KR100406258B1 - soldering method of condenser microphone using SMD formula - Google Patents

Abstract

The present invention relates to a soldering method of a condenser microphone using an SMD method in which the condenser microphone is mounted on a printed circuit board (PCB) of a product such as a mobile phone or a mobile terminal by an SMD (Surface Mounting Device) method.

That is, according to the present invention, the first step of drying the condenser microphone at a temperature of 100 to 110 ° C. for 4 hours, the positive terminal of the bottom center of the dried condenser microphone, and three of the negative terminals formed around A second step of partially applying solder cream to the PCB of the product for soldering the condenser microphone corresponding to four points, and placing the condenser microphone on the PCB of the solder cream-coated product and heating at 230 to 250 ° C. It is characterized in that it comprises a third step of connecting the condenser microphone to the PCB of the product by applying for 3 to 5 minutes.

Thus, the present invention can minimize the degradation of the sensitivity characteristics of the condenser microphone by the heat applied during the soldering operation. In addition, the present invention has the effect of reducing the working time by automatically promoting the soldering operation connecting the condenser microphone to the PCB of the product.

Description

Soldering method of condenser microphone using SMD method

The present invention relates to a soldering method of a condenser microphone using a SMD (Surface Mounting Device) method, and more particularly, to a capacitor (Printed Circuit Board) of a product such as a mobile phone or a mobile terminal by the SMD method. The soldering method of the condenser microphone using the SMD system which reflows a microphone.

In general, a pin method has been mainly used for mounting components such as resistors, capacitors, transistors, condenser microphones, etc. to PCBs of various products. However, as the volume of components is smaller and the space of products on which the components are to be mounted becomes smaller, SMD method is mainly used according to the needs of the pin method and the process automation.

This is to apply the solder cream on the PCB of products such as mobile terminals and mobile phones, and then put various components on the PCB of the products, and then heat and melt the solder cream to mount the components on the PCB of the products. Of course, each terminal of the components for the soldering operation must be composed of a single plane.

However, components such as condenser microphones are heat sensitive, so the characteristics change significantly after soldering. In other words, in order to melt a large amount of solder cream applied to the PCB of the product that will be in close contact with each terminal of the condenser microphone, high heat should be applied and as the amount of solder cream applied increases, the amount of residual heat also increases. Properties deteriorate.

In addition, a predetermined drying time is given before the condenser microphone is soldered. In the related art, a drying time of the condenser microphone is 8 to 10 hours, and thus the entire process becomes long.

The present invention for solving the conventional drawback as described above, by reducing the amount of heat applied to the condenser microphone when soldering (reflow operation) using the SMD method to minimize the degradation of the sensitivity characteristics of the condenser microphone by heat. It is an object of the present invention to provide a soldering method of a condenser microphone using an SMD method.

In addition, an object of the present invention is to provide a soldering method of a condenser microphone using an SMD method that can shorten the working time by automatically promoting the soldering operation for connecting the condenser microphone to the PCB of the product.

1 is a bottom view showing the contact point of the condenser microphone which is in close contact with the PCB of the product coated with the soldering cream in the present invention.

Figure 2 is a schematic diagram showing the adhesive structure of the PCB and the condenser microphone of the product.

※ Explanation of code about main part of drawing ※

1: condenser microphone 2: (+) terminal

3: (-) terminal 4,5: specific part

6,7: PCB 8: case

Soldering method of the condenser microphone using the SMD method according to the present invention for achieving the above object, the soldering of the condenser microphone using the SMD method for mounting the condenser microphone on a PCB embedded in a product such as a mobile phone or a mobile terminal. In the method, the first step of drying the condenser microphone at a temperature of 100 ~ 110 ℃ for 4 hours, the positive terminal in the center of the bottom surface of the dried condenser microphone, and three of the (-) terminal formed around A second step of partially applying solder cream to the PCB of the product for soldering the condenser microphone corresponding to four points, and placing the condenser microphone on the PCB of the solder cream-coated product and heating at 230 to 250 ° C. It is characterized in that it comprises a third step of connecting the condenser microphone to the PCB of the product by applying for 3 to 5 minutes.

Hereinafter, a preferred embodiment of the present invention will be described in detail with an exemplary drawing.

1 and 2, a condenser microphone 1 embedded in a small product such as a mobile phone or a mobile terminal has a PCB 6 having a capacitor, an FET, an amplifier, etc. mounted in the case 8, The (6) terminal (2) and (-) terminal (3) are formed on the surface of the PCB (6) for SMD connection (soldering). The terminal 3 is electrically connected to the case 8.

The process of connecting the condenser microphone 1 having the configuration as described above to the PCB 7 of a product such as a mobile phone or a mobile terminal in a SMD manner will be described.

First, prior to the soldering operation, the condenser microphone is dried at a temperature of 100 to 110 ° C. for 4 hours using a thermostat or other heating means. This is to minimize the characteristic change of the condenser microphone due to the sudden temperature change, and to completely remove the moisture remaining in the condenser microphone, so that the condenser microphone and the PCB can be perfectly bonded.

The PCB (6) of the condenser microphone (1) that has finished the drying process corresponds to the (+) terminal (2) in the center of the bottom and the specific portion (4) (5) of the annular (-) terminal (3) formed around the bottom. Solder cream (melting at 180 ℃ to 200 ℃ during soldering, and melting at 230 ℃ to 250 ℃ after soldering) by applying metal mask to PCB of products such as mobile terminal or mobile phone It is preferable to use solder cream). In particular, the solder cream is completely applied to the PCB of the product corresponding to the specific portion 5 of the (+) terminal 2, and the PCB of the product corresponding to the specific portion 4 of the annular (-) terminal 3 is applied. The solder cream is only partially applied at 3 to 5 points. That is, the PCB of the product corresponding to the annular (-) terminal (3) of the condenser microphone due to the heat generated during the soldering process while maintaining sufficient mechanical and electrical adhesion state with the annular (-) terminal (3) Minimize the amount of solder cream to minimize degradation.

After applying the solder cream to a specific part of the PCB of the product, the condenser microphone 1 is mounted on the PCB 7 of the product together with the other components as shown in Fig. By applying heat for 3 to 5 minutes, the positive terminal (2) and the negative terminal (3) of the PCB 7 and the condenser microphone 1 of the product are connected mechanically and electrically.

Table 1 to Figure 4 (Table 1 is 3 points, Table 2 is 4 points, Table 3 is 5 points, Table 4 is (-)) before and after the soldering operation between the capacitor microphone and the PCB of the product. It refers to the case where solder cream is applied to the PCB of the product corresponding to the whole terminal.)

Table 1

NO Before soldering After soldering Deviation One 42.3 dB 42.2 dB 0.1 dB 2 41.2 dB 41.0 dB 0.2 dB 3 41.8 dB 42.1 dB 0.3 dB 4 45.2 dB 45.7 dB 0.5 dB 5 44.5 dB 44.4 dB 0.1 dB 6 44.9 dB 45.1 dB 0.2 dB 7 42.8 dB 43.2 dB 0.4 dB 8 42.3 dB 42.0 dB 0.3 dB 9 41.8 dB 41.3 dB 0.5 dB 10 42.4 dB 42.1 dB 0.3 dB 11 43.7 dB 43.2 dB 0.5 dB 12 42.1 dB 42.0 dB 0.1 dB 13 45.0 dB 44.7 dB 0.3 dB 14 42.1 dB 41.9 dB 0.2 dB maximum 41.2 dB 41.0 dB 0.5 dB at least 45.2 dB 45.7 dB 0.5 dB Average 43.0 dB 42.9 dB 0.1 dB

Table 2

NO Before soldering After soldering Deviation One 43.6 dB 43.1 dB 0.5 dB 2 44.1 dB 43.1 dB -1.0 dB 3 42.8 dB 42.3 dB 0.5 dB 4 42.9 dB 42.7 dB 0.2 dB 5 45.8 dB 45.4 dB 0.4 dB 6 41.7 dB 42.3 dB 0.6 dB 7 42.3 dB 43.4 dB 1.4 dB 8 42.2 dB 42.5 dB 0.3 dB 9 45.8 dB 45.3 dB 0.5 dB 10 41.4 dB 40.8 dB 0.6 dB maximum 41.4 dB 40.8 dB 1.1 dB at least 45.8 dB 45.4 dB -1.0 dB Average 43.3 dB 43.1 dB 0.2 dB

Table 3

NO Before soldering After soldering Deviation One 43.1 dB 42.6 dB 0.5 dB 2 43.3 dB 43.1 dB 0.2 dB 3 38.1 dB 39.9 dB 1.8 dB 4 45.3 dB 45.7 dB 0.4 dB 5 45.7 dB 45.1 dB 0.6 dB 6 41.7 dB 41.1 dB 0.6 dB 7 42.1 dB 42.1 dB 0.0 dB 8 40.5 dB 40.1 dB 0.4 dB 9 42.2 dB 41.9 dB 0.3 dB 10 43.0 dB 43.1 dB 0.1 dB maximum 38.1 dB 39.9 dB 1.8 dB at least 45.7 dB 45.7 dB 0.6 dB Average 42.5 dB 42.5 dB 0.0 dB

Table 4 (Primary)

NO Before soldering After soldering Deviation One 42.1 dB 43.6 dB 1.5 dB 2 43.7 dB 45.1 dB 1.4 dB 3 40.1 dB 41.2 dB 1.1 dB 4 44.8 dB 45.9 dB 1.1 dB 5 44.7 dB 46.1 dB 1.4 dB 6 42.6 dB 44.6 dB 2.0 dB 7 43.1 dB 44.3 dB 1.2 dB 8 42.5 dB 44.1 dB 1.6 dB 9 41.2 dB 42.8 dB 1.6 dB 10 42.5 dB 43.0 dB 0.5 dB maximum 40.1 dB 41.2 dB 2.0 dB at least 44.8 dB 46.1 dB 0.5 dB Average 42.7 dB 44.0 dB 1.3 dB

As described above, according to the conventional method of soldering after applying the solder cream to the PCB corresponding to the entire (-) terminal (3), the deviation before and after the soldering operation as shown in Table 4 above -0.5 to-2.0 dB, but according to the method according to the invention to apply the solder cream only to a specific portion of the PCB corresponding to the 3 to 5 points of the (-) terminal (3) the soldering operation according to the above Table 1 to As shown in Table 3, the deviation before and after soldering is only -0.6 to 1.8 dB. In particular, in the case of applying solder cream to a specific part of the PCB corresponding to three points of the method of partially applying the solder cream, the deviation before and after the soldering operation is -0.5 to 0.5 dB as shown in Table 1 above. Is the least.

Therefore, it can be seen that the deterioration of the condenser microphone is minimized by partially soldering the solder cream and then performing the soldering operation.

Therefore, according to the present invention, by reducing the amount of heat applied to the condenser microphone when soldering by the SMD method, there is an effect that it is possible to minimize the degradation of the sensitivity characteristics of the condenser microphone by heat.

In addition, the present invention has the effect of reducing the working time by automatically promoting the soldering operation connecting the condenser microphone to the PCB of the product.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims (1)

In the soldering method of the condenser microphone using the SMD method of mounting the condenser microphone on the PCB embedded in products such as mobile phones and mobile terminals, A first step of drying the condenser microphone at a temperature of 100 to 110 ° C. for 4 hours; Partially applying solder cream to a PCB of a product for soldering the condenser microphone to correspond to three or four points of the negative terminal in the center of the bottom surface of the dried condenser microphone and the negative terminal formed on the periphery thereof Second step; And A third step of mounting the condenser microphone on the PCB of the solder cream-coated product and connecting the condenser microphone to the PCB of the product by applying heat of 230 to 250 ° C. for 3 to 5 minutes; Soldering method of a condenser microphone using a SMD method characterized in that it comprises a.