TWI361457B - Substrate cleaning apparatus - Google Patents
Substrate cleaning apparatus Download PDFInfo
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- TWI361457B TWI361457B TW096143660A TW96143660A TWI361457B TW I361457 B TWI361457 B TW I361457B TW 096143660 A TW096143660 A TW 096143660A TW 96143660 A TW96143660 A TW 96143660A TW I361457 B TWI361457 B TW I361457B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Nozzles (AREA)
Description
L361457 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種基板清洗裝置，尤其涉及一種用於清 洗平板顯示面板用基板的清洗裝置’特別是以對基板均勾 喷射兩種混合流體的清洗流體來進行清洗作業的基板清洗 裝置。 ί 【先前技術】 通常’在製造平板顯示面板用基板時，爲去除基板上 _ 的各種雜質和藥液要進行清洗作業。 在所述清洗作業中使用以喷射清洗流體的方式除去點 在基板上的各種雜質和藥液的基板清洗裝置。 由本申請人於2004,年3月23日提出申請，並被授予 專利權的第59 1475號專利公報所公開的基板清洗裝置就 是所述基板清洗裝置。 然而，所述專利第591475號專利公報所公開的基板清 洗裝置，在具有長方體狀流體喷射區域的噴射裝置的排出 •部分上相隔預定距離處形成有多個噴射口。 因此，在各噴射口之間存在噴射閒置區域，從而在進 行清洗作業時可能引起如下問題。 首先，在長方體狀流體喷射區域内，由於閒置區域不 會喷射流體，因而可能出現流體斷流現象，而這種流體斷 流現象可能降低基板清洗效果。 例如，對基板噴射清洗流體時，沒有被流體噴射到的 基板表面會留下波紋狀痕跡。 5 與小面積的基板相比在、主 ’月洗大面積的基板睹 紋狀痕跡可能出現得更爲 時上述波 ·""·—重’因此這種裝置报難、奋1¾ J· 逐漸大面積化的基板製造形勢。 、適應於 爲解決上述問題，沿荽 、， 者基板輸送方向配置多個噴射妒 噴射的間距大小使噴射裝置相互 開排列，而在此狀態下進行.主 'a 退仃β洗作業。然而這種裝置 使整體結構過於複雜，而且 +僅 J且j月b引起清洗液消耗過多 一問題。 的另[Technical Field] The present invention relates to a substrate cleaning apparatus, and more particularly to a cleaning apparatus for cleaning a substrate for a flat panel display panel, in particular, cleaning of two mixed fluids for a substrate A substrate cleaning device that performs fluid cleaning operations. [Prior Art] Generally, when manufacturing a substrate for a flat panel display panel, cleaning operations are performed to remove various impurities and chemical liquid on the substrate. A substrate cleaning device that removes various impurities and chemical liquids on the substrate by spraying the cleaning fluid is used in the cleaning operation. The substrate cleaning apparatus disclosed in Japanese Laid-Open Patent Publication No. 59 1475, the entire disclosure of which is hereby incorporated by reference. However, in the substrate cleaning device disclosed in Japanese Patent No. 591475, a plurality of ejection ports are formed at a predetermined distance from a discharge portion of the ejection device having a rectangular parallelepiped fluid ejection region. Therefore, there is a spray idle area between the respective injection ports, which may cause the following problems when performing the cleaning operation. First, in the cuboid fluid ejection region, fluid leakage may occur due to the fact that the idle region does not eject fluid, and this fluid interruption may reduce the substrate cleaning effect. For example, when the cleaning fluid is sprayed onto the substrate, the surface of the substrate which is not sprayed by the fluid leaves a corrugated mark. 5 Compared with a small-area substrate, the main 月 洗 大 的 洗 睹 睹 睹 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 洗 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹 睹The substrate manufacturing situation is gradually increasing. In order to solve the above problem, the pitches of the plurality of jets are arranged along the transport direction of the substrate, so that the jetting devices are arranged to be mutually arranged, and in this state, the main 'a untwisting β washing operation is performed. However, such a device makes the overall structure too complicated, and + only J and j months b cause excessive consumption of the cleaning liquid. Another
因此，在長方體狀嗔射區域内之用於喷射清洗流體的 喷射口之間，存在於間置區域的狀態下很難從根本上解決 上述基板清洗作業中出現的問題。 【發明内容】 本發明係鑒於上述問題而作的，其目的在於提供—種 在對基板噴射清洗流體時，於在長方體狀流體喷射區域内 沒有閑置區域的狀態下，進行清洗作業的基板清洗裝置。Therefore, it is difficult to fundamentally solve the problems occurring in the substrate cleaning operation in the state where the intervening regions are present between the ejection ports for ejecting the cleaning fluid in the rectangular parallelepiped region. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a substrate cleaning apparatus that performs a cleaning operation in a state where an empty area is not present in a rectangular parallelepiped fluid ejection region when a cleaning fluid is ejected to a substrate. .
爲貫現上述目的，本發明提供一種基板清洗裝置，其 包括： 清洗槽，其用於提供作業空間； 氣體供給裝置，其位於所述清洗槽内部，且用於供給 清洗氣體； 液體供給裝置，其與所述氣體供給裝置相面對地結合， 並且用於供給清洗液體； 第一噴射裝置，其在所述氣體供給裝置和液體供給裝 置之間形成長方體狀流體噴射區域’並在所述流體喷射區 6 域内相隔預定距離形成多個第一噴孔，所述第-嘴孔且有 用於混合噴射清洗氣體和清洗液體的流路； -有 第，嗔射裝置，其在所述第—喷射裝置的多個第一喷 成多個第二噴孔，所述第二噴孔具有用於混合喷 射 洗氣體和清洗液體的流路。 少本發明使用具備用於混合喷射兩種流體（氣體及液體） ^夕個噴孔的長方體狀喷射裝置，因此能夠容Η除枯在 基板上的各異物和藥液。 特別是，所述各噴射裝置設置爲以下結構：即任何一 個喷射裝置的噴孔之間分別設有另—個喷射裝置的喷孔， 這種設置可以使長方體狀流體嘴射區域内不出現流體斷流 現象’從而能夠均勾地喷射清洗流體。這種結構解決了使 用現有喷射裝置來進行作、業時，即使用存在喷射閑置區域 的長方體狀噴射裝置時’由於在整個喷射區域内出現流體 斷流區域而在基板表面留下波紋等痕迹的問題。 因此，在進行基板清洗作業時可進一步提高工作效率 和清洗質量。 【實施方式】 下面，參照附圖詳細說明本發明的較佳實施例，並在 所屬技術領域的技術人員㈣實施本發明的範圍内進行說 明。 由於本發明的實施例可以採用多種方式實施，因此本 發明的申請專利範圍並不侷限於下述實施例。 圖1及圖2是本發明之一實施例中的基板清洗裝置整 7 1361457 體及内部結構圖，圖t元件符號2表示清洗槽。 所述清洗槽2爲常規的箱體結構，其内部設有作業* 間S可進行用於製造平面顯示面板用基板〇 (以下簡稱其 板）的清洗作業。 所述清洗槽2内部設有用於輸送基板g的輸送裝置4。 所述輸送裝置4是由多個輸送輥R構成的，為一般的輥輪 式輸送器結構。 所述輸送輥R經由一般的方法從電機（未圖示）接收 動力以進行旋轉，並以基板G的一面朝上的狀態承載所述 基板G，且如圖2所示地在所述作業空間s上從左向右輸 送基板G。 1 所述清洗槽2内設置有氣體供給裝置6。如圖i所示， 所述氣體供給裝置6中設置有用於使清洗氣體W通過的 内部空間S1 ’該氣體供給裝置6之形狀爲長方體狀箱體。In order to achieve the above object, the present invention provides a substrate cleaning apparatus comprising: a cleaning tank for providing a working space; a gas supply device located inside the cleaning tank for supplying a cleaning gas; and a liquid supply device, It is combined with the gas supply device and is used to supply a cleaning liquid; a first injection device that forms a cuboid fluid ejection region between the gas supply device and the liquid supply device and is in the fluid a plurality of first injection holes are formed in the spray zone 6 at a predetermined distance from the first nozzle hole, and the first nozzle hole has a flow path for mixing the spray cleaning gas and the cleaning liquid; and a first, a spray device is in the first spray The plurality of first portions of the apparatus are sprayed into a plurality of second orifices having flow paths for mixing the jet purge gas and the purge liquid. In the present invention, a rectangular parallelepiped injection device having a plurality of fluids (gas and liquid) for mixing and spraying is used, so that foreign matter and a chemical liquid which are dried on the substrate can be accommodated. In particular, each of the spraying devices is configured to be provided with an injection hole of another injection device between the injection holes of any one of the injection devices, such that the fluid does not appear in the area of the cuboid fluid nozzle. The shut-off phenomenon' thus enables the cleaning fluid to be sprayed uniformly. This structure solves the problem of using existing injection devices for the production, in the case of using a rectangular parallelepiped spray device in which the idle area is sprayed, because of the occurrence of ripples on the surface of the substrate due to the occurrence of a fluid cut-off region in the entire spray region. problem. Therefore, work efficiency and cleaning quality can be further improved when the substrate cleaning operation is performed. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and the invention will be described within the scope of the invention. Since the embodiments of the present invention can be implemented in various ways, the scope of the present invention is not limited to the following embodiments. 1 and 2 are views showing the body and internal structure of a substrate cleaning apparatus according to an embodiment of the present invention, and reference numeral 2 denotes a cleaning tank. The cleaning tank 2 is a conventional cabinet structure, and the inside of the cleaning tank 2 is provided with a cleaning operation for manufacturing a substrate for a flat display panel (hereinafter referred to as a board). A conveying device 4 for conveying the substrate g is provided inside the cleaning tank 2. The conveying device 4 is constituted by a plurality of conveying rollers R and is a general roller conveyor structure. The conveying roller R receives power from a motor (not shown) to rotate by a general method, and carries the substrate G with the side of the substrate G facing upward, and the operation is performed as shown in FIG. The substrate G is transported from left to right on the space s. 1 The gas supply device 6 is disposed in the cleaning tank 2. As shown in Fig. 1, the gas supply device 6 is provided with an internal space S1' for passing the cleaning gas W. The gas supply device 6 has a rectangular parallelepiped shape.
如圖2所示，所述氣體供給裝置6與管 並從所述管體P1接收清洗氣體W1。 W1使用一 般的清潔壓縮空氣（CDA : 所述清洗氣體 清潔壓縮空氣在儲存於存 通過上述管體P1供給到As shown in Fig. 2, the gas supply device 6 and the tube receive the cleaning gas W1 from the tube P1. W1 uses general clean compressed air (CDA: the cleaning gas cleans compressed air stored in the storage through the above-mentioned pipe P1 to
Clean Dry Air) ’ 如圖 2 所示， 儲容器T1的狀態下，以預定壓力 所述氣體供給裝置6中。 如圓 "I 小 所述氣體供給裝晋& ^ 灿山 ,, 装罝6之一側形成有氣體Clean Dry Air) ′ As shown in Fig. 2, in the state of the storage container T1, the gas supply device 6 is at a predetermined pressure. Such as the circle "I small said gas supply loading Jin & ^ Can Shan,, one side of the mounting 6 is formed with gas
排出口 Η1，所述氣體排出口 H _ 兵有通道的作用，以使清 洗氣體W1經過所述内部空間s丨向外部排出。 如圖1所示，在所述清洗槽 ^叹有與所述氣體供給 8 1361457 裝置6相面對的液體供給裝置8。 所述液體供給裝置8具有用於使清洗液體W2通過的 内部空間S2’並由與所述氣體供給裝置6相同的長方體狀 箱體構成。 如圖2所示’所述液體供給裝置8通過管體P2與液 體儲存容器T2相連。雖然未圖示，所述液體供給裝置8 通過一般流體泵的泵送接收經所述管體Ρ2供給的清洗液 體W2。 修 所述清洗液體W2使用一般的去離子水等純水，並與 所述清洗氣體W1混合而進行清洗基板G的作業。 如圖3所示，所述液體供給裝置8的一侧形成有液體 排出口 H2。 所述液體排出口 H2作爲通道，將從所述液體存儲容 器T2供給的清洗液體W2經所述内部空間S2向外部排出。 而且，如圖3所不，所述氣體供給裝置6和所述液體 鲁供給裝置8的内部空間S1、S2，可以通過另設的蓋罩。向 外部開放。 根據本發明-實施例的基板清洗m括帛一喷射裝 置J1。 。。所述第-喷射裝置n由第—流路單元i 0和第二流路 早7L 12構成’以便在噴射清洗氣體W1時，使所述清洗液 體W2混合在所述清洗氣體中後噴射。 圖4所tf戶斤述第一流路單& 1〇自多個第一薄板以 構成，而在所述第-薄板L1上相隔預定距離形成有多個 1361457 第一氣體流路孔vi。 如圖3所示，當所述多個第一薄板L1相面對地結合 時’所述多個第一氣體流路孔V1互相重疊，從而分別形 成用於從所述氣體供給裝置6喷射出之清洗氣體wi的第 —氣體流路K1。 即’所述第一氣體流路K1通過所述多個第一氣體流 路孔V1以預定距離分割形成。The discharge port Η1, the gas discharge port H__ has a function of the passage so that the purge gas W1 is discharged to the outside through the internal space s. As shown in Fig. 1, a liquid supply device 8 facing the gas supply 8 1361457 device 6 is sighed in the cleaning tank. The liquid supply device 8 has an internal space S2' through which the cleaning liquid W2 passes, and is constituted by the same rectangular parallelepiped casing as the gas supply device 6. As shown in Fig. 2, the liquid supply device 8 is connected to the liquid storage container T2 via the pipe body P2. Although not shown, the liquid supply device 8 receives the cleaning liquid W2 supplied through the tubular body 2 by pumping by a general fluid pump. The cleaning liquid W2 is cleaned using pure water such as general deionized water, and mixed with the cleaning gas W1 to perform the operation of cleaning the substrate G. As shown in Fig. 3, a liquid discharge port H2 is formed at one side of the liquid supply device 8. The liquid discharge port H2 serves as a passage, and the cleaning liquid W2 supplied from the liquid storage container T2 is discharged to the outside through the internal space S2. Further, as shown in Fig. 3, the gas supply means 6 and the internal spaces S1, S2 of the liquid supply means 8 may pass through a separate cover. Open to the outside. The substrate cleaning according to the present invention-an embodiment includes a first ejection device J1. . . The first injection device n is constituted by the first flow path unit i 0 and the second flow path early 7L 12 so that when the cleaning gas W1 is ejected, the cleaning liquid W2 is mixed in the cleaning gas and then ejected. In Fig. 4, a first flow path list & 1 is formed from a plurality of first thin plates, and a plurality of 1361457 first gas flow path holes vi are formed on the first thin plate L1 by a predetermined distance. As shown in FIG. 3, when the plurality of first thin plates L1 are joined face to face, the plurality of first gas flow path holes V1 overlap each other, thereby being respectively formed for ejecting from the gas supply device 6. The first gas flow path K1 of the cleaning gas wi. That is, the first gas flow path K1 is formed by dividing the plurality of first gas flow path holes V1 by a predetermined distance.
而且，如圖3所示，所述第一氣體流路K1可使所述 氣體供給裝置6的清洗氣體W1經氣體排出槽H1向外部 排出後逐漸向下喷射。 例如，如圖4所示，所述第一氣體流路孔νι可在鄰 接所述氣體供給裝置6的任何一個第一薄板li上形成爲 圓孔，而在另一個第一薄板u ±則可以形成爲底部開放 的“门”字形孔。 字形的第一氣體流路 逐漸向裏變窄再逐漸 另外’如圖5所示，所述‘‘ η，， 孔νι具有在第一薄板L1的底部朝上 向外變寬的一般瓶頸結構。 W1 $過Γ述第一乳體流路K1以預定壓力噴射清洗氣體 孔V1的 構根據伯努利原理，在所述第-氣體流路 於位置上使氣體流速加快並錢氣體壓力逐漸 低於大軋壓，從而産生吸？丨力。 構成 所述第—流路單元1 2由JL右贫 個第二薄板L2_ 八有第一液體流路孔V2的多 相面對地結合時， 如圖4所示，在多個第二薄板 10 L361457 所述多個第-液體流路,L V2互相重疊而形成用於嗔射产 洗液體W2的第一液體流路K2 (參照圖3 )。 月 所述多個第-液體流路孔V2可在所述第二薄板以上 形成爲圓形，並如目5所示，其等與形成於所述第—薄板 L1 一側的第一氣體流路孔V1瓶頸部分相對應。Further, as shown in Fig. 3, the first gas flow path K1 allows the cleaning gas W1 of the gas supply device 6 to be discharged to the outside through the gas discharge groove H1, and then gradually ejected downward. For example, as shown in FIG. 4, the first gas flow path hole νι may be formed as a circular hole on any one of the first thin plates li adjacent to the gas supply device 6, and in the other first thin plate u ± Formed as a "door" shaped hole at the bottom. The first gas flow path of the glyph is gradually narrowed inwardly and gradually further. As shown in Fig. 5, the '' η, the hole νι has a general bottleneck structure which widens outward at the bottom of the first thin plate L1. W1 $ cites the first emulsion flow path K1 to spray the cleaning gas hole V1 at a predetermined pressure according to the Bernoulli principle, the gas flow rate is accelerated at the position of the first gas flow path and the money gas pressure is gradually lower than Large rolling, resulting in suction?丨力. When the first flow path unit 12 is combined by the JL right second thin plate L2_8 having the first liquid flow path hole V2, as shown in FIG. 4, in the plurality of second thin plates 10 L361457 The plurality of first liquid passages, L V2, overlap each other to form a first liquid flow path K2 (see FIG. 3 ) for jetting the production liquid W2. The plurality of first-liquid flow path holes V2 may be formed in a circular shape above the second thin plate, and as shown in FIG. 5, etc., and the first gas flow formed on one side of the first thin plate L1 The bottle neck portion of the road hole V1 corresponds.
而且，如圖ό所示，所述第一氣體流路尺丨和所述第 一液體流路Κ2,其排出端部互相連通而在由所述第—流路 單7Ό 10和第二流路單元12所形成的長方體狀流體噴射區 域D中形成多個第一喷孔Ν1。 根據清洗氣體wi經過所述第一氣體流路K1的瓶頸 位置時壓力下降的現象，清洗液體W2經所述第一液體流 路K2被吸入後兩種流體（即氣體w 1和液體W2 )相混合。 所述第一喷孔N1噴射這種混合流體。 由此’如圖3所示’可對基板G噴射清洗氣體wi和 清洗液體W2的混合清洗流體w。 另外，貫通形成所述氣體供給裝置6和液體供給裝置 8的氣體排出孔Η1及液體排出孔H2，以便向所述第一氣 體流路孔VI和第一液體流路孔V2通暢地供給清洗氣體W1 和清洗液體W 2。 所述第一流路單元1 〇和所述第二流路單元12的第一 薄板L1和第二薄板L2可使用金屬薄板，而所述第一氣體 流路孔V1和第一液體流路孔V2可經由一般的蝕刻等程序 來形成* 如上所述’若以多個薄板L1和多個薄板L2形成第一 11 L361457 流路單元1 〇和第二流路單元12 ’則以分割形成方式可 易於製造出用於使清洗氣體W1和清洗液體W2通過的微 細流路Κ1和流路Κ2區域’而且能夠提高整體或局部的維 修保養性能。 另外，如圖4所示，根據本發明一實施例的基板清洗 裝置包括第二喷射裝置J2,第二喷射裝置J2由第三流路 單元14和第四流路單元16構成。 所述第二流路單元14具有用於噴射清洗氣體w丨的第 二氣體流路孔V3 » 所述第二氣體流路孔V3形成在第三薄板L3上，其等 之形狀爲向第三薄板L3下側開放的“门”字形。 所述第二薄板L3與第一薄板L1相面對地結合時，如 圖7所示，所述第二氣體流路孔v 3設置在所述第一薄板 L 1上的多個第一氣體流路孔v 1之間。 即，如圖5所示，在所述多個第—氣體流路孔v丨之 間設置所述第二氣體流路孔V3的狀態下相結合。 此時，如圖5所示，所述第二氣體流路孔V3和所述 第-氣體流路子L V1的上部，其一部分互相連通從而可 接收由所述氣體供給部6的氣體排出D H1供給的清洗氣 體W1。 如圖8所示’當所述第三薄板L3與第一薄板L1及第 二薄板L2相面對地結合時’通過所述第二氣體流路孔幻 形成第二氣體流路K3。 而且所述第四流路單元16具有用於喷射清洗液體 12 vu457 的第二液體流路孔V4。 如圖4及圖7所示，所述第二液體流路孔V4在形成 ' 有所述第二流路單元12的多個第二薄板L2上，穿設於所 迷多個第一液體流路孔V2之間。 如圖8所示，所述多個第二液體流路孔V4經由所述 夕 夕個第二薄板L2的結合，形成可從所述液體供給裝置8 供给清洗液體W2的第二液體流路K4。 % 如圖6所示，所述第二氣體流路K3和所述第二液體 ’贪路K4的排出端部互相連通，從而在所述多個第一喷孔 ^1之間分別形成第二噴孔N2。 所述第二喷孔N2通過進行與所述第一噴孔N1相同的 操作，而噴射清洗流體W » 即，經所述第二氣體流路K3喷射清洗氣體wi時， 通過所述氣體W1的流動壓力，所述清洗液體W2經第二 夜體流路K4被吸入後和氣體一起混合喷射。 % 由此，如圖9所示，通過所述第一噴孔則和所述第 二噴孔N2,在長方體狀的整個流體喷射區域〇内，可均 句噴射清洗氣體W1和清洗液體W2的混合清洗流體w。 所述結構，'可防止使用現有長方形喷嘴來進行清洗作 業時，因噴射口之間的喷射間置區域引起的流體^流現 象。 所述第一流路單元1 〇和所述第二流路罝； 、 平兀12以及所 述第三流路單元14和所述第四流路單元 6在所述氣體供Further, as shown in FIG. 3, the first gas flow path 丨 and the first liquid flow path 2 have discharge ends communicating with each other by the first flow path unit 7 Ό 10 and the second flow path A plurality of first orifices 1 are formed in the rectangular parallelepiped fluid ejection region D formed by the unit 12. According to the phenomenon that the pressure of the cleaning gas wi passes through the neck position of the first gas flow path K1, the cleaning liquid W2 is sucked through the first liquid flow path K2, and the two fluids (ie, the gas w 1 and the liquid W2) are phased. mixing. The first injection hole N1 sprays such a mixed fluid. Thus, as shown in Fig. 3, the mixed cleaning fluid w of the cleaning gas wi and the cleaning liquid W2 can be ejected to the substrate G. Further, the gas discharge port 1 and the liquid discharge port H2 of the gas supply device 6 and the liquid supply device 8 are formed to smoothly supply the purge gas to the first gas flow path hole VI and the first liquid flow path hole V2. W1 and cleaning liquid W 2 . The first flow path unit 1 〇 and the first thin plate L1 and the second thin plate L2 of the second flow path unit 12 may use a metal thin plate, and the first gas flow path hole V1 and the first liquid flow path hole V2 It can be formed by a general etching or the like * As described above, 'If the first 11 L361457 flow path unit 1 and the second flow path unit 12' are formed by a plurality of thin plates L1 and a plurality of thin plates L2, it is easy to divide and form. The fine flow path 1 and the flow path 2 area for passing the cleaning gas W1 and the cleaning liquid W2 are manufactured and the overall or partial maintenance performance can be improved. Further, as shown in Fig. 4, a substrate cleaning apparatus according to an embodiment of the present invention includes a second ejection device J2, which is constituted by a third flow path unit 14 and a fourth flow path unit 16. The second flow path unit 14 has a second gas flow path hole V3 for ejecting the cleaning gas w丨. The second gas flow path hole V3 is formed on the third thin plate L3, and the shape thereof is the third direction. The "door" shape of the lower side of the thin plate L3 is open. When the second thin plate L3 is combined with the first thin plate L1, as shown in FIG. 7, the second gas flow path hole v3 is disposed on the first thin plate L1. Between the flow path holes v 1 . That is, as shown in Fig. 5, the second gas flow path holes V3 are provided in the state in which the second gas flow path holes V3 are provided between the plurality of first gas flow path holes v?. At this time, as shown in FIG. 5, the second gas flow path hole V3 and the upper portion of the first gas flow path L V1 are partially connected to each other to receive the gas discharge D H1 by the gas supply portion 6. The supplied cleaning gas W1. As shown in Fig. 8, when the third thin plate L3 is joined to face the first thin plate L1 and the second thin plate L2, the second gas flow path K3 is morphologically formed through the second gas flow path hole. Further, the fourth flow path unit 16 has a second liquid flow path hole V4 for ejecting the cleaning liquid 12 vu457. As shown in FIG. 4 and FIG. 7, the second liquid flow path hole V4 is formed on the plurality of second thin plates L2 having the second flow path unit 12, and is disposed in the plurality of first liquid flows. Between the road holes V2. As shown in FIG. 8, the plurality of second liquid flow path holes V4 form a second liquid flow path K4 through which the cleaning liquid W2 can be supplied from the liquid supply device 8 via the combination of the second thin plates L2. . %, as shown in FIG. 6, the second gas flow path K3 and the discharge end of the second liquid 'corruption path K4 are in communication with each other, thereby forming a second between the plurality of first injection holes ^1, respectively. Spray hole N2. The second injection hole N2 is sprayed with the cleaning fluid W by performing the same operation as the first injection hole N1, that is, when the cleaning gas wi is sprayed through the second gas flow path K3, through the gas W1 The flow pressure, which is sucked by the second night body flow path K4, is mixed and injected with the gas. Therefore, as shown in FIG. 9, through the first injection hole and the second injection hole N2, the cleaning gas W1 and the cleaning liquid W2 can be uniformly sprayed in the entire fluid ejection region 长 in the rectangular parallelepiped shape. Mix the cleaning fluid w. The structure, 'prevents the phenomenon of fluid flow caused by the injection intervening area between the ejection openings when the conventional rectangular nozzle is used for the cleaning operation. The first flow path unit 1 〇 and the second flow path 罝; the flat raft 12 and the third flow path unit 14 and the fourth flow path unit 6 are provided in the gas
給裝置6和所述液體供給裝置8之間，通诉A %過螺絲等連接部 13 1361457 件以一般方法予以連接固定。 根據本發明一實施例的基板清洗裝置還可包括固定銷 如圖3及圖4所示，所述固定銷b貫通形成於薄板Ll、 L2、L3上的導槽的方向上插入並掛在氣體裝置6及液體供 給裝置8的一側面。 所述固定銷B不僅引導多個薄板Ll、L2、L3結合時 的位置’還防止因清洗流體W的壓力或外力導致結合位置 改變的現象。 【圖式簡單說明】 圖1是本發明一實施例的基板清洗裝置的整體結構 圖。 圖2是本發明一實施例的基板清洗裝置内部結構示意 圖。 圖3是用於說明本發明一實施例的基板清洗裝置中第 一噴射裝置的剖視圖。 圖4是圖3所示本發明一實施例的基板清洗裝置中第 一噴射裝置的立體分解圖。 圖5是本發明一實施例的基板清洗裝置中第一氣體流 路孔及第二氣體流路孔的結構示意圖。 圖6是本發明一實施例的基板清洗裝置中第一喷孔和 第二噴孔的排列狀態示意圖。 圖7是本發明一實施例的基板清洗裝置中第二噴射裝 置的結構示意圖。 14 L361457 圖8是本發明一實施例的基板清洗裝置中第二喷射裝 置的剖視圖。 圖9是本發明一實施例的基板清洗裝置中第一喷射裝 置和第二喷射裝置的作用示意圖。 【主要元件符號說明】Between the device 6 and the liquid supply device 8, the connection portion 13 1361457 such as A% screw is connected and fixed in a usual manner. The substrate cleaning apparatus according to an embodiment of the present invention may further include a fixing pin as shown in FIGS. 3 and 4, wherein the fixing pin b is inserted and suspended in a direction of a guide groove formed in the thin plates L1, L2, and L3. A side of the device 6 and the liquid supply device 8. The fixing pin B not only guides the position when the plurality of thin plates L1, L2, and L3 are joined, but also prevents the bonding position from being changed due to the pressure or external force of the cleaning fluid W. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the overall configuration of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 2 is a schematic view showing the internal structure of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 3 is a cross-sectional view showing a first ejecting apparatus in the substrate cleaning apparatus according to the embodiment of the present invention. Fig. 4 is an exploded perspective view showing the first ejecting apparatus in the substrate cleaning apparatus of the embodiment of the present invention shown in Fig. 3. Fig. 5 is a view showing the configuration of a first gas flow path hole and a second gas flow path hole in a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 6 is a view showing an arrangement state of a first orifice and a second orifice in a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 7 is a view showing the configuration of a second ejecting apparatus in a substrate cleaning apparatus according to an embodiment of the present invention. 14 L361457 Fig. 8 is a cross-sectional view showing a second ejecting apparatus in the substrate cleaning apparatus according to the embodiment of the present invention. Fig. 9 is a view showing the operation of the first ejecting apparatus and the second ejecting apparatus in the substrate cleaning apparatus according to the embodiment of the present invention. [Main component symbol description]
2 清洗槽 4 輸送裝置 6 氣體供給單元 8 液體供給單元 10 第一流路單元 12 第二流路單元 14 第三流路單元 16 第四流路單元 B 固定銷 C 蓋罩 G 基板 H1 氣體排出口 H2 液體排出口 J1 第一喷射裝置 J2 第二喷射裝置 K1 第一氣體流路 K2 第一液體流路 K3 第二氣體流路 K4 第二液體流路 15 13614572 Cleaning tank 4 Conveying device 6 Gas supply unit 8 Liquid supply unit 10 First flow path unit 12 Second flow path unit 14 Third flow path unit 16 Fourth flow path unit B Fixed pin C Cover G Substrate H1 Gas discharge port H2 Liquid discharge port J1 first injection device J2 second injection device K1 first gas flow path K2 first liquid flow path K3 second gas flow path K4 second liquid flow path 15 1361457
Ll、L2、L3 薄板 N1 第一喷孔 N2 第二喷孔 PI 管體 R 輸送輥輪 SI 内部空間 S2 内部空間 T1 存儲容器 VI 第一氧體流路孔 V2 第一液體流路孔 V3 第二氣體流路孔 V4 第二液體流路孔 W 清洗流體 W1 清洗氣體 W2 清洗液體 16Ll, L2, L3 thin plate N1 first injection hole N2 second injection hole PI pipe body R conveying roller SI internal space S2 internal space T1 storage container VI first oxygen flow path hole V2 first liquid flow path hole V3 second Gas flow path hole V4 second liquid flow path hole W cleaning fluid W1 cleaning gas W2 cleaning liquid 16
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| KR1020070001068A KR100783763B1 (en) | 2007-01-04 | 2007-01-04 | Substrate cleaning apparatus |
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| TW200830399A TW200830399A (en) | 2008-07-16 |
| TWI361457B true TWI361457B (en) | 2012-04-01 |
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| KR101229775B1 (en) * | 2008-12-26 | 2013-02-06 | 엘지디스플레이 주식회사 | Apparatus for cleaning substrate |
| US20120216840A1 (en) * | 2009-11-03 | 2012-08-30 | Arakawa Chemical Industries, Ltd. | Electronic component cleaning device and cleaning method |
| CN105081930B (en) * | 2015-08-12 | 2017-05-17 | 京东方科技集团股份有限公司 | Panel polishing device and panel cleaning equipment |
| KR101966648B1 (en) * | 2016-09-05 | 2019-08-14 | 주식회사 디엠에스 | Apparatus for cleaning a substrate |
| CN106623189A (en) * | 2016-12-19 | 2017-05-10 | 武汉华星光电技术有限公司 | Substrate cleaning equipment |
| KR101833745B1 (en) * | 2017-09-01 | 2018-03-02 | 류병길 | Cleaning devices for various display panels, and for mixed discharge pipe the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100390661B1 (en) * | 2001-07-19 | 2003-07-07 | (주)케이.씨.텍 | Apparatus for Spraying a Fluid and Apparatus for cleaning having the same |
| TW561072B (en) * | 2001-10-15 | 2003-11-11 | Soshio Kk | Cleaning nozzle |
| US7018481B2 (en) | 2002-01-28 | 2006-03-28 | Kabushiki Kaisha Toshiba | Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzle |
| KR100591475B1 (en) | 2004-03-23 | 2006-06-20 | 주식회사 디엠에스 | apparatus for cleaning flat display panel |
-
2007
- 2007-01-04 KR KR1020070001068A patent/KR100783763B1/en not_active IP Right Cessation
- 2007-11-19 TW TW096143660A patent/TWI361457B/en not_active IP Right Cessation
- 2007-11-29 CN CN2007101947371A patent/CN101214484B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101214484B (en) | 2010-08-18 |
| TW200830399A (en) | 2008-07-16 |
| KR100783763B1 (en) | 2007-12-07 |
| CN101214484A (en) | 2008-07-09 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |