TW200827940A - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method Download PDF

Info

Publication number
TW200827940A
TW200827940A TW096140486A TW96140486A TW200827940A TW 200827940 A TW200827940 A TW 200827940A TW 096140486 A TW096140486 A TW 096140486A TW 96140486 A TW96140486 A TW 96140486A TW 200827940 A TW200827940 A TW 200827940A
Authority
TW
Taiwan
Prior art keywords
light
wavelength
exposure
light source
wafer
Prior art date
Application number
TW096140486A
Other languages
English (en)
Chinese (zh)
Inventor
Tadahiro Asaishi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200827940A publication Critical patent/TW200827940A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70575—Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70041—Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096140486A 2006-12-01 2007-10-26 Exposure apparatus and device manufacturing method TW200827940A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006325229A JP2008140956A (ja) 2006-12-01 2006-12-01 露光装置

Publications (1)

Publication Number Publication Date
TW200827940A true TW200827940A (en) 2008-07-01

Family

ID=39475312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096140486A TW200827940A (en) 2006-12-01 2007-10-26 Exposure apparatus and device manufacturing method

Country Status (4)

Country Link
US (1) US7456934B2 (https=)
JP (1) JP2008140956A (https=)
KR (1) KR20080050305A (https=)
TW (1) TW200827940A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102162998A (zh) * 2010-02-12 2011-08-24 Asml荷兰有限公司 光刻设备和方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8149319B2 (en) * 2007-12-03 2012-04-03 Ricoh Co., Ltd. End-to-end design of electro-optic imaging systems for color-correlated objects
US9599510B2 (en) * 2014-06-04 2017-03-21 Cymer, Llc Estimation of spectral feature of pulsed light beam
CN109616405A (zh) * 2018-12-05 2019-04-12 上海华力微电子有限公司 半导体刻蚀工艺真空腔体设备及刻蚀方法
WO2023135658A1 (ja) * 2022-01-11 2023-07-20 ギガフォトン株式会社 電子デバイスの製造方法、レーザ装置、及び波長シーケンス算出システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937619A (en) * 1986-08-08 1990-06-26 Hitachi, Ltd. Projection aligner and exposure method
JP2619473B2 (ja) * 1987-06-17 1997-06-11 株式会社日立製作所 縮小投影露光方法
JP3175180B2 (ja) * 1990-03-09 2001-06-11 キヤノン株式会社 露光方法及び露光装置
US5097291A (en) * 1991-04-22 1992-03-17 Nikon Corporation Energy amount control device
JP2852169B2 (ja) * 1993-02-25 1999-01-27 日本電気株式会社 投影露光方法および装置
US6671294B2 (en) * 1997-07-22 2003-12-30 Cymer, Inc. Laser spectral engineering for lithographic process
US6853653B2 (en) * 1997-07-22 2005-02-08 Cymer, Inc. Laser spectral engineering for lithographic process
JPH11162824A (ja) 1997-12-02 1999-06-18 Sony Corp 露光装置
JP3039531B2 (ja) * 1998-08-17 2000-05-08 株式会社ニコン 回路パターンの製造方法
US7154928B2 (en) * 2004-06-23 2006-12-26 Cymer Inc. Laser output beam wavefront splitter for bandwidth spectrum control
US7088758B2 (en) * 2001-07-27 2006-08-08 Cymer, Inc. Relax gas discharge laser lithography light source
JP4580338B2 (ja) * 2004-12-23 2010-11-10 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、エキシマ・レーザ、およびデバイス製造方法
US7534552B2 (en) * 2004-12-23 2009-05-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102162998A (zh) * 2010-02-12 2011-08-24 Asml荷兰有限公司 光刻设备和方法
US8717540B2 (en) 2010-02-12 2014-05-06 Asml Netherlands B.V. Calculating a laser metric within a lithographic apparatus and method thereof
CN102162998B (zh) * 2010-02-12 2015-04-01 Asml荷兰有限公司 光刻设备和方法

Also Published As

Publication number Publication date
KR20080050305A (ko) 2008-06-05
JP2008140956A (ja) 2008-06-19
US20080129974A1 (en) 2008-06-05
US7456934B2 (en) 2008-11-25

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