CN101166402A - Mounting method for mounting microphone on flexible printed circuit board - Google Patents

Mounting method for mounting microphone on flexible printed circuit board Download PDF

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Publication number
CN101166402A
CN101166402A CNA2007101524485A CN200710152448A CN101166402A CN 101166402 A CN101166402 A CN 101166402A CN A2007101524485 A CNA2007101524485 A CN A2007101524485A CN 200710152448 A CN200710152448 A CN 200710152448A CN 101166402 A CN101166402 A CN 101166402A
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CN
China
Prior art keywords
fpcb
microphone
electrode terminal
motherboard
profile
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2007101524485A
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Chinese (zh)
Other versions
CN101166402B (en
Inventor
金正敏
李相镐
金亨周
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BO SUNG ELECTRICS Co Ltd
BSE Co Ltd
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BO SUNG ELECTRICS Co Ltd
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Filing date
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Publication of CN101166402A publication Critical patent/CN101166402A/en
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Publication of CN101166402B publication Critical patent/CN101166402B/en
Expired - Fee Related legal-status Critical Current
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A mounting method for mounting a microphone onto a flexible printed circuit board is provided in the present invention, it is characterized in that comprising: first step, preparing mother board according to the mode of leading a plurality of FPCBs to separately locally connect with mother board and process arrangement, there are an electrode terminal connecting with the microphone, a connecting terminal connecting with the main board and a circuit pattern for electric connecting the electrode terminal and the connecting terminal forming on the FPCBs; second step, coating soldering medium on the electrode terminal of the FPCB; third step, placing the microphone on the electrode terminal coated soldering medium of the FPCB; forth step, mounting the microphone onto the FPCB by surface mounting technique; and fifth step, relieving the locally connecting, separating out FPCB mounted microphone from mother board. By the structure, miniaturization microphone and FPCB lost danger can reduce, and can realize automation, therefore comparing with the prior art by hand-operated work to mount, it can promote operation efficiency.

Description

Microphone is installed to installation method on the flexible printed circuit board
Technical field
The microphone that the present invention relates to be arranged at mobile phone or portable multimedia electronic equipment internal is installed to the installation method on the flexible printed circuit board.In more detail, the operation that the present invention relates to by automation is installed to installation method on the flexible printed circuit board in a large number with the microphone of miniaturization.
Background technology
In recent years, the multimedia electronic equipment that often can touch around, for example MP3 (Moving Picture Experts Group Layer 3), video camera (Camcorder), mobile phone electronic equipments such as (Mobile) generally provide transmit or record down around the function of the sound that produces.Especially for multimedia electronic equipment with miniaturization, very thinization, high performance trend, the one important reason that can realize this class sound-recording function is, has realized miniaturization because of it and has constituted the improvement to the microphone that can be installed to multimedia electronic equipment inside.
The microphone of widespread usage is a condenser microphone in this class microphone.Condenser microphone possesses: be referred to as the dielectric plate of electret, it applies electric charge to macromolecule membrane and forms, and has semipermanent electric charge (Electric Charge); And oscillating plate, it is that (Polyethylen Terephthalate: PETG) vibrating membrane of film material is made by go up joint PET at metal polar ring (polarring), described condenser microphone utilization is formed at the electrostatic field between dielectric plate and the oscillating plate, and voice signal is converted to the signal of telecommunication.
Above-mentioned microphone is inserted on the multimedia electronic equipments such as video camera, mobile communication terminal, MP3, be electrically connected with these electronic installations, for this reason, general microphone is by welding negative electrode and anode to be directly connected on the mainboard of electronic equipment, perhaps, consider the insertion space between microphone and the mainboard (not shown), and for the easiness that is electrically connected, in the following way: the electrode of microphone is connected to flexible printed circuit board (Flexible Printed Circuit Board: the following FPCB of being called), FPCB is connected with mainboard.
For the mode of above-mentioned use FPCB, FPCB is the substrate that is formed with circuit pattern, and the microphone manufacturer can supply under the state that microphone is installed on the FPCB.Microphone of supplying and the FPCB that this microphone is installed are electrically connected by the mainboard in making FPCB and being assemblied in multimedia electronic equipment, thereby are assembled in the multimedia electronic equipment.
In the past, as shown in Figure 1, microphone was installed on the FPCB by handwork.Specifically, at first on the anchor clamps 520 that are provided with the groove 521 that microphone 500 and FPCB 510 can be installed, microphone 500 is installed so that be formed at the mode that the electrode 501 of microphone 500 lower surfaces exposes, on microphone 500 so that the electrode terminal 511 of FPCB 510 is placed FPCB 510 with the mode of the position consistency of the electrode 501 of microphone.Then, the electrode terminal 511 of FPCB is connected electrically in weld job on the electrode 501 of microphone, microphone 500 is installed on the FPCB 510 by using welding equipment 540 such as flatiron.
Aforesaid existing installation exercise is undertaken by handwork, and therefore, operating speed is slow, consequently has the low problem of operating efficiency.And in recent years, along with miniaturization, the very thinization trend of multimedia electronic equipment, the diameter that requires microphone is about about 3mm~4mm.Thereupon, the spacing that is formed between the electrode 501 at microphone 500 back sides is dwindled, and thus, for the electrode terminal 511 of the FPCB 510 that is electrically connected with above-mentioned electrode 501, the spacing between its electrode terminal is also dwindled.Thereby, when as in the past, carrying out weld job, have the problem of the electrode terminal 511 of the electrode 501 that is difficult to connect exactly microphone and FPCB by handwork.
In addition, because the miniaturization of FPCB 510 is difficult to control FPCB 510, therefore, that loses is dangerous big, and exists the electrode terminal 511 that is difficult to make FPCB 510 to be positioned at problem on the electrode 501 of microphone exactly.
Summary of the invention
The present invention proposes in order to solve prior art problems, its purpose is, provide a kind of microphone is installed to installation method on the FPCB, wherein, on the motherboard (board plate) that a plurality of FPCB connect with local mode, utilize surface mounting technology that microphone is installed to after each FPCB goes up, isolate the FPCB that microphone is installed from motherboard, thereby reduce the danger of loss of parts, and realize microphone is installed to the automation of the operation on the FPCB, thereby can produce in batches.
In addition, the objective of the invention is to, provide a kind of microphone is installed to installation method on the FPCB, wherein, profile separately is consistent with respect to the electrode of the electrode terminal of FPCB and microphone, just keeper electrode terminal and electrode naturally, thus the automation efficient of operation can further be improved.
In addition, the objective of the invention is to, provide a kind of microphone is installed to installation method on the FPCB, wherein, can easily FPCB be positioned on the separator when motherboard separates the operation of FPCB carrying out, further carry out the automation of operation effectively.
In order to achieve the above object, the invention provides and a kind of microphone is installed to installation method on the FPCB, it is characterized in that, described installation method comprises: the 1st step, the mode of arranging according to a plurality of FPCB are connected with motherboard is respectively partly prepared motherboard, is formed with the electrode terminal that is connected with microphone on this FPCB, with the mainboard connection terminals and be used for circuit pattern that electrode terminal and splicing ear are electrically connected; The 2nd step is coated with welding medium on the electrode terminal of above-mentioned FPCB; The 3rd step is placed into microphone on the electrode terminal of the FPCB that is coated with above-mentioned welding medium; The 4th step uses surface mounting technology that microphone is installed on the FPCB; And the 5th step, remove above-mentioned local the connection, isolate the FPCB that microphone is installed from motherboard.By such structure, the danger that the microphone of miniaturization and FPCB lose reduces, and can realize automation, therefore, compares with the prior art of installing by handwork, can improve operating efficiency.
In addition, in the 1st step of the present invention, the shape installation portion identical with the profile of microphone is set on above-mentioned FPCB, go up the formation positive electrode terminal at the center (center of fiqure) of the figure that constitutes above-mentioned installation portion profile, and, form negative electrode terminal from the above-mentioned positive electrode terminal preset distance of being separated by laterally; For above-mentioned microphone, in the figure that constitutes its profile, be formed centrally positive electrode, form banded negative electrode from be separated by preset distance and the position corresponding of positive electrode with the negative electrode terminal of above-mentioned FPCB; In the 3rd step, so that the mode that the profile of above-mentioned microphone is alignd with the profile of above-mentioned installation portion is placed into microphone on the installation portion of FPCB.By such structure, as long as the operation that the profile of microphone is alignd with the profile of the installation portion of FPCB just can make the aligned in position of the electrode terminal of the electrode of microphone and FPCB exactly.
In addition, above-mentioned the 5th step of the present invention comprises: the 5a step, and the motherboard that will comprise the FPCB that above-mentioned microphone is installed is transported to separator and positions; And 5b step, the die-cut parts (blanking) that can be assemblied in up or down on the above-mentioned separator carry out die-cut to FPCB with the part that motherboard is connected partly, and, in above-mentioned 5a step, the precalculated position of above-mentioned FPCB is provided with the location hole (Aligning hole) that runs through formation, the alignment pin (Aligning pin) that can be assemblied in up or down on the above-mentioned separator is inserted into above-mentioned location hole, thereby FPCB is positioned on the separator.By such structure, the FPCB of microphone is installed can be easily and be positioned at exactly on the die-cut position of separator.
Description of drawings
Fig. 1 is the figure that expression is installed to microphone the existing installation method on the flexible printed circuit board.
Fig. 2 is the precedence diagram of expression installation method of the present invention.
Fig. 3 is that expression is connected on the motherboard with local mode and the figure of the FPCB that forms.
Fig. 4 amplifies the figure that expression is coated with the FPCB of welding medium.
Fig. 5 is the figure that the expression microphone is positioned at the electrode structure of the state on FPCB top and microphone.
Fig. 6 is the figure that FPCB that expression is equipped with microphone is positioned at the state on the separator.
Fig. 7 is the figure of the die-cut state of the separated device of expression bridgeware (bridge).
Symbol description
10 motherboards; 11 bridgewares; 20 FPCB; 21 installation portions; 22 extensions; 30 microphones; 40 separators; 42 die-cut parts
Embodiment
Below, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
<the 1 step 〉
Fig. 2 is the precedence diagram of expression installation method of the present invention, and Fig. 3 is that expression is connected on the motherboard with local mode and the figure of the FPCB that forms.
With reference to Fig. 2, of the present invention that microphone is installed to the installation method of FPCB is as follows: at first, form a plurality of FPCB 20 in the mode with certain spread pattern on motherboard 10.At this moment, as shown in Figure 3, a plurality of FPCB 20 are connected on the motherboard 10 with local mode by bridgeware 11 respectively.By such structure, microphone is installed under the situation on the FPCB, FPCB 20 moves as a whole with motherboard 10, therefore, even the size of FPCB 20 is littler, does not also have the danger of losing.
With reference to Fig. 3, FPCB 20 is made of installation portion 21 that microphone is installed and the extension 22 that prolongs from above-mentioned installation portion 21.Above-mentioned installation portion 21 has the identical profile of profile with microphone 30 described later (with reference to Fig. 4), is formed with positive electrode terminal 210 (210a) at the center of the figure that profile possessed (that is center of fiqure).With above-mentioned positive electrode terminal 210a is that the center preset distance of being separated by laterally is provided with at least one negative electrode terminal 210 (210b).In addition, be provided with positive splicing ear 220 (220a) and negative splicing ear 220 (220b) at the end of above-mentioned extension 22 preset distance of being separated by mutually, this positive splicing ear 220 (220a) and negative splicing ear 220 (220b) be used for be arranged at multimedia electronic equipment in mainboard (not shown) be electrically connected.Above-mentioned positive electrode terminal 210a is electrically connected with above-mentioned positive splicing ear 220a by printed circuit pattern 230 (230a), and above-mentioned negative electrode terminal 210b is electrically connected with negative splicing ear 220b by printed circuit pattern 230 (230b).
Each FPCB 20 with this structure at first is formed on electrode terminal 210, splicing ear 220 and printed circuit pattern 230 on the motherboard 10, afterwards according to the profile of desired FPCB 20, partly die-cut motherboard 10, keep bridgeware 11 parts, thereby FPCB 20 is connected on the motherboard 10 with local mode.
<the 2 step 〉
In the 2nd step, connect the motherboard of arranging 10 by bridgeware 11 with local mode, coating welding medium 240 on the electrode terminal 210 of above-mentioned FPCB 20 for FPCB 20 that in above-mentioned the 1st step, finish, a plurality of.Fig. 4 amplifies the figure that expression is coated with the FPCB 20 of welding medium.
Welding medium 240 mainly is solder(ing) paste (cream solder), is the conductive material of semi-solid state, becomes solid-state during cooling.On the other hand, as shown in Figure 3, on the electrode terminal 210 of FPCB 20, be formed with groove, so that welding medium 240 is flowed into.As shown in Figure 4, be coated with above-mentioned welding medium 240 and reach following degree: above-mentioned welding medium 240 flow into above-mentioned groove fully, groove is filled up, thereby its with electrode terminal 210 between keep fully and contact, simultaneously, be stranded in the top of above-mentioned groove, thereby in the 3rd step described later and the 4th step, can fully contact with the electrode of microphone 30.
<the 3 step 〉
In the 3rd step, in above-mentioned the 2nd step, welding medium 240 is applied on the electrode terminal 210 of FPCB 20 after, make microphone 30 be positioned at the top of the electrode terminal 210 of FPCB 20.Fig. 5 is the figure that the expression microphone is positioned at the electrode structure of the state on FPCB top and microphone.With reference to Fig. 5, the profile of microphone 30 is identical with the profile of the installation portion 21 of FPCB 20.And, the center of the figure that profile possessed of microphone 30 is provided with positive electrode 310 (310a), in addition, be formed with banded negative electrode 310 (310b) from be separated by preset distance and the position corresponding of above-mentioned positive electrode 310a with the negative electrode terminal 210b of above-mentioned FPCB 20.
The profile of above-mentioned microphone 30 can be made into the polygon of variform, in this case, the installation portion 21 of FPCB 20 is made into has the profile identical with the profile of microphone 30 correspondingly.And the positive electrode 310a of microphone 30 is positioned at the center of the figure that profile possesses, and similarly the positive electrode terminal 210a of FPCB 20 also is positioned at the center of the figure that profile possessed of installation portion 21.In addition, the negative electrode 310b of microphone 30 is banded, and the negative electrode terminal 210b of FPCB 20 is positioned at the position corresponding with negative electrode 310b.The electrode terminal 210 of the electrode 310 of microphone 30 and corresponding with it FPCB20 has aforesaid structure and position relation, therefore, as long as the profile of microphone 30 is alignd with installation portion 21 profiles of FPCB 20, will align naturally in the position of electrode 310 and electrode terminal 210.
And, can easily carry out the location of the microphone 30 and the FPCB 20 of miniaturization, thereby can improve the efficient of integral installation operation.And, can realize the automation of installation procedure.
<the 4 step 〉
If finish above-mentioned the 3rd step, then be in microphone 30 and be placed into state above the welding medium 240, this welding medium 240 is coated on the electrode terminal 210 of FPCB installation portion 21.The 4th step is to utilize surface mounting technology to pass through welding medium 240 with microphone 30 and FPCB 20 step of connecting in this state.
Specifically, make the microphone 30 that is placed with FPCB 20 be in the condition of high temperature, welding medium 240 becomes after the liquid state, cools off once more, thereby by welding medium 240 electrode 310 of microphone 30 and the electrode terminal 210 of FPCB is fixed.
Surface mounting technology did not use directly that medium is fixing operation such as flatiron by the operator as in the past, only microphone 30 is put into and need not busy work under the state on the FPCB 20 and also can finish, therefore operating efficiency can be improved, and the automation of installation procedure can be realized.
<the 5 step 〉
Finish after above-mentioned the 4th step, microphone 30 is installed on the FPCB 20.But, because FPCB 20 is to be medium with bridgeware 11, be connected on the motherboard 10 with local mode, therefore in the 5th step that bridgeware 11 parts are die-cut, the FPCB 20 that microphone 30 is installed is separated from motherboard 11.Fig. 6 is the figure that FPCB that expression is equipped with microphone is positioned at the state on the separator, and Fig. 7 is the figure of the die-cut state of the separated device of expression bridgeware.
At first, the motherboard 10 that will comprise the FPCB 20 that microphone 30 is installed is transported to the separator 40 (5a step) that is used for die-cut bridgeware 11.At this moment, FPCB 20 still is connected on the motherboard 10 with local mode, therefore, does not have the danger of losing during conveying.In addition, be to serve as to carry main body rather than carry main body with the FPCB 20 of miniaturization with the big motherboard 10 of size, therefore, need not intricately and design conveying device (not shown), have the advantage of easy design conveying device.
Then, the FPCB 20 that will become die-cut object in the motherboard 10 of conveying is positioned on the separator 40, so that only separate bridgeware 11 parts.For this reason, to shown in Figure 7, the central authorities of the extension 22 of FPCB 20 of the present invention are provided with the location hole 250 that runs through formation as Fig. 2.And, on separator 40, being provided with alignment pin 41 correspondingly, this alignment pin 41 can move up and down with respect to separator 40.As shown in Figure 6, when the FPCB 20 that microphone 30 is installed is positioned on the separator 40, make location hole 250 be positioned at the bottom of alignment pin 41 as far as possible.Then, carry alignment pin 41, alignment pin 41 is inserted into location hole 250, want die-cut position thereby the bridgeware 11 of FPCB 20 is positioned at exactly to the bottom.Above-mentioned alignment pin 41 forms taper, and promptly the bottom of alignment pin 41 forms narrowlyer, and past more top diameter is big more, and preferred upper part diameter is made into identical with the diameter of location hole 250.By such structure, even FPCB 20 is not positioned on the separator 40 exactly, the bottom of alignment pin 41 also can be inserted into location hole 250 fully, and, if the top of alignment pin 41 is inserted into location hole 250, then FPCB 20 obtains fine setting, bridgeware 11 is positioned at can carries out die-cut accurate position.
Above-mentioned separator 40 preset distance of being separated by in the both sides of alignment pin 41 is provided with die-cut parts 42.Distance among distance between above-mentioned die-cut parts 42 and the alignment pin 41 and the FPCB 20 between location hole 250 and the bridgeware 11 is identical, and above-mentioned die-cut parts 42 are arranged to and can be moved up and down with respect to separator 40.And if above-mentioned FPCB 20 is positioned at die-cut position exactly with respect to separator 40, then above-mentioned die-cut parts 42 are located in the top of bridgeware 11.
Then, move die-cut parts 42 to the bottom, after the die-cut bridgeware 11, as shown in Figure 7, when moving to top once more, FPCB 20 keeps from the state (5b step) of motherboard 10 separation.And, can access the FPCB 20 that microphone 30 is installed.
The invention effect
As mentioned above, of the present invention microphone is installed in the installation method on the FPCB, under the state that a plurality of FPCB is connected to local mode on the motherboard, use surface mounting technology to install after the microphone, the FPCB that microphone is installed is separated from motherboard, because through as above step, the danger that the microphone of miniaturization and FPCB lose reduces, and can realize automation, therefore, compare with the prior art of installing, can improve operating efficiency by handwork.
Of the present invention microphone is installed in the installation method on the FPCB, as long as making the profile of microphone aligns with the profile of the installation portion of FPCB, just can naturally the electrode of microphone and the electrode terminal of FPCB be located, so operation is easy, can also realize automation thus.
And, of the present invention microphone is installed in the installation method on the FPCB,, can easily makes FPCB be positioned at die-cut accurately position with respect to separator by being formed at the alignment pin that location hole and separator possessed on the FPCB, therefore, has the effect that can realize automation.
And; the preferred embodiments of the present invention are enumerated to be illustrated as purpose; it should be appreciated by those skilled in the art and in thought of the present invention and scope, to carry out various modifications and changes and append etc., such modification, change and append etc. also in the claim protection range.

Claims (4)

1. one kind is installed to installation method on the FPCB with microphone, it is characterized in that described installation method comprises:
The 1st step, the mode of arranging according to a plurality of FPCB are connected with motherboard is respectively partly prepared motherboard, is formed with the electrode terminal that is connected with microphone on this FPCB, with the mainboard connection terminals and be used for circuit pattern that electrode terminal and splicing ear are electrically connected;
The 2nd step is coated with welding medium on the electrode terminal of described FPCB;
The 3rd step is placed into microphone on the electrode terminal of the FPCB that is coated with described welding medium;
The 4th step uses surface mounting technology that microphone is installed on the FPCB; And
The 5th step is removed described local the connection, isolates the FPCB that microphone is installed from motherboard.
2. according to claim 1 microphone is installed to installation method on the FPCB, it is characterized in that, in the 1st step, the shape installation portion identical with the profile of microphone is set on described FPCB, at the center of the figure that constitutes described installation portion profile, be to form positive electrode terminal on the center of fiqure, and, form negative electrode terminal from the described positive electrode terminal preset distance of being separated by laterally;
For described microphone, in the figure that constitutes its profile, be formed centrally positive electrode, be formed with banded negative electrode from be separated by preset distance and the position corresponding of positive electrode with the negative electrode terminal of described FPCB;
In the 3rd step, so that the mode that the profile of described microphone is alignd with the profile of described installation portion is placed into microphone on the installation portion of FPCB.
3. according to claim 1 microphone is installed to installation method on the FPCB, it is characterized in that described the 5th step comprises:
The 5a step, the motherboard that will comprise the FPCB that described microphone is installed is transported to separator and positions; And
The 5b step, the die-cut parts that can be assemblied in up or down on the described separator carry out die-cut to the part with motherboard is connected partly of FPCB.
4. according to claim 3 microphone is installed to installation method on the FPCB, it is characterized in that, in described 5a step, the precalculated position of described FPCB is provided with the location hole that runs through formation, the alignment pin that can be assemblied in up or down on the described separator is inserted into described location hole, thereby FPCB is positioned on the separator.
CN2007101524485A 2006-10-16 2007-10-12 Mounting method for mounting microphone on flexible printed circuit board Expired - Fee Related CN101166402B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020060100184 2006-10-16
KR10-2006-0100184 2006-10-16
KR1020060100184A KR100776189B1 (en) 2006-10-16 2006-10-16 Mounting method for mounting microphone on flexible printed circuit board

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CN101166402A true CN101166402A (en) 2008-04-23
CN101166402B CN101166402B (en) 2010-06-02

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CN (1) CN101166402B (en)
TW (1) TWI360378B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101626532B (en) * 2008-07-11 2013-01-16 宝星电子株式会社 A variable directional microphone assembly and method of making the microphone assembly
CN108055789A (en) * 2018-01-03 2018-05-18 苏州维信电子有限公司 Prevent the production technology of MIC dysfunctions

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101509019B1 (en) 2014-04-18 2015-04-14 (주)글로벌텍 hot-bar soldering apparatus

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CA2187495A1 (en) * 1995-10-31 1997-05-01 Dan Charles Plitt Electronic component assembly and method fhereof
DE69626747T2 (en) * 1995-11-16 2003-09-04 Matsushita Electric Ind Co Ltd Printed circuit board and its arrangement
JP3283226B2 (en) * 1997-12-26 2002-05-20 ポリマテック株式会社 How to make a holder
JP2002345092A (en) 2001-05-15 2002-11-29 Citizen Electronics Co Ltd Manufacturing method for condenser microphone
KR100406258B1 (en) 2002-01-25 2003-11-14 주식회사 삼부커뮤닉스 soldering method of condenser microphone using SMD formula
JP4366342B2 (en) * 2005-07-08 2009-11-18 ホシデン株式会社 Mounting board and microphone mounted thereon
KR100720839B1 (en) 2005-09-26 2007-05-22 주식회사 비에스이 Flexible Printed Circuit Board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101626532B (en) * 2008-07-11 2013-01-16 宝星电子株式会社 A variable directional microphone assembly and method of making the microphone assembly
CN108055789A (en) * 2018-01-03 2018-05-18 苏州维信电子有限公司 Prevent the production technology of MIC dysfunctions

Also Published As

Publication number Publication date
CN101166402B (en) 2010-06-02
TWI360378B (en) 2012-03-11
TW200820859A (en) 2008-05-01
KR100776189B1 (en) 2007-11-16

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