TW200820859A - Mounting method for mounting microphone on flexible printed circuit board - Google Patents

Mounting method for mounting microphone on flexible printed circuit board Download PDF

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Publication number
TW200820859A
TW200820859A TW096138700A TW96138700A TW200820859A TW 200820859 A TW200820859 A TW 200820859A TW 096138700 A TW096138700 A TW 096138700A TW 96138700 A TW96138700 A TW 96138700A TW 200820859 A TW200820859 A TW 200820859A
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TW
Taiwan
Prior art keywords
fpcb
microphone
mounting
substrate
electrode
Prior art date
Application number
TW096138700A
Other languages
Chinese (zh)
Other versions
TWI360378B (en
Inventor
Jung-Min Kim
Sang-Ho Lee
Hyoung-Joo Kim
Original Assignee
Bse Co Ltd
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Application filed by Bse Co Ltd filed Critical Bse Co Ltd
Publication of TW200820859A publication Critical patent/TW200820859A/en
Application granted granted Critical
Publication of TWI360378B publication Critical patent/TWI360378B/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The present invention provides a mounting method for mounting a microphone on a flexible printed circuit board (PCB), which is characterized in comprising: (1) preparing a substrate by separately locally connecting a plurality of FPCB with a substrate, forming electrode terminals on the FPCB in connection with a microphone, connection terminals in connection with the main board, and a circuit pattern for forming electrical connection between the electrode terminals and the connection terminals; (2) coating a soldering medium on the electrode terminals of the FPCB; (3) mounting the microphone on the electrode terminals of FPCB coated with the soldering medium; (4) using a surface mounting technique to mount the microphone on the FPCB; and (5) releasing the above-mentioned local connection and separating the FPCB mounted with the microphone from the substrate.

Description

200820859 九、發明說明: 【發明所屬之技術領域】 本發明係關於將設置於手機或可攜式多媒體電子設備 内部的傳聲ϋ安裝·性印刷電路板上的安裝方法。更旦 體而言,本發明·於透過自動化的程序將小型化的傳聲 器大量安裝到軟性印刷電路板上的安褒方法。 【先前技術】 近年來,在生活周遭經常能夠接觸到的多媒體電子設 備’例如 MP3 ( Moving Picture Expem Gr〇up Layer 3 )、攝 影機(Camcorder)及手機(Mobile)等電子設備,係普遍 提供傳遞或錄下其周圍產生聲音的功能。尤其對於具有小 型化、纖細化、高性能化趨勢的多媒體電子設備,能夠實 現這類錄音功能的一個重要理由在於,因為其係實現了 = 型化而構成了對能夠安裝到多媒體電子設備内部傳聲器/的 改進。 〇 …這類傳聲H中最普遍應㈣傳㈣是電容傳聲器。電 容傳聲器具備:稱之為駐極體的電介質板,苴 书 r“電荷來形成的,且具有半永久性電二二t ^arge);以及振動板,其係透過 · p 垃人 b ^ v polar ring) 上接 δ PET ( Polyethylen Terephthalate :聚對婪 一 w 於 醢舻1益 可本一甲酸乙二 〜-曰)溥膜材質的振動膜所製作,該電容傳敕哭 於電介質板和振動板之間的靜電場,將聲♦ 成 信號。 ㈢t唬轉換為電 200820859 上述的傳聲器被安插至攝像機、移 等多媒體電子設備上,與這些電子裝置電、,=及 =專:器是通過谭接將陰極和陽極直接連接到電子 :備 的主板上’或者,考慮到傳聲器和主板之間的插入空間, j 了電連接的容易性,制如下方式:將傳聲器的電極 連接到軟性印刷電路板(Flexible Printed㈣此β。心下 面稱為FPCB)上,將FPCB與主板進行連接。 對於上述使用FPCB的方式,FPCB是形成有電路圖案 的基板,傳聲ϋ製造業者可以在將傳聲器安裝到FpcB上 的狀態下進行供貨。進行供貨的傳聲器以及安裝有該傳聲 器的FPCB透過使FPCB與裝配在多媒體電子設備内的主 板電連接,從而裝配到多媒體電子設備内。 習知上,如第一圖所示,過過手工作業將傳聲器安裝 到FPCB上。具體而言,首先在設置有能夠安裝傳聲器5〇〇 和FPCB 510的槽521之夾具520上,以使形成於傳聲器 5〇〇下表面的電極501露出的方式安裝傳聲器5〇〇,在傳聲 态500上面以使FPCB 510的電極端子511與傳聲器的電極 501的位置一致性方式放置FPCB 510。然後,通過使用烙 杨專焊接設備540將FPCB的電極端子51ι電連接在傳聲 态電極501上之焊接作‘業,將傳聲器500安裝到FPCB 510 上。 如上所述的習知安裝作業是透過手工作業來進行的, 因此,作業速度緩丨更,其結果是存在作業效率低的問題。 並且,近年來,隨著多媒體電子設備的小型化、纖細化趨 200820859 勢,要料聲器的直徑約為3咖〜4_左右。隨之, ,於傳⑼谓背面電極5()1間之間距 形 與上述電極_____ H J於 作業來進杆從而’像以往那樣透過手工 ςΛ1^ 十妾作業時,存在難以準確地連接傳聲哭 训和FK3電極端子川㈣題。傳耳 另外’由於FPCB 51〇之小型化,難卿 Γ:Γ危險大,並且存在難以使電二 511準確地定位於傳聲器電極地上之問題。 ^子 【發明内容】 — 本發明是為了解決現有技術的 在於,提供一種將傳聲 Ώθ7〜目的 可肘得耳益文衮到FPCB上的安裝方法,,其 ^固FPCB以局部方式連接的基板(boardplate)玉, 利用表面安裝技㈣傳聲器安朗各個FpcB上之後 基板分離出安裝有傳聲器的FPCB,從喊少部件丟失的^ 險,並且實現將傳聲器安裝到FpcB上的程序的自動化广 從而能夠進行批次生產。 此外,本發明的目的在於,提供一種將傳聲器安裝到 F山PCB上的安裝方法,其中,各自的外形相對於f⑽電極 %子和傳耳電極—致’就能夠自然;地定位電極端子和電 極’從而_進—步提高程序的自純效率。 另外本發明的目的在於,提供一種將傳聲器安裝到 CB上的安i方法,其中,在進行從基板分離ppcB的作 200820859 業時,能夠容易地將FPCB定位在分離裝置上,進一步有 效地進行程序的自動化。 為了達到上述目的’本發明提供一種將傳聲器安裝到 FPCB上的安裝方法,其特徵在於,所述安裝方法包括:第 1 /驟依據使多個FPCB分別局部地與基板連接而進行排 列的方式準備基板,在該FPCB上形成有與傳聲器連接的 電極端子、與主板連接的連接端子及用於將電極端子和連 揍端子電連接的電路圖案;第2步驟,在該FpeB的電極 端子上塗布焊接介質;第3步驟,將傳聲器放置到塗布具 上述知接介質FPCB的電極端子上;第4步驟,使用表面 安裝技術將傳聲器安裝到FPCB上;以及第5步驟,解除 上述局部連接,從基板分離出安裝有傳聲器的仲⑶過 這樣的結構,小型化的傳聲器及fpcb丟失 並且能夠實現自動化,因此,與透過手巧業進行= 現有技術相比,能夠提高作業效率。 、 =卜,本發明的第!步驟中,在上述肌 形的中心(圖心)上二t構成該安裝部外形的圖 _ ¾極j^子,並且,從該正雷搞 端子向外側相隔預定距離 〇 器.,在構成其外形的圖形的中成:於, 隔預定距離並與上述Fpc =正屯極,攸正電極相200820859 IX. Description of the Invention: [Technical Field] The present invention relates to a mounting method for a sound-sounding mounting printed circuit board to be mounted inside a mobile phone or a portable multimedia electronic device. More specifically, the present invention provides an ampoule method for mounting a small number of miniaturized microphones onto a flexible printed circuit board through an automated program. [Prior Art] In recent years, electronic devices such as MP3 (Moving Picture Expem Gr〇up Layer 3), Camera (Camcorder), and Mobile (Mobile), which are often accessible to people around the world, are generally available for delivery or Record the function of producing sound around it. Especially for multimedia electronic devices with miniaturization, slimming, and high-performance trends, an important reason for enabling such recording functions is that they are capable of being installed into the internal microphones of multimedia electronic devices because they are implemented. /improvement of. 〇 ... The most common of these types of transmission H should be (four) transmission (four) is a condenser microphone. The condenser microphone has a dielectric plate called an electret, which is formed by "charge" and has a semi-permanent electric power; and a vibrating plate which transmits through the p-b Ring) is made of a diaphragm made of δ PET (Polyethylen Terephthalate: Polyethylen Terephthalate: Polyethylen Terephthalate), which is made of a diaphragm made of enamel film. The capacitor is cried on the dielectric plate and the vibration plate. Between the electrostatic field, the sound is ♦ into a signal. (3) t唬 is converted into electricity 200820859 The above microphone is inserted into the multimedia device such as camera, mobile, etc., and these electronic devices are electrically, == and = special: through the tan Connect the cathode and anode directly to the electronics: on the motherboard. Or, considering the insertion space between the microphone and the motherboard, the ease of electrical connection is made by connecting the electrodes of the microphone to the flexible printed circuit board ( Flexible Printed (4) This β. The heart is called FPCB. The FPCB is connected to the motherboard. For the above method of using the FPCB, the FPCB is a substrate with a circuit pattern formed by the manufacturer. The microphone is supplied in a state where the microphone is mounted on the FpcB. The supplied microphone and the FPCB on which the microphone is mounted are assembled into the multimedia electronic device by electrically connecting the FPCB to the motherboard mounted in the multimedia electronic device. Conventionally, as shown in the first figure, the microphone has been manually mounted on the FPCB. Specifically, first, on a jig 520 provided with a slot 521 capable of mounting the microphone 5 and the FPCB 510, to form The microphone 5 is mounted in such a manner that the electrode 501 on the lower surface of the microphone 5 is exposed, and the FPCB 510 is placed on the sound transmitting state 500 so that the electrode terminal 511 of the FPCB 510 and the electrode 501 of the microphone are in a positional manner. Then, The electrode terminal 51 of the FPCB is electrically connected to the soldering electrode 501 by using a soldering special welding device 540, and the microphone 500 is mounted on the FPCB 510. The conventional mounting operation as described above is performed by manual work. Therefore, the work speed is slower, and as a result, there is a problem that the work efficiency is low. And, in recent years, with the multimedia electronic device The shape and the slimness tend to be 200820859, and the diameter of the sounder is about 3 to 4 _. Then, Yu Chuan (9) is the distance between the back electrode 5 () 1 and the above electrode _____ HJ In order to enter the pole and thus, as in the past, it is difficult to accurately connect the sound crying training and the FK3 electrode terminal Chuan (4) when passing through the manual ςΛ 1 ^ 十妾 operation. The ear is also different because of the miniaturization of FPCB 51〇, it is difficult to clear: The hazard is large, and there is a problem that it is difficult to accurately position the electric second 511 on the ground of the microphone electrode. [Subject] The present invention is to solve the prior art, and provides a mounting method for transmitting a sound Ώ θ7 〜 a target to an FPCB, which is a substrate in which the FPCB is partially connected. (boardplate) Jade, using surface mount technology (4) Microphones On all FpcBs, the substrate is separated from the FPCB with the microphone installed, the risk of missing parts is lost, and the automation of the program for mounting the microphone to the FpcB can be realized. Batch production. Further, it is an object of the present invention to provide a mounting method for mounting a microphone on a F-mountain PCB, wherein the respective shapes are natural with respect to the f(10) electrode % and the ear-electrodes; and the electrode terminals and electrodes are positioned ' Thus _ advance-step to improve the self-purity efficiency of the program. Another object of the present invention is to provide an AI method for mounting a microphone to a CB, wherein the FPCB can be easily positioned on the separation device when performing the separation of the ppcB from the substrate for the 200820859, and the program can be further efficiently performed. Automation. In order to achieve the above object, the present invention provides a mounting method for mounting a microphone on an FPCB, characterized in that the mounting method comprises: preparing the first/sub-step according to a manner in which a plurality of FPCBs are locally connected to the substrate and arranged a substrate on which an electrode terminal connected to the microphone, a connection terminal connected to the main board, and a circuit pattern for electrically connecting the electrode terminal and the connection terminal are formed on the FPCB; and in the second step, the electrode terminal of the FpeB is coated and soldered a medium; in the third step, the microphone is placed on the electrode terminal of the coating device FPCB; in the fourth step, the microphone is mounted on the FPCB using surface mounting technology; and in the fifth step, the partial connection is released and separated from the substrate Since the microphone (3) in which the microphone is mounted has such a structure, the miniaturized microphone and the fpcb are lost and can be automated, and therefore, the work efficiency can be improved as compared with the conventional technique. , = Bu, the first of the invention! In the step, at the center of the above-mentioned muscle shape (the center of the figure), the shape of the mounting portion is formed as a figure _ 3⁄4 pole, and the predetermined distance is separated from the front of the positive tapping terminal. The shape of the shape of the figure: in, separated by a predetermined distance and with the above Fpc = positive 屯, 攸 positive electrode phase

帶狀的負電極;在第3步^負^端子對應的位置形成 处★ ,驟中,以使該傳聲器的外形歲L 述魏部的外形對齊的方式將傳聲器放置到FPCB的^ 部上。透過這樣的結構,0 | 女衣A strip-shaped negative electrode; at the position corresponding to the position of the third step ^n^ terminal, in the middle, the microphone is placed on the portion of the FPCB in such a manner that the shape of the microphone is aligned with the outer shape of the Wei. Through such a structure, 0 | women's clothing

/、要進仃使傳聲器的外形與pPcB 200820859 的安裝部的外形對齊的作業,就能夠準確地使傳聲器的電 極與FPCB的電極端子的位置對齊。 包 另外,本發明的上述第5步驟包括:第5a步驟,將包 括安裝有該傳聲器的FPCB的基板輸送到分離裝置進行定 位,以及第5b步驟,可上下移動地裝配在該分離裝置上的 沖切部件(blanking)對FPCB和基板局部地連接的部分進 _行沖切,並且,在該第5a步驟中,在該FPCB的預定位置 ⑩ 上汉置有貝牙形成的定位孔(Aligning hole ),將可上下移 動地裝配在該分離裝置上的定位銷(Aligningpin)插入^ 該定位孔,從而將FPCB定位在分離裝置上。透過這檬的 結構,安裝有傳聲器的FPCB可以容易且準確地定位在分 離裝置的沖切位置上。 【實施方式】 $ 下面,參照附圖詳細說明本發明的較佳具體實施例。 &lt;第1步驟&gt; 第二圖是表示本發明安裝方法的流程圖,第三圖是表 示以局部方式連接在基板上所形成FPCB之圖形。 參照第二圖,本發明將傳聲器安裝到FPCB的安装方 法如下:首先,在基板1〇上以具有一定排列形式的方式形 成多個FPCB 20。此時,如第三圖所示,多個FpcB 2〇分 別透過橋接件11以局部方式連接在基板.1〇上。透過遠檬 的結構’將傳聲器安裝到FPCB上的情況下,FPCB 2〇與 200820859 基板ίο作為整體—起移動,因此,即使FPCB2〇的尺寸再 小,也不會有丟失的危險。 上—=照第三圖,FPCB2〇由安裝有傳聲器安裴部21及從 该安裝部21延長的延長部22所構成。該安裝部幻具有與 以下的傳聲器30 (參見第四圖)外形相同的外形,:外开; 所具備的圖形的中心(即’圖心)形成有正電極端子训 ♦ ) 乂 °亥正宅極端子21〇a為中心向外側相隔預定距 離設置有至少一個負電極端,子210 (210b)。另外,在該延 長部22的末端相互相隔預定距離設置有正連接端子2汕 (22〇a)和負連接端子220( 22仳),該正連接端子22〇( 22〇a) 和負連接端子22〇(22〇b)用於與設置於多媒體電子設 :的主板(未圖示)電連接。該正電極端子21如透過印刷 =路圖案23〇 (23()a)與該正連接端子島電連接,該負 電極端子210b也是透過印刷電路圖案23〇 (2 义連 接端子220b電連接。 一貝遝 具有這種結構的各個FPCB 20首先將電極端子训、 連接端子220及印刷電路圖案23〇形成在基才反ι〇上 要求FPCB20的外形,部分地沖切基板,保留橋 接件1丨部分’從而使FPCB 2〇«局料錢縣基板ι〇 &lt;第2步驟&gt; 第2步驟中,對於在該第j步驟中完成的多個砰⑶加 透過橋接件U以局部方式連接而進行排列的基板1〇,在 200820859 該FPCB 20的雷搞嫂工, 一 i^子210上塗布焊接介質240。第四圖 是放=表—布有·介質的m:B 20之圖式。 焊接&quot;胃240主要是烊錫膏(cream solder),為半固 體狀態的導電性材料,冷卻時成為固態。另-方面,如第 二圖所不’在FPCB 2〇的電極端子21〇上形成一槽,以便 能夠使焊齡#謂以。如第四圖赫,塗布該焊接介 質240達到如下程度:該焊接介質24〇充分地流入到該槽, ,槽填滿’從而其與電極.端子21G之間維持充分接觸,同 枯,咿留於該槽的上部’從而在以下的第3步驟和第4步 驟中能夠與傳聲器30的電極充分接觸。 〈第3步驟〉 第3步驟中,在該第2步驟中將焊接介質24〇塗布到 PCB 20的電極端子21〇上之後,使傳聲器3〇位於j7pcg|2〇 的%極:^子210之上部。第五圖是表示傳聲器位於fpcb 上°卩狀態以及傳聲器電極結構之圖式。參照第五圖,傳聲 器30的外形與fpCB 20安裝部21的外形相同。並且,在 傳聲器30外形所具備的圖形的中心上設置有正電極31〇 (310a),另外,從該正電極3i〇a相隔預定距離並與該FPcb 20的負電極端子210b對應位置上形成有帶狀的負電極310 (3l〇b) 〇 該傳聲器30的外形可以製作成多種形態的多邊形,在 此〜情況下,與之對應地將F P C B 2 0安裝部.21製作成具有 與傳聲器30外形相同的外形。並且,傳聲器30的正電極 11 200820859 310a位於外形所具備的圖形的中心,同樣地FPC]B 2〇正電 極端子210a也位於安裝部21外形所具備圖形的中心。另 外,傳聲器30的負電極310b為帶狀,FPCB 20的負電極 端子210b位於與負電極31〇b對應的位置。傳聲器30的電 極310和與之對應的FPCB 20的電極端子210具有如上所 述的結構和位置關係,因此,只要使傳聲器30的外形與 FPCB 20的安裝部21外形對齊’電極310和電極端子21〇 的位置自然就會對齊。 - 並且·,能夠容易地進行小塑化的傳聲器30和FPCB 20 的定位,從而能夠提高整體安裝程序的效率。而且,可以 貝現女裝程序的自動化。 &lt;第4步驟&gt; 若完成該第3步驟,則處於傳聲器30放置到焊接介質 240上面的狀態,該焊接介質24〇塗布於FpcB安裝邛二 的電極端子2H)上。第4步驟是在這種狀態下利用^面安 裝技術透過焊接介質240將傳聲器30和FpcB2〇連接的步/, to align the shape of the microphone with the shape of the mounting portion of the pPcB 200820859, the position of the electrode of the microphone and the electrode terminal of the FPCB can be accurately aligned. In addition, the above fifth step of the present invention includes: in the step 5a, transporting the substrate including the FPCB on which the microphone is mounted to the separating device for positioning, and the step 5b, rushing up and down on the separating device A portion punching the portion of the FPCB and the substrate that is locally connected, and, in the step 5a, placing an aligning hole formed by the beak at a predetermined position 10 of the FPCB A positioning pin (Aligning pin) that is movably mounted on the separating device is inserted into the positioning hole to position the FPCB on the separating device. Through the structure of the lemon, the FPCB on which the microphone is mounted can be easily and accurately positioned at the punching position of the separation device. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. &lt;First Step&gt; The second diagram is a flowchart showing the mounting method of the present invention, and the third diagram is a graph showing the FPCB formed on the substrate in a partial manner. Referring to the second figure, the mounting method of the present invention for mounting the microphone to the FPCB is as follows: First, a plurality of FPCBs 20 are formed on the substrate 1 in a manner of having a certain arrangement. At this time, as shown in the third figure, a plurality of FpcB 2 连接 are locally connected to the substrate .1 via the bridge member 11, respectively. In the case where the microphone is mounted on the FPCB through the structure of the remote lemon, the FPCB 2〇 and the 200820859 substrate ίο as a whole move, so even if the size of the FPCB 2 再 is small, there is no danger of loss. Up-= As shown in the third figure, the FPCB 2 is composed of a microphone mounting portion 21 and an extension 22 extending from the mounting portion 21. The mounting portion has the same shape as the following microphone 30 (see the fourth figure), and is externally opened; the center of the graphic (ie, the 'picture center) is formed with a positive electrode terminal ♦) 乂°海正宅The terminal 21〇a is provided with at least one negative electrode terminal, the sub-210 (210b), at a predetermined distance from the center to the outside. Further, a positive connection terminal 2A (22〇a) and a negative connection terminal 220 (22仳) are provided at a predetermined distance from each other at the end of the extension portion 22, and the positive connection terminal 22〇 (22〇a) and the negative connection terminal are provided. 22〇(22〇b) is used to electrically connect to a motherboard (not shown) provided on the multimedia electronic device: The positive electrode terminal 21 is electrically connected to the positive connection terminal island via a print=road pattern 23〇(23()a), and the negative electrode terminal 210b is also electrically connected through the printed circuit pattern 23〇 (2 sense connection terminal 220b. Each of the FPCBs 20 having such a structure firstly forms the electrode terminal training, the connection terminal 220, and the printed circuit pattern 23〇 on the basis of the shape of the FPCB 20, partially punches the substrate, and retains the bridge portion. 'Therefore, the FPCB 2 〇 局 钱 县 县 基板 基板 〇 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第The aligned substrate 1〇, in 200820859, the FPCB 20 is completed, and the soldering medium 240 is coated on the i-sub-210. The fourth figure is a diagram of the m:B 20 of the discharge-table-cloth medium. &quot;Stomach 240 is mainly cream solder, which is a semi-solid conductive material, which becomes solid when cooled. On the other hand, as shown in the second figure, it is formed on the electrode terminal 21 of the FPCB 2〇. a slot so that the welding age can be made. For example, the fourth figure The soldering medium 240 is applied to the extent that the soldering medium 24 〇 flows sufficiently into the groove, and the groove is filled up so that it maintains sufficient contact with the electrode. terminal 21G, and is left in the upper portion of the groove. Therefore, it is possible to sufficiently contact the electrodes of the microphone 30 in the following third step and fourth step. <Third step> In the third step, the solder medium 24 is applied to the electrode terminal 21 of the PCB 20 in the second step. After the cymbal, the microphone 3 is located at the upper part of the j7pcg|2〇: the upper part of the ^ 210. The fifth figure is a diagram showing the microphone located on the fpcb and the structure of the microphone electrode. Referring to the fifth figure, the microphone 30 The outer shape is the same as that of the fpCB 20 mounting portion 21. Further, a positive electrode 31A (310a) is provided at the center of the pattern provided in the outer shape of the microphone 30, and the positive electrode 3i〇a is spaced apart from the positive electrode 3i〇a by a predetermined distance. The negative electrode terminal 210b of the FPcb 20 is formed with a strip-shaped negative electrode 310 (3l〇b) corresponding to the position. The outer shape of the microphone 30 can be formed into a plurality of polygons. In this case, the FPCB 2 is correspondingly formed. 0 The mounting portion 21 is formed to have the same outer shape as that of the microphone 30. Further, the positive electrode 11 200820859 310a of the microphone 30 is located at the center of the pattern provided in the outer shape, and likewise the FPC] B 2 〇 positive electrode terminal 210a is also located at the mounting portion 21 The shape has a center of the pattern. Further, the negative electrode 310b of the microphone 30 has a strip shape, and the negative electrode terminal 210b of the FPCB 20 is located at a position corresponding to the negative electrode 31〇b. The electrode 310 of the microphone 30 and the electrode terminal 210 of the FPCB 20 corresponding thereto have the structure and positional relationship as described above, and therefore, the outer shape of the microphone 30 is aligned with the outer shape of the mounting portion 21 of the FPCB 20 'electrode 310 and electrode terminal 21 The position of the cockroach will naturally align. - And, the positioning of the microphone 30 and the FPCB 20 that can be easily plasticized can be easily performed, thereby improving the efficiency of the overall mounting procedure. Moreover, it is possible to automate the women's program. &lt;Step 4&gt; When the third step is completed, the microphone 30 is placed on the upper surface of the welding medium 240, and the welding medium 24 is applied to the electrode terminal 2H of the FpcB mounting unit 2. The fourth step is a step of connecting the microphone 30 and the FpcB2 through the welding medium 240 by means of the surface mounting technique in this state.

具體而言,使放置有FPCB μ得耸器30處於高溫) q卞的ου爽 悲,焊接介質240絲㈣之後,再錢行冷卻, 過焊接介質240將傳聲n 3〇㈣極31 子210固定。 1^的电極3 表面安裝技術不進行像以往那樣由 獲將&quot;貝固疋的作業,只將傳聲器30放到FPCB如上会 12 200820859 狀態下無需追加作業也能完成,因此能夠提高作業效率 並且可以實現安裝程序的自動化。 &lt;第5步驟&gt; 完成該第4步驟之後,傳聲器3〇被安袭到FpcB 2〇 上。但是,由於FPCB 20是以橋接件n為介質,以局部方 式連接在基板10上,因此,在第5步驟中,將橋接件n •.部分沖切,使安裝有傳聲器30的FPCB 20從基板11分離。 第六圖是表示安裝有傳聲器的FPCB定位在分離裝置上的 狀態之圖式,第七圖是表示橋接件被分離裝置沖切的狀態 之圖式。 首先,將包括安裝有傳聲器30的FPCB 20的基板10 &quot; 輸送到用於沖切橋接件Π的分離裝置40 (第5a步驟)。此 時,FPCB 20仍以局部方式連接在基板10上,因此,祕送‘ 時不會有丟失的危險。另外,是以大尺寸的基板10為輸送 鲁 主體而不是以小型化的FPCB 20為輸送主體,因此,無需 複雜地設計輸送裝置(未圖示)’具有容易設計输送裝置的 優點。Specifically, the FPCB μ is placed at a high temperature), and after the welding medium 240 (four) is welded, the cooling is performed, and the welding medium 240 transmits the sound n 3 〇 (four) pole 31 210 fixed. The electrode surface mounting technology of the 1^ electrode is not performed as in the past, and the operation of the "Becai" is only performed. The microphone 30 is placed on the FPCB as described above. 12 200820859 can be completed without additional work, thereby improving work efficiency. And you can automate the installer. &lt;Step 5&gt; After the completion of the fourth step, the microphone 3 is hit by the FpcB 2〇. However, since the FPCB 20 is connected to the substrate 10 in a partial manner by using the bridge n as a medium, in the fifth step, the bridge n. is partially die-cut so that the FPCB 20 on which the microphone 30 is mounted is removed from the substrate. 11 separation. Fig. 6 is a view showing a state in which the FPCB on which the microphone is mounted is positioned on the separating device, and Fig. 7 is a view showing a state in which the bridge is punched by the separating device. First, the substrate 10 &quot; including the FPCB 20 on which the microphone 30 is mounted is transported to the separating device 40 for punching the bridge Π (step 5a). At this time, the FPCB 20 is still connected to the substrate 10 in a partial manner, so there is no risk of loss when it is secretly transmitted. Further, since the large-sized substrate 10 is used as the transporting body rather than the miniaturized FPCB 20 as the transporting body, there is no need to complicatedly design the transporting device (not shown), which has the advantage of easily designing the transporting device.

然後,將經輸送的基板10中成為沖切對象的FPCB 20 定位在分離裝置40上,以便僅分離橋接件11部分。為此, 如第二圖至第七圖所示,本發明的FPCB 20延長部22的中 央設置有貫穿形成的定位孔250。並且’與之對應地在分 離裝置40上設有定位銷41,該定位銷41可相對於分離裝 置40上下移動。如·第六圖所示,安裝有傳聲.器3〇的FpCB 13 200820859 20定位在分離裝置40上時,儘可能使定位孔25〇位於定 位銷41的下部。然後,向下部輸送定位銷41,將定位銷 41插入到定位孔250,從而能夠使FPCB 20的橋接件n 準確地位於要衝切的位置。該定位鎮41形成為錐形,即定 位銷41的下端部形成得較窄,越往上部直徑越大,較佳是 上部的直徑製作成與定位孔250的直徑相同。透過這樣的 結構,即使不將FPCB 20準確地定位在分離裝置4〇上,定 位銷41的下端部也能夠充分地插入到定位孔25〇,並且, 若定位銷41的上部插入到定位孔25〇,則FpcB2〇得到微 調,使橋接件11定位在能夠進行沖切的準確位置。 該分離裝置40在定位銷41的兩侧相隔預定距離設置 有沖切部件42。該沖切部件42與定位銷41間之距離和 FPCB烈巾定減ho與橋接件^狀距離相同,該沖切 部件42設置成可相對於分離裝置4〇上下移動。而且,若 該FPCB 20相對於分離裝置4〇準確地定位在沖切位置,則 該沖切部件42就位於橋接件^的上部。 然後’向下部移動沖切部件42,沖切橋接件n之後, 如第七圖所示’再切_上料,fpcb 2G保持從基板 1 〇分雒的狀恶(第5b步驟)。並且,能夠得 器 30 的 FPCB 20。 發明效果 如上所述’本發明的將傳聲器安裝到fpcb上的安裝 方法中,在將多個FPCft a &amp; ^ 土 B以局部方式連接到基板上的狀態 200820859 下,使用表面安裝技術安裝傳聲器之後,將安裝有傳聲器 的FPCB從基板分離,由於經過如上步驟,小型化的傳聲 器和FPCB丟失的危險減小,並且可以實現自動化,因此, 與透過手工作業來進行安裝的現有技術相比,能夠提高作 業效率。 本發明的將傳聲器安裝到FPCB上的安裝方法中,只 要使傳聲器的外形與FPCB的安裝部的外形對齊,就能夠 自然地將傳聲器的電極和FPCB的電極端子定位,因此作 業容易,由此還能夠實現自動化。 並且,本發明的將傳聲器安裝到FPCB上的安裝方法 中,透過形成於FPCB上的定位孔和分離裝置所具備的定 位銷,能夠容易地使FPCB相對於分離裝置位於準確的沖 切位置,因此,具有能夠實現自動化的效果。 而且,本發明的較佳具體實施例是以例示為目的幕出 的,本發明所屬技術領域之人士應該理解可以在本發明的 思想和範圍内進行各種修改和變更及追加等,此等的修 改、變更及追加等也在申請專利範圍之保護範圍内。 【圖式簡單說明】 本發明的某些具體實施例將參考下列圖式來詳細說 明,其中同樣的符號表示同樣的構件,其中: 第一圖是表示將傳聲器安裝到軟性印刷電路板上的習 知安裝方法之圖式。 第二圖是表示本發明的安裝方法之流程圖。 15 200820859 第三圖是表示以局部方式連接在基板上而形成的 FPCB之圖式。 第四圖是放大表示塗布有焊接介質的FPCB之圖式。 第五圖是表示傳聲器位於FPCB上部的狀態以及傳聲 的電極結構之圖式。 第六圖是表示安裝有傳聲器的FPCB定位在分離裝置 上的狀態之圖式。 第七圖是表示橋接件(bridge )被分離裝置沖切的狀態 之圖式。 【主要元件符號說明】 10 基板 11 橋接件 20 FPCB 21 安裝部 22 延長部 30 傳聲器 40 分離裝置 41 定位銷 42 沖切部件 210 電極端子 210a 正電極端子 210b 負電極端子 220 連接端子 200820859Then, the FPCB 20 which becomes the punching target in the conveyed substrate 10 is positioned on the separating device 40 so as to separate only the portion of the bridge 11. To this end, as shown in the second to seventh figures, the center of the FPCB 20 extension 22 of the present invention is provided with a positioning hole 250 formed therethrough. And correspondingly, the separation device 40 is provided with a positioning pin 41 which is movable up and down with respect to the separating device 40. As shown in the sixth figure, when the FpCB 13 200820859 20 to which the sound transmitter 3 is mounted is positioned on the separating device 40, the positioning hole 25 is placed as far as possible in the lower portion of the positioning pin 41. Then, the positioning pin 41 is conveyed downward, and the positioning pin 41 is inserted into the positioning hole 250, so that the bridge n of the FPCB 20 can be accurately positioned at the position to be punched. The positioning town 41 is formed in a tapered shape, that is, the lower end portion of the positioning pin 41 is formed to be narrow, and the larger the diameter toward the upper portion, the diameter of the upper portion is preferably made the same as the diameter of the positioning hole 250. With such a configuration, even if the FPCB 20 is not accurately positioned on the separating device 4, the lower end portion of the positioning pin 41 can be sufficiently inserted into the positioning hole 25A, and if the upper portion of the positioning pin 41 is inserted into the positioning hole 25 〇, the FpcB2〇 is fine-tuned so that the bridge 11 is positioned at the exact position where the punching can be performed. The separating device 40 is provided with a punching member 42 at a predetermined distance on both sides of the positioning pin 41. The distance between the punching member 42 and the positioning pin 41 and the FPCB wiper reduction ho are the same as the bridge member. The punching member 42 is disposed to be movable up and down with respect to the separating device 4〇. Moreover, if the FPCB 20 is accurately positioned at the punching position with respect to the separating device 4, the punching member 42 is located at the upper portion of the bridge member. Then, the punching member 42 is moved downward, and after the bridge n is punched, as shown in Fig. 7, the fpcb 2G is kept in a state of being separated from the substrate 1 (step 5b). Also, the FPCB 20 of the device 30 can be obtained. Advantageous Effects of Invention As described above, in the mounting method of the present invention for mounting a microphone to an fpcb, after a plurality of FPCft a &amp; ^ soil B is locally connected to a substrate in a state of 200820859, after the microphone is mounted using surface mounting technology The FPCB on which the microphone is mounted is separated from the substrate, and since the above steps, the risk of loss of the miniaturized microphone and the FPCB is reduced, and automation can be achieved, and therefore, it can be improved as compared with the prior art which is installed by manual work. Work efficiency. In the mounting method of mounting the microphone on the FPCB of the present invention, as long as the outer shape of the microphone is aligned with the outer shape of the mounting portion of the FPCB, the electrode of the microphone and the electrode terminal of the FPCB can be naturally positioned, so that the work is easy, thereby also Ability to automate. Moreover, in the mounting method of mounting the microphone on the FPCB of the present invention, the positioning pin provided on the FPCB and the positioning pin provided in the separating device can easily position the FPCB at an accurate punching position with respect to the separating device. With the effect of being able to achieve automation. Further, the preferred embodiments of the present invention are intended to be illustrative, and those skilled in the art should understand that various modifications, changes, additions, etc. can be made within the spirit and scope of the present invention. Changes, additions, and additions are also covered by the scope of patent application. BRIEF DESCRIPTION OF THE DRAWINGS Some specific embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which the same reference numerals represent the same components, in which: the first figure shows the installation of the microphone on the flexible printed circuit board. Know the schema of the installation method. The second figure is a flow chart showing the mounting method of the present invention. 15 200820859 The third figure is a diagram showing the FPCB formed by connecting it locally on a substrate. The fourth figure is an enlarged view of the FPCB coated with the solder medium. The fifth figure is a diagram showing the state in which the microphone is located at the upper portion of the FPCB and the structure of the sound-transmitting electrode. The sixth diagram is a diagram showing a state in which the FPCB on which the microphone is mounted is positioned on the separating device. The seventh figure is a diagram showing a state in which the bridge is punched by the separating device. [Main component symbol description] 10 Substrate 11 Bridge 20 FPCB 21 Mounting section 22 Extension 30 Microphone 40 Separation device 41 Locating pin 42 Punching part 210 Electrode terminal 210a Positive electrode terminal 210b Negative electrode terminal 220 Connection terminal 200820859

220a 正連接端子 220b 正連接端子 230 印刷電路圖案 230a 印刷電路圖案 230b 印刷電路圖案 240 焊接介質 250 定位孔 310 電極- 310a 正電極 310b 負電極 500 傳聲器 501 電極 510 FPCB 511 電極端子 520 夾具 521 槽 540 焊接設備220a positive connection terminal 220b positive connection terminal 230 printed circuit pattern 230a printed circuit pattern 230b printed circuit pattern 240 soldering medium 250 positioning hole 310 electrode - 310a positive electrode 310b negative electrode 500 microphone 501 electrode 510 FPCB 511 electrode terminal 520 clamp 521 slot 540 soldering device

Claims (1)

200820859 十、申請專利範圍·· 傳聲器安裝到FPCB上的安裝方法,其特徵在於, 该女裝方法包括: 第1步驟,依據使多個FPCB分別局部地與基板連 傳列,式準備基板,在該FPCB上形成有與 於:二山的電極端子、與主板連接的連接端子以及用 ;:二圣^子和連接端子電連接的電路圖案; ,2步驟’在該FpcB的電極端子上塗布焊接介質. 劃V電=子1·傳聲器放⑽^ .第4步驟’使用表面安裝技術將傳聲器安装到咖b 上,以及 傳聲^^3。解除該局部連接,從基板分離出安裳有 2.樹ft請專利範圍第1項所述之將傳聲器安裝到FPCB 、女I方法,其特徵在於,在第i步驟中,在爷ρ =形狀與傳聲器的外形相同的安裝構 裝部外形的圖形的中心(即圖心)上形成正電 亚且,從該正電極端子向外侧相隔預定 ^ ’ 端子;對於該傳聲器,在構成其外形的圖形的tL 電極 正電極’從正電極相隔預定距離並與該咖 二成 端子對應的位置形成㈣狀的負電極;在第3步驟:極 以使該傳聲器的外形與該安裝部十, 聲器放置到FPCB的安褒部上。 -的方式將傳 18 200820859 3. 根據申請專利範圍第1項所述的將傳聲器安裝到FPCB 上的安裝方法,其特徵在於,該第5步驟包括: 第5a步驟,將包括安裝有該傳聲器的FPCB的基板 輸送到分離裝置進行定位;以及 第5b步驟,可上下移動地裝配在該分離裝置上的沖 切部件對FPCB的與基板局部地連接的部分進行沖切。 4. 根據申請專利範圍第3項所述的將傳聲器安裝到FPCB 上的安裝方法,其特徵在於,在該第5a步驟中,在該 FPCB的預定位置上設置有貫穿形成的定位孔,將可上下 移動地裝配在該分離裝置上的定位銷插入到該定位孔, 從而將FPCB定位在分離裝置上。200820859 X. Patent application scope·· The installation method of the microphone mounted on the FPCB is characterized in that: the first method comprises: preparing the substrate according to the method of causing a plurality of FPCBs to be partially connected to the substrate respectively. The FPCB is formed with an electrode terminal connected to the Ershan, a connection terminal connected to the main board, and a circuit pattern electrically connected to the connection terminal; and 2 steps 'application and soldering on the electrode terminal of the FpcB Media. 划V = sub1. Microphone (10)^. Step 4 'Install the microphone on the coffee b using surface mount technology, and pass the sound ^^3. The local connection is released, and the stalk is separated from the substrate. 2. The tree ft is attached to the FPCB and the female I method according to the first item of the patent scope, which is characterized in that, in the i-th step, the shape is Forming a positive electric current on the center (ie, the center of the figure) of the outer shape of the mounting structure portion having the same outer shape as the microphone, and separating the predetermined terminal from the positive electrode terminal to the outer side; for the microphone, the graphic forming the outer shape thereof The positive electrode of the tL electrode forms a (four)-shaped negative electrode from a position at a predetermined distance from the positive electrode and corresponding to the terminal of the coffee; in the third step: the pole is placed so that the shape of the microphone and the mounting portion are ten, the sounder is placed Go to the safety section of the FPCB. The method of mounting the microphone to the FPCB according to the scope of claim 1 is characterized in that the fifth step comprises: step 5a, which will include the installation of the microphone. The substrate of the FPCB is transported to the separation device for positioning; and in the step 5b, the punching member that is movably mounted on the separating device is punched and cut to the portion of the FPCB that is partially connected to the substrate. 4. The mounting method for mounting a microphone on an FPCB according to claim 3, wherein in the step 5a, a positioning hole formed through the through hole is formed at a predetermined position of the FPCB. A positioning pin that is mounted up and down on the separating device is inserted into the positioning hole to position the FPCB on the separating device. 1919
TW096138700A 2006-10-16 2007-10-16 Mounting method for mounting microphone on flexibl TWI360378B (en)

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KR100963296B1 (en) * 2008-07-11 2010-06-11 주식회사 비에스이 A variable directional microphone assmebly and method of making the microphone assembly
KR101509019B1 (en) 2014-04-18 2015-04-14 (주)글로벌텍 hot-bar soldering apparatus
CN108055789A (en) * 2018-01-03 2018-05-18 苏州维信电子有限公司 Prevent the production technology of MIC dysfunctions

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CA2187495A1 (en) * 1995-10-31 1997-05-01 Dan Charles Plitt Electronic component assembly and method fhereof
DE69626747T2 (en) * 1995-11-16 2003-09-04 Matsushita Electric Ind Co Ltd Printed circuit board and its arrangement
JP3283226B2 (en) * 1997-12-26 2002-05-20 ポリマテック株式会社 How to make a holder
JP2002345092A (en) 2001-05-15 2002-11-29 Citizen Electronics Co Ltd Manufacturing method for condenser microphone
KR100406258B1 (en) 2002-01-25 2003-11-14 주식회사 삼부커뮤닉스 soldering method of condenser microphone using SMD formula
JP4366342B2 (en) * 2005-07-08 2009-11-18 ホシデン株式会社 Mounting board and microphone mounted thereon
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