1.359294 1100年.10月27曰修正替‘頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種成像模組，尤其涉及一種便於組裝、拆 卸之成像模組。 【先前技術】 [0002] 影像感測器可用於空間中檢測光訊號並將其轉換為電訊 號，其已被廣泛應用於各種光電產品中’且成為關鍵元 件之一。目前，行動電話向著多功能趨勢發展，具有照 相功能之行動電話一經推出即倍受歡迎°應用於行動電 ® 話之相機模組不僅要滿足輕薄短小之要求，其亦須具有 較好之畫面品質，而灰塵污染係影響晝面品質重要因素 之一。因此如何對成像模組進行拆卸清理灰塵，成為業 者所努力去克服研發之問題。 [0003] 如圖1所示，為先前之成像模組100之示意圖，其包括一 基板30、一影像感測晶片20、熱固膠18、多條導線19、 —鏡頭模組10及一濾光片15。所述基板包括一承載面31 • ’所述影像感測晶片20藉由熱固膠18固設於基板30之承 載面31上。所述承載面31上設有複數個基板焊墊3〇1，所 述影像感測晶片20上設有複數個晶片焊墊2〇1，所述複數 個基板焊墊301與所述複數個晶片焊墊201藉由所述多條 導線19對應電性連接。所述鏡頭模組10包括一透鏡組16 、一鏡筒12及一鏡座14。所述透鏡組16收容於鏡筒12内 ’所述鏡筒12螺合於鏡座14内。所述濾光片15藉由熱固 膠18粘接於鏡筒12之下端面121。所述鏡座14藉由熱固 膠18固設於基板30之承載面31上。 096144538 表單编號A0101 第3頁/共18頁 1003397946-0 1359294 _ 1100年10月27日梭正替換i [0004] 鏡座14與基板30及濾光片15與鏡筒12之間都係以熱固膠 18之方式粘合，然後進行烘烤，使熱固膠ι8熱固。惟， 於鏡座14點膠前，仍無法避免鏡筒12與鏡座14對焦而摩 擦產生之粉塵或外來灰塵掉落到影像感測晶片20上，而 影響影像感測晶片20之畫素提升，降低該成像模組1〇〇之 成像品質。同時，鏡座14與基板3〇藉由熱固膠18枯合， 熱固膠18熱固後，鏡座14與基板3〇之間不易拆除。當有 粉塵或灰塵落到影像感測晶片2 〇導致畫面品質降低時， 需更換整個成像模組1 〇〇。 【發明内容】 [0005] 有鑒於此，有必要提供一種便於組裝、拆卸、便於清理 灰塵之成像模組。 [0006] 一種成像模組’其包括：一鏡頭模組、一影像感測晶片 、一基板。所述鏡頭模組與影像感測晶片對正設置。所 述基板有一承載面用於承載所述影像感測晶片及鏡頭模 組。所述鏡頭模組包括一透鏡組、鏡筒及鏡座。所述透 鏡組設置於鏡筒内。所述鏡筒收容於鏡座内。所述成像 泰 模組還進一步包括一連接件，所述連接件固設於基板承 載面上並環繞所述影像感測晶片。所述鏡頭模組之鏡座 可拆卸地固定於連接件上。 [〇〇〇7] 相對於先前技術’所述鏡頭模組之鏡座與基板之間設有 一連接件，所述連接件固設於基板上，所述鏡頭模組之 鏡座可拆卸地固定於連接件上。如此，當有灰塵落入影 像感測晶片上時，可方便拆卸進行清理。 ί實施方式】 096144538 表單编號Α0101 第4頁/共18頁 1003397946-0 1.359294 [0008] 1100年10月27日修正替 以下將结合附圖對本發明作進一步之詳細說明。 [0009] 請一併參閱圖2至圖5，本發明第一實施方式之成像模組 200包括〆基板6〇、〆影像感測晶片50、一連接件40、 一透光元样90、一膠體層80及一鏡頭模組70。 [0010] 所述基板60可以由玻璃纖維、強化塑膠或陶瓷等材質所 製成，其包括一承載面61。 [0011] 所述影像感測晶片50可為CCD (Charge Coupled Device，電荷耦合組件感測器）4CM0S(Complement_ ary Metal Oxide Semiconductor,互補性金屬氧化物 感測器）。所述影像感測晶片5 〇既可以枯接至所述基板 60承載面61上並藉由打線方式與基板60電性連接，亦可 以使用覆晶形式、内引腳貼合、自動載帶貼合、倒貼封 裝或熱壓合連接方式使影像感測晶片結構性及電性連接 於基板6 0。所述影像感測晶片5 〇具有一感測區51。 [0012] 本實施方式中，所述透光元件9 0為一紅外濾光片，用於 對光線進行過濾。 [0013] 所述膠體層80為雙面膠、軟膠中之一種。 [0014] 所述連接件40為一中空方形邊框結構，包括四相互鄰接 之邊框42。該連接件40固設於所述基板60之承載面61上 並環繞所述影像感測晶片50。本實施方式中，所述連接 件40之邊框内設有一隔板43 ’因此，所述連接件4〇之邊 框42内被間隔形成二凹槽，即第一凹槽41及與第一凹槽 41相對之第二凹槽46。所述第一凹槽41之深度與所述透 光元件90之厚度相當，優選地’所述第一凹槽41之深度 096144538 表單編號A0101 第5頁/共18頁 1003397946-0 100年ίο月27日修正替換百 與所述透光元件90之厚度相同。所述第二凹槽46之深度 大於或等於所述影像感測晶片50之厚度’優選地’所述 第二凹槽46之深度與所述影像感測晶片5〇之厚度相同。 所述第二凹槽46收容所述影像感測晶片50且環繞該影像 感漁j晶片50。所述隔板43包括一與鏡頭模組70相對之頂 面47，該頂面47上開設有一圓形之貫穿開口 44，所述貫 穿開口 44之尺寸大於或等於所述影像感測晶片5〇之感測 區51之尺寸。所述透光元件90藉由所述膠體層80固設於 所述隔板43之頂面47上。所述邊框42上設有第一卡制部 ，所述第一卡制部為複數個等高之凸塊45 ’本實施方式 € 中，所述第一卡制部為四個等高之凸塊45 ’其分別設置 於不同之邊框42上。該四個凸塊45與邊框42採用相同材 料做成，並為一體結構。所述四個凸塊45與所述邊框42 亦可為二獨立之元件，該四個凸塊45藉由粘接方式粘著 於所述邊框42上。 [0015] 實際應用中，所述連接件40亦可與所述基板60為一體結 構。所述四個&塊45亦可分別設置於之邊框42之拐角位 置上，並不限於本實施方式。 [0016] 所述鏡頭模組70包括透鏡組（圖未示）、一鏡筒72及一 鏡座74。所述透鏡組包括至少一光學鏡片，該透鏡組收 容於所述鏡筒74内。所述鏡筒72外側設有外螺紋71 ’所 述鏡座74内側設有内螺紋73 ’所述鏡筒72藉由外螺紋71 與内螺紋73旋入至鏡座74内固定或調焦。本實施方式中 ，所述鏡座74包括一與影像感測晶片50正對之底面741， 該底面741對應所述邊框42上之第一卡制部設有第二卡制 096144538 表單編號A0101 第6頁/共18頁 1003397946-0 100年.10月27日梭正替換頁 部’所述第二卡制部為為複數個收容孔742。本實施方式 中所述第二卡制部對應連接件40上之四個凸塊45對應 為四個收容孔742。所述凸塊45與所述收容孔742藉由過 盈配合’使鏡座74固定於連接件4〇之邊框42上。 [00Π]貝際應用中，所述連接件4〇之邊框42之第一卡制部亦可 為複數個收容孔’所述鏡座74之第二卡制部為複數個凸 塊°所述連接件4〇亦可不設有隔板43，所述透光元件9〇 設於鏡筒72内，並不限於本實施方式。 [〇〇18]明參閱圖6 ’為本發明第二實施方式之成像模組300。所 述成像模組300之結構與所述第一實施方式成像模組2〇〇 之結構大體相同，該成像裝置3〇〇之結構與成像裝置200 之結構主要差異在於：所述連接件4〇上之第一卡制部為 各邊框42上分別延伸出之四個凸條48，所述鏡頭模組7〇 之鏡座74包括相互鄰接之四側邊78，所述第二卡制部為 所述鏡座74之各側邊78對應所述凸條48開設之四個卡制 槽75，所述凸條48卡制於所述卡制槽75内，使鏡座74固 定於連接件40之邊框42上。 [0019] 所述鏡頭模組之鏡座與基板之間設有一連接件，所述連 接件固設於基板上，所述鏡頭模組之鏡座可拆卸地固定 於連接件上。如此，當有灰塵落入影像感測晶片上時， 可方便拆卸進行清理。 [0020] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟’以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技 096144538 表單编號A0101 第7頁/共18頁 1003397946-0 1359294 100年10月27日核正替換i 蝥之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0021]圖1係先前之一種成像模組剖視圖； []圖2係本發明第一實施方式之成像模組之立體分解圖； [0023]圖3係本圖2中之連接件之另一角度之立體圖； [〇〇24]圖4係本發明第一實施方式之成像模組之鏡座之立體圖； [0025] 圖5係本發明第一實施方式之成像模組之立體剖視圖； [0026] 圖6係本發明第二實施方式之成像模組之立體分解圖。 【主要元件符號說明】 [⑽27]成像模組：1〇〇，2〇〇，300 [0028] 鏡頭模組：1〇，70 [0029] 外螺紋：Η _〇]鏡筒：12，72 [0031] 内螺紋:73 _ [0032] 鏡座：，74 [0033] 透鏡組：1 6 [0034] 熱固膠：1 81.359294 1100. October 27曰 Revision ‘Page VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an imaging module, and more particularly to an imaging module that is easy to assemble and disassemble. [Prior Art] [0002] Image sensors can be used to detect optical signals in space and convert them into electrical signals, which have been widely used in various optoelectronic products' and become one of the key components. At present, mobile phones are moving towards multi-functional trends. Mobile phones with camera functions are popular as soon as they are launched. Camera modules for mobile phones are not only required to meet the requirements of lightness and thinness, but also have better picture quality. And dust pollution is one of the important factors affecting the quality of kneading. Therefore, how to disassemble and clean the dust of the imaging module has become a problem that the industry has tried to overcome the research and development. [0003] As shown in FIG. 1 , a schematic diagram of a prior imaging module 100 includes a substrate 30 , an image sensing chip 20 , a thermosetting adhesive 18 , a plurality of wires 19 , a lens module 10 , and a filter . Light sheet 15. The substrate includes a bearing surface 31. The image sensing wafer 20 is fixed on the carrier surface 31 of the substrate 30 by a thermosetting glue 18. The carrier surface 31 is provided with a plurality of substrate pads 3〇1, and the image sensing wafer 20 is provided with a plurality of wafer pads 2〇1, the plurality of substrate pads 301 and the plurality of wafers The pad 201 is electrically connected by the plurality of wires 19 . The lens module 10 includes a lens group 16 , a lens barrel 12 and a lens holder 14 . The lens group 16 is housed in the lens barrel 12. The lens barrel 12 is screwed into the lens holder 14. The filter 15 is bonded to the lower end surface 121 of the lens barrel 12 by a thermosetting glue 18. The lens holder 14 is fixed to the bearing surface 31 of the substrate 30 by a thermosetting glue 18. 096144538 Form No. A0101 Page 3 of 18 1003397946-0 1359294 _ October 27, 1100 Shuttle Replacement i [0004] Mirror mount 14 and substrate 30 and between filter 15 and barrel 12 are The thermosetting glue 18 is bonded and then baked to thermoset the thermosetting adhesive ι8. However, before the lens holder 14 is dispensed, it is still impossible to prevent the lens barrel 12 from focusing on the lens holder 14 and the dust generated by the friction or the external dust falling onto the image sensing wafer 20, thereby affecting the pixel enhancement of the image sensing wafer 20. , reducing the imaging quality of the imaging module. At the same time, the lens holder 14 and the substrate 3 are dried by the thermosetting glue 18, and after the thermosetting glue 18 is thermosetting, the lens holder 14 and the substrate 3 are not easily removed. When dust or dust falls on the image sensing wafer 2 and the picture quality is degraded, the entire imaging module 1 需 needs to be replaced. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide an imaging module that is easy to assemble, disassemble, and facilitate cleaning of dust. An imaging module includes a lens module, an image sensing chip, and a substrate. The lens module and the image sensing wafer are aligned. The substrate has a carrying surface for carrying the image sensing wafer and the lens module. The lens module includes a lens group, a lens barrel and a lens holder. The lens group is disposed in the lens barrel. The lens barrel is housed in the lens holder. The imaging module further includes a connector fixed to the substrate carrying surface and surrounding the image sensing wafer. The lens holder of the lens module is detachably fixed to the connecting member. [〇〇〇7] A connecting member is disposed between the lens holder and the substrate of the lens module, and the connecting member is fixed on the substrate, and the lens holder of the lens module is detachably fixed On the connector. Thus, when dust falls on the image sensing wafer, it can be easily disassembled for cleaning.实施实施方式] 096144538 Form No. 1010101 Page 4 of 18 1003397946-0 1.359294 [0008] October 27, 1100, the present invention will be further described in detail below with reference to the accompanying drawings. 2 to FIG. 5, the imaging module 200 of the first embodiment of the present invention includes a 〆 substrate 6 〇, a 〆 image sensing wafer 50, a connecting member 40, a light transmitting element 90, and a The colloid layer 80 and a lens module 70. [0010] The substrate 60 may be made of a material such as glass fiber, reinforced plastic or ceramic, and includes a bearing surface 61. [0011] The image sensing wafer 50 may be a CCD (Charge Coupled Device) 4CMOS (Complementary Metal Oxide Semiconductor). The image sensing chip 5 〇 can be adhered to the substrate 60 bearing surface 61 and electrically connected to the substrate 60 by wire bonding, or can be used in the form of flip chip, internal pin bonding, and automatic tape loading. The image sensing wafer is structurally and electrically connected to the substrate 60 by a flip-chip, a flip-chip package or a thermocompression bonding. The image sensing wafer 5 has a sensing region 51. [0012] In the embodiment, the light transmitting element 90 is an infrared filter for filtering light. [0013] The colloid layer 80 is one of a double-sided tape and a soft rubber. [0014] The connecting member 40 is a hollow square frame structure, and includes four adjacent frames 42. The connecting member 40 is fixed on the bearing surface 61 of the substrate 60 and surrounds the image sensing wafer 50. In this embodiment, a partition plate 43 is disposed in the frame of the connecting member 40. Therefore, the frame 42 of the connecting member 4 is spaced apart to form two grooves, that is, the first groove 41 and the first groove. 41 opposite the second recess 46. The depth of the first groove 41 is equivalent to the thickness of the light transmissive element 90, preferably 'the depth of the first groove 41 096144538 Form No. A0101 Page 5 / 18 pages 1003397946-0 100 years ίο月The correction replacement on the 27th is the same as the thickness of the light transmissive element 90. The depth of the second recess 46 is greater than or equal to the thickness of the image sensing wafer 50. Preferably, the depth of the second recess 46 is the same as the thickness of the image sensing wafer 5'. The second recess 46 receives the image sensing wafer 50 and surrounds the image sensing wafer 50. The partition plate 43 includes a top surface 47 opposite to the lens module 70. The top surface 47 defines a circular through opening 44. The through opening 44 has a size greater than or equal to the image sensing wafer 5〇. The size of the sensing area 51. The light transmissive element 90 is fixed to the top surface 47 of the partition 43 by the colloid layer 80. The frame 42 is provided with a first locking portion, and the first clamping portion is a plurality of bumps 45 of the same height. In the embodiment, the first clamping portion has four contour protrusions. Block 45' is disposed on a different bezel 42 respectively. The four projections 45 are made of the same material as the bezel 42 and are of unitary construction. The four bumps 45 and the frame 42 may also be two separate components, and the four bumps 45 are adhered to the frame 42 by adhesive bonding. [0015] In practical applications, the connecting member 40 may also be integrally formed with the substrate 60. The four & blocks 45 may also be disposed at the corners of the bezel 42 respectively, and are not limited to the embodiment. [0016] The lens module 70 includes a lens group (not shown), a lens barrel 72, and a lens holder 74. The lens group includes at least one optical lens housed within the lens barrel 74. The outer side of the lens barrel 72 is provided with an external thread 71'. The inside of the lens holder 74 is provided with an internal thread 73'. The lens barrel 72 is screwed into the lens holder 74 by an external thread 71 and an internal thread 73 to be fixed or adjusted. In this embodiment, the lens holder 74 includes a bottom surface 741 opposite to the image sensing wafer 50. The bottom surface 741 is provided with a second card 096144538 corresponding to the first card portion on the frame 42. Form No. A0101 6 pages / a total of 18 pages 1003397946-0 100 years. On October 27th, the shuttle is replacing the page portion 'the second card portion is a plurality of receiving holes 742. In the embodiment, the four engaging portions of the second engaging portion corresponding connector 40 are corresponding to the four receiving holes 742. The bump 45 and the receiving hole 742 are fixed to the frame 42 of the connecting member 4 by an interference fit. [0050] In the field application, the first locking portion of the frame 42 of the connecting member 4 can also be a plurality of receiving holes. The second locking portion of the lens holder 74 is a plurality of bumps. The connecting member 4A may not be provided with the partition plate 43, and the light transmitting member 9 is disposed in the lens barrel 72, and is not limited to the embodiment. [0018] Referring to Figure 6 is an imaging module 300 according to a second embodiment of the present invention. The structure of the imaging module 300 is substantially the same as that of the imaging module 2A of the first embodiment. The structure of the imaging device 3 is different from the structure of the imaging device 200 in that the connector 4〇 The first clamping portion is a plurality of four ribs 48 extending from the respective frame 42. The lens holder 74 of the lens module 7 includes four side edges 78 adjacent to each other, and the second clamping portion is Each of the side edges 78 of the lens holder 74 corresponds to the four locking grooves 75 formed by the ribs 48. The ribs 48 are locked in the locking groove 75, so that the lens holder 74 is fixed to the connecting member 40. On the border 42. [0019] A connecting member is disposed between the lens holder of the lens module and the substrate, and the connecting member is fixed on the substrate, and the lens holder of the lens module is detachably fixed to the connecting member. In this way, when dust falls on the image sensing wafer, it can be easily disassembled for cleaning. [0020] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiment, and is familiar with the present technology 096144538 Form No. A0101 Page 7 / 18 pages 1003397946-0 1359294 100 Equivalent modifications or variations made by a person who has been replaced by i 蝥 10 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 BRIEF DESCRIPTION OF THE DRAWINGS [0021] FIG. 1 is a cross-sectional view of a prior art imaging module; [2] FIG. 2 is an exploded perspective view of an imaging module according to a first embodiment of the present invention; [0023] FIG. 3 is in FIG. FIG. 4 is a perspective view of a lens holder of an imaging module according to a first embodiment of the present invention; [0025] FIG. 5 is an imaging module according to a first embodiment of the present invention; 3 is a perspective exploded view of an imaging module according to a second embodiment of the present invention. [Main component symbol description] [(10)27] Imaging module: 1〇〇, 2〇〇, 300 [0028] Lens module: 1〇, 70 [0029] External thread: Η _〇] Lens barrel: 12,72 [ 0031] Internal thread: 73 _ [0032] Frame: 74 [0033] Lens group: 1 6 [0034] Thermosetting glue: 1 8
[0035] 膠體層：U[0035] Colloid layer: U
[0036] 透光元件：15, 90 096144538 表單編號A0101 第8頁/共18頁 1003397946-0 100年.10月27日梭正替換頁 1359294 [0037] 導線：19 [0038] 下端面：121 [0039] 連接件：40 [0040] 第一凹槽：41 [0041] 邊框：42 [0042] 隔板：43 [0043] 貫穿開口 ： 44Light transmissive element: 15, 90 096144538 Form number A0101 Page 8 of 18 page 1003397946-0 100 years. October 27th shuttle replacement page 1359294 [0037] Wire: 19 [0038] Lower end face: 121 [ 0039] Connector: 40 [0040] First groove: 41 [0041] Frame: 42 [0042] Partition: 43 [0043] Through opening: 44
[0044] 凸塊：45 [0045] 頂面：47 [0046] 影像感測晶片：20，50 [0047] 感測區：51 [0048] 基板：30，60 [0049] 承載面：31，61 [0050] 晶片焊墊：201 [0051] 基板焊墊：301 [0052] 第二凹槽：46 [0053] 底面：741 [0054] 收容孔：742 [0055] 凸條：48 096144538 表單編號A0101 第9頁/共18頁 1003397946-0 1359294 100年10月27日核正替换百 [0056] 卡制槽：7 5 [0057] 側邊：78 096144538 表單编號A0101 第10頁/共18頁 1003397946-0[0044] Bump: 45 [0045] Top surface: 47 [0046] Image sensing wafer: 20, 50 [0047] Sensing area: 51 [0048] Substrate: 30, 60 [0049] Bearing surface: 31, 61 Wafer pad: 201 [0051] Substrate pad: 301 [0052] Second groove: 46 [0053] Bottom surface: 741 [0054] Housing hole: 742 [0055] Rib: 48 096144538 Form No. A0101 9 pages / total 18 pages 1003397946-0 1359294 October 27, 100 nuclear replacement 100 [0056] Card slot: 7 5 [0057] Side: 78 096144538 Form number A0101 Page 10 / Total 18 pages 1003397946- 0