KR101509019B1 - hot-bar soldering apparatus - Google Patents

Abstract

The present invention relates to a hot-bar soldering apparatus and, more particularly, to a hot-bar soldering apparatus for automatically soldering an FPC in a PCB. The hot-bar soldering device of the present invention includes: a first PCB transporter adsorbing and transferring a printed circuit board (PCB) with a mark supplied by a tray; a PCB alignment table on which the PCB supplied by the first PCB transporter is mounted and which has a mark; a PCB alignment camera taking the images of the PCB mounted on the PCB alignment table and the PCB alignment table; a control unit for calculating difference between the mark formed on the PCB alignment table and the mark formed on the PCB from the image photographed by the PCB alignment camera and calculating a movement rate to correct the calculated difference; a flux applying unit for applying flux on the upper part of a solder formed on the aligned PCB; an FPC transporter mounting the FPC to supply the FPC onto the PCB coated with the flux by the flux applying unit; and a soldering unit performing a soldering process while the FPC is mounted on the PCB.

Description

A hot-bar soldering apparatus,

The present invention relates to a hot bar soldering apparatus, and more particularly to a hot bar soldering apparatus for automatically soldering an FPC to a PCB.

A variety of recognition techniques and structures are applied to the touch screen, which is an input device for recognizing a user's touch applied to a specific position on the display screen, such as a resistive film type, a capacitive type, and an ultrasonic type.

Recently, electrostatic capacitive type touch screen, which is getting wider attention due to its advantages such as multi-touch input and excellent durability, has developed a transparent conductive material such as ITO (Indium Tin Oxide) on the back surface of a window And recognizes the position where the user's touch and contact are applied using the formed sensor pattern.

A conventional capacitive touch screen is composed of a transparent sensor substrate attached to the back surface of a cover lens made of acrylic or glass material by a transparent adhesive layer such as OCA (Optically Clear Adhesive).

On one surface of a transparent sensor substrate made of PET (polyethylene terephthalate) or glass, a sensor pattern layer including a transparent conductive material such as ITO and a metal wiring is formed.

Generally, a capacitance type touch screen panel having such a structure is attached to an FPCB on which a sensor IC is mounted by an ACF (Anisotropic Conductive Film) or an ACP (Anisotropic Conductive Paste). As a result, the individual sensor electrodes constituting the sensor pattern layer 31 are electrically connected to the sensor pins of the sensor IC.

However, in the electrostatic capacitive type touch screen panel having the above structure, the process of attaching the transparent sensor substrate to the cover lens with the transparent adhesive layer must be performed during the manufacturing process, and the defective rate in the adhering process, which is the final process, There are certain limitations in terms of reducing the number. To overcome these limitations, a window-integrated touch screen panel has been proposed.

With the proposal of a window-integrated touchscreen panel, despite the improved efficiency of the manufacturing process, still high rejection rates are exhibited by the high temperature and high pressure compression methods that occur in some areas of the cover lens.

The cover lens must be in contact with the FPCB using an Anisotropic Conductive Film (ACF). In this process, it is necessary to generate high temperature and high pressure in a part of the cover lens.

Anisotropic Conductive Film (ACF) is a kind of thermosetting resin, and it is possible to bond FPCB and cover lens by applying constant temperature, pressurization, and time.

In order to generate a constant temperature, pressurization, and time, a hot bar equipped with a heater is usually used, and a hot bar is pressed against the contact surface of the object for attachment, .

Korean Patent Publication No. 2011-0045339 (a method of bonding plastic and glass touch panels with a flexible circuit board) is a method of bonding a surface of a touch screen portable terminal using an FPCB bonding method using a laser bonding machine. And performing bonding and bonding using a high-temperature high-pressure apparatus (autoclave) that performs pressing and heating after completion of the bonding.

Korean Patent Laid-Open No. 2011-0078247 (an anisotropic conductive film using a photocurable system, a bonding apparatus and a bonding method using the same) relates to an anisotropic conductive film, and more particularly to an anisotropic conductive film, Anisotropic conductive film using a light curing system that improves the reliability of the bonding operation and has a high curing speed instead of using limited heat and pressure when connecting an anisotropic conductive film used for mounting a flat panel display (FPD) such as an EL And a bonding method and a bonding method using the same.

Korean Unexamined Patent Publication No. 2011-0076050 (entitled " Anisotropic Conductive Film Bonding Method Using Photocuring System ") discloses a method of bonding an anisotropic conductive film containing a photopolymerization initiator capable of UV curing reaction between a glass panel and an adherend A step of irradiating a light source of a predetermined wavelength to a connection portion between the glass panel and the adherend to melt and adhere the anisotropic conductive film and pressing the connection portion to break the conductive ball of the anisotropic conductive film to have conductivity in the vertical direction A method of bonding an anisotropic conductive film using a photo-curing system is proposed.

Various methods for bonding an FPCB to a PCB using a conventional hot bar have been proposed, but in general, the FPCB is bonded to a PCB by manual operation. Therefore, it is required to automatically bond the FPCB to the PCB.

A problem to be solved by the present invention is to provide a hot bar soldering apparatus for automatically soldering an FPC to a PCB.

Another problem to be solved by the present invention is a hot bar soldering apparatus capable of reducing the time required for automatically soldering the FPC to the PCB.

Another object of the present invention is to provide a hot-bar soldering apparatus capable of preventing dirt from adhering to a hot bar when the FPC is automatically soldered to a PCB.

To this end, the hot bar soldering apparatus of the present invention includes a first PCB feeder for picking up and transporting a PCB on which marks formed by trays are formed, a PCB (PCB) feeder for feeding the PCB, A PCB alignment table on which the marks are formed, a PCB alignment table on which the marks are formed, a PCB alignment camera for photographing the PCB alignment table and the PCB alignment on the PCB alignment table, And a controller for calculating a difference between a mark formed on the PCB alignment table and a mark formed on the PCB and calculating a movement amount for correcting the calculated difference, wherein the flux is applied to the top of the solder formed on the aligned PCB An FPC feeder for placing an FPC for feeding an FPC to the top of the PCB to which the flux is applied by the plus application unit, And a soldering unit for performing a soldering process while the base FPC is mounted on the PCB.

The hot bar soldering apparatus according to the present invention can automatically solder the FPC to the PCB, and in particular, can reduce the time required for soldering. The present invention also provides a protective sheet between the hot bar and the solder to prevent the solder from attaching to the hot bar during the soldering process.

1 is a flowchart illustrating a process of bonding an FPC to a PCB according to an embodiment of the present invention.
2 is a schematic view of a hot bar soldering apparatus for soldering an FPC to a PCB according to an embodiment of the present invention.
3 illustrates the structure of a PCB provided by a PCB supply unit according to an embodiment of the present invention.
4 is a view showing a configuration of a PCB feeding member according to an embodiment of the present invention.
5 shows a flux applicator according to an embodiment of the present invention.
6 illustrates a PCB on which a flux is applied by an application nozzle according to an embodiment of the present invention.
According to Fig. 7, the FPC supply member includes an FPC supply transfer unit.
8 illustrates a soldering portion according to an embodiment of the present invention.
9 is a view showing a configuration of an inspection member and a discharge member according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The foregoing and further aspects of the present invention will become more apparent from the following detailed description of preferred embodiments with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a flowchart illustrating a process of bonding an FPC to a PCB according to an embodiment of the present invention. Hereinafter, a process of bonding an FPC to a PCB according to an embodiment of the present invention will be described in detail with reference to FIG.

In step S100, the PCB is supplied using a tray.

In step S110, the alignment of the supplied PCB is performed using a vision camera (PCB alignment camera).

In step S120, the present invention applies a flux to the PCB.

In step S130, the present invention receives an FPC.

In step S140, the FPC is bonded (soldered) to the PCB using a hot bar.

In step S150, the FPC-soldered PCB is inspected using a vision camera (inspection camera).

In step S160, the PCB in which the defect is found is discharged to the defective box, and the PCB on which the FPC is soldered normally discharges to the normal box.

2 is a schematic view of a hot bar soldering apparatus for soldering an FPC to a PCB according to an embodiment of the present invention. Hereinafter, a soldering apparatus for soldering an FPC to a PCB according to an embodiment of the present invention will be described with reference to FIG.

2, the soldering apparatus includes a PCB supply unit, an FPC supply unit, a PCB alignment camera, a flux application unit, a soldering unit, an inspection unit, and a discharge unit. Of course, other configurations than those described above may be included in the soldering apparatus proposed by the present invention.

The PCB supply unit 200 supplies the PCB using a tray. That is, the PCB is supplied using the tray, and when the PCB to be supplied is supplied, the empty tray is discharged to the outside.

3 illustrates the structure of a PCB provided by a PCB supply unit according to an embodiment of the present invention. Hereinafter, the structure of the PCB provided by the PCB supplying unit according to the embodiment of the present invention will be described with reference to FIG.

Referring to FIG. 3, the PCB includes a pad (solder) coated at regular intervals. In particular, FIG. 3 illustrates solder coated in two rows, but is not limited thereto. That is, the number of rows of solder applied may be greater or less than two. Also, the size of the applied solder may have a size other than the size shown in FIG.

The FPC supply unit 220 supplies an FPC to be soldered to the PCB. The FPC supply unit 220 uses the same tray as the PCB supply unit 200, and discharges the empty tray to the outside when all the FPCs are supplied.

The PCB alignment camera 210 aligns the PCB and the table to align the PCB, which is seated on the table, with the table.

The flux applying unit 230 applies flux to the solder (pad) of the PCB that is seated on the table.

The soldering portion 240 solders the aligned FPC and the PCB. To this end, solder is applied to the PCB so that the FPC can be soldered as described above.

The inspection unit 250 checks whether the FPC is correctly soldered to the PCB. Once the solder is correctly soldered, the PCB is ejected to the normal box. If it is not correctly soldered, the PCB is ejected to the defective box.

4 is a view showing a configuration of a PCB feeding member according to an embodiment of the present invention. Hereinafter, the construction of the PCB feeding member according to an embodiment of the present invention will be described in detail with reference to FIG.

Referring to FIG. 4, the PCB feeding member includes a first PCB feeder, a PCB alignment table, a PCB alignment camera, and a second PCB feeder. Of course, other configurations than the above-described configuration may be included in the PCB supply member proposed in the present invention.

The first PCB feeder 202 sucks the PCB transferred by the tray and places it on the PCB alignment table 204. The first PCB feeder 202 seats two PCBs on the PCB alignment table 204 in one process. That is, in order to improve the operation speed, the two PCBs are seated on the PCB alignment table 204, rather than placing one PCB on the PCB alignment table in one operation.

The PCB transferred by the first PCB feeder 202 is seated on the PCB alignment table 204. The PCB alignment table 204 forms a mark, and the PCB also forms a mark. When the two PCBs are seated, the PCB alignment table 204 moves toward the PCB alignment camera 210 so that the PCB alignment camera 210 can capture images.

The PCB alignment camera 210 photographs the marks formed on the PCB alignment table 204 moved to the lower end and the marks formed on the PCB seated on the PCB alignment table 204.

The PCB alignment camera 210 supplies the photographed image to a control unit (not shown), and the control unit calculates an alignment angle of each PCB mounted on the PCB alignment table 204 from the supplied image. That is, the control unit calculates the difference between the actually seated points on the PCB alignment table 204 based on the point where each PCB is to be seated. In this case, the controller calculates the difference for each PCB that is seated on the PCB alignment table.

The PCB alignment camera 210 may be composed of one camera. In this case, each of the PCBs mounted on the PCB alignment table 204 is photographed through two operations.

After the image is captured by the PCB alignment camera 210, the PCB alignment table 204 moves to the point where the second PCB feeder 206 is located.

The PCB alignment table 204 moves by an angle calculated by the control unit so that the second PCB feeder 206 can pick up the first PCB placed on the PCB alignment table 204 in an aligned state. When the second PCB feeder 206 sucks the first PCB that is seated on the PCB alignment table 204, the PCB alignment table 204 allows the second PCB feeder 206 to move to the PCB alignment table 210 Is moved by the angle calculated by the control unit so that the second PCB that is seated on the second PCB can be sucked in the aligned state.

As such, the PCB alignment table 204 of the present invention performs two alignment processes to provide the PCB mounted on the PCB alignment table to the second PCB feeder 206.

The second PCB feeder 206 includes two PCB-attached headers, and the first PCB attached to the PCB feed table 204 is picked up using the first PCB-attached header, and the second PCB- So that the second PCB seated on the PCB supply table is absorbed. The PCB attach header provides the absorbed PCB to the mount.

5 shows a flux applicator according to an embodiment of the present invention. Hereinafter, a flux application unit according to an embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 5, the flux applying section includes a coating table, a coating nozzle, a flux supply section, and an application inspection section. Of course, other configurations than those described above may be included in the flux application portion of the present invention.

On the application table 510, the PCB transferred by the second PCB feeder is seated. That is, the second PCB feeder transfers the aligned PCB to the application table.

The flux supplier 530 constitutes the PCB and supplies the flux to be applied to the top of the solder.

The application nozzle 520 applies the solder supplied from the flux supply part 530 to the top of the solder constituting the PCB. Since the present invention transfers two PCBs in a single process as described above, there are also two application nozzles.

6 illustrates a PCB on which a flux is applied by an application nozzle according to an embodiment of the present invention. According to Fig. 6, when the application liquid is applied, the application liquid spreads by the backup heat and is applied to the top of the solder.

The application inspection unit 540 checks whether or not the flux is accurately applied to the PCB using the vision camera. If the flux is not accurately applied to the PCB, the reapplication process is performed. If the flux is correctly applied, the process proceeds to the next process.

7 is a view showing a configuration of an FPC supplying member according to an embodiment of the present invention. Hereinafter, the configuration of the FPC supplying member according to the embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 7, the FPC supply member includes an FPC supply transfer unit. Of course, other configurations than those described above may be included in the FPC supply member proposed in the present invention.

The FPC feeder 222 sucks the FPC transferred by the tray and places it on the application table. That is, the FPC feeder 222 seats the FPC transferred by the tray on the PCB to which the flux is applied. Of course, the FPC feeder 222 seats the FPC in a position where it can be soldered by the solder applied to the PCB.

8 illustrates a soldering portion according to an embodiment of the present invention. Hereinafter, a soldering portion according to an embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 8, the soldering portion includes a hot bar control portion, a compression bonding header, a hot bar, a protective sheet feeding portion, a protective sheet collecting portion, and a protective sheet. Of course, other configurations than those described above may be included in the soldering portion according to an embodiment of the present invention.

The hot bar control unit controls the pressure and temperature supplied to the crimp header and the hot bar. That is, the hot bar control does not solder the PCB and FPC at the same pressure and temperature but solder the PCB and FPC at different pressure and temperature.

Hereinafter, a method of controlling the pressure of the compression head and the temperature of the hot bar in the hot bar control unit will be described.

The hot bar control unit 241 controls the compression headers and the hot bars at different pressures (heights) and temperatures, instead of controlling the compression headers and the hot bars at the same pressure and temperature as described above.

Particularly, the hot bar controller divides the hot bar controller into three stages and controls the compression head 242 and the hot bar 243. That is, the solder performs the crystallization process, the melting process, and the recrystallization process by the hot bar control unit.

In the crystallization process, the hot bar control unit varies the height of the hot bar. That is, in the first step of the crystallization process, the hot bar control unit maintains the distance between the hot bar terminal and the solder to be a predetermined separation distance. Hereinafter, the hot bar control unit performs the second step of the crystallization process in which the hot bar end is brought into close contact with the solder. In the first step of the crystallization process, the hot bar control section maintains the normal temperature state. The hot bar control unit then raises the temperature of the hot bar to a temperature at which the solder melts through the temperature rising period of at least three steps in the second step of the crystallization process. That is, the hot bar control unit includes a first temperature rising section for raising the temperature from the room temperature to the first temperature, a first temperature holding section for maintaining the first temperature, a second temperature rising section for raising from the first temperature to the second temperature, A third temperature rising period for raising the temperature from the second temperature to the third temperature, and a third temperature holding period for maintaining the third temperature, the temperature of the hot bar is raised to the third temperature.

In the melting process, the hot bar control unit lowers the height of the hot bar to the set height. Further, the hot bar control unit maintains the temperature of the hot bar at the third temperature.

In the recrystallization process, the hot bar control unit restores the height of the hot bar to its original position through at least two steps. That is, the hot bar control unit includes a first height rising section for raising from a first height (point) to a second height as a position of a hot bar in a melting process, a first height holding section for maintaining a first height, The height of the hot bar is controlled to have a second height rising section for raising to the third height, which is the position of the previous hot bar, and a second height holding section for maintaining the third height. In addition, the hot bar control unit lowers the temperature of the hot bar from the third temperature to room temperature.

As described above, the hot bar control unit controls the height of the compression bonding header and the temperature of the hot bar.

The compression headers and the hot bars vary in height and temperature under the control of the hot bar control unit.

The protective sheet feeding portion 244 feeds the protective sheet 245 and the protective sheet feeding portion 246 collects the protective sheet fed by the protective sheet feeding portion 244. That is, the protective sheet supplied from the protective sheet supply unit 244 is recovered in the protective sheet recovery unit.

When the hot bar directly presses the FPC, the solder can be attached to the end of the hot bar. When the solder is attached to the end of the hot bar, there is a high possibility of failure in the subsequent process. In order to solve such a problem, the protection sheet is used to prevent the end of the hot bar from directly coming into close contact with the FPC. That is, the protective sheet is drawn between the end of the hot bar and the FPC.

9 is a view showing a configuration of an inspection member and a discharge member according to an embodiment of the present invention. Hereinafter, the configuration of the inspection member and the discharge member according to the embodiment of the present invention will be described in detail with reference to FIG.

According to Fig. 9, the inspecting member and the discharging member include a PCB transfer unit, a PCB table, a camera, a good output unit, and a poor output unit. Of course, other configurations than the above-described configuration may be included in the inspection member and the discharge member proposed in the present invention.

The PCB loader 510 transfers the FPC-soldered PCB to the PCB table 520.

The PCB table 520 seats the transferred PCB, and the camera 530 captures an image when the PCB 530 is seated on the PCB.

The photographed image is supplied to the control unit, and the control unit checks whether the FPC is normally soldered to the PCB from the supplied image. The control unit controls the PCB to be transferred to the good discharge unit 540 if the FPC is properly soldered to the PCB, and controls the PCB to be transferred to the defective discharge unit 550 if the FPC is not normally soldered to the PCB.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the scope of the present invention .

200: PCB supplier 210: PCB alignment camera
220: FPC supply unit 230: Flux application unit
240: Soldering section 250: Inspection section
202: First PCB feeder 204: PCB alignment table
206: second PCB feeder 231: dispensing table
232: Application nozzle 233:
234: flux supplier 222: FPC feeder
241: a hot bar control unit 242:
243: Hot bar 244: Protective sheet feeding part
245: protective sheet 246: protective sheet recovery part
510: PCB loader 520: PCB table
530: camera 540: good output unit
550: Bad discharge unit

Claims (5)

A first PCB feeder for picking up and transferring a printed circuit board (PCB) on which marks formed by trays are formed;
A PCB alignment table on which the PCB fed by the first PCB feeder is seated and forming a mark;
A PCB alignment camera for capturing an image of the PCB aligned on the PCB alignment table and the PCB alignment table;
And a control unit for calculating a difference between a mark formed on the PCB alignment table and a mark formed on the PCB from the image photographed by the PCB alignment camera and calculating a movement amount for correcting the calculated difference,
A flux applying unit for applying a flux to an upper end of a solder formed on the aligned PCB;
An FPC feeder for placing an FPC for feeding an FPC to the top of the PCB to which the flux is applied by the flux applying unit;
And a soldering unit for performing a soldering process while the FPC is mounted on the PCB.
The solder joint according to claim 1,
Compression headers;
A hot bar for supplying high-temperature heat formed at an end of the compression head to the FPC;
A hot bar controller for controlling the height of the compression head and the temperature of the hot bar;
A protective sheet supply unit for supplying a protective sheet between the hot bar and the FPC to prevent the solder from adhering to the hot bar during a soldering process,
And a protective sheet collecting unit for collecting the protective sheet supplied from the protective sheet supplying unit.
[3] The apparatus of claim 2,
A crystallization process, a melting process, and a recrystallization process,
The crystallization process may include a first step of a crystallization process for maintaining the distance between the hot bar end and the solder to be a predetermined separation distance and a second step of a crystallization process for bringing the hot bar end into close contact with the solder,
The second step of the crystallization process may include a first temperature rising period for raising from the normal temperature to the first temperature, a first temperature holding period for maintaining the first temperature, a second temperature rising period for raising from the first temperature to the second temperature, A second temperature holding period for maintaining the first temperature, a third temperature rising period for raising from the second temperature to the third temperature, and a third temperature holding period for maintaining the third temperature,
Wherein the melting process is performed by lowering the height of the hot bar to a first predetermined height, maintaining the temperature of the hot bar at a third temperature,
The recrystallization process may include a first height elevation section for elevating the hot bar from the first point to a second point, a first elevation maintenance section for maintaining a height of the second point, a hot bar height before the crystallization process at the second point, Wherein the height of the hot bar is controlled to have a second height rising section for raising the hot bar to a third point and a second height holding section for maintaining a height of the third point.
4. The apparatus of claim 3, wherein the PCB alignment table includes at least two PCBs mounted thereon,
The PCB alignment camera sequentially photographs PCBs mounted on the PCB alignment table,
The control unit calculates the amount of movement of each PCB from the image captured by the PCB alignment camera,
Wherein the PCB alignment table is disposed at a predetermined position so as to sequentially sequentially pick up PCBs mounted on the PCB alignment table in a state where the second PCB feeder is aligned, Wherein the hot bar soldering device moves the hot bar solder.
5. The method of claim 4,
A PCB transferring unit for transferring the soldered PCB;
And a camera for photographing a soldering point of the PCB transferred by the PCB transfer unit,
If it is determined from the image photographed by the camera that the FPC is soldered to the soldering position of the PCB, the FPC is discharged to the good discharge unit. If it is determined that the FPC is not soldered to the soldering position of the PCB, And discharged to the defective discharge unit.

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