200814732 九、發明說明： 【發明所屬之技術領域】 -本發明關於一種影像測器封裝及其應用之數位相機模 組，特別係關於一種成像品質較高及產品可靠度較高之影像 感測器封裝及其應用之數位相機模組。 【先前技術】 目前，行動電話向著多功能之趨勢發展，具有照相功能 广 之行動電話一經推出即倍受歡迎。應用於行動電話之數位相 機模組不僅需具有較好的照相性能，亦須滿足輕薄短小之要 求以配合行動電話之輕薄短小之發展趨勢。數位相機模組中 用以獲取影像之影像感測器封裝之尺寸及性能係決定數位 相機模組尺寸大小及照相性能優劣之一重要因素。 請參閱圖2，一種習知之數位相機模組80，包括一基板 81、一凸緣層82、一晶片84、多數條導線85、一第一接著 劑86、一蓋體87、一第二接著劑88及一鏡頭89。該基板 81設有一上表面（圖未標）及一下表面（圖未標），下表面 上形成有訊號輸出端812。該凸緣層82係固設於基板81之 上表面，而與基板81共同形成一凹槽83。該凸緣層82頂面 形成有訊號連接端822,該訊號連接端822與基板81之訊號 輸出端812電性連接。該晶片84係設置於基板81之上表面， 並位於凹槽83内，其上表面形成有焊墊841及感測區843。 該導線85係電連接晶片84之焊墊841至凸緣層82之訊號 連接端822。該第一接著劑86係塗佈於凸緣層82上，並將 導線85與訊號連接端822之銜接處覆蓋住。該蓋體87係由 6 200814732 透明材料製成，其藉由第一接荽 w w 弟接考86黏著於凸緣層82上， 從而將晶片84封閉於凹样μ向 …主 該第二接著劑88塗佈於 盖體87之上表面。鏡頭89孫茲山每t 體87上。 兄碩89係猎由第二接著劑88黏著於蓋 惟，該蓋體87係黏著於第一接著齊m上，再於蓋體π 上塗佈第二接著劑88，使鐘通糾益山μ 體87 Ρ Μ / 猎由第二接著劑88黏著蓋 ^7。上，如此，無形中增加了封裝之高度，使其封裝尺寸 再者，基板81之上表面及凹槽83内存在的 感測_是以，如何使晶片％之感測區二 又5木降私度至取低以提高數位相機模組之影像品質，成 數位相機模組之重要課題。 、 、、 另帛接著片J 86在烘烤製程中會大量釋放揮發性氣 {使凹槽83内產生内壓，因而蓋體87容易在使用中移位 或剝落，致使產品之可靠性不高。 【發明内容】 馨於上述問題，有必要提供—種成像品質較高且 較高之影像感測器封裝。 還有必要提供一種成像品質較高且可靠性較高之數位 相機模組。 1 -種影像感測器封裝，包括一承載體、一晶片、複數 導線、-第-黏著物及—蓋體。該承載體呈平板狀，具有 -頂面’頂面上設置有複數上焊塾。該晶片固設於承載體 頂面上，晶片之頂面具有—感測區及複數晶片焊墊。該導 200814732 線電性連接晶片焊墊與承載體之上焊墊。該第一黏著物佈 叹於晶片之頂面，且環繞晶片感測區之外側。該蓋體藉由 該第一黏著物黏設於晶片上並封閉晶片之感測區。 一種數位相機模組，包括一影像感測器封裝及一鏡頭 杈組。該影像感測器封裝包括一承載體、一晶片、複數導 線、一第一黏著物及一蓋體。該承載體呈平板狀，具有一 頂面，頂面上設置有複數上焊墊。該晶片固設於承載體頂 面上，晶片之頂面具有一感測區及複數晶片焊墊。該導線 電性連接晶片焊墊與承載體之上焊墊。該第一黏著物佈設 於曰曰片之頂面，且環繞晶片感測區之外侧。該蓋體藉由該 第黏著物黏设於晶片上並封閉晶片之感測區。該鏡頭模 組設置於影像感測器封裝之光路中。 相較習知技術，所述影像感測器封裝之蓋體藉由塗佈 於晶片頂面周緣之第一黏著物固設於晶片上以封閉晶片之 感測區，一方面，形成之封閉空間更小，封閉空間内存在 之粉塵、粒子等污染物較少，可以減少對晶片之感測區之 >可染，從而提高該數位相機模組之影像品質；另一方面， :減小第一黏著物在烘烤製程中之揮發出之氣體產生之内 壓，從而減小蓋體剝落或偏移的可能性，提高了產品之可靠 性。 【實施方式】 請參閱圖1所示的本發明數位相機模組一較佳實施 例，該數位相機模組10包括一影像感測器封裝20、一第 二黏著物40、一鏡頭模組5〇及一鏡座6〇，其中，該鏡頭 200814732 模組50設置於鏡座60内，該鏡座60藉由第二黏著物40 ST定於影像感測器封裝20上，且影像感測器封裝20處於 鏡頭模組50之光路中。 該影像感測器封裝20包括有一承載體21、一晶片23、 複數導線24、一支撐件25、一第一黏著物26及一蓋體28。 該承載體21呈平板狀，具有一頂面（圖未標）及一底面 (圖未標）。該承載體21包括複數設置於頂面之上焊墊215， γ 及複數設置於底面之下焊墊216。該下焊墊216與上焊墊215 f ;i, 電性連接，其用於與其他元件如印製電路板等相電性連接。 該晶片23係一影像感測器晶片，其藉由膠水或雙面膠 等黏著物固設於承載體21之頂面上。該晶片23之頂面上具 有一感測區231，晶片23頂面周緣佈設有複數晶片焊墊 233。該晶片焊墊233用於輸出該晶片23產生之影像訊號。 該複數導線24之一端連接晶片焊墊233，另一端則連 接承載體21之上焊墊215。 該支撐件25為一框體，其設置於晶片23頂面，位於晶 片23之感測區231外。可以理解，該支撐件25亦可為複數 柱體，該柱體分別設置於晶片23頂面之四角處。 該第一黏著物26係環繞塗佈於晶片23之感測區231周 緣，並覆蓋該支撐件25，及覆蓋導線24與晶片焊墊233之 連接處以保護及加強導線24與晶片焊墊233之連接處。 該蓋體28由透明材料製成，其尺寸大於晶片23之感測 區231之尺寸。該蓋體28設置於晶片23頂面上方，其由支 撐件25支撐住，且藉由第一黏著物26黏接於晶片23上， 200814732 從而將晶片23之感測區231封閉。 第二黏著物40係塗佈於承載體21之頂面，環繞上焊墊 215之周緣設置，並進一步覆蓋該導線24與承載體21之上 焊墊215之連接處以保護該連接處。該第二黏著物4〇亦塗 佈於蓋體28之頂面周緣。 該鏡頭模組50包括一鏡筒51、至少一鏡片52及一濾波 片53。該鏡筒51係一半封閉圓筒，其具有一半封閉端（圖未 標）及一開口端（圖未標）。該半封閉端中部具有一入射窗 5工1，以使外部光線進入鏡筒51内。該鏡筒外壁設置一 外螺、、文513。該鏡片52固定於鏡筒51内，且其與入射窗511 軸认计，以便被攝物反射之光線入射至鏡筒内之鏡片 52上。該濾波片53，如紅外截止濾波片，固設於鏡筒51之 開口端，其可封閉鏡筒51以阻擋灰塵等雜質進入鏡筒51而 污染鏡片52且可濾去不需要之光線。 ^該鏡座60呈中空狀，其包括一筒部61及一座部63。該 筒邛61呈中空圓柱狀，其内壁設有與鏡筒之外螺紋 相配合之内螺紋612。該座部63呈矩形，其相對兩端分別轴 向凸設有一凸緣631及所述筒部61。該凸緣631内壁圍成一 容室633,該容室633用於容置影像感測器封裝2〇，該容室 633可收容承載體21之上焊墊215於其中。該座部幻之内 壁還向内凸設有-凸框635，該凸框635之内緣之尺寸大於 晶片23之感測區231之尺寸而小於蓋體“之尺寸。 該鏡座60設置於影像感測器封裝2〇上，其中，鏡座6〇 之凸緣633藉由第二黏著物4Q而固接於承載體之頂面將 200814732 影像感測器封裝20收容於其中，包括承載體21之上焊墊 2Γ5，鏡座60之凸框635之底面藉由塗佈於蓋體28頂面周 緣之第二黏著物40固接於蓋體28之頂面上。該鏡頭模組50 設置於鏡座60之筒部61内，其鏡筒51之外螺紋513與鏡 座60之筒部61之内螺紋612相配合。該鏡頭模組50之鏡 片52與影像感測器封裝20之晶片23之感測區231相對正。 可以理解，該鏡頭模組50可以省略，而該鏡座60之筒 部61内可藉由黏合或卡配等方式固設至少一鏡片以滿足成 像需求。 所述影像感測器封裝20之蓋體28與第一黏著物26配 合封閉晶片23之感測區231，其形成一更小的封閉空間，一 方面可以減少該封閉空間内之灰塵、粒子等污染物，從而減 小晶片23之感測區231之受污染程度以提高該影像感測器 封裝20之成像品質；另一方面，可減小第一黏著物26在烘 烤製程中之揮發出之氣體產生之内壓，進而減小蓋體28剝 落或偏移的可能性以提高該影像感測器封裝20之可靠性。 另外，蓋體28藉由支撐件26的支撐可以更平穩的固設於晶 片23上方，可以減小蓋體28傾斜的可能性，因此可以進一 步提1¾成像品質。 另，鏡座60藉由第二黏著物40直接黏著於承載體21 之頂面上，可有效降低該數位相機模組10之高度。而且， 該鏡座60之座部63之凸框635黏著於蓋體28之上表面， 可同時增加鏡座60及蓋體28之結構強度，且亦可有效降低 容室633内之粉塵、粒子等污染物對該蓋體28之污染程度 11 200814732 以提高該數位相機模組ίο之成像品質。 •綜上所述，本發明符合發明專利要件，爰依法提出專 村申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在、援依本案創作精神所作之等效 修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明數位相機模組一較佳實施例之剖示圖；及 , 圖2係一習知數位相機模組之示意圖。 【主要元件符號說明】 (本發明） 數位相機模組 10 影像感測器封裝 20 承載體 21 上焊墊 215 下焊墊 216 晶片 23 感測區 231 晶片焊塾 233 導線 24 支撐件 25 第一黏著物 26 蓋體 28 第二黏著物 40 鏡頭模組 50 鏡肉 51 入射窗 511 外螺紋 513 鏡片 52 遽波片 53 鏡座 60 筒部 61 内螺紋 612 座部 63 凸緣 631 容室 633 凸框 635 (習知） 12 200814732 數位相機模組 訊‘號輸出端 訊·號連接端 晶片 感測區 第一接著層 第二接著層 80 基板 81 812 凸緣層 82 822 容室 83 84 焊墊 841 843 導線 85 86 蓋體 87 88 鏡頭 89 13200814732 IX. Description of the Invention: [Technical Field of the Invention] - The present invention relates to a digital camera module for an image sensor package and its application, in particular to an image sensor with high image quality and high product reliability Digital camera module for packaging and its applications. [Prior Art] At present, mobile phones are moving toward a multi-functional trend, and mobile phones with a wide range of camera functions are popular as soon as they are launched. The digital camera module used in mobile phones not only needs to have better photographic performance, but also needs to meet the requirements of lightness and shortness to match the trend of thin and light mobile phones. The size and performance of the image sensor package used to capture images in a digital camera module is an important factor in determining the size and photographic performance of digital camera modules. Referring to FIG. 2 , a conventional digital camera module 80 includes a substrate 81 , a flange layer 82 , a wafer 84 , a plurality of wires 85 , a first adhesive 86 , a cover 87 , and a second substrate . Agent 88 and a lens 89. The substrate 81 is provided with an upper surface (not shown) and a lower surface (not shown), and a signal output end 812 is formed on the lower surface. The flange layer 82 is fixed to the upper surface of the substrate 81 to form a recess 83 together with the substrate 81. A signal connection end 822 is formed on the top surface of the flange layer 82. The signal connection end 822 is electrically connected to the signal output end 812 of the substrate 81. The wafer 84 is disposed on the upper surface of the substrate 81 and is located in the recess 83. The upper surface thereof is formed with a pad 841 and a sensing region 843. The wire 85 is electrically connected to the pad 841 of the wafer 84 to the signal connection end 822 of the flange layer 82. The first adhesive 86 is applied to the flange layer 82 and covers the junction of the wire 85 and the signal connection end 822. The cover body 87 is made of a transparent material of 6 200814732, which is adhered to the flange layer 82 by a first interface, and the wafer 84 is sealed to the concave sample. 88 is applied to the upper surface of the lid 87. Lens 89 Sunz Mountain per t body 87. The brothers 89 series are adhered to the cover by the second adhesive agent 88. The cover body 87 is adhered to the first adhesive layer m, and then the second adhesive agent 88 is applied on the cover body π to make Zhongtong Correction Hill μ Body 87 Ρ Μ / Hunting is adhered to the cover by a second adhesive 88. In this way, the height of the package is increased invisibly, and the package size is further increased. The sensing on the upper surface of the substrate 81 and the groove 83 is how to make the sensing area of the wafer % 2 and 5 Private to low to improve the image quality of digital camera modules, becoming an important topic in digital camera modules. , and, in addition, the sheet J 86 releases a large amount of volatile gas during the baking process. {The internal pressure is generated in the groove 83, so that the cover 87 is easily displaced or peeled off during use, resulting in low reliability of the product. . SUMMARY OF THE INVENTION In order to solve the above problems, it is necessary to provide an image sensor package with higher imaging quality and higher image quality. It is also necessary to provide a digital camera module with higher imaging quality and higher reliability. A type of image sensor package comprising a carrier, a wafer, a plurality of wires, a -adhesive and a cover. The carrier has a flat shape and has a top surface on the top surface of which a plurality of upper pads are disposed. The wafer is fixed on the top surface of the carrier, and the top surface of the wafer has a sensing area and a plurality of wafer pads. The guide 200814732 electrically connects the wafer pads to the pads above the carrier. The first adhesive slaps the top surface of the wafer and surrounds the outside of the wafer sensing region. The cover is adhered to the wafer by the first adhesive and closes the sensing area of the wafer. A digital camera module includes an image sensor package and a lens stack. The image sensor package includes a carrier, a wafer, a plurality of wires, a first adhesive, and a cover. The carrier has a flat shape and has a top surface, and a plurality of upper pads are disposed on the top surface. The wafer is fixed on the top surface of the carrier, and the top mask of the wafer has a sensing area and a plurality of wafer pads. The wire is electrically connected to the pad of the wafer and the pad above the carrier. The first adhesive is disposed on the top surface of the cymbal and surrounds the outer side of the wafer sensing region. The cover is adhered to the wafer by the first adhesive and closes the sensing area of the wafer. The lens module is disposed in the optical path of the image sensor package. Compared with the prior art, the cover of the image sensor package is fixed on the wafer by the first adhesive coated on the periphery of the top surface of the wafer to close the sensing area of the wafer. On the one hand, the closed space is formed. Smaller, there are fewer dusts and particles in the enclosed space, which can reduce the dyeing of the sensing area of the chip, thereby improving the image quality of the digital camera module; on the other hand, reducing the number The internal pressure generated by the volatilized gas in the baking process reduces the possibility of peeling or offset of the cover and improves the reliability of the product. [Embodiment] Referring to a preferred embodiment of the digital camera module of the present invention, the digital camera module 10 includes an image sensor package 20, a second adhesive 40, and a lens module 5. And a lens holder 6〇, wherein the lens 200814732 module 50 is disposed in the lens holder 60, the lens holder 60 is fixed on the image sensor package 20 by the second adhesive 40 ST, and the image sensor The package 20 is in the optical path of the lens module 50. The image sensor package 20 includes a carrier 21, a wafer 23, a plurality of wires 24, a support member 25, a first adhesive member 26, and a cover member 28. The carrier 21 has a flat shape and has a top surface (not shown) and a bottom surface (not shown). The carrier 21 includes a plurality of pads 215 disposed on the top surface, γ and a plurality of pads 216 disposed under the bottom surface. The lower pad 216 is electrically connected to the upper pad 215 f ; i for electrical connection with other components such as a printed circuit board or the like. The wafer 23 is an image sensor wafer which is fixed to the top surface of the carrier 21 by an adhesive such as glue or double-sided tape. The top surface of the wafer 23 has a sensing region 231, and a plurality of wafer pads 233 are disposed on the periphery of the top surface of the wafer 23. The wafer pad 233 is used to output an image signal generated by the wafer 23. One end of the plurality of wires 24 is connected to the die pad 233, and the other end is connected to the pad 215 above the carrier 21. The support member 25 is a frame disposed on the top surface of the wafer 23 outside the sensing region 231 of the wafer 23. It can be understood that the support member 25 can also be a plurality of cylinders respectively disposed at four corners of the top surface of the wafer 23. The first adhesive 26 is applied around the periphery of the sensing region 231 of the wafer 23 and covers the support member 25, and covers the connection between the wire 24 and the die pad 233 to protect and strengthen the wire 24 and the wafer pad 233. Junction. The cover 28 is made of a transparent material having a size larger than the size of the sensing region 231 of the wafer 23. The cover 28 is disposed above the top surface of the wafer 23 and supported by the support member 25, and is adhered to the wafer 23 by the first adhesive 26, thereby blocking the sensing region 231 of the wafer 23. The second adhesive 40 is applied to the top surface of the carrier 21, disposed around the periphery of the upper pad 215, and further covers the connection of the wire 24 to the pad 215 above the carrier 21 to protect the connection. The second adhesive 4〇 is also applied to the periphery of the top surface of the cover 28. The lens module 50 includes a lens barrel 51, at least one lens 52, and a filter sheet 53. The lens barrel 51 is a half-closed cylinder having a half closed end (not shown) and an open end (not shown). The central portion of the semi-closed end has an entrance window 5 for allowing external light to enter the lens barrel 51. An outer screw, 513 is disposed on the outer wall of the lens barrel. The lens 52 is fixed in the lens barrel 51 and is axially aligned with the entrance window 511 so that the light reflected by the object is incident on the lens 52 in the lens barrel. The filter 53, such as an infrared cut filter, is fixed to the open end of the lens barrel 51, and can close the lens barrel 51 to block impurities such as dust from entering the lens barrel 51 to contaminate the lens 52 and filter out unnecessary light. The mirror holder 60 is hollow and includes a tubular portion 61 and a portion 63. The cartridge 61 has a hollow cylindrical shape, and its inner wall is provided with internal threads 612 that cooperate with the external threads of the lens barrel. The seat portion 63 has a rectangular shape, and a flange 631 and the tubular portion 61 are axially protruded from opposite ends of the seat portion 63, respectively. The inner wall of the flange 631 encloses a cavity 633 for accommodating the image sensor package 2, and the chamber 633 can receive the pad 215 above the carrier 21. The inner wall of the phantom is also convexly provided with a convex frame 635. The inner edge of the convex frame 635 has a larger size than the sensing area 231 of the wafer 23 and smaller than the size of the cover. The lens holder 60 is disposed at The image sensor package 2 is mounted on the top surface of the carrier by the second adhesive 4Q, and the 200814732 image sensor package 20 is received therein, including the carrier. The upper surface of the bumper 2 Γ 5, the bottom surface of the convex frame 635 of the lens holder 60 is fixed to the top surface of the cover body 28 by the second adhesive 40 coated on the periphery of the top surface of the cover body 28. The lens module 50 is disposed. In the cylindrical portion 61 of the lens holder 60, the external thread 513 of the lens barrel 51 cooperates with the internal thread 612 of the cylindrical portion 61 of the lens holder 60. The lens 52 of the lens module 50 and the wafer of the image sensor package 20 The sensing area 231 of the lens block 231 is relatively positive. It can be understood that the lens module 50 can be omitted, and at least one lens can be fixed in the tube portion 61 of the lens holder 60 by means of bonding or snapping to meet imaging requirements. The cover 28 of the image sensor package 20 cooperates with the first adhesive 26 to close the sensing region 231 of the wafer 23, which forms a smaller seal. Space, on the one hand, can reduce dust, particles and the like in the enclosed space, thereby reducing the degree of contamination of the sensing area 231 of the wafer 23 to improve the image quality of the image sensor package 20; The internal pressure generated by the volatilized gas of the first adhesive 26 during the baking process is reduced, thereby reducing the possibility of peeling or offset of the cover 28 to improve the reliability of the image sensor package 20. The cover body 28 can be more stably fixed on the wafer 23 by the support of the support member 26, and the possibility of tilting of the cover body 28 can be reduced, so that the image quality can be further improved. In addition, the mirror holder 60 is secondly adhered. The object 40 is directly adhered to the top surface of the carrier 21, which can effectively reduce the height of the digital camera module 10. Moreover, the convex frame 635 of the seat portion 63 of the lens holder 60 is adhered to the upper surface of the cover body 28, and can simultaneously The structural strength of the lens holder 60 and the cover body 28 is increased, and the degree of contamination of the cover body 28 by dust, particles and the like in the chamber 633 can be effectively reduced to improve the imaging quality of the digital camera module. •In summary, The invention meets the requirements of the invention patent, and the application for the village is filed according to law. However, the above description is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are equivalent to the modification or change of the spirit of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a preferred embodiment of a digital camera module of the present invention; and FIG. 2 is a conventional digital camera module. [Main component symbol description] (Invention) Digital camera module 10 Image sensor package 20 Carrier 21 Upper pad 215 Lower pad 216 Wafer 23 Sensing area 231 Wafer pad 233 Wire 24 Support 25 An adhesive 26 cover 28 second adhesive 40 lens module 50 mirror meat 51 entrance window 511 external thread 513 lens 52 chopping plate 53 mirror base 60 barrel 61 internal thread 612 seat 63 flange 631 chamber 633 convex Box 635 (conventional) 12 200814732 digital camera module signal 'number output terminal number · terminal wafer sensing area first back layer second back layer 80 substrate 81 812 flange layer 82 822 Room 83 84 Pad 841 843 Conductor 85 86 Cover 87 88 Lens 89 13