TW200817150A - Multi-joint robot and wiring method - Google Patents

Multi-joint robot and wiring method Download PDF

Info

Publication number
TW200817150A
TW200817150A TW096124500A TW96124500A TW200817150A TW 200817150 A TW200817150 A TW 200817150A TW 096124500 A TW096124500 A TW 096124500A TW 96124500 A TW96124500 A TW 96124500A TW 200817150 A TW200817150 A TW 200817150A
Authority
TW
Taiwan
Prior art keywords
joint
core cable
hand
cable
wiring
Prior art date
Application number
TW096124500A
Other languages
English (en)
Chinese (zh)
Other versions
TWI329558B (https=
Inventor
Satoshi Sueyoshi
Kentaro Tanaka
Tomohiro Matsuo
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of TW200817150A publication Critical patent/TW200817150A/zh
Application granted granted Critical
Publication of TWI329558B publication Critical patent/TWI329558B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0025—Means for supplying energy to the end effector
    • B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/10—Program-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Program-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
TW096124500A 2006-07-11 2007-07-05 Multi-joint robot and wiring method TW200817150A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006190823 2006-07-11

Publications (2)

Publication Number Publication Date
TW200817150A true TW200817150A (en) 2008-04-16
TWI329558B TWI329558B (https=) 2010-09-01

Family

ID=38923082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096124500A TW200817150A (en) 2006-07-11 2007-07-05 Multi-joint robot and wiring method

Country Status (5)

Country Link
JP (1) JP4911371B2 (https=)
KR (1) KR101108767B1 (https=)
CN (1) CN101484281B (https=)
TW (1) TW200817150A (https=)
WO (1) WO2008007517A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100914387B1 (ko) * 2006-07-11 2009-08-28 가부시키가이샤 야스카와덴키 다관절 로봇
JP2010064219A (ja) * 2008-09-12 2010-03-25 Yaskawa Electric Corp 多関節ロボット
JP5263945B2 (ja) * 2008-09-17 2013-08-14 株式会社レクザム ダブルアーム型ロボット
EP2872301B1 (en) * 2012-07-13 2017-01-11 ABB Schweiz AG Structure used for robot
CN103802131A (zh) * 2012-11-08 2014-05-21 沈阳新松机器人自动化股份有限公司 堆垛机手臂结构及其走线布置方法
JP6108859B2 (ja) * 2013-02-13 2017-04-05 日本電産サンキョー株式会社 産業用ロボット
JP7009935B2 (ja) * 2017-11-06 2022-01-26 セイコーエプソン株式会社 ロボット

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837117B2 (ja) 1979-09-04 1983-08-13 株式会社明電舎 マニピユレ−タ等における関節
JPS6258188U (https=) * 1985-09-27 1987-04-10
JP2559807B2 (ja) * 1988-06-01 1996-12-04 ファナック株式会社 産業用ロボットの関節部におけるケーブル処理装置
JPH04269193A (ja) 1991-02-19 1992-09-25 Canon Inc 産業用ロボツト
JP3973006B2 (ja) * 2000-03-23 2007-09-05 日本電産サンキョー株式会社 ダブルアーム型ロボット
JP2002079487A (ja) * 2000-09-05 2002-03-19 Nachi Fujikoshi Corp 産業用ロボットの手首装置
JP2007015053A (ja) * 2005-07-07 2007-01-25 Fanuc Ltd 産業用ロボット

Also Published As

Publication number Publication date
CN101484281A (zh) 2009-07-15
JPWO2008007517A1 (ja) 2009-12-10
JP4911371B2 (ja) 2012-04-04
WO2008007517A1 (fr) 2008-01-17
CN101484281B (zh) 2011-10-26
TWI329558B (https=) 2010-09-01
KR101108767B1 (ko) 2012-03-13
KR20080102223A (ko) 2008-11-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees