JPH09223873A - Portable electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-price, thin and light weight portable electronic device by using conductive paste. SOLUTION: After applying low-temperature curing type conductive paste in a case 1, a pattern 3 is formed by drying and curing the paste at 150 deg.C for 30 minutes. Then after applying lowtemperature curing type conductive paste, a pad 2 is formed by drying and curing the paste at 150 deg.C for 30 minutes. Therefore, a component 4 is mounted on the pad 2 formed in the case 1 and is soldered, and a circuit is formed in the case 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a portable electronic device, and more particularly to a portable electronic device using a conductive paste.

[0002]

2. Description of the Related Art In a conventional printed circuit board of a portable electronic device (not shown), when a pattern is formed by using a conductive paste, the conductive paste does not have good solderability, and therefore a pad for soldering is used. The copper-clad laminate is used in combination with a copper foil and is combined with a conductive paste.

[0003]

However, in the conventional portable electronic device, the copper foil of the pad to be soldered needs to be subjected to the step of etching the copper clad laminate on the printed circuit board, so that the degree of freedom in design is low. Limited, it has hindered the thinning, weight reduction, and cost reduction of electronic devices.

Therefore, an object of the present invention is to provide a thin, lightweight and inexpensive portable electronic device without using a printed circuit board.

[0005]

In order to solve the above-mentioned problems, a portable electronic device of the present invention comprises a resin case,
The parts mounted in this case, the pads formed in the case by the low temperature curable conductive paste to which the parts are soldered, and the low temperature curable conductive paste that connects the pads in the case And a pattern formed on the.

In order to solve the above-mentioned problems, the portable electronic device of the present invention applies an insulating paste onto the pattern, and forms a pad and a low-temperature curable conductive paste on the insulating paste. It is characterized by being composed of patterns.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a portable electronic device according to a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram of a portable electronic device according to a first embodiment of the present invention.

In the portable electronic device according to the first embodiment of the present invention, as shown in FIG. 1, a resin case 1, a component 4 mounted in the case 1, and the component 4 are soldered. The pad 2 is formed in the case by the low temperature curable conductive paste and the pattern 3 is formed in the case by the low temperature curable conductive paste connecting the pads 2.

Next, a method of manufacturing the portable electronic device according to the first embodiment of the present invention will be described with reference to the drawings.

In the method of manufacturing a portable electronic device according to the first embodiment of the present invention, as shown in FIG. 1, first, a low temperature curable conductive paste is applied in a case 1 and then at 30 ° C. at 30 ° C.
After drying and curing for 3 minutes to form pattern 3, after applying low temperature curable conductive paste, it is heated at 150 ° C for 30 minutes.
Dry and cure for minutes to form pad 2.

Therefore, the pad 2 formed in the case 1
The component 4 is mounted and soldered to form a circuit in the case 1.

Next, a portable electronic device according to a second embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a block diagram of a portable electronic device according to a second embodiment of the present invention.

The portable electronic device according to the second embodiment of the present invention, as shown in FIG.
And the component 4 mounted in the case 1 and the component 4
The pad 2 formed in the case by the low temperature curable conductive paste soldered to, the pattern 3 formed in the case by the low temperature curable conductive paste connecting the pads 2, and the pattern 3 And a pad 2 and a pattern 3 formed of a low temperature curable conductive paste with an insulating paste 6 interposed therebetween.

Next, a method of manufacturing the portable electronic device according to the second embodiment of the present invention will be described with reference to the drawings.

In the method of manufacturing the portable electronic device according to the second embodiment of the present invention, as shown in FIG. 2, first, a low temperature curable conductive paste is applied in the case 1 and then at 30 ° C. at 30 ° C.
After drying and curing for 3 minutes to form pattern 3, after applying low temperature curable conductive paste, it is heated at 150 ° C for 30 minutes.
Dry and cure for minutes to form pad 2.

Further, an insulating paste 6 such as a resist is placed in a space where the component 4 can be added in the case 1 in which the component is mounted.
Is applied and cured, and then a low temperature curable conductive paste is applied and dried and cured at 150 ° C. for 30 minutes to form a pattern 3.

Further, after applying the low temperature curable conductive paste, it is dried and cured at 150 ° C. for 30 minutes to be pad 2
Then, the component 4 is soldered on the pad 2.

[0020]

As described above, according to the portable electronic device of the present invention, a circuit can be formed by using the low temperature curable conductive paste, so that the step of etching the copper foil on the printed circuit board becomes unnecessary, In addition, since it is possible to process even a substrate with low heat resistance, the degree of freedom in design is increased, the device is thin and lightweight, and the cost is reduced, and insulating paste is applied to facilitate three-dimensional component mounting. Has the effect of

[Brief description of drawings]

FIG. 1 is a configuration diagram of a portable electronic device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a portable electronic device according to a second embodiment of the present invention.

[Explanation of symbols]

 1 case 2 pad 3 pattern 4 parts 5 solder 6 insulating paste

Claims (2)

[Claims] 1. A resin case, a component mounted in the case, a pad formed in the case with a low temperature curable conductive paste to which the component is soldered, and a connection between the pads. And a pattern formed in the case with the low temperature curable conductive paste described above. 2. The portable electronic device according to claim 1, wherein an insulating paste is applied on the pattern, and the insulating paste includes a pad and a pattern formed of a low temperature curable conductive paste. apparatus.