200810539 九、發明說明： 【發明所屬之技術領域】 本發明關於一種影像感測器封裝及其應用之數位相機 模組，特別係關於一種成像品質較高且產品可靠性較高之影 像感測器封裝及其應用之數位相機模組。 【先前技術】 目前，行動電話向著多功能之趨勢發展，具有照相功能 之行動電話一經推出即倍受歡迎。應用於行動電話之數位相 機模組不僅需具有較好的照相性能，亦須滿足輕薄短小之要 求以配合行動電話之輕薄短小之發展趨勢。數位相機模組中 用以獲取影像之影像感測器封裝之尺寸及性能係決定數位 相機模組尺寸大小及照相性能優劣之一重要因素。 請參閱圖2所示，一種習知之數位相機模組80，包括一 基板81、一凸緣層82、一晶片84、多數條導線85、一第一 接著劑86、一蓋體87、一第二接著劑88及一鏡頭89。該基 板81設有一上表面（圖未標）及一下表面（圖未標），下表 面上形成有訊號輸出端812。該凸緣層82係固設於基板81 之上表面，而與基板81共同形成一凹槽83。該凸緣層82 頂面形成有訊號連接端822，該訊號連接端822與基板81 之訊號輸出端812電性連接。該晶片84係設置於基板81之 上表面，並位於凹槽83内，其上表面形成有焊墊841及感 測區843。該導線85係電連接晶片84之焊墊841至凸緣層 82之訊號連接端822。該第一接著劑86係塗佈於凸緣層82 上，並將導線85與訊號連接端822之銜接處覆蓋住。該蓋 200810539 體87係由透明材料製成，其藉由第一接著劑86黏著於凸緣 層82上，從而將晶片84封閉於凹槽83内。該第二接著劑 88塗佈於蓋體87之上表面。鏡頭89係藉由第二接著劑88 黏著於蓋體87上。 惟，該蓋體87係黏著於第一接著劑86上，再於蓋體87 上塗佈第二接著劑88,使鏡頭89藉由第二接著劑88黏著蓋 體87上，如此，無形中增加了封裝之高度，使其封裝尺寸 較大。 再者，基板81之上表面及凹槽83内存在的塵灰將污染 到晶片8 4之感測區8 4 3 ’是以’如何使晶片8 4之感測區8 4 3 受污染降程度至最低以提高數位相機模組之影像品質，成為 數位相機模組之重要課題。 另，第一接著劑86在烘烤製程中會大量釋放揮發性氣 體，使凹槽83内產生内壓，因而蓋體87容易在使用中移位 或剝落，致使產品之可靠性不高。 【發明内容】 鑒於上述問題，有必要提供一種成像品質較高且可靠性 較高之影像感測器封裝。 還有必要提供一種封裝尺寸較小、成像品質較高且可靠 性較高之數位相機模組。 一種影像感測器封裝，包括一承載體、一晶片、複數 條導線、一第一黏著物及一蓋體。該承載體設有一容室， 該容室於承載體一頂面形成一開口，該承載體之頂面設置 有複數上焊墊。該晶片設置於承載體之容室中，其頂面具 200810539 有-感測區及複數晶片焊塾。該導線電連接該晶片焊塾與 承載體之上焊墊。該第-黏著物佈設於晶片頂面周緣，且 環繞晶片感測區之外侧。該蓋體藉由該第一黏著物黏設於 晶片上並封閉晶片之感測區。 一種數位相機模組， 模組。該影像感測器封裝 導線 第一黏著物及 容室於承載體一頂面形成 複數上焊墊。該晶片設置 一感測區及複數晶片焊墊 載體之上焊墊。該第一黏 繞晶片感測區之外侧。該 片上並封閉晶片之感測區 模組之光路中。 匕括一影像感測器封裝及一鏡頭 ^括一承載體、一晶片、複數條 蓋體。該承载體設有一容室，該 一開口，該承載體之頂面設置有 於承载體之容室中，其頂面具有 。該導線電連接該晶片焊墊與承 著物佈设於晶片頂面周緣，且環 蓋體藉由該第一黏著物黏設於晶 。該影像感測器封裝設置於鏡頭 —相較習知技術，料影像❹封裝及數仙機模組 之蓋體藉由塗佈於晶片頂面周緣之第—黏著物固設於晶片 上以封閉晶片之感測區’一方面’形成之封閉空間更小， 封閉空間内存在之粉塵、粒子等污染物較少，可以減少對 ^之感測區之污染，從而提高該數位相機模組之影像品 質；另一方面，可減小第一黏著物在烘烤製程中之揮發出之 氣體產生之内壓，從而減小蓋體剝落或偏移的可能性:提高 了產品之可靠性。 【實施方式】 請參閱圖1所示本發明數位相機模組一較佳實施例 200810539 該數位相機模組10包括一影像感測器封裝20、一第二黏 著物40、一鏡頭模組50及一鏡座60，其中，該鏡頭模組 50設置於鏡座60内，該鏡座60藉由第二黏著物40固定 於影像感測器封裝20上，且影像感測器封裝20處於鏡頭 模組50之光路中。 該影像感測器封裝20包括有一承載體21、一晶片23、 複數導線24、一支撐件25、一第一黏著物26及一蓋體28。 該承載體21包括一基板211及一框體212。該基板211 具有一頂面（圖未標）及一與該頂面相對之底面（圖未標）。 該框體212設置於基板211之頂面上，與基板211共同形成 一容室213。該承載體21還包括複數設置於框體212之頂面 之上焊墊215,及複數設置於基板211之底面之下焊墊216。 該下焊墊216與上焊墊215電連接，其用於與其他元件如印 製電路板等電性連接。 該晶片23係一影像感測器晶片，其固設於基板211上， 且位於容室213内。該晶片23之頂面上具有一感測區231， 晶片23頂面周緣佈設有複數晶片焊墊233。該晶片焊墊233 用於輸出該晶片23產生之影像訊號。 該複數導線24之一端連接晶片焊墊233，另一端則連 接承載體21之上焊墊215。 該支撐件25為一框體，其設置於晶片23頂面，位於晶 片23之感測區231外。可以理解，該支撐件25亦可為複數 柱體，該柱體分別設置於晶片23頂面之四角處。 該第一黏著物26係環繞塗佈於晶片23之感測區231周 200810539 '緣，並覆蓋該支撐件25，及覆蓋導線24與晶片焊墊233之 連接處以保護及加強導線24與晶片焊墊233之連接。該第 一黏著物26可進一步塗佈於晶片23之四周。 該蓋體28由透明材料製成，其尺寸不大於容室213之 尺寸。該蓋體28設置於晶片23頂面上方，其由支撐件25 支撐住，且藉由第一黏著物26黏接於晶片23上，從而將晶 片23之感測區231封閉。 第二黏著物40係塗佈於承載體21之框體212之頂面， 其覆蓋該導線24與承載體21之上焊墊215之連接處。該第 二黏著物40亦塗佈於蓋體28之頂面周緣。 該鏡頭模組50包括一鏡筒51、至少一鏡片52及一濾波 片53。該鏡筒51係一半封閉圓筒，其具有一半封閉端及一 開口端。該半封閉端中部具有一入射窗511，以使外部光線 進入鏡筒51内。該鏡筒51外壁設置一外螺紋513。該鏡片 52固定於鏡筒51内，且其與入射窗511共軸設計，以便被 攝物反射之光線入射至鏡筒51内之鏡片52上。該濾波片 511，如紅外截止濾波片，固設於鏡筒51之開口端，其可封 閉鏡筒51以阻擋灰塵等雜質進入鏡筒51而污染鏡片52且 可濾去不需要之光線。 該鏡座60呈中空狀，其包括一筒部61及一座部63。該 筒部61呈中空圓柱狀，其内壁設有與鏡筒51之外螺紋513 相配合之内螺紋612。該座部63呈矩形，其相對兩端分別軸 向凸設有一凸緣631及所述筒部61。該凸緣631之尺寸與承 載體21之框體212相當。該座部63之内壁還向内凸設有一 200810539 _凸框633，該凸框633之内緣之尺寸大於晶片23之感測區 231之尺寸而小於蓋體28之尺寸。 該鏡座60設置於影像感測器封裝20上，其中，鏡座60 之凸緣藉由第二黏著物40與承載體21之框體212頂面相固 接，鏡座60之凸框633之底面與塗佈於蓋體28頂面周緣之 第二黏著物40相固接。該鏡頭模組50設置於鏡座60之筒 部61内，其鏡筒51之外螺紋513與鏡座60之筒部61之内 螺紋612相配合。該鏡頭模組50之鏡片52與影像感測器封 裝20之晶片23之感測區231相對正。 可以理解，該鏡頭模組50可以省略，而該鏡座60之筒 部61内可藉由黏合或卡配等方式固設至少一鏡片以滿足成 像需求。 所述數位相機模組10之蓋體28與第一黏著物26配合 封閉晶片23之感測區231，其形成一更小的封閉空間，一方 面可以減少該封閉空間内之灰塵、粒子等，從而減少對晶片 23之感測區231之污染以提高該影像感測器封裝20之成像 品質；另一方面，可減小第一黏著物26在烘烤製程中之揮 發出之氣體產生之内壓，進而減小蓋體28剝落或偏移的可 能性以提高該數位相機模組10之可靠性。另外，蓋體28藉 由支撐件26的支撐可以更平穩的固設於晶片23上方，可以 減小蓋體28傾斜的可能性，因此可以進一步提高成像品質； 而且，該蓋體28之尺寸較小，可以節省材料成本。 另，鏡座60藉由第二黏著物40直接黏著於承載體21 之框體213之頂面上，可有效降低該數位相機模組10之高 11 200810539 度。而且，該鏡座60之座部63之凸框633黏著於蓋體28 之上表面，可同時增加鏡座60及蓋體28之結構強度，且亦 可有效避免容室213内之粉塵污染該蓋體28。 ’、 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士’纟、援依本案創作精神所作之等效 修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明數位相機模組一較佳實施例之剖示圖；及 圖2係習知數位相機模組之示意圖。 【主要元件符號說明】 (本發明） 數位相機模組 10 承載體 21 框體 212 上焊墊 215 晶片 23 晶片焊塾 233 支樓件 25 蓋體 28 鏡頭模組 50 入射窗 511 鏡片 52 影像感測器封裝 20 基板 21 容室 213 下焊墊 216 感測區 231 導線 24 第一黏著物 26 第二黏著物 40 鏡筒 51 外螺紋 513 濾波片 53 12 200810539 鏡座 60 筒部 61 内螺紋 612 座部 63 凸緣 631 凸框 633 (習知） 數位相機模組 80 基板 81 訊號輸出端 812 凸緣層 82 訊號連接端 822 容室 83 晶片 84 焊墊 841 感測區 843 導線 85 第一接著層 86 蓋體 87 第二接著層 88 鏡頭 89 13200810539 IX. Description of the Invention: [Technical Field] The present invention relates to an image sensor package and a digital camera module thereof, and more particularly to an image sensor with high image quality and high product reliability Digital camera module for packaging and its applications. [Prior Art] At present, mobile phones are moving toward a multi-functional trend, and mobile phones with camera functions are popular as soon as they are launched. The digital camera module used in mobile phones not only needs to have better photographic performance, but also needs to meet the requirements of lightness and shortness to match the trend of thin and light mobile phones. The size and performance of the image sensor package used to capture images in a digital camera module is an important factor in determining the size and photographic performance of digital camera modules. Referring to FIG. 2 , a conventional digital camera module 80 includes a substrate 81 , a flange layer 82 , a wafer 84 , a plurality of wires 85 , a first adhesive 86 , a cover 87 , and a first Two adhesives 88 and a lens 89. The substrate 81 is provided with an upper surface (not shown) and a lower surface (not shown), and a signal output end 812 is formed on the lower surface. The flange layer 82 is fixed to the upper surface of the substrate 81, and forms a groove 83 together with the substrate 81. A signal connection end 822 is formed on the top surface of the flange layer 82. The signal connection end 822 is electrically connected to the signal output end 812 of the substrate 81. The wafer 84 is disposed on the upper surface of the substrate 81 and is located in the recess 83. The upper surface thereof is formed with a pad 841 and a sensing region 843. The wire 85 is electrically connected to the pad 841 of the wafer 84 to the signal connection end 822 of the flange layer 82. The first adhesive 86 is applied to the flange layer 82 and covers the junction of the wire 85 and the signal connection end 822. The cover 200810539 body 87 is made of a transparent material that is adhered to the flange layer 82 by a first adhesive 86 to enclose the wafer 84 within the recess 83. The second adhesive 88 is applied to the upper surface of the lid 87. The lens 89 is adhered to the lid 87 by a second adhesive 88. However, the cover 87 is adhered to the first adhesive 86, and the second adhesive 88 is applied to the cover 87, so that the lens 89 is adhered to the cover 87 by the second adhesive 88, thus being invisible. The height of the package is increased to make the package size larger. Moreover, the dust on the upper surface of the substrate 81 and the recess 83 will contaminate the sensing area of the wafer 84. 4 4 3 ' is how to make the sensing area 8 4 3 of the wafer 8 4 contaminated. To the lowest to improve the image quality of digital camera modules, it has become an important topic for digital camera modules. Further, the first adhesive 86 releases a large amount of volatile gas during the baking process, causing internal pressure to be generated in the recess 83, so that the cover 87 is easily displaced or peeled off during use, resulting in low reliability of the product. SUMMARY OF THE INVENTION In view of the above problems, it is necessary to provide an image sensor package having high imaging quality and high reliability. It is also necessary to provide a digital camera module with a small package size, high image quality, and high reliability. An image sensor package includes a carrier, a wafer, a plurality of wires, a first adhesive, and a cover. The carrier is provided with a cavity, and the cavity forms an opening on a top surface of the carrier, and the top surface of the carrier is provided with a plurality of upper pads. The wafer is disposed in a chamber of the carrier, and the top mask 200810539 has a sensing area and a plurality of wafer pads. The wire electrically connects the wafer pad to the pad above the carrier. The first adhesive is disposed on the periphery of the top surface of the wafer and surrounds the outer side of the wafer sensing region. The cover is adhered to the wafer by the first adhesive and closes the sensing area of the wafer. A digital camera module, a module. The image sensor package leads the first adhesive and the chamber to form a plurality of upper pads on a top surface of the carrier. The wafer is provided with a sensing area and pads on the plurality of wafer pad carriers. The first is wrapped around the outside of the wafer sensing region. The film is enclosed in the optical path of the sensing area module of the wafer. An image sensor package and a lens include a carrier, a wafer, and a plurality of covers. The carrier is provided with a chamber, and the top surface of the carrier is disposed in the chamber of the carrier, and the top surface thereof has. The wire is electrically connected to the wafer pad and the substrate is disposed on the periphery of the top surface of the wafer, and the ring body is adhered to the crystal by the first adhesive. The image sensor package is disposed on the lens—the cover of the image image package and the digital device module is fixed on the wafer by the first adhesive coated on the periphery of the top surface of the wafer to close the film. The sensing area of the wafer is smaller on the one hand, and there are fewer dusts and particles in the enclosed space, which can reduce the pollution of the sensing area of the ^, thereby improving the image of the digital camera module. On the other hand, the internal pressure generated by the volatilized gas of the first adhesive during the baking process can be reduced, thereby reducing the possibility of peeling or offset of the cover: improving the reliability of the product. The digital camera module 10 includes an image sensor package 20, a second adhesive 40, a lens module 50, and a preferred embodiment of the digital camera module of the present invention. A lens holder 60 is disposed in the lens holder 60. The lens holder 60 is fixed to the image sensor package 20 by the second adhesive 40, and the image sensor package 20 is in the lens module. Group 50 in the light path. The image sensor package 20 includes a carrier 21, a wafer 23, a plurality of wires 24, a support member 25, a first adhesive member 26, and a cover member 28. The carrier 21 includes a substrate 211 and a frame 212. The substrate 211 has a top surface (not shown) and a bottom surface opposite the top surface (not shown). The frame 212 is disposed on the top surface of the substrate 211 to form a chamber 213 together with the substrate 211. The carrier 21 further includes a plurality of pads 215 disposed on the top surface of the frame 212, and a plurality of pads 216 disposed on the bottom surface of the substrate 211. The lower pad 216 is electrically connected to the upper pad 215 for electrical connection with other components such as a printed circuit board. The wafer 23 is an image sensor wafer that is fixed on the substrate 211 and located in the chamber 213. The top surface of the wafer 23 has a sensing region 231, and a plurality of wafer pads 233 are disposed on the periphery of the top surface of the wafer 23. The wafer pad 233 is used to output an image signal generated by the wafer 23. One end of the plurality of wires 24 is connected to the die pad 233, and the other end is connected to the pad 215 above the carrier 21. The support member 25 is a frame disposed on the top surface of the wafer 23 outside the sensing region 231 of the wafer 23. It can be understood that the support member 25 can also be a plurality of cylinders respectively disposed at four corners of the top surface of the wafer 23. The first adhesive 26 is applied around the periphery of the sensing region 231 of the wafer 23, and covers the support member 25, and covers the connection between the wire 24 and the wafer pad 233 to protect and strengthen the wire 24 and the wafer. The connection of the pad 233. The first adhesive 26 can be further coated around the wafer 23. The cover 28 is made of a transparent material and has a size no larger than the size of the chamber 213. The cover body 28 is disposed above the top surface of the wafer 23 and supported by the support member 25, and is adhered to the wafer 23 by the first adhesive 26 to close the sensing region 231 of the wafer 23. The second adhesive 40 is applied to the top surface of the frame 212 of the carrier 21, and covers the connection between the wire 24 and the pad 215 above the carrier 21. The second adhesive 40 is also applied to the periphery of the top surface of the lid 28. The lens module 50 includes a lens barrel 51, at least one lens 52, and a filter sheet 53. The lens barrel 51 is a half closed cylinder having a half closed end and an open end. The central portion of the semi-closed end has an entrance window 511 for external light to enter the lens barrel 51. An outer thread 513 is disposed on the outer wall of the lens barrel 51. The lens 52 is fixed in the lens barrel 51, and is coaxially designed with the entrance window 511 so that the light reflected by the object is incident on the lens 52 in the lens barrel 51. The filter 511, such as an infrared cut filter, is fixed to the open end of the lens barrel 51, and can close the lens barrel 51 to block impurities such as dust from entering the lens barrel 51 to contaminate the lens 52 and filter out unnecessary light. The lens holder 60 is hollow and includes a tubular portion 61 and a portion 63. The tubular portion 61 has a hollow cylindrical shape, and an inner thread 612 is provided on the inner wall thereof to cooperate with the external thread 513 of the lens barrel 51. The seat portion 63 has a rectangular shape, and a flange 631 and the tubular portion 61 are axially protruded from opposite ends of the seat portion 63, respectively. The flange 631 is sized to correspond to the frame 212 of the carrier 21. The inner wall of the seat portion 63 is also convexly provided with a 200810539 _ convex frame 633. The inner edge of the convex frame 633 has a size larger than the size of the sensing region 231 of the wafer 23 and smaller than the size of the cover body 28. The lens holder 60 is disposed on the image sensor package 20, wherein the flange of the lens holder 60 is fixed to the top surface of the frame 212 of the carrier 21 by the second adhesive 40, and the convex frame 633 of the lens holder 60 is The bottom surface is fixed to the second adhesive 40 applied to the periphery of the top surface of the lid 28. The lens module 50 is disposed in the barrel portion 61 of the lens holder 60, and the external thread 513 of the lens barrel 51 cooperates with the internal thread 612 of the cylindrical portion 61 of the lens holder 60. The lens 52 of the lens module 50 is aligned with the sensing region 231 of the wafer 23 of the image sensor package 20. It can be understood that the lens module 50 can be omitted, and at least one lens can be fixed in the tube portion 61 of the lens holder 60 by bonding or splicing to meet the imaging requirements. The cover 28 of the digital camera module 10 cooperates with the first adhesive 26 to close the sensing area 231 of the wafer 23, which forms a smaller enclosed space, on the one hand, can reduce dust, particles and the like in the closed space. Thereby reducing the contamination of the sensing region 231 of the wafer 23 to improve the image quality of the image sensor package 20; on the other hand, reducing the volatilized gas generated by the first adhesive 26 during the baking process The pressure, in turn, reduces the likelihood of the cover 28 being peeled off or offset to improve the reliability of the digital camera module 10. In addition, the cover body 28 can be more stably fixed on the wafer 23 by the support of the support member 26, and the possibility that the cover body 28 is inclined can be reduced, so that the image quality can be further improved; moreover, the size of the cover body 28 is higher. Small, you can save on material costs. In addition, the lens holder 60 is directly adhered to the top surface of the frame 213 of the carrier 21 by the second adhesive 40, which can effectively reduce the height of the digital camera module 10 by 200810539 degrees. Moreover, the convex frame 633 of the seat portion 63 of the lens holder 60 is adhered to the upper surface of the cover body 28, which can simultaneously increase the structural strength of the lens holder 60 and the cover body 28, and can also effectively prevent the dust in the chamber 213 from being contaminated. Cover body 28. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a preferred embodiment of a digital camera module of the present invention; and FIG. 2 is a schematic diagram of a conventional digital camera module. [Main component symbol description] (Invention) Digital camera module 10 Carrier 21 Frame 212 Upper pad 215 Wafer 23 Wafer soldering 233 Branch member 25 Cover 28 Lens module 50 Incident window 511 Lens 52 Image sensing Package 20 substrate 21 chamber 213 lower pad 216 sensing area 231 wire 24 first adhesive 26 second adhesive 40 lens barrel 51 external thread 513 filter 53 12 200810539 lens holder 60 barrel 61 internal thread 612 seat 63 Flange 631 convex frame 633 (conventional) digital camera module 80 substrate 81 signal output terminal 812 flange layer 82 signal connection end 822 chamber 83 wafer 84 pad 841 sensing area 843 wire 85 first back layer 86 cover Body 87 second layer 88 lens 89 13