JP2005093752A - Electronic component device - Google Patents

Electronic component device Download PDF

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Publication number
JP2005093752A
JP2005093752A JP2003325708A JP2003325708A JP2005093752A JP 2005093752 A JP2005093752 A JP 2005093752A JP 2003325708 A JP2003325708 A JP 2003325708A JP 2003325708 A JP2003325708 A JP 2003325708A JP 2005093752 A JP2005093752 A JP 2005093752A
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Prior art keywords
electronic component
circuit board
shield case
fixing portion
solder
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Japanese (ja)
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Shiyunei Nobusada
俊英 信定
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2003325708A priority Critical patent/JP2005093752A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

<P>PROBLEM TO BE SOLVED: To improve adhesion strength between an electronic component device and a mother board. <P>SOLUTION: A mother board electrode 8 of a mother board 6 is connected to an external connection electrode 7 of a circuit board 2 in the electronic component device with solder 9. Further, a solder application portion 4 is provided on the surface of the periphery fixing portion 3 of a shield case 1 not in contact with the circuit board 2, so that the portion 4 can be soldered to a mother board grounding electrode 13 on the mother board 6, and the solder application portion 4 is connected to the mother board grounding electrode 13 with a module fixing solder connection portion 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電子部品装置に係り、特に回路基板の一面を電子部品と共に覆うシールドケースを具備する電子部品装置に関するものである。   The present invention relates to an electronic component device, and more particularly to an electronic component device including a shield case that covers one surface of a circuit board together with the electronic component.

近年、携帯電話あるいはＰＤＡ（Personal Digital Assistant）などの通信機器では多機能化が進行している。これに伴い内部の回路構成も複雑化しており、各ブロックの品質保証，実装容易性などの観点から各回路ブロックを、あらかじめ電子部品装置としてモジュール化し、マザーボードに実装する構成を採用したものがある（特許文献１参照）。   In recent years, communication devices such as mobile phones and PDAs (Personal Digital Assistants) have become multifunctional. Along with this, the internal circuit configuration has become complicated, and from the viewpoints of quality assurance and ease of mounting of each block, there is a configuration in which each circuit block is modularized in advance as an electronic component device and mounted on a motherboard. (See Patent Document 1).

特に、通信機器の回路ブロックの中で無線回路部分は最も高い周波数を取り扱うため、高周波特有の回路ノウハウが必要となり、セットサイドからモジュール化された電子部品装置としての要望が強い部分である。   Particularly, in the circuit block of the communication device, the radio circuit portion handles the highest frequency, so that circuit know-how specific to high frequency is required, and there is a strong demand as a modularized electronic component device from the set side.

図７は従来の高周波回路ブロックをモジュール化した電子回路装置を示す斜視図、図８は図７の電子回路装置の実装状態を示す断面図であり、１は回路基板２を覆うシールドケース、３はシールドケース１の外周固定部、５は回路基板２のシールドケース固定部、６はマザーボード、７は回路基板２の外部接続電極、８はマザーボード電極、９は電極固定用の半田、１０は回路基板２に実装された電子部品である。   7 is a perspective view showing an electronic circuit device in which a conventional high-frequency circuit block is modularized, FIG. 8 is a cross-sectional view showing a mounting state of the electronic circuit device of FIG. 7, 1 is a shield case that covers the circuit board 2, 3 Is the outer periphery fixing part of the shield case 1, 5 is the shield case fixing part of the circuit board 2, 6 is the motherboard, 7 is the external connection electrode of the circuit board 2, 8 is the motherboard electrode, 9 is the solder for fixing the electrode, 10 is the circuit This is an electronic component mounted on the substrate 2.

この電子回路装置は、セラミックあるいは樹脂などで構成される回路基板２上に、半導体素子と抵抗，コンデンサ，インダクタなどの受動素子などの電子部品１０が半田実装されており、さらに、他の回路ブロックとの相互干渉を遮蔽するために導電性金属材からなるシールドケース１が設けられている。このシールドケース１は、回路基板２の端面に設けられたシールドケース固定部５に半田付けされることによって固定されると共にシールドケース固定部５を通じて接地端子に接続される。また、回路基板２の裏面に設けられた外部接続電極７は、マザーボード６側の電極８に半田実装されて電力供給あるいは信号の入出力を行う。   In this electronic circuit device, a semiconductor element and an electronic component 10 such as a passive element such as a resistor, a capacitor, and an inductor are solder-mounted on a circuit board 2 made of ceramic or resin. A shield case 1 made of a conductive metal material is provided to shield the mutual interference with each other. The shield case 1 is fixed by being soldered to a shield case fixing portion 5 provided on an end surface of the circuit board 2 and is connected to a ground terminal through the shield case fixing portion 5. The external connection electrodes 7 provided on the back surface of the circuit board 2 are solder-mounted on the electrodes 8 on the mother board 6 side to supply power or input / output signals.

上記のような電子部品装置を製作し、所定の回路ブロックを機能保証することにより、一部の回路ブロックの開発に係わる工数を軽減することができ、効率的に複雑な電子機器を実現することが可能となる。
特開２００１−３０８５７９号公報 Manufacture electronic component devices as described above and guarantee the functions of predetermined circuit blocks, thereby reducing the man-hours involved in the development of some circuit blocks and efficiently realizing complex electronic devices. Is possible.
JP 2001-308579 A

上述したように電子部品装置は、信号の入出力を兼ねた裏面の電極部の半田によりマザーボードに固定される。したがって、マザーボードと電子部品装置との密着強度は電極数と電極の面積に依存する。回路規模の大きいブロックが構成された電子部品装置では、そのサイズが大きくなったり、また入出力端子が多い電子部品装置においては、電極数を多数設けるために電極面積が小さくなったりする。   As described above, the electronic component device is fixed to the mother board by soldering the electrode portion on the back surface that also serves as signal input / output. Therefore, the adhesion strength between the mother board and the electronic component device depends on the number of electrodes and the area of the electrodes. In an electronic component device in which a block having a large circuit scale is configured, the size of the electronic component device is increased, and in an electronic component device having a large number of input / output terminals, the electrode area is reduced because a large number of electrodes are provided.

このような電子部品装置では、マザーボードと電子部品装置は熱膨張係数の違いによって、ヒートサイクル試験においてマザーボードと電子部品装置の半田実装部分が断線するという不良が発生しやすくなるという問題が生じる。   In such an electronic component device, there arises a problem that the mother board and the electronic component device are likely to have a defect that the solder mounting portion of the mother board and the electronic component device is disconnected in the heat cycle test due to the difference in thermal expansion coefficient.

本発明は、前記従来の課題を解決するためになされたものであり、マザーボードとの密着強度の高い電子部品装置を提供することを目的とする。   The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide an electronic component device having high adhesion strength with a mother board.

前記目的を達成するため、請求項１に記載の発明は、一面にマザーボードと電気的な接続をするための電極が設けられた回路基板と、該回路基板の他面に搭載された電子部品と、前記回路基板の一面を前記電子部品と共に覆うシールドケースを備えた電子部品装置において、前記シールドケースに外周固定部を設け、該外周固定部を前記回路基板に半田あるいは銀ペーストにより固定し、かつ前記外周固定部の外側に該外周固定部を前記マザーボードの接地パターンに半田固定するための半田塗布部を設けたことを特徴とする。   In order to achieve the above object, the invention according to claim 1 is directed to a circuit board provided with an electrode for electrical connection with a motherboard on one side, and an electronic component mounted on the other side of the circuit board. An electronic component device comprising a shield case that covers one surface of the circuit board together with the electronic component, wherein the shield case is provided with an outer peripheral fixing portion, and the outer peripheral fixing portion is fixed to the circuit board with solder or silver paste; and A solder application portion for soldering the outer periphery fixing portion to the ground pattern of the motherboard is provided outside the outer periphery fixing portion.

また、請求項２に記載の発明は、一面にマザーボードと電気的な接続をするための電極が設けられた回路基板と、該回路基板の他面に搭載された電子部品と、前記回路基板の一面を前記電子部品と共に覆うシールドケースを備えた電子部品装置において、前記シールドケースに外周固定部を設け、該外周固定部を固定する固定溝を前記回路基板に設け、かつ前記外周固定部の外側に該外周固定部を前記マザーボードの接地パターンに半田固定するための半田塗布部を設けたことを特徴とする。   According to a second aspect of the present invention, there is provided a circuit board provided with an electrode for electrical connection with a mother board on one side, an electronic component mounted on the other side of the circuit board, and the circuit board. In an electronic component device including a shield case that covers one surface together with the electronic component, an outer periphery fixing portion is provided in the shield case, a fixing groove for fixing the outer periphery fixing portion is provided in the circuit board, and an outer side of the outer periphery fixing portion And a solder coating portion for soldering the outer periphery fixing portion to the ground pattern of the mother board.

このように構成することにより、電子部品装置の電極に加えシールドケースの外周固定部がマザーボードと半田固定することができるため、密着高度の強い電子部品装置を構成することができる。   With this configuration, since the outer peripheral fixing portion of the shield case can be solder-fixed to the mother board in addition to the electrodes of the electronic component device, an electronic component device having a high adhesion level can be configured.

本発明の電子部品装置によれば、シールドケースと回路基板を固定する外周固定部に半田塗布部が設けられており、マザーボードとシールドケースを直接実装できるため、電子部品装置とマザーボードとの間の密着強度を強化することができる。このため熱衝撃試験，落下試験などの信頼性強化を図ることができ、さらにシールドケースはマザーボードの接地電極と直接接続できるため、従来のように回路基板の側面でグランドに接地する必要がなくなり、回路基板設計の自由度が高くなる。   According to the electronic component device of the present invention, the solder coating portion is provided in the outer peripheral fixing portion that fixes the shield case and the circuit board, and the mother board and the shield case can be directly mounted. The adhesion strength can be enhanced. For this reason, it is possible to enhance the reliability of thermal shock test, drop test, etc. Furthermore, since the shield case can be directly connected to the ground electrode of the motherboard, there is no need to ground to the ground on the side of the circuit board as before, The degree of freedom in circuit board design is increased.

以下、本発明の実施形態について図面を参照して説明する。なお、以下の説明において、図７，図８にて説明した部材には同一符号を付して詳しい説明は省略する。   Embodiments of the present invention will be described below with reference to the drawings. In the following description, the members described in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

図１は本発明の実施形態１の高周波回路ブロックをモジュール化した電子回路装置を示す斜視図、図２は図１の電子回路装置の実装状態を示す断面図である。   1 is a perspective view showing an electronic circuit device obtained by modularizing the high-frequency circuit block according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view showing a mounted state of the electronic circuit device of FIG.

電子部品装置には、高周波回路ブロックを集積化している半導体ＩＣあるいはフィルタ，コンデンサ，抵抗，インダクタなどの電子部品１０が、回路基板２上に半田実装されている。回路基板２は、絶縁性樹脂あるいはセラミックなどの材料からなる多層基板であり、各層にパターニングされた配線と層間を接続しているスルーホール（図示せず）により各電子部品と外部接続電極７とを相互に配線している。   In the electronic component device, a semiconductor IC in which high-frequency circuit blocks are integrated or an electronic component 10 such as a filter, a capacitor, a resistor, and an inductor is solder-mounted on the circuit board 2. The circuit board 2 is a multilayer board made of a material such as an insulating resin or ceramic, and each electronic component and the external connection electrode 7 are connected to each other by wirings patterned on each layer and through holes (not shown) connecting the layers. Are interconnected.

さらに電子部品装置に対して、外部からの電波の干渉の防止あるいは当該電子部品装置からの電波の放出を防ぐためにシールドケース１が覆うように設けられている。シールドケース１は、回路基板２に固定されるための外周固定部３が設けられており、回路基板２の側面に設けられたシールドケース固定部５に半田付け、もしくはレーザー溶接によって固定されている。シールドケース１を半田で回路基板２に固定する場合には、電子部品装置をマザーボード６に半田実装するときにシールドケース１が浮き上がったり位置ずれしたりしないように、通常、マザーボード６に実装するときに用いる半田の融点よりも高い温度で溶融する半田を使用する。   Furthermore, a shield case 1 is provided to cover the electronic component device in order to prevent external radio wave interference or emission of the radio wave from the electronic component device. The shield case 1 is provided with an outer periphery fixing portion 3 for fixing to the circuit board 2 and is fixed to the shield case fixing portion 5 provided on the side surface of the circuit board 2 by soldering or laser welding. . When the shield case 1 is fixed to the circuit board 2 with solder, it is usually mounted on the motherboard 6 so that the shield case 1 is not lifted or displaced when the electronic component device is solder mounted on the motherboard 6. Solder that melts at a temperature higher than the melting point of the solder used in the above is used.

さらに、シールドケース１の外周固定部３における回路基板２と接触しない面には、マザーボード６上のマザーボード接地電極１３に半田付けできるように半田が塗布された半田塗布部４が設けられている。   Further, on the surface of the outer periphery fixing portion 3 of the shield case 1 that is not in contact with the circuit board 2, a solder application portion 4 to which solder is applied so as to be soldered to the motherboard ground electrode 13 on the motherboard 6 is provided.

上記のように構成することによって、特定の高周波回路ブロックをモジュール化した電子部品装置は、マザーボード６に半田実装され、特定の回路ブロックとして機能する。受け基板となるマザーボード６にはマザーボード電極８およびマザーボード接地電極１３が設けられており、電子部品装置の外部接続電極７を半田９により接続すると同時にシールドケース１も半田（モジュール固定半田接続部１１）で固定する。   By configuring as described above, an electronic component device obtained by modularizing a specific high-frequency circuit block is solder-mounted on the mother board 6 and functions as a specific circuit block. A mother board 6 serving as a receiving board is provided with a mother board electrode 8 and a mother board ground electrode 13. The external connection electrode 7 of the electronic component device is connected by solder 9 and at the same time the shield case 1 is also soldered (module fixing solder connection portion 11). Secure with.

上記のように外部接続電極７とシールドケース１をマザーボード６に半田付けすることにより、電子部品装置とマザーボード６との間の密着強度を強化することができるため、熱衝撃試験，落下試験などの信頼性強化を図ることができる。さらに、シールドケース１はマザーボード６の接地電極１３と直接接続することができるため、従来のように回路基板２の側面においてＧＮＤへの接地が必要ないため、回路基板２の設計の自由度が高くなる。   By soldering the external connection electrode 7 and the shield case 1 to the mother board 6 as described above, the adhesion strength between the electronic component device and the mother board 6 can be enhanced, so that a thermal shock test, a drop test, etc. Reliability can be enhanced. Further, since the shield case 1 can be directly connected to the ground electrode 13 of the mother board 6, since there is no need to ground to the GND on the side surface of the circuit board 2 as in the prior art, the design flexibility of the circuit board 2 is high. Become.

図３は本発明の実施形態２の高周波回路ブロックをモジュール化した電子回路装置を示す斜視図、図４は図２の電子回路装置の実装状態を示す断面図である。   FIG. 3 is a perspective view showing an electronic circuit device obtained by modularizing the high-frequency circuit block according to Embodiment 2 of the present invention, and FIG. 4 is a cross-sectional view showing a mounted state of the electronic circuit device of FIG.

実施形態２では、実施形態１と同様に高周波回路ブロックを集積化している半導体ＩＣあるいはフィルタ，コンデンサ，抵抗，インダクタなどの電子部品１０が、回路基板２上に半田実装されている。回路基板２は絶縁性樹脂あるいはセラミックなどの材料からなる多層基板であり、各層にパターニングされた配線と層間を接続しているスルーホール（図示せず）により、各電子部品と外部接続電極７とを相互に配線している。   In the second embodiment, as in the first embodiment, a semiconductor IC in which high-frequency circuit blocks are integrated, or an electronic component 10 such as a filter, a capacitor, a resistor, and an inductor is solder-mounted on the circuit board 2. The circuit board 2 is a multilayer board made of a material such as an insulating resin or ceramic, and each electronic component and the external connection electrode 7 are connected to each other by wirings patterned on each layer and through holes (not shown) connecting the layers. Are interconnected.

実施形態２ではシールドケースを回路基板２に機械的に固定できるように、シールドケース１に鍵状の外周固定部３が設けられており、一方、回路基板２の側面には鍵状の外周固定部３と同様の形状の固定溝１２が形成されており、外周固定部３を固定溝１２に嵌め込むことによって、シールドケース１が回路基板２に固定されるようになっている。このように構成することにより、実施形態１において必要であったシールドケース１の回路基板２への半田付けの工程を省略できる。   In the second embodiment, the shield case 1 is provided with a key-shaped outer periphery fixing portion 3 so that the shield case can be mechanically fixed to the circuit board 2. A fixing groove 12 having the same shape as the portion 3 is formed, and the shield case 1 is fixed to the circuit board 2 by fitting the outer peripheral fixing portion 3 into the fixing groove 12. With this configuration, the process of soldering the shield case 1 to the circuit board 2 that is necessary in the first embodiment can be omitted.

また外周固定部３には、実施形態１と同様にマザーボード６と半田実装できるように、半田塗布部４が設けられており、マザーボード６に外部接続電極７と外周固定部３の半田塗布部４を同時に半田付けすることができる。   The outer periphery fixing portion 3 is provided with a solder application portion 4 so that it can be soldered to the mother board 6 in the same manner as in the first embodiment. The outer connection electrode 7 and the solder application portion 4 of the outer periphery fixing portion 3 are provided on the mother board 6. Can be soldered simultaneously.

前記構成の実施形態２の電子部品装置でも、前記実施形態１と同様の作用効果を得ることができる。   The electronic component device according to the second embodiment having the above-described configuration can obtain the same effects as those of the first embodiment.

なお、図５，図６に示すように、実施形態２において、鍵状の外周固定部３を回路基板２のシールドケース固定部５に半田付けすることにより、さらに接合強度を増すことができる。   As shown in FIGS. 5 and 6, in the second embodiment, the bonding strength can be further increased by soldering the key-shaped outer periphery fixing portion 3 to the shield case fixing portion 5 of the circuit board 2.

本発明は、回路基板の一面を電子部品と共に覆うシールドケースを具備する電子部品装置に適用され、特にシールドケースとマザーボードとの密着強度が要求される電子部品装置に用いて有効である。   The present invention is applied to an electronic component device including a shield case that covers one surface of the circuit board together with the electronic component, and is particularly effective for use in an electronic component device that requires adhesion strength between the shield case and the motherboard.

本発明の実施形態１の高周波回路ブロックをモジュール化した電子回路装置を示す斜視図The perspective view which shows the electronic circuit device which modularized the high frequency circuit block of Embodiment 1 of this invention 実施形態１の電子回路装置における実装状態を示す断面図Sectional drawing which shows the mounting state in the electronic circuit device of Embodiment 1. 本発明の実施形態２の高周波回路ブロックをモジュール化した電子回路装置を示す斜視図The perspective view which shows the electronic circuit device which modularized the high frequency circuit block of Embodiment 2 of this invention 実施形態２の電子回路装置における実装状態を示す断面図Sectional drawing which shows the mounting state in the electronic circuit device of Embodiment 2. 実施形態２の電子回路装置の変形例を示す斜視図The perspective view which shows the modification of the electronic circuit device of Embodiment 2. FIG. 実施形態２の電子回路装置の変形例における実装状態を示す断面図Sectional drawing which shows the mounting state in the modification of the electronic circuit device of Embodiment 2. 従来の高周波回路ブロックをモジュール化した電子回路装置を示す斜視図The perspective view which shows the electronic circuit device which modularized the conventional high frequency circuit block 従来の電子回路装置における実装状態を示す断面図Sectional drawing which shows the mounting state in the conventional electronic circuit device

符号の説明Explanation of symbols

１ シールドケース
２ 回路基板
３ 外周固定部
４ 半田塗布部
５ シールドケース固定部
６ マザーボード
７ 外部接続電極
８ マザーボード電極
９ 半田
１０ 電子部品
１１ モジュール固定半田接続部
１２ シールドケース固定溝
１３ マザーボード接地電極 DESCRIPTION OF SYMBOLS 1 Shield case 2 Circuit board 3 Outer periphery fixing | fixed part 4 Solder application part 5 Shield case fixing | fixed part 6 Mother board 7 External connection electrode 8 Mother board electrode 9 Solder 10 Electronic component 11 Module fixing solder connection part 12 Shield case fixing groove 13 Motherboard ground electrode

Claims (2)

一面にマザーボードと電気的な接続をするための電極が設けられた回路基板と、該回路基板の他面に搭載された電子部品と、前記回路基板の一面を前記電子部品と共に覆うシールドケースを備えた電子部品装置において、
前記シールドケースに外周固定部を設け、該外周固定部を前記回路基板に半田あるいは銀ペーストにより固定し、かつ前記外周固定部の外側に該外周固定部を前記マザーボードの接地パターンに半田固定するための半田塗布部を設けたことを特徴とする電子部品装置。 A circuit board having an electrode for electrical connection with a motherboard on one side, an electronic component mounted on the other side of the circuit board, and a shield case that covers the one side of the circuit board together with the electronic part In electronic component equipment
An outer periphery fixing portion is provided in the shield case, the outer periphery fixing portion is fixed to the circuit board by solder or silver paste, and the outer periphery fixing portion is fixed to the ground pattern of the motherboard outside the outer periphery fixing portion. An electronic component device comprising a solder application part. 一面にマザーボードと電気的な接続をするための電極が設けられた回路基板と、該回路基板の他面に搭載された電子部品と、前記回路基板の一面を前記電子部品と共に覆うシールドケースを備えた電子部品装置において、
前記シールドケースに外周固定部を設け、該外周固定部を固定する固定溝を前記回路基板に設け、かつ前記外周固定部の外側に該外周固定部を前記マザーボードの接地パターンに半田固定するための半田塗布部を設けたことを特徴とする電子部品装置。 A circuit board having an electrode for electrical connection with a motherboard on one side, an electronic component mounted on the other side of the circuit board, and a shield case that covers the one side of the circuit board together with the electronic part In electronic component equipment
An outer periphery fixing portion is provided in the shield case, a fixing groove for fixing the outer periphery fixing portion is provided in the circuit board, and the outer periphery fixing portion is fixed to the ground pattern of the motherboard on the outside of the outer periphery fixing portion. An electronic component device provided with a solder application part.
JP2003325708A 2003-09-18 2003-09-18 Electronic component device Pending JP2005093752A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035058A (en) * 2009-07-30 2011-02-17 Sharp Corp High frequency module, and printed circuit board with high frequency module mounted thereon
KR20140136743A (en) * 2013-05-21 2014-12-01 삼성전기주식회사 High frequency module
CN106455463A (en) * 2016-09-30 2017-02-22 奇酷互联网络科技（深圳）有限公司 Shielding device, manufacturing method of shielding device and electronic equipment
WO2018163961A1 (en) * 2017-03-06 2018-09-13 株式会社村田製作所 Structure and method for mounting shield-equipped module on printed wiring board, and shield-equipped module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035058A (en) * 2009-07-30 2011-02-17 Sharp Corp High frequency module, and printed circuit board with high frequency module mounted thereon
KR20140136743A (en) * 2013-05-21 2014-12-01 삼성전기주식회사 High frequency module
KR101994714B1 (en) 2013-05-21 2019-07-01 삼성전기주식회사 High frequency module
CN106455463A (en) * 2016-09-30 2017-02-22 奇酷互联网络科技（深圳）有限公司 Shielding device, manufacturing method of shielding device and electronic equipment
WO2018163961A1 (en) * 2017-03-06 2018-09-13 株式会社村田製作所 Structure and method for mounting shield-equipped module on printed wiring board, and shield-equipped module
JPWO2018163961A1 (en) * 2017-03-06 2019-11-07 株式会社村田製作所 Mounting structure and mounting method of shielded module on printed wiring board, and shielded module
US20190387612A1 (en) * 2017-03-06 2019-12-19 Murata Manufacturing Co., Ltd. Structure and method for mounting shielded module on printed wiring board, and shielded module
US10750609B2 (en) 2017-03-06 2020-08-18 Murata Manufacturing Co., Ltd. Structure and method for mounting shielded module on printed wiring board, and shielded module

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