CN113412535A - Suspension conveying device - Google Patents
Suspension conveying device Download PDFInfo
- Publication number
- CN113412535A CN113412535A CN201980075803.4A CN201980075803A CN113412535A CN 113412535 A CN113412535 A CN 113412535A CN 201980075803 A CN201980075803 A CN 201980075803A CN 113412535 A CN113412535 A CN 113412535A
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- CN
- China
- Prior art keywords
- air
- levitation
- substrate
- glass substrate
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000725 suspension Substances 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 148
- 238000005339 levitation Methods 0.000 claims abstract description 92
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000007921 spray Substances 0.000 claims abstract description 19
- 239000007900 aqueous suspension Substances 0.000 claims abstract description 6
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 230000032258 transport Effects 0.000 claims 15
- 239000011521 glass Substances 0.000 abstract description 84
- 238000005530 etching Methods 0.000 abstract description 73
- 239000007788 liquid Substances 0.000 description 26
- 238000005406 washing Methods 0.000 description 17
- 238000007667 floating Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 7
- 229920000306 polymethylpentene Polymers 0.000 description 7
- 239000011116 polymethylpentene Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 208000028659 discharge Diseases 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/01—Hydraulic transport of articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Abstract
The invention provides a suspension conveying device capable of conveying a thin substrate in a wet state after etching treatment in a stable state. The levitation transport unit (60) is provided with: the glass substrate conveyance device is provided with a water levitation conveyance unit (62), an air knife (64), a first air levitation conveyance unit (66), a second air levitation conveyance unit (68), an auxiliary roller (70), and a conveyance belt (72), and conveys the glass substrate (24) in a levitated state. The water suspension transport unit (62) has a water film forming plate (621) configured to form a water film on the surface. The air knife (64) is configured to spray air to the substrate to be processed. The first air levitation transportation unit (66) has a levitation transportation plate (67) in which an ejection hole (82) for ejecting air from below toward the glass substrate (24) is formed. The second air-levitation transport unit (68) has a porous plate (681). The auxiliary roller (70) and the conveyor belt (72) convey the glass substrate (24) in a conveying direction.
Description
Technical Field
The present invention relates to a levitation transportation device for transporting a thin substrate such as a glass substrate in a state of levitation.
Background
In recent years, there has been a strong demand for a flat panel display such as a liquid crystal display to be thinner. In general, a liquid crystal panel is thinned by wet etching. The thickness of the liquid crystal panel thinned by the etching treatment is about 0.1 to 0.3 mm.
The mechanical strength of the liquid crystal panel after the etching treatment is reduced, and therefore the treatment becomes difficult. For example, if a fine damage occurs during the conveyance of the substrate, the substrate may be damaged from the damage. In addition, in the case of a thin substrate, the substrate may be damaged due to its deflection during transportation.
The substrate is generally carried in a state of being mounted on a roller, but the contact with the roller causes damage to the substrate. Further, if the arrangement interval of the rollers is increased, the substrate may be bent between the rollers during conveyance, and may fall during conveyance of the substrate. Even if the distance between the rollers is intended to be narrowed, the distance between the rollers may not be sufficiently narrowed depending on the relationship between the driving mechanism and the gear.
Therefore, it is considered to convey a thin substrate using a levitation conveyor capable of conveying the thin substrate in a non-contact state. The levitation transportation device can levitate the thin substrate at a constant height by controlling the balance between the ejection of the pressurized gas from the porous pad and the vacuum suction (see, for example, patent document 1). By using the levitation transportation device, the glass substrate can be transported in a non-contact state without generating deflection or the like.
Prior art documents
Patent document
Patent document 1: japanese patent laid-open publication No. 2016-121015
Disclosure of Invention
(problems to be solved by the invention)
However, the substrate after the etching treatment is in a state of being wetted with the treatment liquid or the like. When a substrate in a wet state is transported by using the levitation transportation device, water adhering to the substrate is sucked through the suction holes for vacuum suction, and the suction holes are closed. Therefore, the balance between the buoyancy and the suction force cannot be maintained, and a conveyance failure occurs.
In order to prevent such a problem, it is necessary to dry the substrate before the substrate is conveyed by the levitation transportation device. However, since it is necessary to convey the substrate during the drying process so as not to damage the substrate, it is difficult to use the conventional drying apparatus and conveying mechanism.
The invention aims to provide a suspension conveying device for conveying a thin substrate in a suspension state.
(means for solving the problems)
The present invention relates to a levitation transportation device for transporting a substrate to be processed in a levitated state, and the levitation transportation device includes a water levitation transportation unit, an air knife, an air levitation transportation unit, and a transportation roller. The water suspension transport unit has a water film forming plate configured to form a water film on a surface thereof. The air knife is arranged at the rear stage of the water suspension conveying part and is configured to spray air to the processed substrate. The air levitation transportation unit is disposed at a rear stage of the air knife, and includes a levitation transportation plate having an ejection hole for ejecting air toward the substrate from below. The conveying rollers are arranged along the conveying direction of the substrate to be processed in the water levitation conveying part and the air levitation conveying part.
The water floating transport unit is configured to support the substrate to be processed in a floating state by the water film on the water film forming plate. The levitation in the present invention includes a state in which a part of the substrate to be processed is supported by the transport rollers. The substrate to be processed is difficult to be transported only by the floating transport unit, and is transported in the transport direction of the floating transport device by the transport roller.
The air knife is configured to dry the substrate to be processed by spraying air. At this time, since the substrate to be processed is held by the surface tension of the water film with the water levitation transport unit, it is possible to prevent troubles such as levitation and deflection caused by the air from the air knife.
The air levitation transportation unit is configured to transport the substrate in a levitated state by ejecting air from below the substrate passing through the air knife. In the air levitation transport unit, the target substrate is also transported by the transport rollers. Since the substrate to be processed by the air knife is in a state where water droplets are removed, the water adhered to the substrate does not block the air ejection holes. By stably conveying the substrate by the air levitation conveyor, the work such as conveyance in the post-processing step and packaging of the substrate to be processed is facilitated.
Further, preferably, the aero-levitation transport unit includes a first aero-levitation transport unit and a second aero-levitation transport unit. The first air levitation transport section is disposed between the air knife and the second air levitation transport section. The second air levitation transportation unit has a levitation transportation plate having suction holes formed in a surface thereof for sucking air.
The substrate to be processed is transported by controlling the balance between the ejection and suction of air, but when water droplets adhere to the substrate passing through the air knife, the suction holes may be clogged. Therefore, the substrate to be processed is conveyed by the second air levitation-conveyance unit after the first air levitation-conveyance unit that conveys the substrate to be processed only by the air jet passes through a certain distance, and thus more stable conveyance can be performed.
Further, the first levitation transport unit preferably includes suction holes for sucking air in a region in contact with the air knife. When the substrate to be processed passes through the air knife, the front end portion of the substrate to be processed passing through the water levitation transport unit may be levitated. Therefore, the substrate to be processed can be stably conveyed by sucking the substrate to be processed through the suction holes of the first levitation conveyance unit.
In addition, preferably, the air knife sprays air to both main surfaces of the substrate to be processed. By jetting air to both main surfaces, it is possible to prevent moisture from being brought into the air floating conveyance unit, and more stable conveyance can be performed. Further, the levitation and deflection of the substrate caused by the ejection of air from the lower surface can be suppressed by the levitating and conveying unit.
(effect of the invention)
According to the present invention, it is possible to provide a levitation transportation device capable of levitation-transporting a thin substrate such as a glass substrate.
Drawings
Fig. 1 is a schematic view of an etching apparatus including a levitation transportation apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic side view of an etching apparatus including a levitation transportation apparatus according to an embodiment of the present invention.
Fig. 3 is a diagram showing a structure of an etching chamber of the etching apparatus.
Fig. 4 is a diagram showing a state in which a door body of a ceiling portion is opened.
Fig. 5 is a diagram showing the structure of the levitation transport unit.
Fig. 6 is a diagram showing a state of the glass substrate conveyed by the water levitation transport unit.
Detailed Description
Here, a levitation transport unit according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 and 2 are schematic diagrams of an etching apparatus 10 for etching a glass substrate provided with a levitation transportation unit 60. The etching apparatus 10 includes a loading unit 12, a front washing chamber 14, a first etching chamber 161, a second etching chamber 162, a rear washing chamber 18, a transfer roller 30, and a levitation transport unit 60.
As shown in fig. 2, the transport rollers 30 are disposed along the longitudinal direction of the etching apparatus 10, and are configured to transport the glass substrate 24 in the horizontal direction. The conveying rollers 30 are arranged at regular intervals along the conveying direction of the glass substrate 24, and convey the glass substrate 24 by supporting it from below. The conveyance speed of the glass substrate 24 is preferably set as appropriate in consideration of the size and thickness of the glass substrate 24, the injection pressure of the etching liquid, the composition of the etching liquid, and the like. The etching apparatus 10 is configured to perform an etching process such as thinning by spraying an etching liquid onto the glass substrate 24 conveyed by the conveying roller 30.
The carrying-in section 12 is configured to introduce the glass substrate 24 into the etching apparatus 10 by placing the glass substrate 24 on the carrying roller 30. The glass substrate 24 is conveyed in the horizontal direction by the conveying rollers 30 and passed through the chambers, thereby performing etching treatment until a desired thickness is achieved. The glass substrates 24 are sequentially loaded into the etching apparatus 10 at predetermined intervals.
The front washing chamber 14 is disposed at the rear stage of the carry-in section 12. The front washing chamber 14 is configured to spray a cleaning liquid from a spray unit 32 disposed above and below the conveying roller 30 onto the glass substrate 24 conveyed by the conveying roller 30. When the etching solution is brought into contact with a dried glass substrate, the glass substrate may be cloudy. Therefore, the etching apparatus 10 is configured to spray the cleaning liquid at the front stage of the etching chamber. In the present embodiment, tap water is used as the cleaning liquid.
The first etching chamber 161 and the second etching chamber 162 have substantially the same configuration, and are configured to eject an etching solution onto the glass substrate 24 being conveyed. In each of the etching chambers 161 and 162, the spray unit 32 is disposed above and below the conveying roller 30, and the etching liquid is sprayed from the spray unit 32 toward the glass substrate 24 on the conveying roller 30.
The spray unit 32 is configured to have a plurality of spray nozzles 36 arranged in a liquid supply pipe 34 and to uniformly spray the etching liquid onto the glass substrate 24. The etching liquid is supplied from a tank or the like containing the etching liquid having the adjusted composition. By the reciprocating movement of the spray unit 32, the etching liquid can be uniformly sprayed by the glass substrate 24, and the etching liquid can be prevented from staying on the upper surface of the glass substrate 24. The arrangement of the ejection units 32 and the number of the ejection nozzles 36 can be appropriately changed according to the size of the substrate to be processed and the etching amount.
As shown in fig. 3, the etching solution ejected from each etching chamber is discharged from a discharge port 38 disposed at a lower portion of the etching chamber. The etching solution discharged from the discharge port 38 is collected in a tank not shown, and is supplied again from the tank to the spray unit 32.
The etching solution in the present embodiment contains at least hydrofluoric acid, and may contain an inorganic acid such as hydrochloric acid or sulfuric acid, and a surfactant. The composition and temperature of the etching solution can be appropriately changed depending on the etching amount and the type of the substrate to be processed. The etching apparatus 10 has 2 etching chambers, but the number of etching chambers may be changed in consideration of the substrate to be processed, the installation location, and the like.
As shown in fig. 1 and 3, each of the etching chambers 161 and 162 is covered with a ceiling portion 40 having an arc-shaped cross section. The ceiling portion 40 includes a transparent member 42, a frame 44, and a protective film 46. The transparent member 42 is made of a resin member having resistance to the etching solution, and has an arc-shaped cross section. Examples of the resin member used as the transparent member 42 include polyethylene-based resins, fluorine-based resins, polypropylene-based resins, and the like. The transparent member 42 can be processed into a desired curved surface shape by hot working.
The frame 44 is attached to the outer wall side of the transparent member 42 in order to maintain the strength of the process chamber. The frame 44 is made of a metal member such as iron, and is arranged in a lattice shape. Since the frame 44 is attached to the outer wall side of the transparent member 42, it is not necessary to dispose an extra structure on the inner wall side of the transparent member 42. Therefore, the trouble that the scattered etching liquid accumulates in the uneven portion on the inner wall side can be eliminated, and the etching liquid can be discharged along the wall surface of the ceiling portion 40. Further, the ceiling portion 40 has a small number of components, and thus visibility in the etching chamber can be improved.
The protective film 46 is a transparent film attached to the inner surface side of the transparent member 42. As the protective film 46, a polymethylpentene film may be used. The polymethylpentene film is a transparent film and also has chemical resistance, and therefore, even if it is stuck to the inner wall of the etching chamber, it does not deteriorate. Further, since polymethylpentene has low surface tension, the etching liquid scattered to the inner wall easily flows along the wall surface.
In the case of using a polymethylpentene film, the polymethylpentene resin is stretched, cut out to a predetermined size suitable for the member to be used, and then subjected to surface modification treatment by a corona surface treatment machine. The surface modification treatment can be performed by using a known corona discharge treatment apparatus such as a vacuum tube system or a thyristor system. In this embodiment, a distance of about 0.1 to 10mm is provided between the discharge electrode and the polymethylpentene film, and the treatment is performed by applying an applied voltage of 0.1 to 50 kV. The surface of the polymethylpentene film subjected to the surface modification treatment is a bonding surface with another transparent resin, and a pressure-sensitive adhesive layer is formed on the bonding surface.
As shown in fig. 4(a), the transparent member 42 is provided with a door 50 that can be opened and closed. The door 50 selectively opens or closes an opening 52 formed in the ceiling portion 40. When the chamber is closed, the door 50 is fitted into the opening 52, and the etching chamber is closed. A seal member is disposed at the peripheral edge of the opening 52, thereby improving the sealing property of the etching chamber.
The door 50 is formed of the transparent member 42 in a curved shape, similarly to the ceiling portion 40. Further, a protective film 46 is also attached to the inner surface side of the door 50. This reduces the possibility of the etching liquid staying in the door 50, and the etching liquid falls along the ceiling portion 40.
The door 50 is rotatably supported by a hinge 54 at an end of the opening 52. The hinge 54 is also formed of the transparent member 42. As shown in fig. 4(a), the door 50 can be opened by being rotated upward. The door 50 includes a grip 56, and when the operator or the like lifts the grip 56, the door 50 rotates about the hinge 54. The door 50 is preferably fixed by a fixing mechanism that can be fixed in an opened state.
Due to the curved shape of the door 50, the etching liquid adhering to the inner wall side of the door 50 does not adhere to the periphery of the etching apparatus 10 even when the door 50 is opened. Further, as shown in fig. 4(B), the etching liquid flows along the curved shape of the door 50, and finally drops from the opening 52 into the etching chamber. This can prevent contamination of the peripheral portion of the etching apparatus 10.
As shown in fig. 2, 2 adjacent process chambers such as the front washing chamber 14 and the first etching chamber 161 are separated by partition walls. The frame of the etching chamber including the partition (except the ceiling portion 40) is made of a resin having hydrofluoric acid resistance, such as polyvinyl chloride. In order to pass the glass substrate 24 through the partition wall, slit portions 22 communicating with the 2 process chambers are formed. The slit portion 22 is formed to have a height enough to allow the glass substrate 24 to pass therethrough, and is preferably formed to have a height of 4 to 10 mm.
The post-water washing chamber 18 is disposed at a rear stage of the second etching chamber 162. The rear washing chamber 18 is configured to wash the etching solution by spraying the cleaning solution onto the glass substrate 24 from the vertical direction, similarly to the front washing chamber 14. Tap water was used as the cleaning liquid in the same manner as in the front water cleaning chamber 14.
A throttle roller 26 is disposed in the most downstream portion of the rear washing chamber 18. The throttle roller 26 is a columnar member disposed above the conveying roller 30, and rotates along the upper surface of the glass substrate 24 to physically remove water on the glass substrate 24.
A liquid cutter (リキッドカッタ corresponding to Japanese) 28 is disposed in the rear stage of the throttle roller 26 above the carrying-out port of the rear washing chamber 18. The liquid cutter 28 sprays air onto the upper portion of the glass substrate 24 to remove the cleaning water. By disposing the liquid cutter 28, the glass substrate 24 can be prevented from being conveyed to the levitation transportation unit 60 in a state where a large amount of washing water remains on the glass substrate 24. The jet pressure and jet angle of the air from the liquid cutter 28 are appropriately adjusted according to the thickness and size of the glass substrate.
The glass substrate 24 having passed through the post-washing chamber 18 is conveyed by the levitation-conveyance unit 60. As shown in fig. 5, the levitation transport unit 60 includes: the water levitation conveyor 62, the air knife 64, the first air levitation conveyor 66, the second air levitation conveyor 68, the auxiliary roller 70, and the conveyor belt 72 convey the glass substrate 24 in the direction indicated by the arrow in the figure. The water levitation transport unit 62, the air knife 64, the first air levitation transport unit 66, and the second levitation transport unit 68 are arranged along the transport direction of the glass substrate 24.
The water levitation transport unit 62 is configured to transport the glass substrate 24 transported from the post-washing chamber 18 to the air knife 64. The water suspension transport section 62 includes 3 water film forming plates 621 to 623. The water film forming plates 621 to 623 are substrates of the same mechanism, but have different shapes depending on the arrangement of the air knife 64. The water film forming plates 621 to 623 are arranged at a predetermined distance in a direction perpendicular to the conveyance direction of the glass substrate 24.
As shown in fig. 6(a), the water spray holes 80 are formed in the main surface of the water film forming plate 621 and configured to spray a predetermined amount of water. The water ejected from the water ejection holes 80 is accumulated on the main surface of the water film forming plate 621 to form a water film. The water film forming plate 621 is configured to form a water film on the surface and suspend the glass substrate 24. The water discharge holes 80 continuously discharge water in order to make the height of the water film constant during the conveyance of the glass substrate 24. The structure of the water film forming plate is not limited to this, and a porous substrate that discharges water from the holes on the surface may be used.
In addition, an auxiliary roller 70 and a conveyor belt 72 are disposed between the water film forming plates 621 to 623. The auxiliary roller 70 is a roller rotated by a drive mechanism not shown. The conveyor belt 72 is an endless belt bridged over the pair of auxiliary rollers 70. The conveyor 72 is disposed in contact with the lower surface of the glass substrate 24, and is configured to convey the glass substrate 24 in the direction indicated by the arrow in the figure.
Since the glass substrate 24 having passed through the post-washing chamber 18 is conveyed in a state where washing water adheres thereto, it is difficult to perform levitation conveyance by air by tensioning the glass substrate 24 and the levitation conveyance unit. Therefore, the water is conveyed by the conveyor 72 while being suspended on the water film. The glass substrate 24 is in contact with the conveyor belt 72, but is floating on the water film, and therefore, pressure is not locally applied.
The air knife 64 includes an upper air knife 641 and a lower air knife 642, and is configured to eject air onto the glass substrate 24 that has passed through the water levitation transport unit 62. The upper air knife 641 and the lower air knife 642 are configured to remove water droplets adhering to the glass substrate 24 by spraying air onto the main surface of the glass substrate 24.
The upper air knife 641 is configured to eject air common to the air supply pipe 651 from the air ejection portion 652 to the upper main surface of the glass substrate 24. The air injection pressure and the air injection angle are appropriately adjusted according to the thickness and the size of the glass substrate 24. In the present embodiment, as shown in fig. 6(a), the front end portion of the upper air knife 641 is disposed so as to face the side 62 of the aerosol transport unit.
The lower air knife 642 is disposed below the upper air knife 641 and configured to spray air onto the lower surface of the glass substrate 24. As shown in fig. 6(B), the lower air knife 642 includes an air supply pipe 74, an air ejection portion 76, and a slit nozzle 78. The air jetting unit 76 of the lower air knife 642 is disposed at a position lower than the main surface of the water film forming plate 621, and jets air from below toward the main surface on the lower side of the glass substrate 24.
The air supply pipe 74 extends in the vertical direction toward the air ejection portion 76, and air supplied from an air supply source not shown passes therethrough. The air ejection portion 76 is an opening portion that ejects air toward the lower air knife 642 at the tip end portion. The air injection unit 76 includes a housing 77 for housing the slit nozzle 78. The housing portion 77 is configured such that the slit nozzle 78 is rotatably supported in the housing portion 77.
The slit nozzle 78 is a cylindrical member disposed at the tip end of the lower air knife 642, and air is supplied from the air supply pipe 74. The slit nozzle 78 is configured such that slits are formed in the air supply pipe 74 side and the air jetting portion 76 side, respectively, and air is jetted from the slits in the air jetting portion 76 side. The width of the slit on the air jet part 76 side is adjusted to be in the range of 0.1 to 0.5 mm.
Since the slit nozzle 78 is rotatable in the housing portion 77, the air injection angle can be adjusted according to the size, thickness, and the like of the glass substrate 24. Further, since the jet angle can be adjusted by the slit nozzle 78, the lower air knife 642 does not need to be disposed obliquely to the glass substrate 24, and can be disposed in the gap between the levitation transport unit 62 and the first levitation transport unit 66.
The gas knife 64 is disposed to be inclined in a plane with respect to the conveyance direction of the glass substrate 24. In the present embodiment, the air knife 64 is disposed obliquely, and air is blown toward the third water film forming plate 623 on the downstream side in the conveyance direction of the glass substrate 24, whereby water on the glass substrate moves to one place, and thus drying can be performed efficiently. The levitation and deflection of the glass substrate 24 by the air from the lower air knife 642 can be prevented by the surface tension of the lower surface of the glass substrate 24 and the water film.
The first air levitation transport unit 66 levitates the glass substrate 24 by jetting air from below against the glass substrate 24 that has passed through the air knife 64. The plurality of levitation transport plates 67 of the first levitation transport unit 66 are arranged in a matrix with a predetermined gap. The suspended conveyance plate 67 has substantially the same structure, but the suspended conveyance plates 671 to 673 adjacent to the air knives 64 have different shapes from those of the other suspended conveyance plates depending on the inclination of the air knives 64.
The floating conveyance plate 67 has a plurality of ejection holes 82 formed in a main surface thereof, and is configured to eject a predetermined amount of compressed air. The size of the hole diameter of the injection hole 82 is preferably 0.1 to 0.9mm, and the holes are arranged in a staggered manner at predetermined intervals in the conveyance direction of the glass substrate 24. The amount of air injected from the injection holes 82 is appropriately adjusted according to the size and thickness of the glass substrate 24.
The glass substrate 24 having passed through the air knife 64 is suspended by the air ejected from the ejection holes 82, and is conveyed in the conveyance direction by the auxiliary roller 70 and the conveyor belt 72. According to this configuration, the glass substrate 24 can be conveyed in a floating manner by the first air floating conveyance unit 66.
As shown in FIG. 6(A), the suspension conveyance plates 671 to 673 have suction holes 84 in the areas close to the air knives 64. The suction holes 84 are formed in the main surfaces of the suspension conveyance plates 671 to 673, and are configured to suck air by suction under reduced pressure or the like. The front end portion of the glass substrate 24 having passed through the air knife 64 may be floated by the air ejected from the levitation transportation plate 67. By sucking from the suction holes 84, the glass substrate 24 can be prevented from floating.
The second air levitation transport unit 68 is configured to transport the glass substrate 24 having passed through the first air levitation transport unit 66 while levitating it by a predetermined amount. The second air levitation transport unit 68 has 3 porous pads 681 arranged in a direction orthogonal to the transport direction. For each porous plate 681, a known porous suspension transporting plate can be used. The porous plate 681 can maintain the glass substrate 24 at a constant height by a balance of gas ejection and vacuum suction from the hole portions formed in the surface.
The second air levitation transport unit 68 can transport the glass substrate 24 without bending, and therefore can measure the thickness of the glass substrate 24 being transported. In this case, a known plate thickness sensor may be disposed above the second air levitation-transporting section 68. By smoothly measuring the thickness of the glass substrate 24 after the etching treatment, the production efficiency can be improved.
The glass substrate 24 is subjected to etching treatment by sequentially passing through the front rinsing chamber 14, the first etching chamber 161, the second etching chamber 162, and the rear rinsing chamber 18. The glass substrate 24 is thinned to, for example, about 0.05 to 0.3mm by being thrown into the etching apparatus 101 or more times. Even the glass substrate 24 thus thinned is stably conveyed by the levitation conveyance unit 60 without being damaged.
In particular, the glass substrate 24 subjected to the etching process is transported to the levitation transport unit 60 in a wet state, but since the drying process is performed by the air knife 64 via the levitation transport unit 62, the drying process is performed without generating levitation, deflection, or the like even for a thin substrate. Even when water droplets adhere to the glass substrate 24 after the drying process, the second air levitation-conveying unit 68 can prevent adhesion of the glass substrate 24 and clogging of the suction holes by removing the water droplets by the air from the ejection holes 82 during the conveyance by the first air levitation-conveying unit 66, and thus the conveyance can be performed stably. Since the diameter of the injection holes 82 is larger than the hole portions on the surface of the second air bearing conveyor 88, the injection holes 82 are less likely to be clogged with water droplets.
In addition, although the present embodiment has been described by taking a glass substrate as an example, the levitation transportation device of the present invention is not limited to the transportation of a glass substrate, and can be applied to a resin substrate or a laminated substrate as long as it is a thin substrate.
The above description of embodiments is illustrative in all respects and should not be taken as limiting. The scope of the present invention is indicated not by the above-described embodiments but by the scope of the claims. The scope of the present invention includes all modifications within the meaning and range equivalent to the scope of the claims.
(description of reference numerals)
10-etching apparatus
12-carry-in part
14-front water washing chamber
161 first etch chamber
18-post water washing chamber
24-glass substrate
30-conveying roller
60-suspension conveying unit
62-Water suspension conveying part
64-air knife
66-first air levitation transport section
68-second air levitation transport section.
Claims (4)
1. A levitation transportation device that transports a substrate to be processed while levitating the substrate, the levitation transportation device comprising at least:
a water suspension transport unit having a water film forming plate configured to form a water film on a surface thereof;
an air knife disposed at a rear stage of the water levitation transport unit and configured to spray air toward the target substrate;
an air levitation transportation unit disposed at a rear stage of the air knife, the air levitation transportation unit having a levitation transportation plate in which an injection hole for injecting air from below toward the target substrate is formed; and
and a transport roller disposed along a transport direction of the target substrate in the levitating transport unit and the air levitating transport unit.
2. The levitation transport device of claim 1,
the aero-levitation transport section has a first aero-levitation transport section and a second aero-levitation transport section,
a first air levitation transport disposed between the air knife and the second air levitation transport,
the second air levitation-transporting unit has suction holes formed in a surface of the levitation-transporting plate to suck air.
3. The levitation transportation device according to claim 2, wherein,
the first levitation transport unit includes suction holes for sucking air in a region in contact with the air knife.
4. The levitation transport device as recited in any one of claims 1-3, wherein,
the air knife sprays air to both main surfaces of the substrate to be processed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-175852 | 2018-09-20 | ||
| JP2018175852A JP6853520B2 (en) | 2018-09-20 | 2018-09-20 | Floating transfer device |
| PCT/JP2019/036747 WO2020059796A1 (en) | 2018-09-20 | 2019-09-19 | Flotation conveyance device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113412535A true CN113412535A (en) | 2021-09-17 |
Family
ID=69888457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980075803.4A Pending CN113412535A (en) | 2018-09-20 | 2019-09-19 | Suspension conveying device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6853520B2 (en) |
| CN (1) | CN113412535A (en) |
| WO (1) | WO2020059796A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156142A (en) * | 2022-05-30 | 2022-10-11 | 江苏亚电科技有限公司 | PSG water film spraying mechanism and photovoltaic silicon wafer water film attaching method |
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| JP5334216B2 (en) * | 2011-10-28 | 2013-11-06 | 株式会社Ｎｓｃ | Manufacturing method of glass substrate |
| JP5990914B2 (en) * | 2012-02-01 | 2016-09-14 | 株式会社Ihi | Transport device |
| JP6032348B2 (en) * | 2013-02-26 | 2016-11-24 | 株式会社Ihi | Transport device |
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- 2018-09-20 JP JP2018175852A patent/JP6853520B2/en active Active
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- 2019-09-19 WO PCT/JP2019/036747 patent/WO2020059796A1/en active Application Filing
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| JP2005247516A (en) * | 2004-03-05 | 2005-09-15 | Tokyo Electron Ltd | Levitated substrate conveying treatment device |
| CN101815661A (en) * | 2007-07-27 | 2010-08-25 | 株式会社Ihi | Floating transfer apparatus, and treating system having the floating transfer apparatus |
| JP2010179985A (en) * | 2009-02-03 | 2010-08-19 | Wacom R & D Corp | Levitation conveying apparatus and levitation conveying method |
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| CN115156142A (en) * | 2022-05-30 | 2022-10-11 | 江苏亚电科技有限公司 | PSG water film spraying mechanism and photovoltaic silicon wafer water film attaching method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020059796A1 (en) | 2020-03-26 |
| JP2020047820A (en) | 2020-03-26 |
| JP6853520B2 (en) | 2021-03-31 |
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