CA2187495A1 - Electronic component assembly and method fhereof - Google Patents
Electronic component assembly and method fhereofInfo
- Publication number
- CA2187495A1 CA2187495A1 CA002187495A CA2187495A CA2187495A1 CA 2187495 A1 CA2187495 A1 CA 2187495A1 CA 002187495 A CA002187495 A CA 002187495A CA 2187495 A CA2187495 A CA 2187495A CA 2187495 A1 CA2187495 A1 CA 2187495A1
- Authority
- CA
- Canada
- Prior art keywords
- microphone
- substrate
- posts
- connector
- throughhole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Telephone Set Structure (AREA)
Abstract
An electronic component assembly (104) includes a microphone (202) and a connector (204). The microphone (202) includes a transducer (212) and substantially rigid posts (214, 216) coupled to the transducer (212) that project outwardly therefrom. The connector (204) mounts to a circuit board (108) and includes two receptacles (222, 224) extending therethrough. The receptacles (222, 224) are sized to receive the posts (214, 216) of the microphone (202) and electrically couple the posts (214, 216) to the circuit board (108).
Description
ELECTRONIC COMPONENT ASSEMBLY AND METHOD THEREOF
Field of the Invention This invention relates generally to electronic components and more specifically to a surface mountable electronic component 15 assembly.
Background of the Invention Electronic components, such as microphones, are used in a 20 variety of electronic communication devices, such as radiotelephones.
Microphones convert audible speech into electrical speech signals. The electrical speech signals are input to electrical circuitry that processes the signals.
Typically, microphones are employed in devices having circuit 25 components mounted on a printed circuit board. These circuit components are ~refeLably electrically connected to the circuit board by automated reflow heating. However, microphones can not be connected to the circuit board in this manner. Microphones are heat sensitive and easily damaged. Once damaged, they can not be readily 30 repaired. Accordingly, microphones are electrically coupled to circuit boards via wires, a flex strip, or two pin connector and wires that are structurally connected to the circuit board via hand soldering. In order to reduce the chance that the microphone will be damaged during hand soldering, a head sinkjig at a minimal temperature is employed 21 ~7495 for the shortest time nec~s~ry to produce a good solder joint.
However, microphones attached using wires or flex strips are susceptible to transmitter induced noise, or "buzz." Flex strips are also costly and difficult to manipulate.
Therefore, what is needed is a microphone assembly that facilitates automated mounting and allows for easy repair and avoids the use of wires.
Brief Description of the Drawings FIG. 1 illustrates a radio communication system including a portable electronic device employing a microphone assembly attached to a substrate;
FIG. 2 illustrates an enlarged cross-sectional view of the microphone assembly and the substrate taken along section lines 2-2 in FIG. 1;
FIG. 3 illustrates an enlarged fragmentary top plan view of the substrate in partial schematic form showing a capacitor and the transceiver circuit; and FIG. 4 illustrates an exploded perspective view of the microphone assembly, the capacitor, and the substrate.
Detailed Description of the Ple~lled Embodiments An electronic component assembly includes an electronic component and a connector. One such electronic component is a microphone. The microphone includes a body and two substantially rigid posts coupled to the body and projecting outwardly therefrom.
The body comprises a transducer. The connector is adapted to be mounted on a substrate by, for example, reflow heating. The connector includes two receptacles for receiving the two substantially rigid posts of the microphone. The two receptacles are electrically coupled to the substrate. The microphone a~s~mbly promotes manufacturability via automated assembly and improves microphone performance by 5 eliminating wires that are susceptible to noise.
FIG. 1 illustrates radio communication ~y~lelll 100 including electronic device 102. Electronic device 102, which is shown as a portable radiotelephone, includes housing 106 and substrate 108 disposed within housing 106. Antenna 110 is carried on housing 106 10 (viewable via a cutaway portion of housing 106). Antenna 110 is electrically connected to transceiver circuit 306 (FIG. 3) disposed on substrate 108 within housing 106 (FIG. 1). Electronic device 102 is powered by detachable battery 111 attached to a rear side of housing 106.
Housing 106 includes speaker bezel and openings 112 having a speaker 15 (not shown) positioned therebehind, display 114, keypad 116, and microphone opening 118. Microphone assembly 104 is positioned behind microphone opening 118 as viewable through another cutaway portion of housing 106.
Electronic device 102 operates in radio communication system 100 by communicating with base station 120 via radio frequency (RF) signals 122. Audible signals detected by microphone assembly 104 are converted into electrical speech signals. The electrical speech signals are coupled to the transceiver circuit 306 (FIG. 3). The transceiver circuit 306 converts the electrical speech signals into electrical RF
signals. The electrical RF signals are converted by antenna 110 (FIG. 1) and transmitted to base station 120 as RF signals 122.
Although electronic device 102 is illustrated as a cellular radiotelephone, it will be recognized that portable computers, cordless telephones, two-way radios, personal digital assistants, and the like, can also benefit from the use of the microphone assembly, and "device" as used herein shall refer to any such equipment and their equivalents.
Turning to FIG. 2, microphone assembly 104 includes microphone 202 and connector 204. Microphone 202 includes housing 206. Microphone 202 is preferably a small microphone of the electret type. For example, housing 206 has: a diameter in the range of 2 to 10 mm, and preferably has a diameter of 6 mm is diameter; and a height of 1 to 4 mm, and ~refe~dbly has a height of approximately 2.5 mm.
Housing 206 is comprised of aluminum, or other suitable metal.
Field of the Invention This invention relates generally to electronic components and more specifically to a surface mountable electronic component 15 assembly.
Background of the Invention Electronic components, such as microphones, are used in a 20 variety of electronic communication devices, such as radiotelephones.
Microphones convert audible speech into electrical speech signals. The electrical speech signals are input to electrical circuitry that processes the signals.
Typically, microphones are employed in devices having circuit 25 components mounted on a printed circuit board. These circuit components are ~refeLably electrically connected to the circuit board by automated reflow heating. However, microphones can not be connected to the circuit board in this manner. Microphones are heat sensitive and easily damaged. Once damaged, they can not be readily 30 repaired. Accordingly, microphones are electrically coupled to circuit boards via wires, a flex strip, or two pin connector and wires that are structurally connected to the circuit board via hand soldering. In order to reduce the chance that the microphone will be damaged during hand soldering, a head sinkjig at a minimal temperature is employed 21 ~7495 for the shortest time nec~s~ry to produce a good solder joint.
However, microphones attached using wires or flex strips are susceptible to transmitter induced noise, or "buzz." Flex strips are also costly and difficult to manipulate.
Therefore, what is needed is a microphone assembly that facilitates automated mounting and allows for easy repair and avoids the use of wires.
Brief Description of the Drawings FIG. 1 illustrates a radio communication system including a portable electronic device employing a microphone assembly attached to a substrate;
FIG. 2 illustrates an enlarged cross-sectional view of the microphone assembly and the substrate taken along section lines 2-2 in FIG. 1;
FIG. 3 illustrates an enlarged fragmentary top plan view of the substrate in partial schematic form showing a capacitor and the transceiver circuit; and FIG. 4 illustrates an exploded perspective view of the microphone assembly, the capacitor, and the substrate.
Detailed Description of the Ple~lled Embodiments An electronic component assembly includes an electronic component and a connector. One such electronic component is a microphone. The microphone includes a body and two substantially rigid posts coupled to the body and projecting outwardly therefrom.
The body comprises a transducer. The connector is adapted to be mounted on a substrate by, for example, reflow heating. The connector includes two receptacles for receiving the two substantially rigid posts of the microphone. The two receptacles are electrically coupled to the substrate. The microphone a~s~mbly promotes manufacturability via automated assembly and improves microphone performance by 5 eliminating wires that are susceptible to noise.
FIG. 1 illustrates radio communication ~y~lelll 100 including electronic device 102. Electronic device 102, which is shown as a portable radiotelephone, includes housing 106 and substrate 108 disposed within housing 106. Antenna 110 is carried on housing 106 10 (viewable via a cutaway portion of housing 106). Antenna 110 is electrically connected to transceiver circuit 306 (FIG. 3) disposed on substrate 108 within housing 106 (FIG. 1). Electronic device 102 is powered by detachable battery 111 attached to a rear side of housing 106.
Housing 106 includes speaker bezel and openings 112 having a speaker 15 (not shown) positioned therebehind, display 114, keypad 116, and microphone opening 118. Microphone assembly 104 is positioned behind microphone opening 118 as viewable through another cutaway portion of housing 106.
Electronic device 102 operates in radio communication system 100 by communicating with base station 120 via radio frequency (RF) signals 122. Audible signals detected by microphone assembly 104 are converted into electrical speech signals. The electrical speech signals are coupled to the transceiver circuit 306 (FIG. 3). The transceiver circuit 306 converts the electrical speech signals into electrical RF
signals. The electrical RF signals are converted by antenna 110 (FIG. 1) and transmitted to base station 120 as RF signals 122.
Although electronic device 102 is illustrated as a cellular radiotelephone, it will be recognized that portable computers, cordless telephones, two-way radios, personal digital assistants, and the like, can also benefit from the use of the microphone assembly, and "device" as used herein shall refer to any such equipment and their equivalents.
Turning to FIG. 2, microphone assembly 104 includes microphone 202 and connector 204. Microphone 202 includes housing 206. Microphone 202 is preferably a small microphone of the electret type. For example, housing 206 has: a diameter in the range of 2 to 10 mm, and preferably has a diameter of 6 mm is diameter; and a height of 1 to 4 mm, and ~refe~dbly has a height of approximately 2.5 mm.
Housing 206 is comprised of aluminum, or other suitable metal.
5 Housing 206 includes sound hole 208. Cloth 210 covers top surface of housing 206 to prevent debris from entering sound hole 208.
Microphone 202 includes transducer 212 disposed within housing 206. Transducer 212 converts sound waves entering housing 206 via sound hole 208 into electrical signals. Transducer 212 may be 10 implemented using any suitable commercially available transducer, such as that embodied in an electret condenser microphone (ECM). For example, transducer 212 consists primarily of a diaphragm (not shown) and a FET (not shown). The diaphragm has a permanent charge and is capacitively coupled between the source and the gate of the FET. The drain and gate of the FET comprise posts 214, 216 that extend outward from microphone 202 through openings in the bottom surface of housing 206. Such microphones are well known and will not be described in greater detail hereinafter.
Posts 214, 216 are substantially rigid members that project out of housing 206 to electrically connect transducer 212 to other circuitry.
Posts 214, 216 are cylindrical and may be manufactured of aluminum, tin, or other suitable metal. Posts 214, 216 extend 2 to 5 mm from the bottom of housing 206, and preferably extend approximately 3.5 mm.
The spacing between posts 214, 216 is 1 to 3 mm, and ~referdbly approximately 2 mm. Posts 214, 216 have a diameter in the range of 0.2 to 1 mm, and ~le~elably have a diameter of approximately 0.5 mm.
Connector 204 mates with posts 214, 216 of microphone 202.
Connector 204 includes body 217 and protrusions 218, 220 extending upward thereLolll. Protrusions 218, 220 are formed about respective receptacles 222, 224 that extend entirely through connector 204.
Receptacles 222, 224 are sized and shaped to receive posts 214, 216, respectively. Receptacles 222, 224 are cylindrical and lined with respective sleeves 226, 228. Sleeves 226, 228 ensure that posts 214, 216, respectively, fit snugly in receptacles 222, 224. Because posts 214, 216 are 2 1 ~ 7 ~ 9 5 CE001197R
cylindrical as opposed to rectangular and flat, the complexity of connector 204 is minimized. Rectangular flat leads require mating contacts that are in alignment with the flat faces of the leads. Such alignment can increase the tooling complexity and cost of connector 5 204. Sleeves 226, 228 include integrally formed pads 230, 232, respectively. Pads 230, 232 extend through the base of protrusions 218, 220, respectively, and reside on the top surface of body 217 of connector 204. Connector 204 is comprised of a suitable dielectric material, such as plastic, ceramic, or other suitable material capable of withstanding 10 reflow heating. Sleeves 226, 228 and pads 230, 232 are comprised of the same material as posts 214, 216 (i.e., tin or other suitable metal) to prevent corrosion.
Substrate 108 includes first side 234 and second side 236.
Throughhole 238 extends between first side 234 and second side 236.
15 Throughhole 238 is sized to permit passage of posts 214, 216 of microphone 202 therethrough. Second side 236 includes pads 240, 242 disposed to the left and right of throughhole 238, respectively. Pads 240, 242 are inlaid so as to be substantially flush with second side 236.
Traces 244, 246 are electrically connected to pads 240, 242 and extend 20 within substrate 108. Substrate 108 is a printed circuit board comprised of polyimide, epoxy-based flame retardant industrial fiberglass (G10-FR4), or other suitable material.
FIG. 3 further illustrates substrate 108. Because pads 240, 242 disposed on second side 236 of substrate 108 and traces 244, 246 are 25 disposed within substrate 108, they are shown in dotted line. Traces 244, 246 travel from pads 240, 242 to pads 302, 304 disposed on first side 234 of substrate 108. Pads 302, 304 are positioned in close proximity to microphone 202. From pad 302, trace 244 travels to transceiver circuit 306 disposed on substrate 108. From pad 304, trace 246 travels to 30 electrical ground 308 of substrate 108.
Capacitor 310 is attached between pads 302, 304. Capacitor 310 is connected to ground to filter RF noise signals produced by antenna 110 (FIG. 1) and the transceiver circuit 306 (FIG. 3) and prevent these signals, which may be detected by microphone 202, from being - 21 8~495 communicated back to transceiver circuit 306 (FIG. 3). Such feedback adds noise that degrades performance of microphone 202. Capacitor 310 is implemented using a suitable device, such as a chip capacitor.
Attachment of microphone 202 and capacitor 310 to substrate 108 is described in conjunction with FIG. 4. Microphone 202 and capacitor 310 are ~r~:fe,dbly assembled via an automated process. Initially, second side 236 of substrate 108 is subjected to a screening process that deposits solder paste on pads 240, 242. The solder paste consists of tin-lead-silver alloy, or other suitable electrically conductive solder. Next, connector 204 is placed on second side 236 so that protrusions 218, 220 insert into throughhole 238 as represented by lines 402. Automated placement of connector 204 is performed using any suitable, commercially available small part placement machine. Once placed, pads 230, 232 (FIG. 2) of connector 204 align with pads 240, 242 (FIG. 4) of substrate 108, respectively, and contact solder paste.
After placement, second side 236 of substrate 108 is reflow heated to a temperature that is sufficient to melt the solder paste and then cooled to room temperature. Reflow heating takes approximately 660 seconds. During this time period, the temperature of second side 236 of substrate 108 and connector 204 is increased to approximately 218 ~C.
The melted solder forms a metallurgical interconnection between pads 240, 242 of substrate 108 and pads 230, 232 of connector 204, respectively.
Once cooled, pads 230, 232 of connector 204 are physically and electrically connected to pads 240, 242 of substrate 108, respectively.
Once connector 204 is attached, substrate 108 is flipped over and the aforementioned process is repeated to attach capacitor 310 across pads 302, 304 (FIG. 3) of first side 234 of substrate 108. Solder paste is screened on pads 302, 304 on first side 234. Capacitor 310 is placed on first side 234 as represented by line 404 (FIG. 4) such that it lays across pads 302, 304 (FIG. 3). Placement of capacitor 310 is performed by the same small part placement machine used to place connector 204. First side 234 of substrate 108 is then reflow heated and cooled, thereby electrically connected capacitor 310 across pads 302, 304.
Microphone 202 includes transducer 212 disposed within housing 206. Transducer 212 converts sound waves entering housing 206 via sound hole 208 into electrical signals. Transducer 212 may be 10 implemented using any suitable commercially available transducer, such as that embodied in an electret condenser microphone (ECM). For example, transducer 212 consists primarily of a diaphragm (not shown) and a FET (not shown). The diaphragm has a permanent charge and is capacitively coupled between the source and the gate of the FET. The drain and gate of the FET comprise posts 214, 216 that extend outward from microphone 202 through openings in the bottom surface of housing 206. Such microphones are well known and will not be described in greater detail hereinafter.
Posts 214, 216 are substantially rigid members that project out of housing 206 to electrically connect transducer 212 to other circuitry.
Posts 214, 216 are cylindrical and may be manufactured of aluminum, tin, or other suitable metal. Posts 214, 216 extend 2 to 5 mm from the bottom of housing 206, and preferably extend approximately 3.5 mm.
The spacing between posts 214, 216 is 1 to 3 mm, and ~referdbly approximately 2 mm. Posts 214, 216 have a diameter in the range of 0.2 to 1 mm, and ~le~elably have a diameter of approximately 0.5 mm.
Connector 204 mates with posts 214, 216 of microphone 202.
Connector 204 includes body 217 and protrusions 218, 220 extending upward thereLolll. Protrusions 218, 220 are formed about respective receptacles 222, 224 that extend entirely through connector 204.
Receptacles 222, 224 are sized and shaped to receive posts 214, 216, respectively. Receptacles 222, 224 are cylindrical and lined with respective sleeves 226, 228. Sleeves 226, 228 ensure that posts 214, 216, respectively, fit snugly in receptacles 222, 224. Because posts 214, 216 are 2 1 ~ 7 ~ 9 5 CE001197R
cylindrical as opposed to rectangular and flat, the complexity of connector 204 is minimized. Rectangular flat leads require mating contacts that are in alignment with the flat faces of the leads. Such alignment can increase the tooling complexity and cost of connector 5 204. Sleeves 226, 228 include integrally formed pads 230, 232, respectively. Pads 230, 232 extend through the base of protrusions 218, 220, respectively, and reside on the top surface of body 217 of connector 204. Connector 204 is comprised of a suitable dielectric material, such as plastic, ceramic, or other suitable material capable of withstanding 10 reflow heating. Sleeves 226, 228 and pads 230, 232 are comprised of the same material as posts 214, 216 (i.e., tin or other suitable metal) to prevent corrosion.
Substrate 108 includes first side 234 and second side 236.
Throughhole 238 extends between first side 234 and second side 236.
15 Throughhole 238 is sized to permit passage of posts 214, 216 of microphone 202 therethrough. Second side 236 includes pads 240, 242 disposed to the left and right of throughhole 238, respectively. Pads 240, 242 are inlaid so as to be substantially flush with second side 236.
Traces 244, 246 are electrically connected to pads 240, 242 and extend 20 within substrate 108. Substrate 108 is a printed circuit board comprised of polyimide, epoxy-based flame retardant industrial fiberglass (G10-FR4), or other suitable material.
FIG. 3 further illustrates substrate 108. Because pads 240, 242 disposed on second side 236 of substrate 108 and traces 244, 246 are 25 disposed within substrate 108, they are shown in dotted line. Traces 244, 246 travel from pads 240, 242 to pads 302, 304 disposed on first side 234 of substrate 108. Pads 302, 304 are positioned in close proximity to microphone 202. From pad 302, trace 244 travels to transceiver circuit 306 disposed on substrate 108. From pad 304, trace 246 travels to 30 electrical ground 308 of substrate 108.
Capacitor 310 is attached between pads 302, 304. Capacitor 310 is connected to ground to filter RF noise signals produced by antenna 110 (FIG. 1) and the transceiver circuit 306 (FIG. 3) and prevent these signals, which may be detected by microphone 202, from being - 21 8~495 communicated back to transceiver circuit 306 (FIG. 3). Such feedback adds noise that degrades performance of microphone 202. Capacitor 310 is implemented using a suitable device, such as a chip capacitor.
Attachment of microphone 202 and capacitor 310 to substrate 108 is described in conjunction with FIG. 4. Microphone 202 and capacitor 310 are ~r~:fe,dbly assembled via an automated process. Initially, second side 236 of substrate 108 is subjected to a screening process that deposits solder paste on pads 240, 242. The solder paste consists of tin-lead-silver alloy, or other suitable electrically conductive solder. Next, connector 204 is placed on second side 236 so that protrusions 218, 220 insert into throughhole 238 as represented by lines 402. Automated placement of connector 204 is performed using any suitable, commercially available small part placement machine. Once placed, pads 230, 232 (FIG. 2) of connector 204 align with pads 240, 242 (FIG. 4) of substrate 108, respectively, and contact solder paste.
After placement, second side 236 of substrate 108 is reflow heated to a temperature that is sufficient to melt the solder paste and then cooled to room temperature. Reflow heating takes approximately 660 seconds. During this time period, the temperature of second side 236 of substrate 108 and connector 204 is increased to approximately 218 ~C.
The melted solder forms a metallurgical interconnection between pads 240, 242 of substrate 108 and pads 230, 232 of connector 204, respectively.
Once cooled, pads 230, 232 of connector 204 are physically and electrically connected to pads 240, 242 of substrate 108, respectively.
Once connector 204 is attached, substrate 108 is flipped over and the aforementioned process is repeated to attach capacitor 310 across pads 302, 304 (FIG. 3) of first side 234 of substrate 108. Solder paste is screened on pads 302, 304 on first side 234. Capacitor 310 is placed on first side 234 as represented by line 404 (FIG. 4) such that it lays across pads 302, 304 (FIG. 3). Placement of capacitor 310 is performed by the same small part placement machine used to place connector 204. First side 234 of substrate 108 is then reflow heated and cooled, thereby electrically connected capacitor 310 across pads 302, 304.
After connector 204 is attached to substrate 108, microphone 202 is attached to connector 204. Microphone 202 is positioned above first side 234 of substrate 108 such that posts 214, 216 extend into throughhole 238 and are aligned with receptacles 222, 224, respectively.
5 Posts 214, 216 of microphone 202 are inserted then pressed into receptacles 222, 224, respectively, as represented by lines 402. To ease insertion, the tips of posts 214, 216 are chamfered. Microphone 202 is lowered until it is fully inserted, such that the bottom surface of housing 206 rests against first side 234 and tips of posts 214, 216 emerge 10 from the bottom end of receptacles 222, 224, respectively (FIG. 2).
Automated placement of microphone 202 can be accomplished by using a commercially available robotic arm.
Once attachedj microphone 202 is held in assemblage by connector 204 as shown in FIG. 2. Transducer 212 of microphone 202 is 15 electrically connected to transceiver circuit 306 (FIG. 3) and electrical ground 308 via the following connection: posts 214, 216 (FIG. 2) to sleeves 226, 228 to pads 240, 242 of connector 204 to pads 240, 242 of substrate 108 to traces 244, 246 of substrate 108. Transducer 212 operates via DC voltage supplied to post 214 (the drain of the FET (not shown)) 20 from transceiver circuit 306 (FIG. 3). Sound waves entering sound hole 208 (FIG. 2) of microphone 202 displace the diaphragm (not shown) of transducer 212 inducing voltage variations at the source of the FET. In response, the FET generates output signals on post 214 (the drain of the FET) having a voltage proportional to the sound pressure placed on the 25 diaphragm. The output signals are thus modulated on the DC voltage and coupled to transceiver circuit 306 (FIG. 3) via trace 244.
Capacitor 310, electrically coupled between posts 214, 216, in close electrical proximity to microphone 202, bypasses RF noise present at post 214 to electrical ground 308. For example, the GSM (Group Special 30 Mobile) digital radiotelephone system operates at a frame rate of 217 Hz. RF noise, commonly called buzz, can be induced on microphone 202 by antenna 110 (FIG. 1) and transceiver circuit 306 (FIG. 3) at harmonics of 217 Hz. To minimize buzz from affecting the operation of microphone 202 in a GSM system, capacitor 310 is coupled across - 21 87~95 posts 214, 216 in close electrical proximity to microphone 202. In previous microphone assemblies having wires or flex strips, the bypass capacitor could not be closely positioned, and had to be either integrated into the microphone, at a high cost, or hand soldered 5 directly to the underside of the microphone, at a high manufacturing cost.
It can thus be seen that microphone assembly 104, and the automated fabrication facilitated thereby, is advantageous over previous microphone assemblies that utilize hand soldered wires or 10 flex strips. Microphone assembly 104 eliminates the time consuming, unreliable, and potentially damaging hand soldering previously required to attach wires and flex strips to microphones. Microphone buzz attributed to lengthy wires and flex strips is significantly reduced.
Reduced buzz allows for an overall electrical part reduction to 15 electronic device 102 (FIG. 1). For example, shielding apparatuses previously employed to eliminate microphone buzz are no longer needed. Also, microphone assembly 104 permits easy removal of microphone 202 (FIG. 2) for repair or replacement. To detach microphone 202 from connector 204, microphone 202 need only be 20 lifted away from substrate 108 until posts 214, 216 clear receptacles 222, 224 and throughhole 238.
Although a microphone assembly is illustrated herein, it will be recognized that connector 204 and throughhole 238 could be adapted to engage electronic components with greater or fewer posts. It will be 25 recognized that the "through-substrate" attachment disclosed could be used to automate attachment of other heat sensitive electronic components including, but not limited to, displays, speakers, and light emitting diodes (LEDs).
It will also be recognized that microphone 202 and connector 204 30 could be assembled in alternative orientations. In particular, microphone 202 and connector 204 can be mounted on the same side of substrate 108, realizing a microphone--connector~substrate orientation.
That is, posts 214, 216 of microphone 202 can be inserted into receptacles 222, 224 via the end of connector 204 opposite protrusions - 21 8749~
g 218, 220. Also, microphone assembly 104 could be employed without throughhole 238 of substrate 108. Connector 204 could be mounted on substrate 108 and posts 214, 216 could be directly inserted therein.
Thus it can be seen that a microphone assembly is disclosed 5 employing a microphone and a surface mountable connector that facilitates automated assembly. The microphone assembly includes a microphone and a connector that both anchors the microphone to a substrate and electrically couples the microphone to circuitry supported on the substrate.
What is claimed is:
5 Posts 214, 216 of microphone 202 are inserted then pressed into receptacles 222, 224, respectively, as represented by lines 402. To ease insertion, the tips of posts 214, 216 are chamfered. Microphone 202 is lowered until it is fully inserted, such that the bottom surface of housing 206 rests against first side 234 and tips of posts 214, 216 emerge 10 from the bottom end of receptacles 222, 224, respectively (FIG. 2).
Automated placement of microphone 202 can be accomplished by using a commercially available robotic arm.
Once attachedj microphone 202 is held in assemblage by connector 204 as shown in FIG. 2. Transducer 212 of microphone 202 is 15 electrically connected to transceiver circuit 306 (FIG. 3) and electrical ground 308 via the following connection: posts 214, 216 (FIG. 2) to sleeves 226, 228 to pads 240, 242 of connector 204 to pads 240, 242 of substrate 108 to traces 244, 246 of substrate 108. Transducer 212 operates via DC voltage supplied to post 214 (the drain of the FET (not shown)) 20 from transceiver circuit 306 (FIG. 3). Sound waves entering sound hole 208 (FIG. 2) of microphone 202 displace the diaphragm (not shown) of transducer 212 inducing voltage variations at the source of the FET. In response, the FET generates output signals on post 214 (the drain of the FET) having a voltage proportional to the sound pressure placed on the 25 diaphragm. The output signals are thus modulated on the DC voltage and coupled to transceiver circuit 306 (FIG. 3) via trace 244.
Capacitor 310, electrically coupled between posts 214, 216, in close electrical proximity to microphone 202, bypasses RF noise present at post 214 to electrical ground 308. For example, the GSM (Group Special 30 Mobile) digital radiotelephone system operates at a frame rate of 217 Hz. RF noise, commonly called buzz, can be induced on microphone 202 by antenna 110 (FIG. 1) and transceiver circuit 306 (FIG. 3) at harmonics of 217 Hz. To minimize buzz from affecting the operation of microphone 202 in a GSM system, capacitor 310 is coupled across - 21 87~95 posts 214, 216 in close electrical proximity to microphone 202. In previous microphone assemblies having wires or flex strips, the bypass capacitor could not be closely positioned, and had to be either integrated into the microphone, at a high cost, or hand soldered 5 directly to the underside of the microphone, at a high manufacturing cost.
It can thus be seen that microphone assembly 104, and the automated fabrication facilitated thereby, is advantageous over previous microphone assemblies that utilize hand soldered wires or 10 flex strips. Microphone assembly 104 eliminates the time consuming, unreliable, and potentially damaging hand soldering previously required to attach wires and flex strips to microphones. Microphone buzz attributed to lengthy wires and flex strips is significantly reduced.
Reduced buzz allows for an overall electrical part reduction to 15 electronic device 102 (FIG. 1). For example, shielding apparatuses previously employed to eliminate microphone buzz are no longer needed. Also, microphone assembly 104 permits easy removal of microphone 202 (FIG. 2) for repair or replacement. To detach microphone 202 from connector 204, microphone 202 need only be 20 lifted away from substrate 108 until posts 214, 216 clear receptacles 222, 224 and throughhole 238.
Although a microphone assembly is illustrated herein, it will be recognized that connector 204 and throughhole 238 could be adapted to engage electronic components with greater or fewer posts. It will be 25 recognized that the "through-substrate" attachment disclosed could be used to automate attachment of other heat sensitive electronic components including, but not limited to, displays, speakers, and light emitting diodes (LEDs).
It will also be recognized that microphone 202 and connector 204 30 could be assembled in alternative orientations. In particular, microphone 202 and connector 204 can be mounted on the same side of substrate 108, realizing a microphone--connector~substrate orientation.
That is, posts 214, 216 of microphone 202 can be inserted into receptacles 222, 224 via the end of connector 204 opposite protrusions - 21 8749~
g 218, 220. Also, microphone assembly 104 could be employed without throughhole 238 of substrate 108. Connector 204 could be mounted on substrate 108 and posts 214, 216 could be directly inserted therein.
Thus it can be seen that a microphone assembly is disclosed 5 employing a microphone and a surface mountable connector that facilitates automated assembly. The microphone assembly includes a microphone and a connector that both anchors the microphone to a substrate and electrically couples the microphone to circuitry supported on the substrate.
What is claimed is:
Claims (10)
1. A microphone assembly comprising:
a microphone including a transducer and at least two substantially rigid posts coupled to the transducer and projecting outwardly therefrom; and a connector adapted to be mounted to a circuit board, the connector including at least two receptacles extending therethrough to receive the at least two substantially rigid posts of the microphone, the at least two receptacles electrically coupled to the circuit board.
a microphone including a transducer and at least two substantially rigid posts coupled to the transducer and projecting outwardly therefrom; and a connector adapted to be mounted to a circuit board, the connector including at least two receptacles extending therethrough to receive the at least two substantially rigid posts of the microphone, the at least two receptacles electrically coupled to the circuit board.
2. A microphone assembly according to claim 1 wherein the at least two substantially rigid posts of the microphone are cylindrical.
3. An electronic device comprising:
a substrate having a first side, a second side, and a throughhole extending therebetween;
an electronic component having a body and a substantially rigid post projecting therefrom, the body positioned on the first side of the substrate such that the substantially rigid post extends into the throughhole; and a connector adapted to be mounted to the second side of the substrate in alignment with the throughhole, the connector including a receptacle for receiving the substantially rigid post of the electronic component, the receptacle electrically coupled to the substrate.
a substrate having a first side, a second side, and a throughhole extending therebetween;
an electronic component having a body and a substantially rigid post projecting therefrom, the body positioned on the first side of the substrate such that the substantially rigid post extends into the throughhole; and a connector adapted to be mounted to the second side of the substrate in alignment with the throughhole, the connector including a receptacle for receiving the substantially rigid post of the electronic component, the receptacle electrically coupled to the substrate.
4. An electronic device comprising:
a substrate having at least two pads and electrical circuitry mounted thereon, the electrical circuitry electrically coupled to the at least two pads;
a connector mounted on the substrate, the connector including at least two receptacles, the at least two receptacles electrically coupled to the at least two pads of the substrate; and a microphone including a transducer and at least two posts electrically coupled to the transducer and extending outwardly therefrom, the at least two posts received in the at least two receptacles and electrically connecting the microphone to the electrical circuitry.
a substrate having at least two pads and electrical circuitry mounted thereon, the electrical circuitry electrically coupled to the at least two pads;
a connector mounted on the substrate, the connector including at least two receptacles, the at least two receptacles electrically coupled to the at least two pads of the substrate; and a microphone including a transducer and at least two posts electrically coupled to the transducer and extending outwardly therefrom, the at least two posts received in the at least two receptacles and electrically connecting the microphone to the electrical circuitry.
5. An electronic device according to claim 4 wherein the at least two posts are substantially rigid.
6. An electronic device according to claim 4 wherein the at least two posts are cylindrical.
7. An electronic device according to claim 4 wherein the substrate includes at least one throughhole aligned with the at least two receptacles of the connector, the at least one throughhole sized to allow the at least two posts of the microphone to extend therethrough.
8. An electronic device according to claim 7 wherein the at least two receptacles extend at least partially into the at least one throughhole.
9. An electronic device according to claim 4 wherein:
the substrate includes a throughhole extending between a first side and a second side thereof, the microphone is positioned on the first side over the throughhole with the at least two posts extending into the throughhole, and the connector is positioned on the second side over the throughhole.
the substrate includes a throughhole extending between a first side and a second side thereof, the microphone is positioned on the first side over the throughhole with the at least two posts extending into the throughhole, and the connector is positioned on the second side over the throughhole.
10. An electronic device according to claim 4 wherein the electrical circuitry includes a capacitor positioned closely proximate to the microphone.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55130095A | 1995-10-31 | 1995-10-31 | |
| US08/551,300 | 1995-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2187495A1 true CA2187495A1 (en) | 1997-05-01 |
Family
ID=24200702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002187495A Abandoned CA2187495A1 (en) | 1995-10-31 | 1996-10-09 | Electronic component assembly and method fhereof |
Country Status (3)
| Country | Link |
|---|---|
| CA (1) | CA2187495A1 (en) |
| GB (1) | GB2306806A (en) |
| MX (1) | MX9605231A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100776189B1 (en) * | 2006-10-16 | 2007-11-16 | 주식회사 비에스이 | Mounting method for mounting microphone on flexible printed circuit board |
| GB201120741D0 (en) * | 2011-12-02 | 2012-01-11 | Soundchip Sa | Transducer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5595998A (en) * | 1979-01-15 | 1980-07-21 | Molex Inc | Connector assembly for converter |
| FR2511570A1 (en) * | 1981-08-11 | 1983-02-18 | Thomson Csf | ELECTROACOUSTIC TRANSDUCER WITH PIEZOELECTRIC POLYMER |
| JP2759764B2 (en) * | 1994-11-30 | 1998-05-28 | 株式会社ユニトロン | Charger for wireless microphone |
-
1996
- 1996-10-09 CA CA002187495A patent/CA2187495A1/en not_active Abandoned
- 1996-10-23 GB GB9622099A patent/GB2306806A/en not_active Withdrawn
- 1996-10-30 MX MX9605231A patent/MX9605231A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB2306806A (en) | 1997-05-07 |
| MX9605231A (en) | 1997-04-30 |
| GB9622099D0 (en) | 1996-12-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |
Effective date: 20001010 |