 8b, a female screw is engraved. Further, the bolt insertion holes 7b and 8b are formed in a direction orthogonal to the cleaning liquid ejection direction from the joint surface 19 toward the surface 6a facing the joint surface 19 in the second component member 6. It is formed so as not to penetrate the member 6 in the aforementioned direction. On the other hand, the pin insertion hole 17b is formed so as to penetrate the second component member 6 from the joint surface 19 toward the surface 6a in a direction orthogonal to the cleaning liquid ejection direction.
第1の構成部材5と第2の構成部材6との接合は、たとえば、第1の構成部材5のピン挿入孔17aに凹所形成面12の方から位置決め用ピン17の一部を挿入し、位置決め用ピン17の凹所形成面12から外方に向けて突出する部分を、第2の構成部材6における接合面20の方からピン挿入孔17bに嵌入して第1の構成部材5の凹所形成面12と第2の構成部材6の接合面20とを当接し、さらにボルト7が第1の構成部材5における面5aの方からボルト挿入孔7a,7bに挿入され、ボルト8が第1の構成部材5における面5aの方からボルト挿入孔8a,8bに挿入され、それぞれの雌ねじに螺合されることによって行われる。これにより、第1の構成部材5と第2の構成部材6との接合体が得られる。   For joining the first component member 5 and the second component member 6, for example, a part of the positioning pin 17 is inserted into the pin insertion hole 17 a of the first component member 5 from the recess forming surface 12. The portion of the positioning pin 17 that protrudes outward from the recess forming surface 12 is fitted into the pin insertion hole 17b from the joint surface 20 of the second component member 6 to the first component member 5. The recess forming surface 12 and the joint surface 20 of the second component member 6 are brought into contact with each other, and the bolt 7 is inserted into the bolt insertion holes 7a and 7b from the surface 5a of the first component member 5, and the bolt 8 is The first component 5 is inserted into the bolt insertion holes 8a and 8b from the surface 5a and screwed into the respective female screws. Thereby, the joined body of the 1st component member 5 and the 2nd component member 6 is obtained.
第3の構成部材9a,9bは、第1の構成部材5と第2の構成部材6との接合体における凹所が延びる方向(長手方向)の一端部と、該一端部に対向する他端部において凹所が外方に向けて開口する開口部を閉塞するための板状部材であり、該接合体の短手方向の断面形状と同一の形状に形成されるのが好ましい。第3の構成部材9a,9bを該接合体に押圧して固定するために、シール材10a,10bが用いられる。シール材10a,10bには、たとえば、パッキンなどが用いられる。   The third component members 9a and 9b include one end portion in the direction (longitudinal direction) in which the recess in the joined body of the first component member 5 and the second component member 6 extends, and the other end facing the one end portion. It is a plate-like member for closing the opening in which the recess opens outward, and is preferably formed in the same shape as the cross-sectional shape in the short direction of the joined body. Sealing members 10a and 10b are used to press and fix the third component members 9a and 9b to the joined body. For example, packing is used for the sealing materials 10a and 10b.
基板洗浄ノズル2によれば、洗浄液供給口18から供給される洗浄液4を流路19内に流過させ、スリット状の噴射開口部11から外方に向けて均一な液膜である噴射流21を噴射する。噴射流21は、基板3の搬送方向34の下流側から上流側に向けて(すなわち搬送方向34とは逆方向に)、基板3の被洗浄面3aに噴射される。これにより、被洗浄面3a上で洗浄液4のせん断流22が発生し、被洗浄面3aに付着するパーティクルなどの微粒子、汚れなどを、後続の工程で問題にならない程度またはそれ以下の程度まで除去する。また、噴射流21の噴射によって、基板3の搬送方向34の下流側から上流側に向けてせん断流22が発生するので、被洗浄面3aから除去される微粒子、汚れなどは速やかに基板3の幅方向(被洗浄面3aにおいて搬送方向34に直交する方向)に流過し、洗浄液34とともに被洗浄面3aから下方に落下する。したがって、一旦除去された微粒子、汚れなどの被洗浄面3aへの再付着も防止される。基板洗浄ノズル2から噴射される噴射流21の噴射速度は、被洗浄面3aに付着する微粒子、汚れなどの種類、洗浄後の基板3の用途などに応じて、広い範囲から適宜決定できるので、常に、被洗浄面3aを所望の清浄度に洗浄できる。また、基板洗浄ノズル1から噴射される噴射流21と、基板3の被洗浄面3aとがなす傾斜角度θは、特に制限されないけれども、好ましくは45〜90°である。傾斜角度θの大きさが、たとえば、せん断流22の流速に影響を及ぼすので、被洗浄面3aに付着する微粒子、汚れなどの種類に応じて傾斜角度θを適宜決定してもよい。   According to the substrate cleaning nozzle 2, the cleaning liquid 4 supplied from the cleaning liquid supply port 18 is allowed to flow into the flow path 19, and the jet flow 21 is a uniform liquid film outward from the slit-shaped jet opening 11. Inject. The jet stream 21 is jetted onto the surface to be cleaned 3 a of the substrate 3 from the downstream side to the upstream side in the transport direction 34 of the substrate 3 (that is, in the direction opposite to the transport direction 34). As a result, a shear flow 22 of the cleaning liquid 4 is generated on the surface to be cleaned 3a, and particles and dirt such as particles adhering to the surface to be cleaned 3a are removed to a level that does not cause a problem in the subsequent process or less. To do. Further, since the jet flow 21 generates a shear flow 22 from the downstream side to the upstream side in the transport direction 34 of the substrate 3, fine particles, dirt, etc. removed from the surface to be cleaned 3 a are promptly removed from the substrate 3. It flows in the width direction (direction orthogonal to the transport direction 34 in the surface to be cleaned 3a) and falls downward from the surface to be cleaned 3a together with the cleaning liquid 34. Therefore, the reattachment of the fine particles and dirt once removed to the surface to be cleaned 3a is also prevented. Since the spraying speed of the jet stream 21 sprayed from the substrate cleaning nozzle 2 can be appropriately determined from a wide range according to the type of fine particles and dirt adhering to the surface to be cleaned 3a, the use of the substrate 3 after cleaning, etc. The surface to be cleaned 3a can always be cleaned to a desired cleanliness level. Further, the inclination angle θ formed by the jet flow 21 ejected from the substrate cleaning nozzle 1 and the surface to be cleaned 3a of the substrate 3 is not particularly limited, but is preferably 45 to 90 °. Since the magnitude of the inclination angle θ affects the flow velocity of the shear flow 22, for example, the inclination angle θ may be appropriately determined according to the type of fine particles, dirt, etc. adhering to the surface to be cleaned 3a.
基板搬送手段30は、基板3を載置し、軸線まわりの回転駆動により基板3を矢符34の方向(搬送方向)に搬送する複数の搬送ローラ32と、搬送ローラ32を回転駆動可能に軸支する複数の搬送シャフト33と、搬送シャフト33をその軸線まわりに回転駆動させる動力を発生させる図示しない駆動手段と、駆動手段からの動力を複数の搬送シャフト33に伝達する図示しない動力伝達手段とを含んで構成される。 基板3は、被洗浄面3aの反対側の面3bが搬送ローラ32に接するように搬送ローラ32上に載置される。   The substrate transport means 30 has a plurality of transport rollers 32 on which the substrate 3 is placed and transports the substrate 3 in the direction of the arrow 34 (transport direction) by rotation around the axis, and the transport roller 32 can be driven to rotate. A plurality of supporting shafts 33 to be supported, a driving means (not shown) for generating power for rotationally driving the conveying shaft 33 about its axis, and a power transmitting means (not shown) for transmitting the power from the driving means to the plurality of conveying shafts 33 It is comprised including. The substrate 3 is placed on the transport roller 32 so that the surface 3 b opposite to the surface to be cleaned 3 a is in contact with the transport roller 32.
複数の搬送シャフト33は、それらの軸線が同一平面内において互いに平行になるように、また該平面が搬送ローラ32上に載置される基板3の被洗浄面3aに対して平行になるように配置される。   The plurality of transport shafts 33 are arranged such that their axes are parallel to each other in the same plane, and the planes are parallel to the surface to be cleaned 3 a of the substrate 3 placed on the transport roller 32. Be placed.
駆動手段にはたとえば電動機が用いられ、動力伝達手段には無端状に形成されるベルトが用いられる。   For example, an electric motor is used as the driving means, and an endless belt is used as the power transmission means.
基板搬送手段30によれば、駆動手段と動力伝達手段とによって、搬送シャフト33が軸線まわりに回転駆動し、搬送ローラ32がその軸線まわりに回転駆動する。搬送ローラ32の回転によって、搬送ローラ32上に載置される基板3が矢符34の方向に搬送される。基板3は、搬送過程において、基板洗浄ノズル2により洗浄液4の噴射流21が噴射される領域を通過する時に、噴射流21によりその被洗浄面3aが洗浄される。   According to the substrate transport means 30, the transport shaft 33 is rotationally driven around the axis by the driving means and the power transmission means, and the transport roller 32 is rotationally driven around the axis. The substrate 3 placed on the transport roller 32 is transported in the direction of the arrow 34 by the rotation of the transport roller 32. When the substrate 3 passes through a region where the jet flow 21 of the cleaning liquid 4 is jetted by the substrate cleaning nozzle 2 in the transport process, the surface to be cleaned 3a is washed by the jet flow 21.
洗浄液供給手段31は、洗浄液4を貯留する洗浄液貯留槽35と、洗浄液4を洗浄液貯留槽35から揚液し、加圧する高圧ポンプ36と、高圧ポンプ36によって加圧される洗浄液4を基板洗浄ノズル2に供給する洗浄液供給管37とを含んで構成される。洗浄液供給手段37によれば、洗浄液貯留槽35内の洗浄液4は、高圧ポンプ36により、洗浄液供給管35を介して加圧状態で基板洗浄ノズル2に供給される。   The cleaning liquid supply means 31 includes a cleaning liquid storage tank 35 that stores the cleaning liquid 4, a high pressure pump 36 that lifts and pressurizes the cleaning liquid 4 from the cleaning liquid storage tank 35, and a cleaning liquid 4 that is pressurized by the high pressure pump 36. 2 and a cleaning liquid supply pipe 37 to be supplied to 2. According to the cleaning liquid supply means 37, the cleaning liquid 4 in the cleaning liquid storage tank 35 is supplied to the substrate cleaning nozzle 2 in a pressurized state by the high pressure pump 36 through the cleaning liquid supply pipe 35.
基板洗浄装置1においては、洗浄液貯留槽35中の洗浄液4が加圧状態で基板洗浄ノズル2に供給され、該ノズル2の噴射開口部11から噴射流21として噴射される。この噴射流21は、搬送ローラ32の回転駆動により矢符34の方向に搬送されてくる基板3の被洗浄面3aに衝突してせん断方向のせん断流22となり、被洗浄面3aに付着するパーティクルなどの微細粒子、よごれなどを除去し、これらを含んだまま被洗浄面3aから下方に落下する。このようにして被洗浄面3aの全面が洗浄された後、基板3はさらに矢符34の方向に搬送され、次なる工程に供される。   In the substrate cleaning apparatus 1, the cleaning liquid 4 in the cleaning liquid storage tank 35 is supplied to the substrate cleaning nozzle 2 in a pressurized state and is jetted as a jet stream 21 from the jet opening 11 of the nozzle 2. This jet stream 21 collides with the surface to be cleaned 3a of the substrate 3 conveyed in the direction of the arrow 34 by the rotation of the conveyance roller 32 to become a shear flow 22 in the shear direction, and particles adhering to the surface to be cleaned 3a. The fine particles such as dust and dirt are removed, and the particles fall downward from the surface to be cleaned 3a while containing them. After the entire surface to be cleaned 3a is cleaned in this way, the substrate 3 is further transported in the direction of the arrow 34 and is subjected to the next step.
本実施の形態では、洗浄液4として純水が用いられるけれども、それに限定されず、水よりも洗浄力が強力なアルカリ水素水、オゾン水、過酸化水素水、アルカリ水などの薬液、これらの2種以上の混合液を使用してもよい。   In the present embodiment, pure water is used as the cleaning liquid 4, but is not limited thereto, and chemical liquids such as alkaline hydrogen water, ozone water, hydrogen peroxide water, alkaline water, and the like, which have stronger cleaning power than water, these 2 Mixtures of seeds or more may be used.
本発明の基板洗浄ノズルおよび基板洗浄装置は、たとえば、液晶表示素子、PDP(プラズマディスプレイパネル)などのフラットパネルディスプレイ、半導体などの製造工程、シリコン基板などの半導体基板、ガラス基板などの洗浄において利用可能である。   The substrate cleaning nozzle and the substrate cleaning apparatus of the present invention are used in, for example, liquid crystal display elements, flat panel displays such as PDP (plasma display panel), semiconductor manufacturing processes, semiconductor substrates such as silicon substrates, and glass substrates. Is possible.
本発明の実施の第1形態である基板洗浄装置1の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of the board | substrate cleaning apparatus 1 which is 1st Embodiment of this invention. 図1に示す基板洗浄ノズルの外観を示す斜視図である。It is a perspective view which shows the external appearance of the board | substrate washing | cleaning nozzle shown in FIG. 図3(a)は図2に示す基板洗浄ノズルの切断面線I−Iから見た断面図である。図3(b)は図2に示す基板洗浄ノズルの切断面線II−IIから見た断面図である。図3(c)は図2に示す基板洗浄ノズルの切断面線III−IIIから見た断面図である。FIG. 3A is a cross-sectional view of the substrate cleaning nozzle shown in FIG. FIG. 3B is a cross-sectional view of the substrate cleaning nozzle shown in FIG. FIG. 3C is a cross-sectional view of the substrate cleaning nozzle shown in FIG. 図1に示す基板洗浄ノズルの吐出部周辺を拡大して示す断面図である。It is sectional drawing which expands and shows the discharge part periphery of the board | substrate cleaning nozzle shown in FIG. 特許文献1に記載の基板洗浄ノズルおよびそれを含む基板洗浄装置の構成を概略的に示す断面図である。It is sectional drawing which shows roughly the structure of the board | substrate cleaning nozzle of patent document 1, and the board | substrate cleaning apparatus containing the same.
符号の説明Explanation of symbols
1 基板洗浄装置
2 基板洗浄ノズル
3 基板
3a 被洗浄面
4 洗浄液
5 第1の構成部材
6 第2の構成部材
7,8 ボルト
7a,7b,8a,8b ボルト挿入孔
9a,9b 第3の構成部材
10a,10b シール部材
11 噴射開口部
12 凹所形成面
13,13x,13y,13z 凹所
13a,13b,13c 底面
14a,14b 支持部
16 柱状部
17 位置決め用ピン
17a,17b 位置決めピン挿入孔
18 洗浄液供給口
19 流路
19a 洗浄液噴射路
20 接合面
20a 第1平面部
20b 第2平面部
21 噴射流
22 せん断流
30 基板搬送手段
31 洗浄液供給手段
32 搬送ローラ
33 搬送シャフト
34 基板搬送方向
35 洗浄液貯留槽
36 高圧ポンプ
37 洗浄液供給管
DESCRIPTION OF SYMBOLS 1 Substrate cleaning apparatus 2 Substrate cleaning nozzle 3 Substrate 3a Surface to be cleaned 4 Cleaning liquid 5 First constituent member 6 Second constituent member 7, 8 Bolt 7a, 7b, 8a, 8b Bolt insertion hole 9a, 9b Third constituent member 10a, 10b Seal member 11 Injection opening 12 Recess formation surface 13, 13x, 13y, 13z Recess 13a, 13b, 13c Bottom surface 14a, 14b Support portion 16 Column-shaped portion 17 Positioning pin 17a, 17b Positioning pin insertion hole 18 Cleaning liquid Supply port 19 Flow path 19a Cleaning liquid injection path 20 Joint surface 20a First flat surface portion 20b Second flat surface portion 21 Jet flow 22 Shear flow 30 Substrate transport means 31 Cleaning liquid supply means 32 Transport roller 33 Transport shaft 34 Substrate transport direction 35 Cleaning liquid storage tank 36 High-pressure pump 37 Cleaning liquid supply pipe

Claims (7)

  1. 略直方体形状を有し、長手方向の一端部から一端部に対向する他端部に向けて延びる凹所が形成される面を少なくとも1つ有する第1の構成部材と、
    略直方体形状を有し、かつ第1の構成部材における凹所が形成される面に対して接合される面を有し、第1の構成部材と接合されることによって、前記凹所を洗浄液が流過する流路と成し、凹所が延びる方向に対して直交する方向の一側端部において、第1の構成部材の一側端部とともに外方に向けて開口する噴射開口部を形成する第2の構成部材と、
    第1の構成部材と第2の構成部材との接合体における前記一端部と他端部とにおいて凹所が形成する開口部を閉塞するように設けられる第3の構成部材とを含み、
    第1の構成部材の凹所は、第2の構成部材に対向する底面が、噴射開口部から噴射される洗浄液噴射方向に対する傾斜角度および/または傾斜長さが異なる2つ以上の傾斜面を有するように形成され、
    第1の構成部材における凹所が形成される面に対して接合される第2の構成部材の面は、1つの段差を有して互いに平行に形成される2つの第1平面部と第2平面部とから成り、
    第1の構成部材には、凹所が延びる方向に予め定める間隔をあけて第2の構成部材の第1平面部または第2平面部まで延びる柱状部が凹所内に複数形成され、
    第1の構成部材と第2の構成部材とは、第1平面部が第1の構成部材の凹所が形成される面と当接し、第2平面部が第1の構成部材の凹所が形成される面と間隔を有するようにして、柱状部において接合され、
    洗浄液を流過させる流路は、
    第1の構成部材の凹所底面における傾斜面よりも洗浄液噴射方向の下流側において、第1の構成部材の凹所が形成される面と第2の構成部材の第2平面部とが平行に離隔して形成される洗浄液噴射路と、
    洗浄液噴射路の洗浄液噴射方向の先端部において、洗浄液噴射路が外方に向けて開口する噴射開口部とを含み、
    第2の構成部材の第1平面部を洗浄液噴射方向に延長した仮想平面と、洗浄液噴射路を形成する第1の構成部材の凹所が形成される面との洗浄液噴射方向に直交する方向の離隔距離は、前記仮想平面と、洗浄液噴射路を形成する第2の構成部材の第2平面部との洗浄液噴射方向に直交する方向の離隔距離と同じであることを特徴とする基板洗浄ノズル。
    A first component member having a substantially rectangular parallelepiped shape and having at least one surface formed with a recess extending from one end in the longitudinal direction toward the other end facing the one end;
    It has a substantially rectangular parallelepiped shape and has a surface bonded to the surface where the recess in the first component member is formed, and the cleaning liquid is removed from the recess by being bonded to the first component member. Formed as a flow channel that flows through and at one side end in a direction orthogonal to the direction in which the recess extends, an injection opening that opens outward together with the one side end of the first component member is formed A second component to
    A third component provided to close an opening formed by a recess in the one end and the other end of the joined body of the first component and the second component;
    In the recess of the first component member, the bottom surface facing the second component member has two or more inclined surfaces having different inclination angles and / or inclination lengths with respect to the cleaning liquid injection direction injected from the injection opening. Formed as
    The surface of the second component member joined to the surface where the recess in the first component member is formed has two first flat portions and a second one formed in parallel with each other with one step. It consists of a plane part,
    In the first component member, a plurality of columnar portions extending to the first plane portion or the second plane portion of the second component member with a predetermined interval in the direction in which the recess extends are formed in the recess.
    The first component member and the second component member are such that the first flat surface portion is in contact with the surface on which the recess of the first component member is formed, and the second flat surface portion is the recess of the first component member. Joined at the columnar part so as to have a gap with the surface to be formed,
    The flow path through which the cleaning liquid flows is
    The surface on which the recess of the first component member is formed and the second flat surface portion of the second component member are parallel to the downstream side of the inclined surface on the bottom surface of the recess of the first component member in the cleaning liquid ejection direction. A cleaning liquid injection path formed at a distance;
    A cleaning liquid injection path at the tip end in the cleaning liquid injection direction, the cleaning liquid injection path includes an injection opening that opens outward;
    A direction perpendicular to the cleaning liquid ejection direction between a virtual plane obtained by extending the first planar portion of the second structural member in the cleaning liquid ejection direction and a surface on which the recess of the first structural member forming the cleaning liquid ejection path is formed. The substrate cleaning nozzle is characterized in that the separation distance is the same as the separation distance in the direction orthogonal to the cleaning liquid ejection direction between the virtual plane and the second plane portion of the second component member forming the cleaning liquid ejection path .
  2. 噴射開口部に最も近接する傾斜面は、
    洗浄液噴射方向に対して傾斜角度15°以下および傾斜長さ10mm以下であることを特徴とする請求項記載の基板洗浄ノズル。
    The inclined surface closest to the injection opening is
    Substrate cleaning nozzle according to claim 1, wherein the relative cleaning solution spray direction inclination angle 15 ° or less or less and inclined length 10 mm.
  3. 洗浄液噴射路は、
    洗浄液噴射方向において1mm以上、5mm以下の長さを有することを特徴とする請求項または記載の基板洗浄ノズル。
    The cleaning liquid injection path
    1mm or more in the washing liquid jetting direction, substrate cleaning nozzle according to claim 1 or 2, wherein the having the following length 5 mm.
  4. 洗浄液噴射路における第1および第2の構成部材の洗浄液との接触面は、
    表面粗度Rmax 1μm以下であることを特徴とする請求項のいずれか1つに記載の基板洗浄ノズル。
    Contact surfaces of the first and second constituent members with the cleaning liquid in the cleaning liquid ejection path are:
    Substrate cleaning nozzle according to any one of claims 1 to 3, characterized in that less surface roughness Rmax 1 [mu] m.
  5. 第2の構成部材の第2平面部は、
    噴射開口部から洗浄液噴射方向とは反対方向への長さが、噴射開口部の短辺長さの1000倍以上であることを特徴とする請求項1〜のいずれか1つに記載の基板洗浄ノズル。
    The second planar portion of the second component member is
    The substrate according to the cleaning liquid injection direction from the injection opening length in the opposite direction, any one of claims 1-4, characterized in that at least 1000 times the short side length of the ejection opening Cleaning nozzle.
  6. 噴射開口部は、
    短辺長さが50μm以下であることを特徴とする請求項1〜のいずれか1つに記載の基板洗浄ノズル。
    The jet opening is
    Substrate cleaning nozzle according to any one of claims 1-5, characterized in that the short side length is 50μm or less.
  7. 請求項1〜のいずれか1つの基板洗浄ノズルと、
    基板洗浄ノズルに高圧洗浄液を供給する洗浄液供給手段と、
    被洗浄基板を載置して搬送する基板搬送手段とを含み
    浄液供給手段から供給される高圧洗浄液を、基板搬送手段により搬送される被洗浄基板の被洗浄面に対して傾斜させ、かつ、被洗浄基板の搬送方向下流側から上流側に向けて基板洗浄ノズルから噴射することによって被洗浄基板を洗浄することを特徴とする基板洗浄装置。
    A substrate cleaning nozzle according to any one of claims 1 to 6 ,
    Cleaning liquid supply means for supplying a high-pressure cleaning liquid to the substrate cleaning nozzle;
    Including substrate transport means for placing and transporting the substrate to be cleaned ,
    The high-pressure washing liquid supplied from the wash solution supply means, is inclined with respect cleaned surface of the substrate to be cleaned being conveyed by the substrate conveying means, and, toward the upstream side from the downstream side of the substrate to be cleaned substrate A substrate cleaning apparatus for cleaning a substrate to be cleaned by spraying from a cleaning nozzle.
JP2005232474A 2005-08-10 2005-08-10 Substrate cleaning nozzle and substrate cleaning apparatus Expired - Fee Related JP4330565B2 (en)

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JP6329380B2 (en) * 2014-02-07 2018-05-23 株式会社ジャパンディスプレイ Manufacturing method and manufacturing apparatus for liquid crystal display device
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