JP2006086474A - Substrate washing nozzle and substrate washing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate washing nozzle which can deal with upsizing of substrate and improvement of detergency, easily removes particles of a submicron size, and facilitates maintenance etc., regarding the washing of a glass substrate, a silicon substrate, etc. <P>SOLUTION: The substrate washing nozzle 1 comprises a nozzle main body 2, a micropore member 3, a sealing material 4, a nozzle cover 5 and a nozzle lid 6. Each of these members is constructed as an independent member, especially the micropore member 3 is made separately from the nozzle main body 2, and the micropore member 3 is held by three members of the nozzle main body 2, the sealing material 4 and the nozzle cover 5, so that substantially constant injection quantity of washing liquid is obtained regardless of the position of the nozzle in a longitudinal direction, and uniform washing becomes possible even for a large size substrate, and particles are easily removed. Further, since each of the members is an independent member, maintenance is easily done. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate cleaning nozzle and a substrate cleaning apparatus.

  Glass substrates used for flat panel displays such as liquid crystal displays and plasma displays (PDPs), silicon substrates used for electronic components, etc. have the performance, durability and electrical insulation reliability required for each application. In order to improve further, high cleanliness is required. Therefore, in the manufacturing process of flat panel displays, electronic components, etc., a cleaning process for cleaning glass substrates, silicon substrates, etc. is indispensable.

  Also, when manufacturing glass substrates, silicon substrates, etc., multi-chamfering has been adopted to improve productivity, the substrate has been increased in size, and large substrates exceeding 2 m diagonal are also manufactured. It is required to be able to cope with the increase in size of the substrate. Furthermore, recently, the demand for high-density and high-definition display quality of flat panel displays has been increasing. Further, as the size of the substrate is increasing as described above, the substrate must be made uniform when cleaning the substrate. In addition to cleaning, it is necessary to increase cleaning power and remove particles at sub-micron level.

  For cleaning glass substrates, silicon substrates, etc., there are mainly a batch method in which the substrate is immersed in a cleaning tank filled with a cleaning solution, and a single wafer method in which the cleaning solution is sprayed onto the surface to be cleaned of the substrate under conveyance. Among these, the single wafer method not only increases the cleanliness of the substrate, but also has the advantage that it can cope with the increase in size of the substrate without increasing the size of the apparatus and has a low cost. is there. Specifically, the cleaning of the substrate by the single wafer method is performed by spraying the cleaning liquid onto the substrate placed on the transport path from at least a pair of substrate cleaning nozzles arranged to face each other via the transport path. Here, in order to uniformly clean the entire surface of the substrate, it is necessary to spray the cleaning liquid uniformly from the substrate cleaning nozzle to the entire surface of the substrate. At this time, by increasing the supply pressure of the cleaning liquid to the nozzle and increasing the spraying pressure of the cleaning liquid onto the substrate, particles of submicron level are being removed.

  Conventionally, as a substrate cleaning nozzle used in a single wafer method, a slit type nozzle in which a pair of plate-like members are joined at a predetermined interval and a slit-like opening is formed in the longitudinal direction is used. The cleaning liquid is supplied into the nozzle under pressure and is ejected from the slit-shaped opening. The slit type nozzle has a drawback that the amount of cleaning liquid ejected from both ends of the opening is smaller than the amount of cleaning liquid ejected from the central portion of the opening, and the cleaning liquid cannot be uniformly supplied to the entire surface of the substrate. Due to this defect, the larger the substrate, the more uneven the cleaning, and the quality of the substrate after cleaning is significantly reduced. Such a defect can be solved to some extent by, for example, further increasing the length of the opening in the longitudinal direction. However, the nozzle is increased in size, and the advantages of the single wafer method are impaired.

  In consideration of the above problems, there has been proposed a substrate cleaning nozzle having a slit-shaped opening that prevents a reduction in the amount of cleaning liquid sprayed from both ends in the longitudinal direction of the opening (for example, , See Patent Document 1). FIG. 7 is a cross-sectional view schematically showing a configuration of a substrate cleaning nozzle 110 and a substrate cleaning apparatus 140 including the nozzle 110 disclosed in Patent Document 1. As shown in FIG. The substrate cleaning apparatus 140 includes a substrate cleaning nozzle 110, a cleaning liquid supply unit 120, and a substrate transport unit 130.

  The substrate cleaning nozzle 110 includes a first plate member 111 and a second plate member 112 each having a recess 116 formed on an inward surface of the nozzle 110 via spacers 113 and 114. It is joined. The first plate-like member 111 and the second plate-like member 112 are joined by inserting a screw 115 through a hole formed in the thickness direction of the first plate-like member 111 and inserting the screw 115 into the second plate-like member. This is performed by screwing into a female screw portion formed in the thickness direction of the plate-like member 112. The nozzle 110 is formed in a substantially rectangular parallelepiped shape extending in the longitudinal direction in the front-rear direction toward the paper surface of FIG. In addition, the second plate-like member 112 has a cleaning liquid so as to correspond to the space 117 formed by the recess 116 by joining the first plate-like member 111 and the second plate-like member 112. Four receiving ports 118 (not shown) are formed in the longitudinal direction of the nozzle 110. These cleaning liquid inlets 118 communicate with the space 117. In addition, a slit (not shown) is formed in the spacer 114 at a predetermined interval in the longitudinal direction of the nozzle 110. The nozzle 110 is disposed above the surface to be cleaned 131a of the substrate 131 so as to face the surface to be cleaned 131a. The nozzle 110 forms a space 117 and forms a slit in the spacer 114, rectifies the flow of the cleaning liquid in the interior thereof, and attempts to make the amount of the cleaning liquid constant by making the cleaning liquid flow pressure almost uniform. To do. In the nozzle 110, the cleaning liquid supplied from the cleaning liquid inlet 118 is rectified by the slits formed in the space 117 and the spacer 114, and then the cleaning liquid injection hole 119 which is a slit-shaped opening from the substrate 131. Sprayed toward the surface to be cleaned 131a.

  The cleaning liquid supply means 120 includes a cleaning liquid storage tank 121 that stores the cleaning liquid, a cleaning liquid supply pipe 122 that supplies the cleaning liquid to the substrate cleaning nozzle 110, and a cleaning liquid that is pumped from the cleaning liquid storage tank 121, and the cleaning liquid is supplied to the cleaning liquid supply pipe 122. And a high-pressure pump 123 that is allowed to flow. The cleaning liquid supply pipe 122 is connected to the cleaning liquid inlet 118 of the nozzle 110 via a connection ring (pressing member) (not shown). The cleaning liquid stored in the cleaning liquid storage tank 121 flows through the cleaning liquid supply pipe 122 by the high-pressure pump 123 and is supplied from the cleaning liquid receiving port 118 of the nozzle 110 to the space 117.

  The substrate transport unit 130 places and transports the substrate 131, the substrate transport belt 132, the rotation roller 133 that rotates the substrate transport belt 132 in the direction of the arrow 135, and the rotation roller 133 that rotates around its axis. And a power unit 134. The substrate 131 is placed on the substrate transport belt 132 with the surface to be cleaned 131a facing upward, and moves in the direction of the arrow 135 in accordance with the rotation driving of the rotating roller 133 and the rotation of the substrate transport belt 132, and the nozzle 110 After being cleaned by jetting the cleaning liquid from the nozzle 110, it is further transported in the direction of the arrow 135 and used for the next step.

  According to the substrate cleaning apparatus 140, the substrate 131 is transported directly below the nozzle 110 in synchronization with the supply of the cleaning solution from the cleaning solution storage tank 121 to the nozzle 110, and the cleaning solution 136 is sprayed from the nozzle 110, A liquid flow 137 of the cleaning liquid is generated on the surface 131a to be cleaned, and the surface 131a to be cleaned is cleaned.

  However, since the nozzle 110 is formed by joining two plate-like members 111 and 112, it is inevitable that the central portion in the longitudinal direction of the cleaning liquid injection hole 119, which is a slit-shaped opening, swells more than the end. As a result, the amount of cleaning liquid sprayed from the central portion becomes larger than that at the end portion, and the substrate cleaning may become uneven. Further, in the nozzle 110, when the supply pressure of the cleaning liquid to the nozzle 110 is increased in order to increase the injection pressure of the cleaning liquid onto the substrate surface and remove submicron level particles on the substrate, the longitudinal direction of the cleaning liquid injection hole 119 is increased. The swelling of the central part becomes even more pronounced. In order to suppress deformation (swelling) due to internal pressure, it is necessary to improve the mechanical strength of the nozzle 110, but this leads to an increase in the weight of the nozzle and hinders the efficiency of the process. Therefore, the nozzle 110 cannot fully satisfy the demands for increasing the size of the substrate and improving the cleaning power for the substrate.

JP 2000-94325 A

  An object of the present invention is a slit type substrate cleaning nozzle that can cope with an increase in substrate size and improvement in cleaning power, and even when cleaning a large substrate, the cleaning liquid can be uniformly supplied to the entire surface of the substrate, and the cleaning can be performed. Including a nozzle for cleaning a substrate that can maintain a substantially constant amount of spray liquid at any part of the cleaning liquid injection hole without causing deformation such as swelling even if the supply pressure of the cleaning liquid is increased to increase the force, and the same A substrate cleaning apparatus is provided.

The present invention provides a substrate cleaning nozzle that is disposed so as to face a surface to be cleaned of a substrate and that cleans the surface to be cleaned by spraying a cleaning liquid from a tip portion facing the surface to be cleaned of the substrate.
A nozzle body for injecting the supplied cleaning liquid to the outside of the nozzle;
A micro-hole member that makes the cleaning liquid sprayed from the nozzle body jet,
A nozzle cover that protects the nozzle body and presses and holds the microporous member;
A nozzle lid for protecting the nozzle body and the nozzle cover;
The nozzle for cleaning a substrate is characterized in that the nozzle body and the minute hole member are configured as separate members.

In the substrate cleaning nozzle of the present invention, the nozzle body has a cleaning liquid flow passage in the interior and a cleaning liquid injection hole that is continuous with the cleaning liquid flow path in one end,
The micro hole member is a thin plate member in which a plurality of micro holes are formed linearly in the longitudinal direction, and is arranged so as to be continuous with the cleaning liquid injection hole of the nozzle body,
The nozzle cover has a recess for accommodating the nozzle body inside and an opening at one end,
The nozzle lid has an opening formed on the surface so as to open outward.

  Further, the substrate cleaning nozzle of the present invention is characterized in that the nozzle body, the nozzle cover, and the minute hole member are arranged in this order.

  Furthermore, the substrate cleaning nozzle of the present invention is characterized in that the nozzle body, the microhole member, and the nozzle cover are arranged in this order.

Furthermore, the substrate cleaning nozzle of the present invention has a cleaning liquid flow path inside the nozzle body,
The cleaning liquid flow path dimension in a direction orthogonal to the cleaning liquid flow direction is formed in a tapered shape so as to decrease as it goes toward the cleaning liquid injection hole.

Further, the substrate cleaning nozzle of the present invention has a seal member disposed between the nozzle body and the microhole member or the nozzle cover and / or between the microhole member and the nozzle cover or the nozzle cover and the microhole member,
By the sealing member,
The cleaning liquid flow path from the cleaning liquid flow path inside the nozzle body to the minute hole member is isolated from the contact portion between the nozzle body and the nozzle cover.

The present invention also includes any one of the aforementioned substrate cleaning nozzles,
Cleaning liquid supply means for supplying a cleaning liquid to the substrate cleaning nozzle;
A substrate cleaning apparatus comprising: a substrate transfer means for placing and transferring a substrate to be cleaned.

Furthermore, the substrate battlefield apparatus of the present invention is such that the cleaning liquid sprayed from the substrate cleaning nozzle flows in the shear direction with respect to the substrate transport direction on the surface to be cleaned of the substrate.
The substrate cleaning nozzle is disposed so as to oppose the surface to be cleaned of the substrate.

  According to the present invention, there is provided a substrate cleaning nozzle including a nozzle main body, a microporous member, a nozzle cover, and a nozzle lid, wherein the microporous member is separate from the nozzle main body, and the microporous member is further provided. There is provided a substrate cleaning nozzle having a structure that is sandwiched and fixed between a nozzle body and a nozzle cover.

  The substrate cleaning nozzle of the present invention has a remarkable improvement in structural strength by adopting the above-described configuration as compared with a conventional slit type nozzle in which a pair of plate-like members are joined. For this reason, a cleaning liquid injection amount similar to that of the central portion can be obtained at the longitudinal end portion of the micro hole member in which the micro holes (cleaning liquid injection holes) are formed, and can sufficiently cope with an increase in the size of the substrate to be cleaned. Further, by increasing the cleaning liquid jet pressure, a uniform high-speed shear flow of the cleaning liquid can be obtained on the substrate surface, so that the cleaning power can be further improved and fine particles on the substrate can be easily removed. Note that even if the cleaning liquid injection pressure is increased, deformation such as swelling does not occur, so that the cleaning liquid injection amount is substantially equal at both the central portion and the end portion in the longitudinal direction of the microporous member. Furthermore, since the cleaning liquid is uniformly sprayed onto the substrate surface, it is possible to reduce the amount of the cleaning liquid sprayed as compared with the conventional slit type nozzle, thereby reducing the consumption of the cleaning liquid. Therefore, the substrate cleaning nozzle of the present invention can sufficiently cope with the increase in size of the substrate and the enhancement of the cleaning power, and can be used very suitably particularly when the substrate is cleaned by the single wafer method.

  In addition, the substrate cleaning nozzle of the present invention is very difficult to manufacture and maintain because the nozzle body and the portion with the minute holes for obtaining the jet of cleaning liquid are not integrated unlike the conventional slit type nozzle. Easy to. Furthermore, since it is necessary to form holes with a small diameter in a long thin plate or a thin plate-like portion at a narrow pitch, the microporous member itself can be produced by making it a separate member as in the present invention. It becomes easy.

  Further, according to the present invention, the nozzle body, the microhole member, and the nozzle cover are arranged when the nozzle body, the nozzle cover, and the microhole member are arranged in this order, and the nozzle body, the microhole member, and the nozzle cover are arranged in this order. It is preferable to arrange them in order. By arranging in this way, the structural strength of the nozzle of the present invention and the holding strength of the microporous member are further improved, and the advantages of the nozzle of the present invention become more remarkable.

  Further, according to the present invention, in the nozzle body having the cleaning liquid flow path therein, the flow path is formed in a tapered shape such that the diameter gradually decreases in the cleaning liquid flow direction, so The pressure loss is reduced, and as a result, the cleaning liquid can flow more smoothly and be sprayed more uniformly.

  Further, according to the present invention, the seal member is disposed between the nozzle body and the minute hole member (or nozzle cover) and / or between the minute hole member and the nozzle cover (or nozzle cover and minute hole member). Preferably, the cleaning liquid flow path from the cleaning liquid flow path inside the nozzle body to the minute hole member is isolated from the contact portion between the nozzle body and the nozzle cover. Accordingly, it is possible to prevent particles generated mainly due to sliding between the nozzle main body and the nozzle cover due to the reception / injection of the cleaning liquid from entering the cleaning liquid flow path and being mixed into the cleaning liquid. Therefore, the cleanliness of the substrate cleaned by the nozzle of the present invention can be further remarkably improved.

  According to the present invention, there is also provided a substrate cleaning apparatus including the substrate cleaning nozzle of the present invention, a cleaning liquid supply means, and a substrate transport means. The substrate cleaning apparatus can clean the substrate surface uniformly and very efficiently regardless of the size of the substrate.

  Further, according to the present invention, the substrate cleaning nozzle of the present invention is disposed above the surface to be cleaned so as to oppose the surface to be cleaned, so that the substrate is cleaned on the surface to be cleaned with respect to the substrate transport direction. The cleaning liquid flows in the shear direction, and the cleaning power is further improved.

  Fig.1 (a) is a perspective view which shows the external appearance of the nozzle 1 for board | substrate washing | cleaning which is the 1st Embodiment of this invention. FIG. 1B is a perspective view showing a state in which the cleaning liquid is ejected from the substrate cleaning nozzle 1. 2 is a cross-sectional view taken along the section line II-II shown in FIG. FIG. 3A is a plan view showing the appearance of the microporous member in the substrate cleaning nozzle 1. FIG.3 (b) is a principal part enlarged plan view of the microporous member shown to Fig.3 (a).

  The substrate cleaning nozzle 1 includes a nozzle body 2 that sprays the supplied cleaning liquid to the outside of the nozzle 1, a microhole member 3 that makes the cleaning liquid sprayed from the nozzle body 2 a jet flow 11, and presses the microhole member 3 A sealing material 4 that protects the nozzle body 2, a nozzle cover 5 that holds the microporous member 3 in association with the nozzle body 2 and the sealing material 4, and a nozzle lid 6 that protects the nozzle body 2 and the nozzle cover 5. It is comprised including.

  The nozzle body 2 has a cleaning liquid inlet 7 at one end and a cleaning liquid injection hole 8 at the other end, and the cleaning liquid inlet 7 and the cleaning liquid injection hole 8 are formed by a cleaning liquid flow passage 9 formed therein. Is configured to communicate. Further, the cleaning liquid flow passage 9 is formed in a tapered shape in which a portion close to the cleaning liquid injection hole 8 gradually decreases in diameter in the flow direction of the cleaning liquid, that is, in the direction of the cleaning liquid injection hole 8. As a result, the pressure loss generated based on the flow-over pressure of the cleaning liquid is reduced, the flow of the cleaning liquid in the flow-through path 9 becomes smoother, and the cleaning liquid can be jetted more uniformly by the nozzles 1. Further, the shape and size of the nozzle body 2 are determined according to the shape and size of the recess 13 of the nozzle cover 5 described later, and are formed so as to be able to fit into the recess 13. The cleaning liquid is introduced into the cleaning liquid flow path 9 from the cleaning liquid receiving port 7, flows through the flow path 9, and is ejected to the outside of the nozzle body 2 from the cleaning liquid injection hole 8.

  As shown in FIG. 3A, the microhole member 3 is a long thin plate member. FIG. 3B is an enlarged view of a portion indicated by 3x in FIG. A plurality of circular holes 10 that are fine through-holes having a diameter D are formed in a line at a pitch d in a central portion in a short direction indicated by a one-dot chain line. Thus, since the minute hole member 3 needs to be finely processed, the use of a separate part as in the present invention has the advantage that its manufacture is simplified. The minute hole member 3 is disposed such that the central portion in the short direction where the circular holes 10 are formed in a row comes into contact with the cleaning liquid injection hole 8 of the nozzle body 2. Since the minute hole member 3 is held by the three members of the nozzle body 2, the sealing material 4, and the nozzle cover 5, even if the cleaning liquid flow pressure increases, deformation or the like hardly occurs, and a substantially uniform jet flow 11 can be formed. The cleaning liquid sprayed from the cleaning liquid spray hole 8 of the nozzle body 2 passes through the circular hole 10 of the microhole member 3 to become a uniform and fine jet flow 11 and is sprayed onto the surface to be cleaned of the substrate (not shown). In the present embodiment, the plate thickness of the minute hole member 3 is 0.1 mm, the diameter D of the circular holes 10 is 0.03 mm, and the pitch d of the adjacent circular holes 10 is 0.06 mm. The flow velocity of the jet stream 11 is 40 m / s. The microporous member 3 is formed of, for example, a metal material such as stainless steel or a synthetic resin such as polyimide.

  A seal member 12 is disposed between the nozzle body 2 and the minute hole member 3. The seal member 12 isolates the cleaning liquid flow path from the cleaning liquid flow path 9 inside the nozzle body 2 to the minute hole member 3 from the contact portion between the nozzle body 2 and the nozzle cover 5. That is, since the substrate cleaning nozzle 1 has a structure in which the nozzle body 2 is fitted into the recess 13 of the nozzle cover 5, the space between the outer surface of the nozzle body 2 and the inner surface of the recess 13 of the nozzle cover 5 is adopted. A slight gap is generated. For this reason, when supplying the cleaning liquid to the nozzle main body 2 and spraying the cleaning liquid from the nozzle main body 2, pressure fluctuations occur, whereby the nozzle main body 2 and the nozzle cover 5, which are metal members, slide, Micron level particles may be generated. Since such particles contaminate the substrate, it is possible to prevent the particles from being mixed into the cleaning liquid by isolating the cleaning liquid flow path using the seal member 12, and cleaning in the substrate cleaning using the substrate cleaning nozzle 1 of the present invention. Reliability is further improved.

  The sealing material 4 is provided so as to face the nozzle body 2 through the microhole member 3, and presses and fixes the microhole member 3 between the nozzle body 2. For the sealing material 4, for example, packing is used.

  The nozzle cover 5 is formed with a recess 13 and a bolt insertion hole 14a for fitting the nozzle body 2 on one end surface 5a side, and from the center of the other end 5b to the inside of the nozzle cover 5. A slit-like opening 15 corresponding to the cleaning liquid injection hole 8 of the nozzle body 2 is formed. The recess 13 is formed so that the microporous member 3 and the sealing material 4 can be arranged in addition to the nozzle body 2. That is, the sealing material 4, the minute hole member 3, and the sealing member 12 are arranged in this order in the recess 13, and the nozzle body 2 is further fitted. An internal thread is engraved on the inner wall of the nozzle cover 5 facing the bolt insertion hole 14a.

  The nozzle lid 6 opens outwardly to form a cleaning liquid supply port 16, and has a cleaning liquid supply path 17 connected to the cleaning liquid inlet 7 of the nozzle body 2, and further includes a nozzle cover 6 and a nozzle cover. 5 is formed with a bolt insertion hole 14b into which a bolt 21 for joining and unifying 5 is integrated. A cleaning liquid supply pipe 18 is connected to the cleaning liquid supply port 16, and a high pressure pump 19 is connected to the cleaning liquid supply pipe 18. The high-pressure pump 19 is connected to a cleaning liquid storage tank that is a cleaning liquid supply source (not shown). The nozzle lid 6 is attached to the nozzle body 2 and the nozzle cover 5 via the packing 20, and the bolt 21 inserted into the bolt insertion holes 14a and 14b is screwed into the female screw of the bolt insertion hole 14a. Joined to the nozzle body 2. A hole 20 a having an appropriate diameter is formed in the packing 20 at a position corresponding to the cleaning liquid inlet 7 and the cleaning liquid supply path 17. The cleaning liquid pumped from the cleaning liquid storage tank (not shown) by the high-pressure pump 19 flows through the cleaning liquid supply pipe 18, enters the cleaning liquid supply path 17 from the cleaning liquid supply port 16 of the nozzle lid 6, and further passes through the cleaning liquid receiving port 7 to the nozzle body. 2 is supplied to the second cleaning liquid flow passage 9.

  Although the substrate cleaning nozzle 1 is constructed by assembling the above-described members, a sealing material 4 is disposed between the microhole member 3 and the nozzle cover 5, and the nozzle body 2 and the nozzle lid 6 are disposed. Since the packing 20 is disposed, by screwing the bolt 21 into the female screw of the bolt insertion port 14a, each member is firmly fixed, and the rigidity of the entire nozzle can be increased. In this way, since members that are not integrally molded are used, the manufacture of each member is easy, and disassembly, maintenance, and the like are also easy. For example, even if foreign matter is mixed in the cleaning liquid and the circular hole 10 of the microporous member 3 is clogged, it can be dealt with by replacing only the microporous member 3. Furthermore, it is possible to reduce the weight of each member and to reduce the weight of the entire nozzle.

  According to the substrate cleaning nozzle 1, the cleaning liquid pressurized by the high-pressure pump 19 is introduced from the cleaning liquid supply port 16 of the nozzle lid 6 and flows through the cleaning liquid supply pipe 18 and the cleaning liquid inlet 7 of the nozzle body 2. It enters the overpass 9 and is jetted from the cleaning liquid jet hole 8 toward the microhole member 3, and becomes a jet flow 11 by the microhole member 3 and is supplied to the surface to be cleaned of the substrate (not shown).

  FIG. 4 is a cross-sectional view schematically showing a configuration of a substrate cleaning apparatus 25 according to another embodiment of the present invention. FIG. 5 is a top view of the substrate cleaning apparatus 25 shown in FIG. The substrate cleaning apparatus 25 includes a substrate cleaning nozzle 1, a substrate transport unit 26, and a cleaning liquid supply unit 27.

  Since the substrate cleaning nozzle 1 is the substrate cleaning nozzle 1 shown in FIGS. 1 to 3, the same reference numerals are assigned and description thereof is omitted. The sealing material 4 disposed between the minute hole member 3 and the nozzle cover 5 and the sealing member 12 disposed between the nozzle body 2 and the minute hole member 3 are not shown.

  The substrate cleaning nozzle 1 is disposed above the substrate 29 with the opening 15 facing the substrate 29, and its longitudinal direction is perpendicular to the direction of the arrow 28, that is, the transport direction of the substrate 29 (hereinafter “substrate”). 29 ”in the width direction). The dimension of the substrate cleaning nozzle 1 in the longitudinal direction is longer than the dimension of the substrate 29 in the width direction. At this time, the circular holes 10 of the minute hole member 3 disposed in the opening 15 face the surface to be cleaned 29 a of the substrate 29 and are positioned in a line in the width direction of the substrate 29.

  The substrate cleaning nozzle 1 injects a jet 11 of cleaning liquid from the downstream side in the transport direction of the substrate 29 toward the upstream side (that is, in the direction opposite to the transport direction). As a result, a shear flow 36 of the cleaning liquid is generated on the surface 29a to be cleaned of the substrate 29, so that particles such as particles and dirt adhering to the surface 29a to be cleaned do not become a problem in the subsequent process or less. Is removed. Further, since the jet flow 11 ejected from the substrate cleaning nozzle 1 generates a shear flow 36 from the downstream side in the conveyance direction of the substrate 29 to the upstream side, fine particles and dirt removed from the surface 29a to be cleaned are It quickly flows in the width direction of the substrate 29 and falls downward from the surface 29a to be cleaned together with the cleaning liquid. Therefore, the reattachment of the fine particles and dirt once removed to the surface 29a to be cleaned is prevented. The ejection speed of the jet stream 11 ejected from the substrate cleaning nozzle 1 can be appropriately determined from a wide range according to the type of fine particles and dirt adhering to the surface 29a to be cleaned, the use of the substrate after cleaning, etc. The surface 29a to be cleaned can always be cleaned to a desired cleanliness level. Further, the inclination angle θ formed by the jet flow 11 ejected from the substrate cleaning nozzle 1 and the surface 29a to be cleaned of the substrate 29 is not particularly limited, but is preferably 45 to 90 °. For example, the flow velocity of the shear flow 36 is determined by the magnitude of the inclination angle θ, and therefore the inclination angle θ may be appropriately determined according to the type of fine particles, dirt, etc. adhering to the surface 29a to be cleaned.

  The substrate transport means 26 has a plurality of transport rollers 30 on which a substrate 29 is placed and transports the substrate 29 in the direction of the arrow 28 (transport direction) by rotation around the axis, and a shaft that can rotate the transport rollers 30. A plurality of supporting shafts 31 to be supported, a belt 32 wound so as to connect the plurality of conveying shafts 31 and transmitting the rotational drive of the conveying shaft 31 on the most upstream side in the conveying direction to the other conveying shafts 31, and the conveying direction An electric motor 33 is connected to the most upstream conveying shaft 31 and rotates the shaft 31 around its axis.

  The substrate 29 is placed on the transport roller 30 so that the surface 29b opposite to the surface 29a to be cleaned is in contact with the transport roller 30.

  The plurality of transport shafts 31 have their axes parallel to each other in the same plane, and the planes are parallel to the surface 29a to be cleaned of the substrate 29 placed on the transport roller 30. Be placed.

  According to the substrate transport means 26, the transport shaft 31 on the most upstream side in the transport direction is rotationally driven around the axis by the electric motor 33, and the rotation is transmitted to each transport shaft 31 by the belt 32 connecting the remaining transport shafts 31. The conveying roller 30 is driven to rotate about its axis. The substrate 29 placed on the transport roller 30 is transported in the direction of the arrow 28 by the rotation of the transport roller 30. When the substrate 29 passes through a region where the cleaning liquid jet 11 is ejected by the substrate cleaning nozzle 1 during the transport process, the surface 29a to be cleaned is cleaned by the jet 11.

  The cleaning liquid supply means 27 is used for cleaning the substrate, a cleaning liquid storage tank 35 for storing the cleaning liquid 34, a high pressure pump 19 for lifting and pressurizing the cleaning liquid 34 from the cleaning liquid storage tank 35, and the cleaning liquid 34 pressurized by the high pressure pump 19. And a cleaning liquid supply pipe 18 that supplies the nozzle 1. According to the cleaning liquid supply means 27, the cleaning liquid 34 in the cleaning liquid storage tank 35 is supplied to the substrate cleaning nozzle 1 in a pressurized state by the high-pressure pump 19 through the cleaning liquid supply pipe 18.

  In the substrate cleaning apparatus 25, the cleaning liquid in the cleaning liquid storage tank 35 is supplied to the substrate cleaning nozzle 1 in a pressurized state and is ejected as an ejection flow 11 from the opening 15 of the nozzle 1. The ejected flow 11 collides with the surface 29a to be cleaned 29a of the substrate 29 conveyed in the direction of the arrow 28 by the rotation of the conveying roller 30 to become a shearing flow 36 in the shear direction, and particles adhering to the surface 29a to be cleaned. The fine particles such as dust, dirt, etc. are removed and fall downward from the surface 29a to be cleaned. After the entire surface to be cleaned 29a is cleaned in this manner, the substrate 29 is further transported in the direction of the arrow 28 and is subjected to the next step.

  FIG. 6 is a cross-sectional view schematically showing the configuration of the substrate cleaning nozzle 40 according to the second embodiment of the present invention. The substrate cleaning nozzle 40 according to the present embodiment is similar to the substrate cleaning nozzle 40 according to the first embodiment, and corresponding portions (the nozzle body 41 and the minute hole member 42) are denoted by the same reference numerals. Description is omitted.

  The substrate cleaning nozzle 40 includes a nozzle body 41 that sprays the supplied cleaning liquid to the outside of the nozzle 40, a micro hole member 42 that makes the cleaning liquid sprayed from the nozzle body 41 a jet flow (not shown), and a micro hole member 42. The sealing member 43 to be pressed, the nozzle body 41 is protected, the nozzle cover 44 that holds the microporous member 42 in cooperation with the nozzle body 41 and the sealing material 43, and the nozzle lid 45 that protects the nozzle body 41 and the nozzle cover 44. It is comprised including.

  The substrate cleaning nozzle 40 has a recess 46 into which the nozzle cover 44 fits the nozzle body 41, a cleaning liquid supply port 48 that is an opening for receiving the cleaning liquid, and the nozzle lid 45 injects the cleaning liquid. It is characterized by having a slit-shaped opening 52.

  The cleaning liquid supplied to the nozzle body 41 is sprayed from the cleaning liquid spray hole 8 toward the circular hole 10 of the minute hole member 42, and becomes a jet flow (not shown) through the circular hole 10.

  For the sealing material 43, for example, rubber packing or the like is used. The minute hole member 42 is firmly held by the sealing material 43, the nozzle body 41 and the nozzle cover 44.

  The nozzle cover 44 has a recess 46 and a bolt insertion hole 47a for fitting the nozzle main body 41 on one end surface 44a, and a cleaning liquid supply port 48 opened outward on the other end surface 44b. . An internal thread is engraved on the inner wall of the nozzle cover 44 facing the bolt insertion hole 47a. In the recess 46, the nozzle body 41 is fitted near the cleaning liquid supply port 48, and the seal member 49, the minute hole member 42, and the seal member 50 are arranged in this order. Further, a cleaning liquid supply pipe, a high-pressure pump, and a cleaning liquid storage tank (not shown) are connected to the cleaning liquid supply port 48 in this order. Further, a seal member 51 is disposed between the nozzle body 41 and the cleaning liquid supply port 48. For the seal members 49, 50, 51, for example, rubber packing is used. When the seal members 49, 50, 51 are arranged in this way, the cleaning liquid flow path from the cleaning liquid flow path 9 to the minute hole member 42 inside the nozzle body 41 is isolated from the contact portion between the nozzle body 41 and the nozzle cover 44. The As a result, as in the case of the substrate cleaning nozzle 1, mixing of particles generated by sliding between the nozzle body 41 and the nozzle cover 44 into the cleaning liquid is prevented.

  The nozzle lid 45 is formed with a slit-like opening 52 penetrating the nozzle lid 45 outwardly at a position continuous with the cleaning liquid ejection hole 8 of the nozzle body 41 and the circular hole 10 of the minute hole member 42. Further, the nozzle lid 45 is formed with a bolt insertion hole 47 b at a position corresponding to the bolt insertion hole 47 a of the nozzle cover 44 so as to penetrate the nozzle lid 45. The nozzle lid 45 is fastened to the nozzle cover 44 by inserting the bolt 53 into the bolt insertion hole 47b through the seal material 43 and screwing it into the female screw of the bolt insertion hole 47a. As a result, the sealing performance between the members is further ensured, and the rigidity of the entire nozzle is improved. A jet flow (not shown) generated by the circular hole 10 of the minute hole member 42 is ejected outward from the slit-shaped opening 52.

  According to the substrate cleaning nozzle 40, the cleaning liquid pressurized by a high pressure pump (not shown) is supplied from the cleaning liquid supply port 48 of the nozzle cover 44 to the nozzle body 41 through the cleaning liquid inlet 7, and further, the cleaning liquid flow path 9, the cleaning liquid injection It passes through the hole 8 and the circular hole 10 of the minute hole member 42, and is sprayed from the slit-shaped opening 52 toward the outside of the nozzle 40 as a jet flow (not shown) onto a surface to be cleaned of a substrate (not shown).

  The substrate cleaning nozzle and the substrate cleaning apparatus of the present invention are used in, for example, a liquid crystal display element, a flat panel display such as a plasma display panel (PDP), a manufacturing process of a semiconductor, a semiconductor substrate such as a silicon substrate, and a glass substrate. Is available.

FIG. 1A is a perspective view showing an appearance of a substrate cleaning nozzle according to the first embodiment of the present invention. FIG. 1B is a perspective view showing a state in which the cleaning liquid is ejected from the substrate cleaning nozzle. It is sectional drawing seen from the cut surface line II of the nozzle for board | substrate washing | cleaning shown in FIG. FIG. 3A is a plan view showing the appearance of the microporous member. FIG.3 (b) is a principal part enlarged plan view of the microporous member shown to Fig.3 (a). It is sectional drawing which shows schematically the structure of the board | substrate cleaning apparatus which is another embodiment of this invention. FIG. 5 is a top view of the substrate cleaning apparatus shown in FIG. 4. It is sectional drawing which shows schematically the structure of the nozzle for board | substrate washing | cleaning which is the 2nd Embodiment of this invention. It is sectional drawing which shows schematically the structure of the nozzle for board | substrate washing | cleaning of patent document 1, and the board | substrate cleaning apparatus containing the same.

Explanation of symbols

1,26,40 Substrate cleaning nozzle 2,41 Nozzle body 3,42 Micro hole member 4,43 Seal material 5,44 Nozzle cover 5a End surface 6,45 Nozzle cover 7 Cleaning liquid inlet 8 Cleaning liquid injection hole 9 Cleaning liquid flow Overflow path 10 Circular hole 11 Spout 12, 49, 50, 51 Seal member 13, 46 Recess 14 a, 14 b, 47 a, 47 b Bolt insertion hole 15, 52 Opening 16, 48 Cleaning liquid supply port 17 Cleaning liquid supply path 18 Cleaning liquid supply pipe DESCRIPTION OF SYMBOLS 19 High pressure pump 20 Packing 20a Hole 21 Bolt 25 Substrate cleaning apparatus 27 Substrate conveyance means 28 Cleaning liquid supply means 29 Arrow 30 Substrate 30a Surface to be cleaned 31 Conveyance roller 32 Conveyance shaft 33 Belt 34 Electric motor 35 Cleaning liquid 36 Cleaning liquid storage tank 37 Shear flow 44a 44b Nozzle cover end face

Claims (8)

In the substrate cleaning nozzle that is disposed so as to face the surface to be cleaned of the substrate and that cleans the surface to be cleaned by spraying the cleaning liquid from the tip that faces the surface to be cleaned of the substrate,
A nozzle body for injecting the supplied cleaning liquid to the outside of the nozzle;
A micro-hole member that makes the cleaning liquid sprayed from the nozzle body jet,
A nozzle cover that protects the nozzle body and presses and holds the microporous member;
A nozzle lid for protecting the nozzle body and the nozzle cover;
A nozzle for cleaning a substrate, wherein the nozzle body and the minute hole member are formed as separate members. The nozzle body has a cleaning liquid injection hole in the inside and a cleaning liquid injection hole connected to the cleaning liquid flow path at one end,
The micro hole member is a thin plate member in which a plurality of micro holes are formed linearly in the longitudinal direction, and is arranged so as to be continuous with the cleaning liquid injection hole of the nozzle body,
The nozzle cover has a recess for accommodating the nozzle body inside and an opening at one end,
2. The substrate cleaning nozzle according to claim 1, wherein the nozzle lid has an opening formed on the surface so as to open outward.   The nozzle for cleaning a substrate according to claim 1 or 2, wherein the nozzle body, the nozzle cover, and the minute hole member are arranged in this order.   3. The nozzle for cleaning a substrate according to claim 1, wherein the nozzle body, the minute hole member, and the nozzle cover are arranged in this order. The nozzle body has a cleaning liquid flow path inside,
The cleaning liquid flow path dimension in a direction orthogonal to the cleaning liquid flow direction is formed in a tapered shape so as to decrease as it goes toward the cleaning liquid injection hole. The nozzle for substrate cleaning as described. A seal member is disposed between the nozzle body and the microhole member or the nozzle cover and / or between the microhole member and the nozzle cover or the nozzle cover and the microhole member;
By the sealing member,
The cleaning liquid flow path from the cleaning liquid flow path inside the nozzle body to the microporous member is isolated from a contact portion between the nozzle body and the nozzle cover. Substrate cleaning nozzle. A substrate cleaning nozzle according to any one of claims 1 to 6,
Cleaning liquid supply means for supplying a cleaning liquid to the substrate cleaning nozzle;
A substrate cleaning apparatus comprising: a substrate transfer means for placing and transferring a substrate to be cleaned. The cleaning liquid sprayed from the substrate cleaning nozzle flows in the shear direction with respect to the substrate transport direction on the surface to be cleaned of the substrate.
The substrate cleaning apparatus according to claim 6, wherein the substrate cleaning nozzle is disposed so as to face the surface to be cleaned of the substrate.

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