JP3283226B2 - How to make a holder - Google Patents

How to make a holder

Info

Publication number
JP3283226B2
JP3283226B2 JP36661997A JP36661997A JP3283226B2 JP 3283226 B2 JP3283226 B2 JP 3283226B2 JP 36661997 A JP36661997 A JP 36661997A JP 36661997 A JP36661997 A JP 36661997A JP 3283226 B2 JP3283226 B2 JP 3283226B2
Authority
JP
Japan
Prior art keywords
holder
magnetic
mold
conductor
elastic connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP36661997A
Other languages
Japanese (ja)
Other versions
JPH11191469A (en
Inventor
野 英 明 今
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polymatech Co Ltd
Original Assignee
Polymatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18487235&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3283226(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Polymatech Co Ltd filed Critical Polymatech Co Ltd
Priority to JP36661997A priority Critical patent/JP3283226B2/en
Priority to DE69811629T priority patent/DE69811629T2/en
Priority to EP98310097A priority patent/EP0938247B1/en
Priority to KR1019980054554A priority patent/KR100592812B1/en
Priority to US09/215,013 priority patent/US6217349B1/en
Publication of JPH11191469A publication Critical patent/JPH11191469A/en
Priority to US09/609,485 priority patent/US6613267B1/en
Publication of JP3283226B2 publication Critical patent/JP3283226B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/03Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/08Mouthpieces; Microphones; Attachments therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、携帯電話、パーソ
ナル・ハンディーホーン・システム(PHS)、パーソ
ナル・デジタル・アシスタント(PDA)等の小型マイ
クロホン、スピーカー等(取付け電子部品)を基板に保
持し、かつ電気的接続をするためのホルダーの製造法
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention holds a small microphone such as a portable telephone, a personal handy horn system (PHS), a personal digital assistant (PDA), a speaker, and the like (attachment electronic parts) on a substrate, The present invention also relates to a method of manufacturing a holder for making an electrical connection.

【0002】[0002]

【従来の技術】従来の携帯電話機、携帯通信機等に使用
されているマイクロホンやスピーカーなどの電子部品の
電極と基板電極は、一般にリード線を用いて半田付けで
接続している。この接続は細いリード線を手作業によっ
て半田付けせねばならないため生産性が悪くコストが高
くなってしまう。また、リード線があるため取り付けス
ペースを広く必要とし近年の小型化のニーズには対応で
きていない。
2. Description of the Related Art In general, electrodes of electronic components such as microphones and speakers used in conventional cellular phones and portable communication devices are connected to substrate electrodes by soldering using lead wires. In this connection, thin lead wires must be manually soldered, which results in poor productivity and high cost. In addition, since there is a lead wire, a large mounting space is required, and it is not possible to cope with recent needs for miniaturization.

【0003】他方、導電性の弾性コネクタを使用して電
極間の電気的接続をする方法が開発されている。
[0003] On the other hand, a method of making electrical connection between electrodes using a conductive elastic connector has been developed.

【0004】[0004]

【発明が解決しようとする課題】しかし、導電性の弾性
コネクタは、絶縁弾性部と導電弾性部が積層された構造
であり、特殊な製法をとるため、従来の取付け電子部品
を取り付けるための保持部とは、別の製造工程をとらね
ばならず、したがって別部品として製作されるので、取
付けの際に取付け電子部品の電極と弾性コネクタの電極
の位置合わせに細かな作業が必要となったり、あるいは
保持部と弾性コネクタ部を接着する必要が生じまだまだ
生産性が悪くコストも掛かるものとなっている。
However, the conductive elastic connector has a structure in which an insulating elastic part and a conductive elastic part are laminated, and a special manufacturing method is employed, so that a conventional holding part for mounting the mounting electronic parts is used. The part must take a separate manufacturing process, and therefore is manufactured as a separate part, so when mounting it requires detailed work to align the electrodes of the mounted electronic components and the electrodes of the elastic connector, Alternatively, it is necessary to bond the holding portion and the elastic connector portion, and the productivity is still low and the cost is high.

【0005】[0005]

【課題を解決するための手段】本発明は上記課題を解決
するものであって、取付け工程の簡略化、生産コストの
削減、取付け部の小スペース化を図ることを目的とした
ホルダーの製造法を提供するものである。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to simplify the mounting process, reduce the production cost, and reduce the space for the mounting portion.
It is intended to provide a method for manufacturing a holder .

【0006】そのため本発明は、小型マイクロホンある
いはスピーカー等の取付け電子部品の電極と基板の電極
との接続を導電性の弾性コネクタを用いて行い、そして
取付け電子部品の保持を行う保持部と弾性コネクタ部と
を一体成形し、取付け電子部品の取付けを簡易的に行な
えるようにしたホルダーの製造法である。
Accordingly, the present invention provides a connection between an electrode of a mounting electronic component such as a small microphone or a speaker and an electrode of a substrate using a conductive elastic connector, and a holding portion for holding the mounting electronic component and an elastic connector. This is a method for manufacturing a holder in which a part is integrally formed so that mounting electronic parts can be easily mounted.

【0007】[0007]

【発明の実施の形態】図1に、本発明のホルダーを分解
して示す。
FIG. 1 is an exploded view of a holder according to the present invention.

【0008】小型マイクロホンあるいはスピーカー等の
取付け電子部品1の電極11と基板3の電極31との電気
的接続は、弾性体である導電性の弾性コネクタ部21
用い、そして取付け電子部品1の取付けを簡単に行なえ
るようにホルダーの保持部22を弾性コネクタ部21に一
体化してある。
[0008] Electrical connection between the electrode 31 of the electrode 11 and the substrate 3 mounting electronic component 1 such as a small microphone or speaker, an elastic connector portion 2 1 of the conductive which is an elastic member, and the mounting of the electronic component 1 the holder 2 2 of the holder capable of being performed easily mounting are integrated with the elastic connector part 2 1.

【0009】取付け電子部品1は、ホルダー2内に押し
込まれ保持部22に係合され、取付け電子部品の下面の
電極11と基板3の電極31とが導電性の弾性コネクタ部
1により導通する。
[0009] Mounting the electronic component 1 is pushed into the holder 2 is engaged with the holding portion 2 2, the electrode 1 of the lower surface of the mounting the electronic component 1 and the electrode 3 1 are conductively elastic connector part 2 1 of the substrate 3 To conduct.

【0010】導電性の弾性コネクタ部21の導電部に
は、取付け電子部品の電気容量を考慮して低抵抗のもの
を用いる。好ましくは接触抵抗で10Ω以下が良く、導
電部の媒体には、抵抗値の低い金属粉、カーボンやグラ
ファイト等を金属でメッキしたもの、金属線等が好まし
い。導電部は、取付け電子部品1の電極11と基板電極
1がそれぞれ対応する電極に接続できるように導電パ
ターンを形成しておく。
[0010] The conductive portion of the elastic connector portion 2 1 of the electrically conductive, in consideration of the capacitance of the mounting electronic part used as a low resistance. The contact resistance is preferably 10Ω or less, and the medium of the conductive portion is preferably a metal powder having a low resistance value, carbon or graphite plated with a metal, a metal wire, or the like. Conductive portion, previously formed a conductive pattern as the electrodes 1 1 and the substrate electrode 3 1 mounting the electronic component 1 can be connected to the corresponding electrode.

【0011】図2に、本発明のホルダーの製造法を示
す。
FIG. 2 shows a method of manufacturing the holder of the present invention.

【0012】所望の導電パターンと同パターンで鉄やニ
ッケル系合金等の磁性体61を埋め込んだ金型を使用す
る。上金型(a)の磁性体61は、下金型(b)内に進
入するように突出して形成されており、下金型(b)の
底部にも磁性体61が埋め込まれている。
A mold is used in which a magnetic material 61 such as iron or a nickel alloy is embedded in the same pattern as the desired conductive pattern. The magnetic body 61 of the upper mold (a) is formed so as to protrude so as to enter the lower mold (b), and the magnetic body 61 is also embedded at the bottom of the lower mold (b).

【0013】この金型に、シリコーンやウレタン等の液
状ポリマーに、ニッケル、鉄、コバルトなどの磁性導電
体あるいはこれらを主成分とする合金、または銅、アル
ミニウム、金、銀等の導電体を前記磁性導電金属でメッ
キしたもの、あるいは逆に磁性導電金属等を導電体でメ
ッキしたもの等を混合した材料を、下金型(b)に流し
込み、上下から磁力をかけ材料中の磁性導電体を磁力線
方向に数珠繋ぎとして磁性導電体鎖を形成する。つまり
図において弾性コネクタ部21の上下方向に磁性導電体
鎖が配向されるため、上下方向にだけ導通する異方性を
持つ弾性コネクタ部21を形成する。その後熱処理等に
よりこの金型中のシリコーンやウレタン等の液状ポリマ
ーを硬化させて保持部と弾性コネクタ部が一体化したホ
ルダー2を完成する。
In this mold, a liquid polymer such as silicone or urethane is mixed with a magnetic conductor such as nickel, iron or cobalt or an alloy containing these as a main component, or a conductor such as copper, aluminum, gold or silver. A material mixed with a material plated with a magnetic conductive metal, or conversely, a material obtained by plating a magnetic conductive metal or the like with a conductor is poured into a lower mold (b), and a magnetic force is applied from above and below to remove the magnetic conductor in the material. A magnetic conductor chain is formed by connecting beads in the direction of the line of magnetic force. That for magnetic conductor strands in the vertical direction of the elastic connector part 2 1 in the figure is oriented to form an elastic connector part 2 1 with anisotropic conducting in the vertical direction by. Thereafter, the liquid polymer such as silicone or urethane in the mold is cured by heat treatment or the like to complete the holder 2 in which the holding portion and the elastic connector portion are integrated.

【0014】このようにして簡単に生産でき、また、使
用の際も取付け電子部品をホルダーに取り付けるだけで
よく、電極の位置合わせなどの細かな作業が不要とな
る。
In this way, it can be easily produced, and in use, it is only necessary to mount the mounting electronic parts on the holder, and detailed operations such as electrode positioning are not required.

【0015】[0015]

【実施例1】図3にホルダーの導電パターンを平面およ
び断面で示す。
Embodiment 1 FIG. 3 shows a plan view and a cross section of a conductive pattern of a holder.

【0016】ホルダーの導電部は、取付け電子部品の電
極と基板電極がそれぞれ対応する電極に接続できるよう
に導電パターンを形成する。例えば、図3に示すよう
に、電子部品1の電極11と同パターンにするタイプ
a、導電部が同心円状となっているタイプb、導電部が
ランダムとなっているタイプc、導電部が十字になって
いるタイプd等が考えられる。なお、タイプdは磁力で
配向させる場合は、異方性があるためプラス極とマイナ
ス極でリークしない。
The conductive portion of the holder forms a conductive pattern so that the electrode of the mounted electronic component and the substrate electrode can be connected to the corresponding electrodes. For example, as shown in FIG. 3, the type a to the pattern electrodes 1 1 of the electronic component 1, type conductive portion is concentric b, type conductive portion is a random c, conductive parts A cross-shaped type d or the like is conceivable. In addition, when the type d is oriented by magnetic force, there is no leakage at the plus and minus poles due to the anisotropy.

【0017】図4において、導電性の弾性コネクタ部2
1は、保持部22の底面に対し上下に凸の形状とし、取付
け電子部品1の電極11と基板電極31との接触を良く
し、また適度の圧縮が加わるように設計してある。
In FIG. 4, a conductive elastic connector 2 is shown.
1, the holding part 2 with respect to the second bottom surface and a convex shape in the vertical, to improve the contact between the electrodes 1 1 and the substrate electrode 3 1 mounting the electronic component 1, also is designed to join moderate compression .

【0018】この図4のホルダーは、図5の金型7を使
用して成形する。この金型の素材は、磁性を持たないも
のであれば特に限定されるものでなくアルミニウム、各
種合金、あるは樹脂等の素材でも良い。この金型内には
所望の位置に導電部のパターンと同パターンで磁性体6
1が上下の型7に埋め込まれている。金型内に埋め込む
素材は磁性を持つものであれば特に限定されるものでな
く、鉄や、ニッケル、コバルト、クロム系等の合金でも
良い。
The holder shown in FIG. 4 is formed by using the mold 7 shown in FIG. The material of the mold is not particularly limited as long as it does not have magnetism, and may be a material such as aluminum, various alloys, or resin. A magnetic material 6 is provided in a desired position in the mold in the same pattern as the pattern of the conductive portion.
1 is embedded in the upper and lower molds 7. The material to be embedded in the mold is not particularly limited as long as it has magnetism, and may be iron or an alloy of nickel, cobalt, chromium, or the like.

【0019】[0019]

【実施例2】実施例1の製品についての製造法を説明す
る。
Embodiment 2 A manufacturing method for the product of Embodiment 1 will be described.

【0020】液状シリコーンゴム(ワッカーケミカル社
LR7665A/B)100重量部に対し、ニッケル粉
を5〜50重量部加え良く攪拌脱泡した材料を金型7の
下型71に流し込み、下型71の下方から上方に磁界(磁
束密度=400ガウス)をかけニッケル粉を導電パター
ンの通りに配向させる。その後上型72を載せ、すなわ
ち型締めし、120℃の熱をかけ前記液状シリコーンゴ
ムを硬化させ、図4に示すホルダーを得た。ここで上型
2を載せる前に、まず材料を流し込んだ下型71に磁界
をかけニッケル粉を導電部のパターンの通りに配向させ
たのは、ニッケル粉が保持部22にまわりこむのを防ぐ
ためである。
[0020] For liquid silicone rubber (Wacker Chemical Company LR7665A / B) 100 parts by weight, pouring materials well stirred degassed added 5-50 parts by weight of nickel powder in the lower mold 71 of the mold 7, the lower die 7 A magnetic field (magnetic flux density = 400 gauss) is applied from below to above 1 to orient the nickel powder according to the conductive pattern. Place the on the type 7 2 Then, Sunawa
The mold was closed, and the liquid silicone rubber was cured by applying heat at 120 ° C. to obtain a holder shown in FIG. Before placing the upper mold 7 2 Here, first, the nickel powder subjected to the magnetic field to the lower die 71 pouring the material was oriented as the pattern of the conductive portion, the nickel powder from flowing to the holding unit 2 2 This is to prevent

【0021】ニッケル粉の添加量を5重量部未満にする
と、導電性の弾性コネクタ部2 1 の上下方向にニッケル
粒子鎖が貫通しない部分が形成される恐れがある。逆に
ニッケル粉を50重量部を超えると、導電性の弾性コネ
クタ部21 の中心円部と外周円部が電気的に接続しリー
クする恐れがある。そのため液状シリコーンゴム100
重量部に対しニッケル粉は5〜50重量部の添加が好ま
しく、より好ましくは10〜20重量部である。
[0021] When the addition amount of the nickel powder to less than 5 parts by weight, there is a possibility that a portion of nickel particle chains does not penetrate in the vertical direction of the conductive elastic connector part 2 1 is formed. When nickel powder reversed more than 50 parts by weight, the center circle portion of the conductive elastic connector part 2 1 and the outer circumference portion is liable to leak electrically connected. Therefore, liquid silicone rubber 100
The addition of nickel powder is preferably 5 to 50 parts by weight, more preferably 10 to 20 parts by weight with respect to parts by weight.

【0022】表1に磁性導電粉の粒径と導電性の弾性コ
ネクタの抵抗値の関係を示す。
Table 1 shows the relationship between the particle size of the magnetic conductive powder and the resistance value of the conductive elastic connector.

【0023】得られたホルダー2の導電性の弾性コネク
タ部 1 の抵抗値は、ニッケル粉の粒径に依存し、ニッ
ケル粉の粒径が大きいほど低く安定した抵抗値が得られ
た。単に低く安定した抵抗値のホルダー2を得たい場合
は、例えば粒径125μm以上のニッケル粉を用いれば
良い。しかしながらニッケル粉の粒径が大きいほど分散
性が悪くなる傾向があるため、きれいな導電パターンを
形成させるためにはニッケル粉の粒径は小さいほど良
い。そのためきれいな導電パターンを形成させ、なおか
つ低く安定した低抵抗を得たい場合は、例えば粒径30
μm〜40μmで金あるいは銀でコーティングされたニ
ッケル粉を用いるのが望ましい。
The resultant resistance value of the conductive elastic connector part 2 1 of the holder 2 depends on the particle size of the nickel powder, stable resistance value lower larger particles of the nickel powder was obtained. To simply obtain the holder 2 having a low and stable resistance value, for example, a nickel powder having a particle diameter of 125 μm or more may be used. However, the larger the particle size of the nickel powder, the worse the dispersibility tends to be. Therefore, the smaller the particle size of the nickel powder, the better to form a beautiful conductive pattern. Therefore, when it is desired to form a clean conductive pattern and obtain a low and stable low resistance, for example, a particle size of 30
It is desirable to use nickel powder coated with gold or silver with a diameter of from 40 μm to 40 μm.

【0024】表2に液状ポリマーの粘度とニッケル粉の
粒径の違いによる配向時間を示す。
Table 2 shows the orientation time depending on the difference between the viscosity of the liquid polymer and the particle size of the nickel powder.

【0025】液状ポリマーの粘度はニッケル粉の配向時
間に影響を与える。基本的には粘度が低いほど、配向に
要する時間が短く成形サイクルの面から有利と言える
が、ポリマーの粘度が低いほど硬化後の物性が悪くなる
傾向があるため、ポリマーの粘度は好ましくは10P〜
2500Pが良く、より好ましくは100P〜1000
Pである。
The viscosity of the liquid polymer affects the orientation time of the nickel powder. Basically, it can be said that the lower the viscosity, the shorter the time required for orientation and the more advantageous in terms of the molding cycle. However, the lower the viscosity of the polymer, the lower the physical properties after curing. ~
2500P is good, more preferably 100P to 1000P
P.

【0026】本発明におけるホルダー2の組み付け方法
の例を以下に示す。
An example of a method for assembling the holder 2 according to the present invention will be described below.

【0027】導電性の弾性コネクタ部を用いる場合、安
定した導通を得るためには弾性コネクタ部にある程度圧
縮がかかる組み付け方法でなければならない。一般的に
圧縮率は、弾性コネクタ部の厚みにより設定されるが、
おおよそ8〜20%が適正範囲である。
When a conductive elastic connector is used, an assembly method must be used in which the elastic connector is compressed to some extent in order to obtain stable conduction. Generally, the compression ratio is set by the thickness of the elastic connector portion,
Approximately 8 to 20% is an appropriate range.

【0028】図6で示す組み付け方法は、弾性コネクタ
部21 を圧縮しうる程度の硬度を有した、例えば樹脂等
の素材で構成し、所望の位置に穴8を設けた取付け具4
を別途に設け、すでに取付け電子部品1を係合したホル
ダー2を、その中に組み付ける。取付け具4についた取
り付け部 1を基板3の取り付け穴 に差し込み固定
する。このとき弾性コネクタ部21は、取付け具4と基
板3とに圧縮され、安定した抵抗値を示すようになる。
The assembling method shown in Figure 6, had a hardness of the degree capable of compressing the elastic connector part 2 1, composed of a material, for example resin, fitting 4 provided with a hole 8 in the desired position
Is separately provided, and the holder 2 already engaged with the mounting electronic component 1 is assembled therein. The mounting portion 4 1 attached to the fixture 4 is inserted and fixed to the mounting holes 3 2 of the substrate 3. Elastic connector part 2 1 this time is compressed and fixture 4 and the substrate 3, exhibits a stable resistance value.

【0029】また図7で示す組み付け方法は、所望の位
置に穴9を設けた筐体5に、すでに取付け電子部品1を
組み込んだ保持部22と弾性コネクタ21を一体化したマ
イクホルダー2を組み付けた場合である。筐体5が本体
に組み付けられると、弾性コネクタ部21が筐体5と基
板3間に押さえつけられ安定した導通が得られる。これ
によりリード線等を半田付けにより接続するという工程
が無く、部品を取りつけるだけの工程ですむため、誰で
も簡単に組み付けが可能となる。
Further assembling method shown in Figure 7, the housing 5 which is provided a hole 9 in the desired position, the microphone holder 2 already integrated holder 2 2 and the elastic connector 2 1 incorporating the mounting electronic part 1 It is a case where is assembled. When housing 5 is assembled to the main body, the conductive elastic connector part 2 1 is pressed is stable between the housing 5 and the substrate 3 is obtained. This eliminates the process of connecting the lead wires and the like by soldering, and only requires the process of mounting components, so that anyone can easily assemble.

【0030】[0030]

【発明の効果】本発明のホルダーは、携帯電話機等に使
用されているマイクロホン電子部品を基板に取り付ける
のに使用される保持部と弾性コネクタ部が一体化してい
るので、リード線等を半田付けにより接続するという工
程が無く、さらに部品点数、組み付け工数を削減するこ
とができるため、製造コストの低減を図ることができ
る。
According to the holder of the present invention, a holding portion used for attaching a microphone electronic component used in a cellular phone or the like to a substrate and an elastic connector portion are integrated, so that a lead wire or the like is soldered. Therefore, the number of components and the number of assembling steps can be reduced, so that the manufacturing cost can be reduced.

【0031】また、本発明の製造法によれば、複雑な形
状の保持部と弾性コネクタ部とを一体化したホルダーを
簡単に製造できる。
Further, according to the manufacturing method of the present invention, a holder in which a holding portion having a complicated shape and an elastic connector portion are integrated can be easily manufactured.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のホルダーを分解して示す斜視図。FIG. 1 is an exploded perspective view showing a holder of the present invention.

【図2】金型の断面図。FIG. 2 is a sectional view of a mold.

【図3】ホルダーの導電パターンの平面および断面図。FIG. 3 is a plan view and a sectional view of a conductive pattern of a holder.

【図4】ホルダーの平面および断面図。FIG. 4 is a plan view and a sectional view of a holder.

【図5】成形状態を示す断面図。FIG. 5 is a sectional view showing a molding state.

【図6】基板への組み付け方法を示す図。FIG. 6 is a view showing a method of assembling the circuit board.

【図7】基板への別の組み付け方法を示す図。FIG. 7 is a view showing another method of assembling the circuit board.

【符号の説明】[Explanation of symbols]

1 電子部品 2 ホルダー 2 弾性コネクタ部 2 保持部 3 基板 4 取付け具 5 筐体 6,7 金型 8,9 穴DESCRIPTION OF SYMBOLS 1 Electronic component 2 Holder 2 1 Elastic connector part 2 2 Retention part 3 Substrate 4 Attachment 5 Housing 6,7 Die 8,9 hole

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI B29L 31:26 H01R 23/68 M ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification code FI B29L 31:26 H01R 23/68 M

Claims (7)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】磁性導電体を配合した液状ポリマーを、ホ
ルダー成形用金型に注入し、金型内の所望の箇所に磁力
を与え、この磁力によって磁性導電体を配向させ弾性コ
ネクタ部を特定した後、液状ポリマーを架橋させて電子
部品取付け用の保持部を一体成形することを特徴とする
ホルダーの製造法。
1. A liquid polymer containing a magnetic conductor,
Inject into a mold for rudder molding and apply magnetic force to a desired location in the mold.
This magnetic force orients the magnetic conductor and makes it elastic.
After specifying the connector, the liquid polymer is cross-linked to
It is characterized by integrally forming the holding part for mounting parts
How to make a holder.
【請求項2】ホルダー成形用金型が、所望の導電パター
ンと同パターンの磁性体を備えていることを特徴とする
請求項1に記載のホルダーの製造法。
2. The method according to claim 1, wherein the mold for forming the holder has a desired conductive pattern.
Characterized by having the same pattern of magnetic material
A method for manufacturing the holder according to claim 1.
【請求項3】弾性コネクタ部の特定が、液状ポリマーに
与える磁力の磁性線に沿って磁性導電体数珠繋ぎに配向
させて行われることを特徴とする請求項1または2に記
載のホルダーの製造法。
3. The method according to claim 1, wherein the elastic connector is specified by a liquid polymer.
Orientation to connect magnetic conductor beads along the magnetic line of applied magnetic force
3. The method according to claim 1, wherein
Manufacturing method of the above-mentioned holder.
【請求項4】液状ポリマーが、粘度10P〜2500P
であることを特徴とする請求項1,2または3に記載の
ホルダーの製造法。
4. A liquid polymer having a viscosity of 10P to 2500P.
4. The method according to claim 1, 2 or 3, wherein
How to make a holder.
【請求項5】磁性導電体が、 ニッケル、鉄、コバルトなどの磁性導電体あるいはこれ
らを主成分とする合金、 または銅、アルミニウム、金、銀等の導電体を前記磁性
導電体でメッキしたもの、 あるいは前記磁性導電体を前記導電体でメッキしたもの
であることを特徴とする請求項1〜4のいずれか1に記
載のホルダーの製造法。
5. The magnetic conductor according to claim 1, wherein the magnetic conductor is nickel, iron, cobalt or the like.
Alloys containing copper, aluminum, gold, silver, etc.
Those plated with a conductor , or those obtained by plating the magnetic conductor with the conductor
The method according to any one of claims 1 to 4, wherein
Manufacturing method of the above-mentioned holder.
【請求項6】金型が、磁性導電体を配向させ弾性コネク
タ部を特定した後、型締めされることを特徴とする請求
項1〜5のいずれか1に記載のホルダーの製造法。
6. A metal mold for orienting a magnetic conductor and an elastic connector.
The mold is clamped after specifying the
Item 6. The method for producing a holder according to any one of Items 1 to 5.
【請求項7】弾性コネクタ部が、保持部の底面に対し凸
の形状に形成されていることを特徴とする請求項1〜6
のいずれか1に記載のホルダーの製造法。
7. An elastic connector part is convex with respect to the bottom surface of the holding part.
7. The shape of claim 1, wherein:
The method for producing a holder according to any one of the above.
JP36661997A 1997-12-26 1997-12-26 How to make a holder Expired - Lifetime JP3283226B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP36661997A JP3283226B2 (en) 1997-12-26 1997-12-26 How to make a holder
DE69811629T DE69811629T2 (en) 1997-12-26 1998-12-09 Holding device with a connecting element made of anisotropically conductive rubber and manufacturing method
EP98310097A EP0938247B1 (en) 1997-12-26 1998-12-09 Holder equipped with an anisotropically conductive rubber connector and method for manufacturing the same
KR1019980054554A KR100592812B1 (en) 1997-12-26 1998-12-11 Holder and its manufacturing method
US09/215,013 US6217349B1 (en) 1997-12-26 1998-12-17 Holder and method for manufacturing the same
US09/609,485 US6613267B1 (en) 1997-12-26 2000-07-05 Method for manufacturing a holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36661997A JP3283226B2 (en) 1997-12-26 1997-12-26 How to make a holder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2001238516A Division JP3658553B2 (en) 2001-08-06 2001-08-06 Conductive connection structure for holder and electronic parts

Publications (2)

Publication Number Publication Date
JPH11191469A JPH11191469A (en) 1999-07-13
JP3283226B2 true JP3283226B2 (en) 2002-05-20

Family

ID=18487235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36661997A Expired - Lifetime JP3283226B2 (en) 1997-12-26 1997-12-26 How to make a holder

Country Status (5)

Country Link
US (2) US6217349B1 (en)
EP (1) EP0938247B1 (en)
JP (1) JP3283226B2 (en)
KR (1) KR100592812B1 (en)
DE (1) DE69811629T2 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244448B2 (en) 1997-03-19 2002-01-07 富士高分子工業株式会社 Small microphone assembly using conductive rubber contacts
US6307946B1 (en) * 1997-06-25 2001-10-23 Fuji Polymer Industries Co., Ltd. Miniature microphone component
WO2000076183A1 (en) * 1999-06-03 2000-12-14 Telefonaktiebolaget Lm Ericsson (Publ) Surface mounting of mobile telephone speaker unit
JP3621615B2 (en) * 1999-11-12 2005-02-16 ヤマハメタニクス株式会社 Microphone holder
JP2001172398A (en) * 1999-12-17 2001-06-26 Polymatech Co Ltd Thermal conduction molded product and its production method
KR20020004056A (en) * 2000-06-30 2002-01-16 김종곤 Connection method for microphone of mobile radio communication unit and structure thereof
KR20030036813A (en) * 2000-09-22 2003-05-09 신에츠 폴리머 가부시키가이샤 Spring element, press-clamped connector, and holder with probe for electro-acoustic component
KR100509526B1 (en) * 2000-09-25 2005-08-23 제이에스알 가부시끼가이샤 Anisotropically Conductive Sheet, Production Process Thereof and Applied Product Thereof
JP4560195B2 (en) * 2000-10-13 2010-10-13 ポリマテック株式会社 holder
EP1251592A1 (en) * 2001-04-21 2002-10-23 Ascom AG System for securing and connecting modules of electrical apparatuses
JP2002324599A (en) * 2001-04-24 2002-11-08 Polymatech Co Ltd Holder and manufacturing method therefor
JP2002345084A (en) * 2001-05-16 2002-11-29 Citizen Electronics Co Ltd Speaker
JPWO2002101885A1 (en) * 2001-06-08 2004-09-30 信越ポリマー株式会社 Connector for electroacoustic component and connection structure thereof
JP2002373716A (en) * 2001-06-13 2002-12-26 Polymatech Co Ltd Elastic connector for vibration generator and device fitted therewith
JP4767450B2 (en) * 2001-08-09 2011-09-07 ポリマテック株式会社 Connector and manufacturing method thereof
JP3471775B2 (en) * 2001-08-27 2003-12-02 ヤマハメタニクス株式会社 Microphone holder
KR100923183B1 (en) * 2002-03-04 2009-10-22 스미토모덴키고교가부시키가이샤 Anisotropic conductive film and method for producing the same
EP1401053A1 (en) 2002-09-19 2004-03-24 Yamaha Metanix Corporation Microphone holder having connector unit molded together with conductive strips
KR100518116B1 (en) * 2002-10-01 2005-09-29 정낙환 Assembly of microphone holder and Manufacturing method thereof
JP4205420B2 (en) * 2002-12-24 2009-01-07 スター精密株式会社 Microphone device and holder
JP4761885B2 (en) 2005-08-18 2011-08-31 ポリマテック株式会社 Holder for small electronic components
KR100776189B1 (en) * 2006-10-16 2007-11-16 주식회사 비에스이 Mounting method for mounting microphone on flexible printed circuit board
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
WO2008097570A2 (en) * 2007-02-06 2008-08-14 World Properties, Inc. Conductive polymer foams, method of manufacture, and uses thereof
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
DE102007029854B3 (en) * 2007-06-28 2008-12-11 Siemens Home And Office Communication Devices Gmbh & Co. Kg contact system
JP5509486B2 (en) * 2009-03-05 2014-06-04 ポリマテック・ジャパン株式会社 Elastic connector, method for manufacturing elastic connector, and conductive connector
GB2491505B (en) * 2009-12-29 2014-03-12 Rogers Corp Conductive polymer foams, method of manufacture, and uses therof
US20130003323A1 (en) * 2011-06-29 2013-01-03 Loc Huynh Conductive gasket holder
CN109149181B (en) * 2018-09-12 2020-05-05 上海航天科工电器研究院有限公司 Elastic shielding ring for signal transmission

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3684817A (en) * 1971-03-04 1972-08-15 Cogar Corp Electronic module and cap therefor
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4008300A (en) * 1974-10-15 1977-02-15 A & P Products Incorporated Multi-conductor element and method of making same
US4209481A (en) * 1976-04-19 1980-06-24 Toray Industries, Inc. Process for producing an anisotropically electroconductive sheet
JPS606391U (en) * 1983-06-27 1985-01-17 株式会社東芝 Built-in microphone device
US4546037A (en) * 1984-09-04 1985-10-08 Minnesota Mining And Manufacturing Company Flexible tape having stripes of electrically conductive particles for making multiple connections
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
US5045249A (en) * 1986-12-04 1991-09-03 At&T Bell Laboratories Electrical interconnection by a composite medium
US4778635A (en) * 1987-09-18 1988-10-18 American Telephone And Telegraph Company Method and apparatus for fabricating anisotropically conductive material
JPH0754868B2 (en) * 1991-09-30 1995-06-07 松下電器産業株式会社 High frequency module board
JPH0770849B2 (en) * 1991-10-23 1995-07-31 山一電機株式会社 Electrical component holder
JPH0723517A (en) * 1993-07-02 1995-01-24 Fujitsu Ltd Attaching structure for power supply bar
WO1995005715A1 (en) * 1993-08-18 1995-02-23 Telefonaktiebolaget Lm Ericsson (Publ) Telephone handset
US5397240A (en) * 1993-10-26 1995-03-14 International Business Machines Corporation Electrical connector
SE506093C2 (en) * 1994-04-05 1997-11-10 Ericsson Ge Mobile Communicat Elastomeric coupling
US5831827A (en) * 1994-04-28 1998-11-03 Dallas Semiconductor Corporation Token shaped module for housing an electronic circuit
GB9510136D0 (en) * 1995-05-19 1995-07-12 At & T Corp Connector for mounting an electrical component
JP2899543B2 (en) * 1995-06-08 1999-06-02 信越ポリマー株式会社 Socket for connecting semiconductor package
JPH11514153A (en) * 1996-06-28 1999-11-30 シーメンス アクチエンゲゼルシヤフト Component casing for surface mounting semiconductor components
US5861578A (en) * 1997-01-27 1999-01-19 Rea Magnet Wire Company, Inc. Electrical conductors coated with corona resistant, multilayer insulation system
EP0880299A1 (en) * 1997-05-23 1998-11-25 Fuji Polymer Industries Co,, Ltd. Miniature microphone arrangement
US5843567A (en) * 1997-06-03 1998-12-01 Xerox Corporation Electrical component containing magnetic particles
US5917709A (en) * 1997-06-16 1999-06-29 Eastman Kodak Company Multiple circuit board assembly having an interconnect mechanism that includes a flex connector
US6307946B1 (en) * 1997-06-25 2001-10-23 Fuji Polymer Industries Co., Ltd. Miniature microphone component
KR100565935B1 (en) * 1997-09-03 2006-05-25 신에츠 포리마 가부시키가이샤 Integral holder-connector for capacitor microphone

Also Published As

Publication number Publication date
EP0938247A1 (en) 1999-08-25
US6217349B1 (en) 2001-04-17
DE69811629D1 (en) 2003-04-03
KR100592812B1 (en) 2006-09-22
EP0938247B1 (en) 2003-02-26
JPH11191469A (en) 1999-07-13
US6613267B1 (en) 2003-09-02
DE69811629T2 (en) 2003-12-18
KR19990063013A (en) 1999-07-26

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