200814902 九.、發明說明： 【·發明所屬之技術領域】 ¥ •本發明關於一種影像測器封裝及其應用之數位相機模 組，特別係關於一種成像品質較高較高之影像感測器封裝及 其應用之數位相機模組。 【先前技術】 目前，行動電話向著多功能之趨勢發展，具有照相功能 之行動電話一經推出即倍受歡迎。應用於行動之數位相 機模組不僅需具有較好的照相性能，亦須滿足輕薄短小之要 求以配合行動電話之輕薄短小之發展趨勢。數位相機模組中 用以獲取衫像之影像感測器封襄之尺寸及性能係決定數位 相機相:組尺寸大小及照相性能優劣之一重要因素。 請參閱圖1，一種習知之數位相機模組1〇〇，包括一影 像感測器封裝10、一鏡座12及一鏡頭14。該影像感測器封 裝10包括一基板101、一凸緣層102、一晶片1〇4、多數條 _導線105、一第一接著劑1〇6及一蓋體107。該基板101設 有一上表面（圖未標）及一下表面（圖未標），其上表面形 成有複數上焊墊1011，其下表面形成有複数與上焊墊1〇11 相電性連接之下焊墊1012。該凸緣層1〇2呈框狀，係固設於 基板ιοί之上表面，而與基板101共同形成一凹槽103。該 基板101之上焊墊1〇11位於該凹槽1〇3内。該晶片1〇4係 设置於基板101之上表面，並位於凹槽1〇3内，其上表面形 成有晶片焊墊1041及感測區1〇42。該導線1〇5係電性連接 晶片焊墊1041至基板1〇1之上焊墊1〇11。該蓋體1〇7係由 200814902 透·明材料製成，其藉由塗佈於凸緣層102上之第一接著劑 10^黏著於凸緣層102上，從而將晶片ι〇4封閉於凹槽1〇3 内-。該鏡座12呈筒狀，其内部收容該鏡頭μ。該鏡座12 係黏著於蓋體107上。 惟，該影像感測器封裝10之凹槽1〇3必須同時容裝晶 片104及基板ιοί之上焊墊ion，且晶片1〇4與凸緣層1〇2 之内壁之間，必須提供足夠的空間供打線器活動，以致該凹 ⑩槽103將遠大於晶片104本身之體積，而導致該影像感測器 封裝10及該數位相機权組之體積較大，較不滿足行動電話 之輕薄短小之發展趨勢。 再者，該基板101之上表面及凹槽103内存在的塵灰將 污染晶片104之感測區1042，是以，如何使晶片1〇4之感測 區1042受污染降程度至最低以提高數位相機模組之影像品 質，成為數位相機模組之重要課題。 另，該鏡座12固定於蓋體107上時，容易發生移位而 _ 導致其内之鏡頭14較難對正晶片104之感測區1042。 【發明内容】 鑒於上述問題，有必要提供一種成像品質較高之影像感 測器封裝。 還有必要提供一種體積較小、成像品質較高之影像感7則 器封裝。 還有必要提供一種體積較小、成像品質較高之數位相機 模組。 一影像感測器封裝，包括一承載體、一晶片、複數條 200814902 導終、-支撐件、-第-黏著物及一蓋體。該承载體呈平 板·_，具有一頂面，頂面上設置有複數上焊墊。該晶片固 «χ-於承載體頂面上，其頂面具有一感測區及複數晶片焊 墊。該導線電性連接晶片焊墊與承載體之上焊墊。該支撐 件設置於承載體之頂面上。該第—黏著物佈設於J“ 面，且環繞晶片感測區之外侧。該蓋體藉由該第一黏著物 黏設於晶片上且由支撐件支撐，其封閉晶片之感測區。相 暑較習知技術，所述影像感測器封裝之蓋體與第一黏著物配 合封閉晶片之感測區，其形成一更小的封閉空間，可以減少 該封閉空間内之灰塵、粒子等污染物，從而減小晶片之感測 區之受污染程度以提高該影像感測器封裝之成像品質。 一景> 像感測器封裝，包括一承載體、一晶片、複數條 導線、一支撐件、一第一黏著物及一蓋體。該承載體呈平 板狀，其具有一頂面，該承載體包括設置於其頂面上之複 數上焊墊及設置於其頂面角落之支撐件。該晶片固設於承 _載體頂面上’其頂面具有一感測區及複數晶片焊整。該導 線電性連接晶片焊墊與承載體之上焊墊。該第一黏著物佈 5又於晶片之頂面，且環繞晶片感測區之外侧，其亦設置於 支撐件上。該蓋體藉由該第一黏著物黏設於晶片上及支撐 件上，其封閉晶片之感測區。相較習知技術，所述影像感 測器封裝之支撐件係位於承載體之頂面角落處，其晶片位 於承載體上，係處於一開放之空間，可供打線器自由活動， 因此，承載體之面積可儘量縮小至與該晶片幾近相同，可 大幅減小該影像感測器封裝之體積；所述蓋體與第一黏著 9 200814902 物，配合封閉晶片之感測區，其形成一更小的封閉空間，可以 減:少該封閉空間内之灰塵、粒子等污染物，從而減小晶片之 感測區之受污染程度以提高該影像感測器封裝之成像品質。 一種數位相機模組’包括一鏡頭模組及一設置於該鏡 頭模組光路中之影像感測器封裝。該影像感測器封裝包括 一承載體、一晶片、複數條導線、一支撐件、一第一黏著 物及一蓋體。該承載體呈平板狀，其具有一頂面，該承載 •體包括設置於其頂面上之複數上焊墊及設置於其頂面角落 之支撐件。該晶片固設於承載體頂面上，其頂面具有一感 測區及複數晶片焊墊。該導線電性連接晶片焊墊與承載體 之上焊墊。該第一黏著物佈設於晶片之頂面，且環繞晶片 感測區之外側。該蓋體藉由該第一黏著物黏設於晶片上且 其由該支撐件支撐，其封閉晶片之感測區。相較習知技術， 戶斤述數位相機模組之支撐件係位於承載體頂面之角落處， 其晶片位於承載體上，係處於一開放之空間，可供打線器 #自由活動’因此，承載體之面積可儘量縮小至與該晶片幾 近相同’可大幅減小該影像感測器封裝之體積，進而減小 該數位相機模組之體積；所述蓋體與第一黏著物配合封閉 晶片之感測區，其形成一更小的封閉空間，可以減少該封閉 空間内之灰塵、粒子等污染物，從而減小晶片之感測區之受 污染程度以提高該數位相機模組之成像品質。 200814902 【實施方式】 % 本發明數位相機模組一較佳實施例，如圖2所示，該 數位相機模組200包括一影像感測器封裝20、一第三黏著 物40、一鏡頭模組50及一鏡座60，其中，該鏡頭模組50 設置於鏡座60内，該鏡座60藉由第三黏著物40固定於影 像感測器封裝20上，且影像感測器封裝20處於鏡頭模組 50之光路中。 該影像感測器封裝20包括有一承載體21、一晶片23、 複數導線24、一支撐件25、一第一黏著物26、一第二黏著 物27及一蓋體28。 請一併參閱圖3所示，該承載體21呈平板狀，具有一 頂面（圖未標）及一底面（圖未標）。該承載體21包括複數設置 於頂面之上焊墊215，及複數設置於底面之下焊墊216。該 下焊墊216與上焊墊215電性連接，其用於與其他元件如印 製電路板等相電性連接。 該晶片23係一影像感測器晶片，其藉由黏膠或雙面膠 等黏著物固設於承載體21之頂面上。該晶片23之頂面上具 有一感測區231，晶片23頂面周緣佈設有複數晶片焊墊 233。該晶片焊墊233用於輸出該晶片23產生之影像訊號。 該複數導線24之一端連接晶片焊墊233，另一端則連 接承載體21之上焊墊215。 該支撐件25為複數柱體，該柱體分別設置於承載體21 之頂面之四角處。該支撐件25可以與承載體21 —體成型， 亦可以通過黏膠、螺釘等連接裝置固定於承載體21上。 11 200814902 、該第一黏著物26係環繞塗佈於晶片23之感測區231周 緣:’並覆蓋導線24與晶片焊整233之連接處以保護及加強 其間之連接。該第-黏著物26之堆疊高度高於導線24形成 之環之高度。 該第一黏著物27係塗佈於支撐件25的頂部，其堆疊高 度高於導線24形成之環之高度。 該蓋體28由透明材料製成，其尺寸與承載體21之頂面 •之尺寸相當。該蓋體28設置於晶片23頂面上方’藉由第一 黏著物26黏接於晶片23上，從而將晶片23之感測區231 封閉。該蓋體28藉由第二黏著物27與支禮件25相黏接， 以便由支撐件25支撐住。由於第—黏著物％及第二黏著物 27之堆疊高度均高於導線24形成之環之高度，因此，在黏 設蓋體28時，可以避免蓋體28觸碰到導線24而損 24 〇 、 、 第三黏著物40係塗佈於蓋體28之頂面周緣。 該鏡頭模組50包括-鏡筒51、至少一鏡片^及一滤波 片53。該鏡筒51係-半封閉圓筒，其具有一半封閉端（圖未 標）及一開口端（圖未標）。該半封閉端中部具有一入射窗 511，以使外部光線進入鏡筒51内。該鏡筒^外壁設置一 外螺紋513。該鏡片52固定於鏡筒51内，且其與入射窗 共轴設計，以便被攝物反射之光線人射至㈣51内之鏡片 52上。該濾、波片53,如紅外截止遽波片，固設於鏡筒^之 開口端’其可封閉鏡筒51以阻揚灰慶等雜質進入鏡筒Μ而 污染鏡片52且可濾去不需要之光線。 12 200814902 該鏡座60呈中空狀，其包括一筒部61及一座部63。該 筒部61呈中空圓柱狀，其内壁設有與鏡筒51之外螺紋513 相·配合之内螺紋612。該座部63呈矩形，其相對兩端分別軸 向凸設有一凸緣631及所述筒部61。該凸緣631之内壁圍成 之空間與蓋體28之尺寸相當。該座部63之内壁還向内凸設 有一凸框635,該凸框635之内緣之尺寸大於晶片23之感測 區231之尺寸而小於蓋體28之尺寸。 該鏡座60設置於影像感測器封裝20上，其中，鏡座60 之凸緣631罩設於影像感測器封裝20之蓋體28上，鏡座60 之凸框635之底面藉由塗佈於蓋體28頂面周緣之第三黏著 物40固接於蓋體28之頂面上。該鏡頭模組50設置於鏡座 60之筒部61内，其鏡筒51之外螺紋513與鏡座60之筒部 61之内螺紋612相配合。該鏡頭模組50之鏡片52與影像感 測器封裝20之晶片23之感測區231相對正。 可以理解，該鏡頭模組50可以省略，而該鏡座60之筒 馨部61内可藉由黏合或卡配等方式固設至少一鏡片以滿足成 像需求。 所述支撐件25位於承載體21之頂面之角落處，所述 晶片23位於承載體21上，係處於一開放之空間，可供打 線器自由活動，因此，承載體21之面積可儘量縮小至與該 晶片23之面積幾近相同，因而，可大幅減小該影像感测器 封裝20之體積，從而減小該數位相機模組200之體積。 所述蓋體28與第一黏著物26配合封閉晶片23之感測 區231，其形成一更小的封閉空間，可以減少該封閉空間内 13 200814902 之灰塵、粒子等污染物，從而減小晶片23之感測區231之 受:污染程度以提高該影像感測器封裝20之成像品質。另外， 蓋體28藉由支撐件25的支撐可以更平穩的固設於晶片23 上方，可以減小蓋體28傾斜的可能性，因此可以進一步提 南成像品質。 所述鏡座60之凸緣631罩設於蓋體28上，鏡座60不 會發生平移，故而鏡頭50更易對正晶片23之感測區231。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在、援依本案創作精神所作之等效 修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係一習知數位相機模組之示意圖； 圖2係本發明數位相機模組一較佳實施例之剖示圖；及 圖3係圖2之數位相機模組之影像感測器封裝之俯視 馨圖，其中蓋體未示出。 【主要元件符號說明】 (習知） 數位相機模組 100 影像感測器模組 10 基板 101 上焊墊 1011 下焊墊 1012 凸緣層 102 容室 103 晶片 104 晶片焊墊 1041 感測區 1042 導線 105 第一接著層 106 200814902 蓋體 4 107 鏡座 12 餘頭 14 C本發明） 數位相機模組 200 影像感測器封裝 20 承載體 21 上焊墊 215 下焊墊 216 晶片 23 感測區 231 晶片焊塾 233 導線 24 支撐件 25 第一黏著物 26 第二黏著物 27 蓋體 28 第三黏著物 40 鏡頭模組 50 JhiL· Mix 鏡if 51 入射窗 511 外螺紋 513 鏡片 52 濾波片 53 鏡座 60 筒部 61 内螺紋 612 座部 63 凸緣 631 凸框 635 15200814902 IX., invention description: [·Technical field to which the invention belongs] ¥• The present invention relates to a digital camera module for an image sensor package and its application, in particular to an image sensor package with higher imaging quality And its application of digital camera modules. [Prior Art] At present, mobile phones are moving toward a multi-functional trend, and mobile phones with camera functions are popular as soon as they are launched. The digital camera module used in action not only needs to have better photographic performance, but also needs to meet the requirements of lightness and thinness to match the trend of thin and light mobile phones. The size and performance of the image sensor package used to capture the image in the digital camera module determines the digital camera phase: an important factor in the size of the group and the quality of the camera. Referring to FIG. 1, a conventional digital camera module 1A includes an image sensor package 10, a lens holder 12 and a lens 14. The image sensor package 10 includes a substrate 101, a flange layer 102, a wafer 1〇4, a plurality of wires 105, a first adhesive 1〇6, and a cover 107. The substrate 101 is provided with an upper surface (not labeled) and a lower surface (not shown). The upper surface is formed with a plurality of upper pads 1011, and the lower surface thereof is formed with a plurality of upper pads electrically connected to the upper pads 1〇11. Lower pad 1012. The flange layer 1〇2 is frame-shaped and is fixed on the upper surface of the substrate ιοί, and forms a groove 103 together with the substrate 101. The pad 1〇11 on the substrate 101 is located in the groove 1〇3. The wafer 1 〇 4 is disposed on the upper surface of the substrate 101 and is located in the recess 1 〇 3, and the upper surface thereof is formed with a wafer pad 1041 and a sensing region 1 〇 42. The wire 1〇5 is electrically connected to the pad pad 1041 to the pad 1〇11 on the substrate 1〇1. The cover 1〇7 is made of 200814902 transparent material, which is adhered to the flange layer 102 by a first adhesive 10 coated on the flange layer 102, thereby sealing the wafer 〇4 Groove 1〇3 inside -. The lens holder 12 has a cylindrical shape, and the lens μ is accommodated inside. The lens holder 12 is adhered to the cover 107. However, the recesses 1〇3 of the image sensor package 10 must simultaneously accommodate the pads 104 on the wafer 104 and the substrate ιοί, and between the wafers 1〇4 and the inner walls of the flange layers 1〇2, sufficient The space is provided for the wire feeder to be so that the concave 10 slot 103 will be much larger than the volume of the wafer 104 itself, resulting in a larger volume of the image sensor package 10 and the digital camera weight group, which is less suitable for the thin and light mobile phone. The development trend. Moreover, the dust on the upper surface of the substrate 101 and the groove 103 will contaminate the sensing region 1042 of the wafer 104, so that how to minimize the contamination of the sensing region 1042 of the wafer 1 4 to improve The image quality of the digital camera module has become an important issue for digital camera modules. In addition, when the lens holder 12 is fixed on the cover body 107, displacement is likely to occur, and the lens 14 therein is more difficult to align the sensing area 1042 of the wafer 104. SUMMARY OF THE INVENTION In view of the above problems, it is necessary to provide an image sensor package with high image quality. It is also necessary to provide a small-sized, high-quality image-sensing 7-seal package. It is also necessary to provide a digital camera module that is smaller and has higher imaging quality. An image sensor package includes a carrier, a wafer, a plurality of layers, a support member, a --adhesive, and a cover. The carrier has a flat plate and has a top surface, and a plurality of upper pads are disposed on the top surface. The wafer is mounted on the top surface of the carrier, and the top mask has a sensing area and a plurality of wafer pads. The wire is electrically connected to the pad of the wafer and the pad above the carrier. The support member is disposed on a top surface of the carrier. The first adhesive is disposed on the J" surface and surrounds the outer side of the sensing region of the wafer. The cover is adhered to the wafer by the first adhesive and supported by the support member, which closes the sensing region of the wafer. Compared with the prior art, the cover of the image sensor package cooperates with the first adhesive to close the sensing area of the wafer, which forms a smaller enclosed space, which can reduce dust, particles and the like in the closed space. The object, thereby reducing the degree of contamination of the sensing area of the wafer to improve the image quality of the image sensor package. A scene sensor package includes a carrier, a wafer, a plurality of wires, a support a first adhesive and a cover. The carrier has a flat shape and has a top surface, the carrier includes a plurality of upper pads disposed on a top surface thereof and a support member disposed at a top corner thereof The wafer is fixed on the top surface of the carrier. The top mask has a sensing area and a plurality of wafer soldering. The wire is electrically connected to the wafer pad and the pad above the carrier. The first adhesive cloth 5 On the top surface of the wafer, and surrounding the wafer sensing area The outer side is also disposed on the support member. The cover body is adhered to the wafer and the support member by the first adhesive, which closes the sensing area of the wafer. Compared with the prior art, the image sensor The support of the package is located at the top corner of the carrier, and the wafer is located on the carrier, and is in an open space for the wire cutter to move freely. Therefore, the area of the carrier can be minimized to be close to the wafer. Similarly, the volume of the image sensor package can be greatly reduced; the cover body and the first adhesive 9 200814902 cooperate with the sensing area of the closed wafer to form a smaller enclosed space, which can reduce: Contaminants such as dust and particles in the space, thereby reducing the degree of contamination of the sensing area of the wafer to improve the imaging quality of the image sensor package. A digital camera module includes a lens module and a An image sensor package in the optical path of the lens module. The image sensor package includes a carrier, a wafer, a plurality of wires, a support member, a first adhesive, and a cover. The carrier is a flat plate. And having a top surface, the carrier body comprising a plurality of upper pads disposed on a top surface thereof and a support member disposed at a corner of a top surface thereof. The wafer is fixed on a top surface of the carrier body, and the top surface has a top surface a sensing area and a plurality of die pads. The wires are electrically connected to the pad of the die and the pad above the carrier. The first adhesive is disposed on the top surface of the chip and surrounds the outside of the sensing area of the chip. The first adhesive is adhered to the wafer and supported by the support member, which closes the sensing area of the wafer. Compared with the prior art, the support member of the digital camera module is located on the top surface of the carrier. At the corner, the wafer is placed on the carrier, which is in an open space, and the wire can be freely moved. Therefore, the area of the carrier can be reduced to be as close as possible to the wafer, which can greatly reduce the image. Measuring the volume of the package, thereby reducing the volume of the digital camera module; the cover and the first adhesive cooperate to close the sensing area of the wafer, which forms a smaller enclosed space, which can reduce the enclosed space Dust, particles, etc. Thereby the degree of contamination of the sensing region of the wafer is reduced to increase the sense of the image quality of a digital camera module. [Embodiment] % A preferred embodiment of the digital camera module of the present invention, as shown in FIG. 2, the digital camera module 200 includes an image sensor package 20, a third adhesive 40, and a lens module. The lens module 50 is disposed in the lens holder 60. The lens holder 60 is fixed on the image sensor package 20 by the third adhesive 40, and the image sensor package 20 is In the light path of the lens module 50. The image sensor package 20 includes a carrier 21, a wafer 23, a plurality of wires 24, a support member 25, a first adhesive member 26, a second adhesive member 27, and a cover member 28. Referring to FIG. 3 together, the carrier 21 has a flat shape and has a top surface (not labeled) and a bottom surface (not shown). The carrier 21 includes a plurality of pads 215 disposed on the top surface, and a plurality of pads 216 disposed on the bottom surface. The lower pad 216 is electrically connected to the upper pad 215 for electrically connecting with other components such as a printed circuit board or the like. The wafer 23 is an image sensor wafer which is fixed to the top surface of the carrier 21 by an adhesive such as adhesive or double-sided tape. The top surface of the wafer 23 has a sensing region 231, and a plurality of wafer pads 233 are disposed on the periphery of the top surface of the wafer 23. The wafer pad 233 is used to output an image signal generated by the wafer 23. One end of the plurality of wires 24 is connected to the die pad 233, and the other end is connected to the pad 215 above the carrier 21. The support member 25 is a plurality of cylinders respectively disposed at four corners of the top surface of the carrier body 21. The support member 25 may be integrally formed with the carrier 21 or may be fixed to the carrier 21 by a connecting device such as an adhesive or a screw. 11 200814902, the first adhesive 26 is applied around the periphery of the sensing region 231 of the wafer 23: and covers the junction of the wire 24 and the wafer soldering 233 to protect and strengthen the connection therebetween. The stack height of the first adhesive 26 is higher than the height of the loop formed by the wires 24. The first adhesive 27 is applied to the top of the support member 25 at a height higher than the height of the loop formed by the wire 24. The cover 28 is made of a transparent material and has a size comparable to that of the top surface of the carrier 21. The cover 28 is disposed above the top surface of the wafer 23 and is adhered to the wafer 23 by the first adhesive 26 to close the sensing region 231 of the wafer 23. The cover body 28 is bonded to the binding member 25 by the second adhesive 27 so as to be supported by the support member 25. Since the stacking height of the first adhesive layer and the second adhesive 27 is higher than the height of the loop formed by the wire 24, when the cover 28 is adhered, the cover 28 can be prevented from contacting the wire 24 and being damaged. The third adhesive 40 is applied to the periphery of the top surface of the lid body 28. The lens module 50 includes a lens barrel 51, at least one lens, and a filter 53. The lens barrel 51 is a semi-closed cylinder having a half closed end (not shown) and an open end (not shown). The central portion of the semi-closed end has an entrance window 511 for external light to enter the lens barrel 51. An outer thread 513 is disposed on the outer wall of the lens barrel. The lens 52 is fixed in the lens barrel 51, and is coaxially designed with the entrance window so that the light reflected by the object is incident on the lens 52 in the (4) 51. The filter, wave plate 53, such as an infrared cut-off chopper plate, is fixed at the open end of the lens barrel ^, which can close the lens barrel 51 to prevent impurities such as gray and white from entering the lens barrel, contaminating the lens 52 and filtering out The light you need. 12 200814902 The mirror base 60 is hollow and includes a tubular portion 61 and a portion 63. The tubular portion 61 has a hollow cylindrical shape, and an inner thread 612 is provided on the inner wall thereof to fit the external thread 513 of the lens barrel 51. The seat portion 63 has a rectangular shape, and a flange 631 and the tubular portion 61 are axially protruded from opposite ends of the seat portion 63, respectively. The space enclosed by the inner wall of the flange 631 is equivalent to the size of the cover body 28. The inner wall of the seat portion 63 also has a convex frame 635 protruding inwardly. The inner edge of the convex frame 635 has a size larger than the size of the sensing region 231 of the wafer 23 and smaller than the size of the cover body 28. The lens holder 60 is disposed on the image sensor package 20, wherein the flange 631 of the lens holder 60 is disposed on the cover 28 of the image sensor package 20, and the bottom surface of the convex frame 635 of the lens holder 60 is coated by The third adhesive 40 disposed on the periphery of the top surface of the cover 28 is fixed to the top surface of the cover 28. The lens module 50 is disposed in the cylindrical portion 61 of the lens holder 60, and the external thread 513 of the lens barrel 51 cooperates with the internal thread 612 of the cylindrical portion 61 of the lens holder 60. The lens 52 of the lens module 50 is aligned with the sensing region 231 of the wafer 23 of the image sensor package 20. It can be understood that the lens module 50 can be omitted, and at least one lens can be fixed in the tube portion 61 of the lens holder 60 by adhesive bonding or the like to meet the imaging requirements. The support member 25 is located at a corner of the top surface of the carrier body 21. The wafer 23 is located on the carrier body 21 and is in an open space for free movement of the wire cutter. Therefore, the area of the carrier body 21 can be minimized. To the same extent as the area of the wafer 23, the volume of the image sensor package 20 can be greatly reduced, thereby reducing the volume of the digital camera module 200. The cover body 28 cooperates with the first adhesive 26 to close the sensing area 231 of the wafer 23, which forms a smaller enclosed space, which can reduce dust, particles and the like in the enclosed space, thereby reducing the wafer. The sensing area 231 of 23 is affected by the degree of contamination to improve the image quality of the image sensor package 20. In addition, the cover body 28 can be more stably fixed on the wafer 23 by the support of the support member 25, and the possibility that the cover body 28 is inclined can be reduced, so that the image quality can be further improved. The flange 631 of the lens holder 60 is disposed on the cover body 28, and the lens holder 60 is not translated. Therefore, the lens 50 is more easily aligned with the sensing area 231 of the positive wafer 23. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention. Any equivalent modifications or variations made by the person skilled in the art to the present invention should be included in the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a conventional digital camera module; FIG. 2 is a cross-sectional view of a preferred embodiment of the digital camera module of the present invention; and FIG. 3 is a digital camera module of FIG. A top view of the image sensor package, wherein the cover is not shown. [Main component symbol description] (General) Digital camera module 100 Image sensor module 10 Substrate 101 Upper pad 1011 Lower pad 1012 Flange layer 102 Capacitor 103 Wafer 104 Wafer pad 1041 Sensing area 1042 Wire 105 first back layer 106 200814902 cover 4 107 mirror base 12 remaining 14 C the present invention) digital camera module 200 image sensor package 20 carrier 21 upper pad 215 lower pad 216 wafer 23 sensing area 231 wafer Weld 233 wire 24 support 25 first adhesive 26 second adhesive 27 cover 28 third adhesive 40 lens module 50 JhiL· Mix mirror if 51 entrance window 511 external thread 513 lens 52 filter 53 mirror holder 60 Cylinder part 61 internal thread 612 seat 63 flange 631 convex frame 635 15