KR101085043B1 - Fpc bonding apparatus for touch panel - Google Patents

Fpc bonding apparatus for touch panel Download PDF

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Publication number
KR101085043B1
KR101085043B1 KR1020110025838A KR20110025838A KR101085043B1 KR 101085043 B1 KR101085043 B1 KR 101085043B1 KR 1020110025838 A KR1020110025838 A KR 1020110025838A KR 20110025838 A KR20110025838 A KR 20110025838A KR 101085043 B1 KR101085043 B1 KR 101085043B1
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KR
South Korea
Prior art keywords
fpc
touch panel
bonding process
working
work
Prior art date
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KR1020110025838A
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Korean (ko)
Inventor
구영석
Original Assignee
주식회사 성진하이메크
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Priority to KR1020110025838A priority Critical patent/KR101085043B1/en
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Publication of KR101085043B1 publication Critical patent/KR101085043B1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

According to the present invention, a plurality of working jigs are disposed on a rotating table, and the touch panel and the FPC are loaded when the worker loads the touch panel and the FPC (Flexible Printed Circuit) on the working jig where the worker is located. The working jig is subjected to an anisotropic conductive film (ACF) bonding process, FPC pre-bonding process and FPC main bonding process sequentially according to the rotation of the rotary table. By bonding FPC to the touch panel, FPC for touch panel can increase productivity and reduce manufacturing cost due to the simplification of in-line equipment. ) Relates to a bonding device.

Description

FPC Bonding Device for Touch Panels {FPC Bonding Apparatus For Touch Panel}

According to the present invention, a plurality of working jigs are disposed on a rotating table, and the touch panel and the FPC are loaded when the worker loads the touch panel and the FPC (Flexible Printed Circuit) on the working jig where the worker is located. The working jig is subjected to an anisotropic conductive film (ACF) bonding process, FPC pre-bonding process and FPC main bonding process sequentially according to the rotation of the rotary table. By bonding FPC to the touch panel, FPC for touch panel can increase productivity and reduce manufacturing cost due to the simplification of in-line equipment. ) Relates to a bonding device.

In general, the touch panel (Touch Panel) is a user can select the desired information by looking at the display device using a finger or a tool on the screen of the display device without an input device such as a keyboard, such as an electronic notebook, smart phone, PDA, navigation, etc. It is widely used in electronic information terminals.

The general structure of the touch panel includes an upper substrate and a lower substrate disposed to face the upper substrate, and a main material is formed of indium tin oxide (ITO) on the lower surface of the upper substrate (the opposite surface facing the lower substrate). The first transparent electrode film having a uniform thickness is patterned, the upper electrode is printed in the X direction so that the first transparent electrode film is energized, and the second transparent electrode film is similarly patterned on the opposite surface of the lower substrate. The lower electrode is printed in the Y direction so as to be energized with the second transparent electrode film to form one touch panel.

The electrode terminals of the upper electrode and the lower electrode of the touch panel are disposed to collect at an arbitrary corner portion, and after bonding an anisotropic conductive film (ACF) to the corner where the electrode terminals are collected. Bonding a flexible printed circuit (FPC) to the ACF enables the touch panel to draw or apply an electrical signal to the outside.

Conventional apparatus for bonding the FPC to the touch panel is bonded by bonding the ACF to the touch panel, pressing the FPC and then main bonding, but each process equipment is arranged in a line to occupy a lot of installation space Since the work by a number of workers had a problem that the efficiency of the work falls.

The present invention has been made to solve the problems of the prior art as described above, the present invention is arranged a plurality of working jig on the rotary table, the operator is in the working jig where the worker is located touch panel and FPC (FPC) When the touch panel and the FPC are loaded, the working jig is loaded with an ACF bonding process, an FPC prebonding process, and an FPC main bonding process according to the rotation of the rotary table. By performing the sequential bonding of the FPC to the touch panel, it is possible to increase the productivity while one-person operation, and to reduce the manufacturing cost of the equipment due to the simplification of the in-line equipment It is an object to provide a FPC bonding apparatus for panels.

In order to achieve the above object, the FPC bonding apparatus for a touch panel according to the present invention is provided with a plurality of working jigs capable of loading the touch panel and the FPC on a rotary table, and are placed in a worker's working position. When the touch panel and the FPC are loaded by the worker on the arranged work jig, the work jig on which the touch panel and the FPC is loaded becomes the ACF bonding process equipment according to the rotation of the rotary table. APC bonding process, FPC prebonding process equipment by FPC prebonding process and FPC main bonding process by FPC main bonding process equipment In the FPC bonding apparatus for a touch panel, which is sequentially bonded to the FPC to the touch panel, the FPC main bonding process equipment is the size of each other Work jig and the FPC disposed at a working position of the FPC pre-bonding processing equipment, including two having the specifications for performing the FPC main bonding process on the touch panel having different (FPC) has a waiting area between working jigs arranged at the working position of the main bonding process equipment, and further arranges the working jig at the working position of the waiting area so that the turntable rotates at an angle of 60 degrees. It is characterized by rotating.

In addition, the present invention is a plurality of working jig disposed on the rotary table, the working jig disposed at the working position of the worker, the working jig disposed at the working position of the ACF bonding process equipment, the FPC ( FPC) working jig disposed in the working position of the pre-bonding process equipment, working jig disposed in the working position of the FPC main bonding process equipment, the working jig is the worker when the rotary table is rotated And it is characterized in that it is arranged in the working position of each process equipment.

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In addition, the present invention is characterized in that a plurality of vacuum holes are provided to provide a vacuum force at the bottom in the position where the touch panel is mounted so that the working jig is easily fixed to the touch panel.

In the FPC bonding apparatus for a touch panel according to the present invention, a FPC bonding apparatus for a touch panel is provided with a plurality of working jigs on a rotating table, and the operator touches the touch panel and the FPC on the working jig where the worker is located. When the FPC) is loaded, the working jig in which the touch panel and the FPC are loaded is subjected to an ACF bonding process, an FPC prebonding process, and an FPC main according to the rotation of the rotary table. By performing the bonding process sequentially to bond the FPC to the touch panel, it is possible to increase the productivity and reduce the manufacturing cost of the equipment due to the simplification of the in-line equipment, while being able to work alone It has an effect.

In addition, the present invention reduces the tact time, which is the time required to produce one product, compared to the FPC bonding apparatus for each touch device, in which process equipment is arranged in a line, thereby improving productivity. It can be installed even in a small space, which makes the arrangement of equipment more efficient.

In addition, the present invention is intended to work by providing two FPC main bonding process equipment different from each other in order to perform the main bonding process according to the size of the touch panel for the FPC bonding apparatus, Even if the size of the touch panel is changed, only the work jig can be changed if the work corresponds to the corresponding touch panel, so that the touch panel of various sizes can be applied.

1 is an external view of an apparatus for explaining an FPC bonding apparatus for a touch panel according to the present invention.
2 is a conceptual diagram illustrating the operating principle of the present invention;
Figure 3 (a) and (b) is a view showing an embodiment of a working jig in the present invention
4 (a) and 4 (b) illustrate an embodiment of a touch panel and an FPC in the present invention.
5 illustrates one embodiment of a completed assembly of an FPC bonding device for a touch panel according to the present invention.

Hereinafter, the FPC bonding apparatus for a touch panel according to the present invention will be described in detail with reference to the accompanying drawings.

According to the present invention, FPC is bonded to a film-shaped touch panel 11 made of indium tin oxide (ITO). The present invention relates to a FPC bonding apparatus for a touch panel, wherein a work jig capable of loading the touch panel 11 and the FPC 12 on an upper portion of the frame 70 as shown in FIGS. 1 and 5. A plurality of the rotary tables 20 are disposed and rotated in a clockwise (or counterclockwise) direction, an ACF bonding process equipment 40 along the outer periphery of the rotary table 20, FPC prebonding process equipment 50, FPC main bonding process equipment 61, 62, etc. are installed.

FIG. 5 illustrates an embodiment of a completed assembly of the FPC bonding apparatus for a touch panel according to the present invention. The FPC bonding apparatus for the touch panel according to the present invention is the FPC bonding for the touch panel illustrated in FIG. 1. On each corner of the frame 70 of the device a side plate 81 made of a transparent material so that the inside can be seen from the outside, an upper cover 82 is placed on top of the side plate 81 and the top cover ( 82 is provided with an air conditioner 83 for supplying air from the outside to the HAPA filter is installed to maintain the air clean inside the FPC bonding device for the touch panel. The work opening 90 is formed at the work position at which the worker 100 works on the side plate 81.

As shown in FIG. 2, the rotary table 20 is a circular table, and a plurality of working jigs 30 capable of loading the touch panel 11 and the FPC 12 are disposed on the upper surface thereof in a clockwise direction. It is supposed to rotate. The rotary table 20 may be rotated in the counterclockwise direction according to the process equipment arrangement.

The plurality of work jig 30, the work jig (30 (a)) disposed at the work position of the front surface of the operator 100 in the state that the rotation is stopped, and an anisotropic conductive film on one side of the touch panel 11 A working jig 30 (b) disposed at a work position of an ACF bonding process apparatus 40 for performing an ACF bonding process for bonding an ACF: Anisotropic Conductive Film (ACF). Align vision camera to electrically connect the electrode terminal 11a of the touch panel 11 and the electrode terminal 12a of the FPC 12 to one side of the AFC bonded touch panel 11. Arranged at the working position of the FPC pre-bonding process equipment 50 for aligning the FPC 12 and the touch panel 11 using the pressure and then press-fit the FPC 12 to one side of the touch panel 11 A working jig 30 (c) and the inspection sensor (not shown) are provided and the inspection sensor (not shown) is the FPC free bone. A work jig 30 (d) disposed in a waiting area for checking whether the FPC 12 is normally pressed on one side of the touch panel 11 in the process equipment 50, and the pressed FPC 12. Working jig [30 (e) disposed at a work position of each of the FPC main bonding process equipments 61 and 62 for fully bonding the FPC 12 to the touch panel 11 by pressing the pressure again to a predetermined pressure at a predetermined temperature. )] And a working jig 30 (f).

When six working jigs 30 are arranged as described above, the rotary table 20 may be rotated at a rotation angle of 60 degrees to perform each process.

By arranging a number of working jigs 30 on the rotary table 20, the touch panel is sequentially performed according to the rotation of the rotary table 20 by ACF bonding process, FPC pre-bonding process and FPC main bonding process. The FPC 12 is bonded to one side of (11).

The working jig 30 is shown in Figs. 3 (a) and (b) showing a temporary example thereof (Fig. 3 (a) is a plan view of the upper surface of the working jig 30, Fig. 3 (b) is a view showing a vacuum pipe in the working jig 30], a plurality of touch panel seating portion 31 for mounting and mounting the touch panel 11 on the upper surface of the working jig 30; And a FPC seating portion 32 which can be placed and mounted on the touch panel mounting portion 31, the FPC 12 bonded to the touch panel 11, the touch panel mounting portion 31. As many as the number is formed. The size and number of the touch panel seating unit 31 may be differently formed according to the size, shape, etc. of the touch panel 11, and the FPC seating unit 32 is the same as the touch panel seating unit 31. Although formed in number, the size and shape of the FPC 12 may be differently formed.

The touch panel seating part 31 is provided with a plurality of vacuum holes 31a that provide a vacuum force so that the touch panel 11 can be easily fixed. The vacuum force and the number of the vacuum holes 31a may be formed differently according to the size of the touch panel 11.

The working jig 30 has a vacuum supply port 33 on one side thereof to supply a vacuum force provided from a vacuum pump (not shown) to each of the touch panel seating portions 31 as shown in FIG. ) Is provided with at least one, and a vacuum supply pipe 34 is piped to the vacuum supply port 33 to supply a vacuum force to the vacuum hole 31a. The other side of the working jig 30 is provided with vacuum blocking pins 35a, 35b, 35c, 35d, and 35e so that the vacuum force provided from the vacuum supply pipe 34 does not leak out of the vacuum hole 31a. It is.

4 (a) and (b) show an embodiment of the touch panel 11 and the FPC 12 in the present invention, Figure 4 (a) is the touch to the working jig 30 The panel 11 and the FPC 12 are shown to be mounted on the touch panel seating portion 31 and the FPC seating portion 32, Figure 4 (b) is a side of the touch panel (11). The state in which the FPC 12 is bonded is illustrated. As illustrated in FIG. 4A, an electrode terminal 11a is formed at one side of the touch panel 11, and an electrode terminal 11a formed at one side of the touch panel 11 is also formed at the FPC 12. An electrode terminal 12a is formed to be bonded with and for electrical connection.

Hereinafter, a process of working in a FPC bonding apparatus for a touch panel according to the present invention will be described.

The operator 100 loads the touch panel 11 and the FPC 12 into the touch panel seating portion 31 and the FPC seating portion 32 of the work jig 30 disposed at the work position, respectively. The panel seating portion 31 has a vacuum hole 31a that provides a vacuum force, so that the touch panel 11 can be easily mounted and fixed.

When the worker 100 finishes loading the touch panel 11 and the FPC 12 on the touch panel seating portion 31 and the FPC seating portion 32 of the working jig 30, respectively, the turntable 20 ) Rotates clockwise (can be designed to rotate counterclockwise according to the arrangement of the process equipment) so that the working jig 30 is placed in the working position of the ACF bonding process equipment (40). And stop.

The ACF bonding process equipment 40 supplies an ACF (not shown) by itself, bonds the electrode terminal 11a formed on one side of the touch panel 11, peels the AFC, and then half-cuts the ACF. Half cutting) to perform the ACF bonding process. When the ACF bonding process is completed, the rotary table 20 is rotated by an angle in a clockwise direction so that the working jig 30 is disposed at the working position of the FPC pre-bonding process equipment 50 and then stops.

In the FPC pre-bonding process equipment 50, the electrode terminal 11a of the touch panel 11 and the electrode terminal 12a of the FPC 12 are electrically connected to one side of the touch panel 11 to which the AFC is bonded. FPC pre-bonding for aligning the FPC 12 and the touch panel 11 using an alignment vision camera so as to be connected, and then pressing the FPC 12 to one side of the touch panel 11. Perform the process. When the FPC pre-bonding process is completed, the rotary table 20 is rotated by an angle in a clockwise direction so that the working jig 30 is disposed at the position of the standby area and then stops.

The waiting area is provided with the inspection sensor (not shown) so that the inspection sensor (not shown) is normally pressed by the FPC 12 to one side of the touch panel 11 in the FPC pre-bonding process equipment 50. Carry out a check. When the inspection is completed in the waiting area, the rotary table 20 is rotated by a predetermined angle in the clockwise direction so that the working jig 30 is disposed at the working position of the FPC main bonding process equipment 61 and then stops.

The FPC main bonding process equipment 61 presses the FPC 12 pressed against the touch panel 11 to a predetermined pressure at a predetermined temperature using a bonding tool, so that the FPC 12 is touched. The FPC main bonding process of fully bonding to the panel 11 is performed. The FPC main bonding process equipment 62 and the FPC main bonding process equipment 62 may be further installed on the right side of the FPC main bonding process equipment 61. Performing the FPC main bonding process for completely bonding the FPC 12 to the different touch panel 11, for example, the FPC main bonding process equipment 61 to the small touch panel 11 Six pressing heads for completely bonding the FPC 12 are installed, and the FPC main bonding process equipment 62 has a pressing head for completely bonding the FPC 12 to the large touch panel 11. There are three installed. In this case, when any one of the FPC main bonding process equipments 61 and 62 performs the main bonding process, the other one does not perform the main bonding process.

As described above, two FPC main bonding process equipments having different specifications from each other in order to perform the main bonding process according to the size of the touch panel 11 with respect to the FPC main bonding process equipment 61 and 62 are intended to work. Even if the size of the touch panel 11 is changed, only the work jig 30 can be changed if the work corresponding to the corresponding touch panel 11 is possible, so that the advantage that can be applied to various sizes of the touch panel 11 have.

When the FPC main bonding process 61 or 62 completes the FPC main bonding process, the rotary table 20 is rotated by a predetermined angle in the clockwise direction so that the work jig 30 is disposed at the work position of the worker 100. Stop as soon as possible.

After the worker 100 releases the vacuum on the touch panel seating portion 31 of the working jig 30 to extract the touch panel 11 to which the FPC 12 is bonded from the working jig 30, For the next operation, the touch panel 11 and the FPC 12 are loaded on the touch panel seating portion 31 and the FPC seating portion 32 of the work jig 30, respectively.

In the above, the worker 100 loads the touch panel 11 and the FPC 12 on the touch panel seating portion 31 and the FPC seating portion 32 of the working jig 30, respectively, and finally the FPC 12 is mounted. Although a series of processes for completing the bonded touch panel 11 is described, the operator 100 touches the touch panel seating portion 31 and the FPC seating portion 32 of the working jig 30, respectively. Even when the 11 and the FPC 12 are being loaded, the ACF bonding process equipment 40, the FPC pre-bonding process equipment 50, and the FPC main bonding process equipment 61 perform the respective processes together. There are all processes happening at the same time

The present invention is suitable for a 3-10 inch touch panel whose main material is Indium Tin Oxide (ITO).

By bonding the FPC to the touch panel by the structure and method as described above, it is possible to increase the productivity and reduce the manufacturing cost of the equipment due to the simplification of the in-line equipment. Compared to the conventional FPC bonding apparatus for touch panels, the tact time, which is a time required to produce one product, is reduced, thereby improving productivity.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that it is possible.

11: touch panel 12: FPC
11a and 12a: electrode terminal 20: rotary table
30: Working jig 31: Touch panel seat
31a: vacuum hole 32: FPC seat
33: vacuum supply port 34: vacuum supply line
35a, 35b, 35c, 35d, 35e: vacuum shutoff pin
40: ACF bonding process equipment 50: FPC pre-bonding process equipment
61, 62: FPC main bonding process equipment 70: frame
81: side plate 82: top cover
83: air conditioner 90: working opening
100: worker

Claims (5)

When a plurality of working jig for stacking the touch panel and FPC is disposed on the turntable, and the touch panel and the FPC are loaded by the worker on the working jig disposed at the working position of the worker. The working jig loaded with the touch panel and FPC is mounted on an ACF bonding process and an FPC prebonding process equipment by an ACF bonding process equipment as the rotary table rotates. FPC pre-bonding process and FPC main bonding process FPC main bonding process by the FPC for the touch panel to bond the FPC to the touch panel in sequence In the fish bonding device,
The FPC main bonding process equipment includes two units having specifications for performing an FPC main bonding process on the touch panels having different sizes.
A work zone disposed between a work jig disposed at a work position of the FPC pre-bonding process equipment and a work jig disposed at a work position of the FPC main bonding process equipment, wherein By further arranging the working jig at the position so that the turntable rotates sequentially at an angle of 60 degrees
The FPC bonding apparatus for touch panels characterized by the above-mentioned.
The method of claim 1,
A plurality of working jig disposed on the rotary table, working jig disposed at the work position of the worker, working jig disposed at the work position of the ACF bonding process equipment, the FPC pre-bonding process A work jig disposed at a work position of the equipment, and work jigs disposed at a work position of the FPC main bonding process equipment, wherein the work jigs are configured to be used by the worker and each process equipment when the rotary table is rotated. To be placed in the working position
The FPC bonding apparatus for touch panels characterized by the above-mentioned.
delete delete The method according to claim 1 or 2,
The working jig is formed with a plurality of vacuum holes for providing a vacuum force at the bottom in the position where the touch panel is loaded so that the touch panel can be easily fixed
The FPC bonding apparatus for touch panels characterized by the above-mentioned.
KR1020110025838A 2011-03-23 2011-03-23 Fpc bonding apparatus for touch panel KR101085043B1 (en)

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Application Number Priority Date Filing Date Title
KR1020110025838A KR101085043B1 (en) 2011-03-23 2011-03-23 Fpc bonding apparatus for touch panel

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Application Number Priority Date Filing Date Title
KR1020110025838A KR101085043B1 (en) 2011-03-23 2011-03-23 Fpc bonding apparatus for touch panel

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101235877B1 (en) 2012-03-28 2013-02-21 주식회사 이엔지코리아 Touch screen pannel producing apparatus
KR101509019B1 (en) 2014-04-18 2015-04-14 (주)글로벌텍 hot-bar soldering apparatus
KR101826978B1 (en) 2016-06-02 2018-02-09 (주)엘디케이 A rotating table type FPC automatic bonding apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308149A (en) * 2000-04-27 2001-11-02 Matsushita Electric Ind Co Ltd Apparatus and method of mounting semiconductor for fpc

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308149A (en) * 2000-04-27 2001-11-02 Matsushita Electric Ind Co Ltd Apparatus and method of mounting semiconductor for fpc

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101235877B1 (en) 2012-03-28 2013-02-21 주식회사 이엔지코리아 Touch screen pannel producing apparatus
KR101509019B1 (en) 2014-04-18 2015-04-14 (주)글로벌텍 hot-bar soldering apparatus
KR101826978B1 (en) 2016-06-02 2018-02-09 (주)엘디케이 A rotating table type FPC automatic bonding apparatus

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