JPH06208098A - Substrate washing device - Google Patents
Substrate washing deviceInfo
- Publication number
- JPH06208098A JPH06208098A JP5233790A JP23379093A JPH06208098A JP H06208098 A JPH06208098 A JP H06208098A JP 5233790 A JP5233790 A JP 5233790A JP 23379093 A JP23379093 A JP 23379093A JP H06208098 A JPH06208098 A JP H06208098A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- air
- pressure water
- cleaning
- washing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＬＣＤなどの薄膜基板
製造工程において基板を洗浄する基板洗浄装置の改良に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a substrate cleaning apparatus for cleaning a substrate in a thin film substrate manufacturing process such as LCD.
【０００２】[0002]
【従来の技術】従来、ＬＣＤなどの薄膜基板製造工程に
おいて基板を洗浄する際には搬送ローラによって基板を
洗浄液槽内に搬送させて洗浄する基板洗浄装置が知られ
ている。特に、近年では、基板に高い洗浄度が要求され
ており、次のような従来技術が提案されている。2. Description of the Related Art Conventionally, there is known a substrate cleaning apparatus for cleaning a substrate in a process for manufacturing a thin film substrate such as an LCD by transporting the substrate into a cleaning liquid tank by a transport roller. In particular, in recent years, high cleanliness is required for substrates, and the following conventional techniques have been proposed.
【０００３】すなわち、図２に示すように、液槽２内に
は洗浄液３が満たされおり、基板１を支持、搬送する搬
送ローラ４が配設されている。この搬送ローラ４は、基
板１を一定方向に搬送するよう回動自在に複数配設され
ている。そして、このような搬送ローラ４上に基板１が
載置されると、基板の上面１ａが洗浄液３の水面３ａ近
傍に位置するようにして洗浄液３に浸されるように構成
されている。さらに、液槽２内には、基板１の搬送方向
に直交して複数のジェットノズル５が配設されている。
このジェットノズル５は基板の上面１ａに対して高圧水
６を噴射するようになっている。That is, as shown in FIG. 2, the cleaning liquid 3 is filled in the liquid tank 2, and a transfer roller 4 for supporting and transferring the substrate 1 is arranged. A plurality of transport rollers 4 are rotatably arranged to transport the substrate 1 in a fixed direction. When the substrate 1 is placed on the transport roller 4 as described above, the upper surface 1 a of the substrate is located near the water surface 3 a of the cleaning liquid 3 and is immersed in the cleaning liquid 3. Furthermore, in the liquid tank 2, a plurality of jet nozzles 5 are arranged orthogonal to the transport direction of the substrate 1.
The jet nozzle 5 is adapted to inject high-pressure water 6 onto the upper surface 1a of the substrate.
【０００４】このような構成を有する従来例によれば、
ジェットノズル５から噴射される高圧水６の圧力により
洗浄液３に強い水流が起き、基板の上面１ａに付着して
いる汚れを効果的に洗い流すことができる。しかも、高
圧水６は水面３ａの空気を巻込み、非常に細かい気泡で
あるキャビテーション７を発生させる。そして、このキ
ャビテーション７は基板の上面１ａに衝突して弾けるこ
とにより、上面１ａの微小な汚れを落とすことができ
る。したがって、基板の上面１ａを極めて高い洗浄度で
洗浄することが可能である。According to the conventional example having such a configuration,
A strong water flow occurs in the cleaning liquid 3 due to the pressure of the high-pressure water 6 jetted from the jet nozzle 5, and the dirt adhering to the upper surface 1a of the substrate can be effectively washed away. Moreover, the high-pressure water 6 entrains the air on the water surface 3a to generate cavitations 7 which are very fine bubbles. Then, the cavitation 7 collides against the upper surface 1a of the substrate and is repelled, so that minute dirt on the upper surface 1a can be removed. Therefore, the upper surface 1a of the substrate can be cleaned with an extremely high degree of cleaning.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、以上の
ような従来例において、高い洗浄度による洗浄は基板の
上面１ａに対してしか、その効果を及ぼすことができな
かった。すなわち、基板の上面１ａはキャビテーション
７によって洗浄されているため高い洗浄度を有している
が、下面１ｂ側は洗浄液３に浸されているだけであるた
め、上面１ａと比べて格段に洗浄度が低かった。However, in the above-mentioned conventional examples, cleaning with a high cleaning degree can exert its effect only on the upper surface 1a of the substrate. That is, the upper surface 1a of the substrate has a high cleaning degree because it is cleaned by the cavitation 7, but the lower surface 1b side is only soaked in the cleaning liquid 3, so that the cleaning degree is significantly higher than that of the upper surface 1a. Was low.
【０００６】このような課題を解消する従来例として、
液槽２の洗浄液３内にジェットノズル５を配設して基板
下面１ｂに対して高圧水６を噴射する技術が提案されて
いる。この従来例によれば、ジェットノズル５からの高
圧水６が下面１ｂに噴射されて、下面１ｂの汚れを落と
すことができる。As a conventional example for solving such a problem,
A technique has been proposed in which a jet nozzle 5 is provided in the cleaning liquid 3 in the liquid tank 2 to inject high-pressure water 6 onto the substrate lower surface 1b. According to this conventional example, the high-pressure water 6 from the jet nozzle 5 is jetted to the lower surface 1b, and the lower surface 1b can be cleaned.
【０００７】ところが、このような従来例においても、
以下のような課題が指摘されていた。すなわち、高圧水
６が下面１ｂに噴射されても、洗浄液３中の下面１ｂ付
近には空気が存在せず、キャビテーション７が発生する
ことがない。従って、微小な汚れを落とすことは困難で
あった。また、基板１の両面を高い洗浄度で洗浄するた
め、２つの液槽２を配置して、基板１の両面を片面づつ
洗浄するよう搬送させる技術も考えられるが、この場
合、装置の大形化を招くことと共に、洗浄液の必要量が
増大するなど、不具合が生じていた。以上のように、従
来技術においては、基板の両面を等しく高い洗浄度で洗
浄することができなかった。However, even in such a conventional example,
The following issues were pointed out. That is, even if the high-pressure water 6 is sprayed onto the lower surface 1b, air does not exist near the lower surface 1b in the cleaning liquid 3, and cavitation 7 does not occur. Therefore, it is difficult to remove minute dirt. In addition, in order to clean both sides of the substrate 1 with a high degree of cleaning, a technique in which two liquid tanks 2 are arranged and both sides of the substrate 1 are transported so as to be cleaned one by one is also conceivable. In addition to the above-mentioned problems, problems such as an increase in the required amount of cleaning liquid have occurred. As described above, in the conventional technique, it was not possible to clean both surfaces of the substrate with an equally high cleaning degree.
【０００８】本発明の基板洗浄装置は、上記のような従
来技術の持つ課題を解決するために提案されたものであ
り、その目的は、簡単な構成で基板の上下両面を高い洗
浄度で洗浄することができる基板洗浄装置を提供するこ
とである。The substrate cleaning apparatus of the present invention has been proposed to solve the problems of the prior art as described above, and its purpose is to clean both upper and lower surfaces of a substrate with a high cleaning degree with a simple structure. It is an object of the present invention to provide a substrate cleaning apparatus that can do the above.
【０００９】[0009]
【課題を解決するための手段】以上のような課題を解決
するために、本発明の請求項１記載の基板洗浄装置は、
基板上面が洗浄液に浸されるよう洗浄液の水面付近に設
置される基板の搬送手段と、基板上面に高圧水を噴射す
るよう搬送手段の搬送方向に直交して複数配設される第
１の高圧水ノズルと、基板下面に高圧水を噴射するよう
搬送手段の搬送方向に直交して洗浄液槽内に複数配設さ
れる第２の高圧水ノズルと、基板下面に対して空気を供
給するよう洗浄液槽内に配設される空気供給手段とを備
えたことを構成上の特徴とする。In order to solve the above-mentioned problems, the substrate cleaning apparatus according to claim 1 of the present invention comprises:
A substrate transfer means installed near the water surface of the cleaning liquid so that the upper surface of the substrate is immersed in the cleaning liquid, and a plurality of first high pressures arranged orthogonal to the transfer direction of the transfer means so as to inject high-pressure water onto the upper surface of the substrate. A water nozzle, a plurality of second high-pressure water nozzles arranged in the cleaning liquid tank orthogonal to the transfer direction of the transfer means so as to inject high-pressure water to the lower surface of the substrate, and a cleaning liquid for supplying air to the lower surface of the substrate. It is a structural feature that it is provided with an air supply means arranged in the tank.
【００１０】また、本発明の請求項２記載の基板洗浄装
置は、液槽内の基板下面の下方に配置される中空の空気
供給菅と、基板下面に対して空気を噴射するよう空気供
給菅の上面に開口されるエアノズルと、空気供給菅内に
収納され、エアノズルに近接して前記基板下面に高圧水
を噴射するよう配設される高圧水ノズルとを備えたこと
を特徴とする。According to a second aspect of the present invention, there is provided a substrate cleaning apparatus in which a hollow air supply pipe is disposed below the lower surface of the substrate in the liquid tank, and an air supply pipe for injecting air toward the lower surface of the substrate. And an high pressure water nozzle which is housed in the air supply tube and is arranged close to the air nozzle so as to inject high pressure water onto the lower surface of the substrate.
【００１１】[0011]
【作用】以上のような構成を有する本発明の作用は次の
通りである。すなわち、請求項１記載の基板洗浄装置
は、第１の高圧水ノズルから噴射される高圧水が洗浄液
の水面付近の空気を巻込み、キャビテーションを発生さ
せて基板上面を洗浄する。一方、基板下面は第２の高圧
水ノズルから高圧水が噴射されると同時に、空気供給手
段から空気が供給される。従って、この高圧水と空気に
よりキャビテーションが基板下面付近に発生する。その
ため、このキャビテーションが基板下面を高い洗浄力で
洗浄することができる。The operation of the present invention having the above construction is as follows. That is, in the substrate cleaning apparatus according to the first aspect, the high-pressure water sprayed from the first high-pressure water nozzle entrains air near the water surface of the cleaning liquid to generate cavitation and clean the upper surface of the substrate. On the other hand, on the lower surface of the substrate, high-pressure water is jetted from the second high-pressure water nozzle, and at the same time, air is supplied from the air supply means. Therefore, cavitation is generated near the lower surface of the substrate by the high pressure water and air. Therefore, this cavitation can clean the lower surface of the substrate with high cleaning power.
【００１２】また、請求項２記載の基板洗浄装置は、中
空の空気供給菅内に高圧水ノズル部が収納することによ
り、空気供給手段と高圧水ノズルとを一体化することが
できる。そのため、基板下面を洗浄する手段を簡単に液
槽内に配設することができる。さらに空気供給菅に開口
されるエアノズルと高圧水ノズルとが近接しているた
め、高圧水ノズルから噴射される高圧水がエアノズル部
から供給される空気を効率良く巻込むことができる。そ
のため、洗浄液中でも、きめの細かい均一なキャビテー
ションを発生させることが可能であり、基板下面を高い
洗浄度で洗浄することができる。In the substrate cleaning apparatus according to the second aspect, the high-pressure water nozzle portion is housed in the hollow air supply tube, so that the air supply means and the high-pressure water nozzle can be integrated. Therefore, the means for cleaning the lower surface of the substrate can be easily arranged in the liquid tank. Further, since the air nozzle opened to the air supply pipe and the high-pressure water nozzle are close to each other, the high-pressure water jetted from the high-pressure water nozzle can efficiently wind the air supplied from the air nozzle portion. Therefore, even in the cleaning liquid, fine and uniform cavitation can be generated, and the lower surface of the substrate can be cleaned with a high cleaning degree.
【００１３】以上のように、本発明によれば、基板の両
面をキャビテーションにより洗浄することが可能であ
り、近年要求される極めて高い洗浄度に応えることがで
きる。As described above, according to the present invention, it is possible to clean both surfaces of the substrate by cavitation, and it is possible to meet the extremely high cleaning degree required in recent years.
【００１４】[0014]
【実施例】以上説明したような本発明の基板洗浄装置の
一実施例を図面に基づいて具体的に説明する。なお、従
来技術と同一の部分に関しては同符号を付し、説明は省
略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the substrate cleaning apparatus of the present invention as described above will be specifically described with reference to the drawings. The same parts as those of the conventional technique are designated by the same reference numerals, and the description thereof will be omitted.
【００１５】すなわち、図１に示すように、液槽２の下
方には、中空の洗浄ユニット１２が配設されている。こ
の洗浄ユニット１２には、洗浄ユニット１２内部に空気
１４を供給するための供給口１２ａが設けられている。
また、洗浄ユニット１２には、上面に複数の突起が形成
され、この突起中央にエアノズル１１が開口して設けら
れている。これらのエアノズル１１は基板１の下面１ｂ
に対して空気１４を噴射するように構成されている。さ
らに、洗浄ユニット１２内部には、複数のジェットノズ
ル１０を備えた高圧水パイプ１３が収納されている。こ
の高圧水パイプ１３は、ジェットノズル１０に高圧水６
を供給するようになっている。また、ジェットノズル１
０はエアノズル１１の真下に配置され、エアノズル１を
通って１基板１の下面１ｂに向けて高圧水６を噴射する
ようになっている。そして、ジェットノズル１０からの
高圧水６がエアノズル１１付近の空気１４を巻込み、基
板１の下面１ａに向けてキャビテーション７が発生する
ように構成されている。That is, as shown in FIG. 1, a hollow cleaning unit 12 is disposed below the liquid tank 2. The cleaning unit 12 is provided with a supply port 12a for supplying the air 14 into the cleaning unit 12.
Further, the cleaning unit 12 has a plurality of protrusions formed on the upper surface thereof, and the air nozzle 11 is provided at the center of the protrusions so as to open. These air nozzles 11 are the lower surface 1b of the substrate 1.
It is configured to inject the air 14 against. Further, a high-pressure water pipe 13 having a plurality of jet nozzles 10 is housed inside the cleaning unit 12. This high-pressure water pipe 13 allows the jet nozzle 10 to apply high-pressure water 6
Are to be supplied. Also, the jet nozzle 1
No. 0 is arranged directly below the air nozzle 11, and the high pressure water 6 is jetted through the air nozzle 1 toward the lower surface 1b of the one substrate 1. The high-pressure water 6 from the jet nozzle 10 entrains the air 14 near the air nozzle 11 to generate cavitation 7 toward the lower surface 1 a of the substrate 1.
【００１６】以上のような構成を有する本実施例によれ
ば、基板１下方のエアノズル１１からの空気１４とジェ
ットノズル１０からの高圧水６により、基板の下面１ｂ
に向かってキャビテーション７を発生させることができ
る。しかも、本実施例は、エアノズル１１の真下にジェ
ットノズル１０が配置されているため、高圧水６が空気
１４を効率良く巻込んで、洗浄液３中でも、均一なキャ
ビテーションを発生させることができる。このような基
板の下面１ｂでのキャビテーション７によって、洗浄時
には基板の下面１ｂの微小な汚れを落とすことができ
る。しかも、基板上面１ａは、従来と同様に基板１上方
のジェットノズル５から噴射される高圧水６が洗浄液３
の水面３ａ付近の空気を巻込み、これによりキャビテー
ション７を発生させて基板の上面１ａを高い洗浄度で洗
浄する。According to this embodiment having the above-mentioned structure, the lower surface 1b of the substrate 1 is formed by the air 14 from the air nozzle 11 below the substrate 1 and the high pressure water 6 from the jet nozzle 10.
The cavitation 7 can be generated toward. Moreover, in this embodiment, since the jet nozzle 10 is arranged directly below the air nozzle 11, the high-pressure water 6 efficiently entrains the air 14 and uniform cavitation can be generated even in the cleaning liquid 3. By such cavitation 7 on the lower surface 1b of the substrate, minute dirt on the lower surface 1b of the substrate can be removed during cleaning. Moreover, the high-pressure water 6 jetted from the jet nozzle 5 above the substrate 1 is applied to the cleaning liquid 3 on the upper surface 1a of the substrate as in the conventional case.
The air near the water surface 3a is engulfed to generate cavitation 7 and clean the upper surface 1a of the substrate with a high degree of cleaning.
【００１７】従って、本実施例では、基板１の上面１ａ
及び下面１ｂの両方を、同時に高い洗浄度により洗浄す
ることができる。さらに、本実施例は、従来の液槽２内
に洗浄ユニット１２を沈めるだけで構成することが可能
であるため、高洗浄度の装置の小形化に貢献することが
できる。しかも、簡単な設置工事により、従来の装置を
優れた洗浄効果を有する装置とすることができる。この
ように、本実施例の基板洗浄装置は、製造及び設置作業
が容易であることから、全体として生産コストを削減す
ることが可能となる。Therefore, in this embodiment, the upper surface 1a of the substrate 1 is
Both the bottom surface 1b and the lower surface 1b can be cleaned simultaneously with a high cleaning degree. Furthermore, since the present embodiment can be configured by only submerging the cleaning unit 12 in the conventional liquid tank 2, it is possible to contribute to downsizing of the apparatus with high cleaning degree. Moreover, the conventional device can be made into a device having an excellent cleaning effect by a simple installation work. As described above, the substrate cleaning apparatus of the present embodiment is easy to manufacture and install, so that it is possible to reduce the production cost as a whole.
【００１８】なお、本発明の基板洗浄装置は、以上のよ
うな実施例に限定されるものではなく、ジェットノズル
とエアノズルを洗浄ユニットに交互に配設しても良く、
また、ジェットノズルとエアノズルの具体的な配設数及
び形状なども適宜選択可能である。The substrate cleaning apparatus of the present invention is not limited to the above embodiment, and jet nozzles and air nozzles may be alternately arranged in the cleaning unit.
Further, the specific number and shape of the jet nozzles and the air nozzles can be appropriately selected.
【００１９】[0019]
【発明の効果】以上述べたように、本発明の基板洗浄装
置によれば、洗浄液水面付近の基板上面に高圧水を噴射
する第１の高圧水ノズルと、洗浄液槽内に配設されて基
板下面に高圧水及び空気を供給する第２の高圧水ノズル
及び空気供給手段とを備えるという簡単な構成によっ
て、同一の液槽内で基板の上下両面を高圧水及び空気に
より発生するキャビテーションにより洗浄することがで
きるため、装置の小形化に貢献しつつ極めて高い洗浄能
力が有する優れた基板洗浄装置を提供することができ
る。As described above, according to the substrate cleaning apparatus of the present invention, the first high-pressure water nozzle for injecting high-pressure water onto the upper surface of the substrate near the water surface of the cleaning liquid and the substrate disposed in the cleaning liquid tank are used. With a simple structure including a second high-pressure water nozzle for supplying high-pressure water and air to the lower surface and an air supply means, both upper and lower surfaces of the substrate are cleaned by cavitation generated by the high-pressure water and air in the same liquid tank. Therefore, it is possible to provide an excellent substrate cleaning apparatus having an extremely high cleaning ability while contributing to downsizing of the apparatus.
【００２０】さらに、本発明によれば、空気供給手段と
高圧水ノズルとを一体化することにより、基板下面の洗
浄手段を簡単に配設することができ、且つ、空気を噴射
するエアノズルと高圧水ノズルとを近接させて、高圧水
に空気を効率良く巻込ませることにより、洗浄液中で
も、洗浄力の高いキャビテーションを発生させることが
可能である優れた基板洗浄装置を提供することができ
る。Further, according to the present invention, by integrating the air supply means and the high pressure water nozzle, the cleaning means for the lower surface of the substrate can be easily arranged, and the air nozzle for injecting air and the high pressure water It is possible to provide an excellent substrate cleaning apparatus capable of generating cavitation with a high cleaning power even in a cleaning liquid by efficiently bringing air into high-pressure water by bringing it close to a water nozzle.
【図１】本発明の一実施例の基板洗浄装置を示す側面断
面図。FIG. 1 is a side sectional view showing a substrate cleaning apparatus according to an embodiment of the present invention.
【図２】従来例の側面断面図。FIG. 2 is a side sectional view of a conventional example.
１…基板 ２…液槽 ３…洗浄液 ４…搬送ローラ ５…ジェットノズル ６…高圧水 ７…キャビテーション １０…ジェットノズル １１…エアノズル １２…洗浄ユニット １３…高圧水パイプ １４…空気 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Liquid tank 3 ... Cleaning liquid 4 ... Conveying roller 5 ... Jet nozzle 6 ... High pressure water 7 ... Cavitation 10 ... Jet nozzle 11 ... Air nozzle 12 ... Cleaning unit 13 ... High pressure water pipe 14 ... Air
Claims (2)
水を噴射して洗浄する基板洗浄装置において、 前記基板上面が洗浄液に浸されるよう洗浄液の水面付近
に設置される基板の搬送手段と、 前記基板上面に高圧水を噴射するよう該搬送手段の搬送
方向に直交して複数配設される第１の高圧水ノズルと、 前記基板下面に高圧水を噴射するよう該搬送手段の搬送
方向に直交して洗浄液槽内に複数配設される第２の高圧
水ノズルと、 前記基板下面に対して空気を供給するよう洗浄液槽内に
配設される空気供給手段と、 を備えたことを特徴とする基板洗浄装置。1. A substrate cleaning apparatus for spraying high-pressure water onto a substrate transported in a cleaning liquid tank to clean the substrate, wherein the substrate transport means is installed near the water surface of the cleaning liquid so that the upper surface of the substrate is immersed in the cleaning liquid. A plurality of first high-pressure water nozzles arranged orthogonal to the transfer direction of the transfer means to inject high-pressure water onto the upper surface of the substrate, and transfer of the transfer means to inject high-pressure water onto the lower surface of the substrate A plurality of second high-pressure water nozzles arranged in the cleaning liquid tank orthogonal to the direction; and an air supply unit arranged in the cleaning liquid tank so as to supply air to the lower surface of the substrate. A substrate cleaning device characterized by the above.
空の空気供給菅と、 前記基板下面に対して空気を噴射するよう該空気供給菅
の上面に開口されるエアノズルと、 前記空気供給菅内に収納され、該エアノズルに近接して
前記基板下面に高圧水を噴射するよう配設される高圧水
ノズルと、 を備えたことを特徴とする請求項１記載の基板洗浄装
置。2. A hollow air supply tube disposed below a lower surface of the substrate in the liquid tank, an air nozzle opened on an upper surface of the air supply tube to inject air toward the lower surface of the substrate, and the air. 2. The substrate cleaning apparatus according to claim 1, further comprising: a high-pressure water nozzle that is housed in a supply tube and is arranged so as to eject high-pressure water onto the lower surface of the substrate in the vicinity of the air nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5233790A JP2504916B2 (en) | 1993-09-20 | 1993-09-20 | Substrate cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5233790A JP2504916B2 (en) | 1993-09-20 | 1993-09-20 | Substrate cleaning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06208098A true JPH06208098A (en) | 1994-07-26 |
| JP2504916B2 JP2504916B2 (en) | 1996-06-05 |
Family
ID=16960613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5233790A Expired - Lifetime JP2504916B2 (en) | 1993-09-20 | 1993-09-20 | Substrate cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504916B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996038027A1 (en) * | 1995-05-25 | 1996-11-28 | Höllmüller Maschinenbau GmbH | Process for treating objects, especially electronic printed circuit boards, and device for implementing it |
| DE19618974A1 (en) * | 1996-05-10 | 1997-11-13 | Wacker Chemie Gmbh | Semiconductor material treatment in cavitating liquid bath |
| US5857474A (en) * | 1995-12-28 | 1999-01-12 | Dainippon Screen Mfg. Co., Ltd. | Method of and apparatus for washing a substrate |
| US6193897B1 (en) | 1996-07-02 | 2001-02-27 | Kabushiki Kaisha Toshiba | Shadow mask manufacturing method, shadow mask manufacturing apparatus, and cleaning device used in the method and apparatus |
| KR20040042287A (en) * | 2002-11-13 | 2004-05-20 | 주식회사 씨어테크 | A detergent supplying apparatus for screen printer |
| JP2012114228A (en) * | 2010-11-24 | 2012-06-14 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Cleaning method of wafer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS493160A (en) * | 1972-04-26 | 1974-01-11 | ||
| JPS58147246U (en) * | 1982-03-30 | 1983-10-03 | 富士通株式会社 | Substrate liquid transfer device |
| JPS61178081A (en) * | 1985-02-05 | 1986-08-09 | 八洋エンジニアリング株式会社 | Washer |
| JPS61182229A (en) * | 1985-02-08 | 1986-08-14 | Hitachi Ltd | Washing apparatus |
| JPS63108630U (en) * | 1986-12-29 | 1988-07-13 |
-
1993
- 1993-09-20 JP JP5233790A patent/JP2504916B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS493160A (en) * | 1972-04-26 | 1974-01-11 | ||
| JPS58147246U (en) * | 1982-03-30 | 1983-10-03 | 富士通株式会社 | Substrate liquid transfer device |
| JPS61178081A (en) * | 1985-02-05 | 1986-08-09 | 八洋エンジニアリング株式会社 | Washer |
| JPS61182229A (en) * | 1985-02-08 | 1986-08-14 | Hitachi Ltd | Washing apparatus |
| JPS63108630U (en) * | 1986-12-29 | 1988-07-13 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996038027A1 (en) * | 1995-05-25 | 1996-11-28 | Höllmüller Maschinenbau GmbH | Process for treating objects, especially electronic printed circuit boards, and device for implementing it |
| US5857474A (en) * | 1995-12-28 | 1999-01-12 | Dainippon Screen Mfg. Co., Ltd. | Method of and apparatus for washing a substrate |
| DE19618974A1 (en) * | 1996-05-10 | 1997-11-13 | Wacker Chemie Gmbh | Semiconductor material treatment in cavitating liquid bath |
| US6193897B1 (en) | 1996-07-02 | 2001-02-27 | Kabushiki Kaisha Toshiba | Shadow mask manufacturing method, shadow mask manufacturing apparatus, and cleaning device used in the method and apparatus |
| KR20040042287A (en) * | 2002-11-13 | 2004-05-20 | 주식회사 씨어테크 | A detergent supplying apparatus for screen printer |
| JP2012114228A (en) * | 2010-11-24 | 2012-06-14 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Cleaning method of wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504916B2 (en) | 1996-06-05 |
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