JP2001332152A - Mid with metal piece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an MID having a metal piece, in which reliability and durability of a contact portion is high. SOLUTION: On the contact portion with other parts and the electrical contact portion in an MID 10, in which an electrical circuit pattern and the contact portion that come in electrical contact with other parts have been formed on a molded plastic, the metal pieces 11 are attached, so that an abrasion resistance at the contact portions is improved by a large amount as compared to a plating film in the conventional arts, and reliability and durability are improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an MID (Molded Inter) used for electronic parts and electric circuit parts.
Connected Device).

[0002]

2. Description of the Related Art FIG. 3 is an external perspective view showing a general method of using a MID.

In FIG. 1, an electronic component 1 such as a semiconductor element
2 shows a state in which the MID 2 mounted using solder (or wire bonding) is mounted on the printed circuit board 3. Soldering is often used at the electrical contact portion. However, in order to avoid the soldering work and to avoid the trouble of replacing parts (soldering and soldering), the printing is performed using the metal terminal 4 having a spring structure. Electric circuit pattern 5 by plating formed on substrate 3 and MID 2
Is widely used.

[0004]

However, in the method using the metal terminal 4 shown in the prior art, the metal terminal 4 and the electric circuit pattern 5 made of a plated film having a thickness of about 10 μm are in direct mechanical contact. This may cause a problem in the durability of the plating film.

[0005] In particular, the plating film tends to cause a problem when the electronic component is attached to and detached from the printed circuit board 3 many times, or when the electronic component 1 is slightly moved by vibration or the like.

Further, if the thickness of the plating film of the electric circuit pattern 5 is increased, the durability naturally increases, but the limit is generally several tens μm, which leads to a problem that the cost is increased.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide an MID with a metal piece having high reliability and durability of a contact portion.

[0008]

Means for Solving the Problems In order to achieve the above object, an MID with a metal piece according to the present invention is provided in a MID in which a plastic molding is provided with a contact portion for making electrical contact with an electric circuit pattern and other parts. , And a metal piece is attached to the contact portion.

In addition to the above configuration, the electric circuit pattern of the MID with metal piece of the present invention is preferably made of electroless copper plating having a thickness in the range of several μm to 100 μm.

According to the present invention, since the metal piece is attached to the contact portion with another component or the electrical contact portion, the wear resistance at the contact portion is greatly improved as compared with the conventional plating film. And
The reliability and durability are improved accordingly.

[0011]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is an external perspective view showing an embodiment of the MID with metal piece of the present invention. Note that common members are used for members similar to those in the conventional example.

The MID 10 with a metal piece is one in which an electric circuit pattern 5 is formed on a plastic molded product, and a metal piece 11 is attached to a contact portion that is in electrical contact with the printed circuit board 3 as another component. .

By configuring the MID 10 with a metal piece in this manner, the abrasion resistance at the contact portion is greatly improved as compared with the conventional plating film, and the reliability and durability are improved accordingly. That is, the MID 10 to which the electronic component 1 is attached can be attached to and detached from the printed circuit board 3 many times.

The electric circuit pattern 5 of the MID 10 is preferably made of an electroless copper plating having a thickness in the range of several μm to 100 μm. Cu, Fe, N
i or an alloy thereof is used, but is not particularly limited as long as it has conductivity. MID of metal piece 11
As a method of attaching to the device 10, fitting, bonding, driving, or the like is used, but is not particularly limited.

As a method of manufacturing the MID 10 with a metal piece, a method in which a metal piece 11 is attached to a contact portion using a so-called insert mold, and then the electric circuit pattern 5 is formed by a plating technique may be used. After performing the molding and plating operations as usual, a metal piece 11
May be fitted.

[0017]

Next, the present invention will be described with reference to specific numerical values, but the present invention is not limited thereto.

Liquid crystal polymer (hereinafter referred to as “LC”) is a resin that can be easily plated (easy plating resin).
P ". ) Is used to perform injection molding of plastic molded products. The obtained plastic molded product was immersed in a catalyst solution having the following composition at about 35 ° C. for 3 minutes, and further immersed in an accelerator solution at about 40 ° C. for about 3 minutes. Palladium as a catalyst core is deposited.

<Catalyst liquid composition> Palladium chloride: about 0.2 g / l Stannous chloride: about 15 g / l Hydrochloric acid: about 150 ml / l <Accelerator liquid composition> Sulfuric acid: about 100 g / l It is formed so as to be covered with a resin that is difficult to be plated (hard-to-plate resin). In this embodiment, an epoxy resin is used as the hard-to-plate resin.

Next, electroless plating is applied to the plastic molding covered with the epoxy resin.

As an example of the electroless plating step, in the present embodiment, the plating composition having the following composition was used at about 70 ° C., and the plating film thickness was formed to be about 30 μm. Since the plating film is formed only on the LCP, it can be freely formed into a predetermined shape.

<Electroless Electroless Cu Plating Composition> Copper sulfate about 10 g / l Rochelle salt about 40 g / l formaldehyde about 10 g / l sodium hydroxide about 10 g / l (pH 12.5) The MID 10 is obtained by attaching the metal piece 11 to the contact portion of the molded product. In this embodiment, the MID 10 shown in FIG. 1 is obtained by attaching a small piece of Cu material to an insertion hole provided in advance.

Next, a minute switch using the MID will be described.

FIGS. 4 (a) and 4 (b) are explanatory views of a micro switch manufactured by the conventional technique.

When a switch pin 23 having a T-shaped cross section is inserted through a hole 22 formed in an upper portion of a switch body 21 (FIG. 4A), the micro switch 20 has a metal terminal 24 and a copper plating portion 25. And the switch is disconnected (FIG. 4B).

In the prior art microswitch 20, since the joint portion is a joint between the plating film and the metal piece, the plating film is easily worn and has a problem in durability.

FIGS. 2A and 2B are explanatory views of a micro switch manufactured by the technique of the present invention.

When a switch pin 23 having a T-shaped cross section is inserted from a hole 22 formed in an upper portion of a switch body 21 (FIG. 2A), the metal switch 24 and the metal piece 31 of the micro switch 30 are connected to each other. Is opened, and the switch is turned off (FIG. 2B).

Unlike the prior art, the present microswitch 30 is excellent in durability and reliability because the bonding portion is made of metal and therefore has less wear than a plated film.

[0030]

In summary, according to the present invention, the following excellent effects are exhibited.

It is possible to provide an MID with a metal piece having high reliability and durability of the contact portion.

[Brief description of the drawings]

FIG. 1 is an external perspective view showing an embodiment of a MID with metal piece of the present invention.

FIGS. 2A and 2B are explanatory views of a micro switch manufactured by the technique of the present invention.

FIG. 3 is an external perspective view showing a general method of using the MID.

FIGS. 4A and 4B are explanatory diagrams of a microswitch manufactured by a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 3 Printed circuit board 4 Metal terminal 5 Electric circuit pattern 10 MID with metal piece 11 Metal piece

Claims (2)

[Claims] 1. A plastic molded article having a contact portion for electrically contacting an electric circuit pattern and other parts.
A MID with a metal piece, wherein a metal piece is attached to the contact portion in the ID. 2. The MID with a metal piece according to claim 1, wherein the electric circuit pattern is made of electroless copper plating having a thickness in a range of several μm to 100 μm.