JP2014017716A - Semiconductor device, manufacturing method of the same, and electronic information device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a semiconductor device which achieves the downsizing, the reduction of a number of packaging components, and the simplification of the packaging process, which prevents substantial optical interference of a light emitting element with a light receiving element in a case where the light receiving element and the light emitting element are housed in the same package.SOLUTION: A camera module 100 includes a light receiving element 110 and light emitting elements 120a to 120c and houses the light receiving element and the light emitting elements in the same package 1. A douser 20b is disposed at an intermediate region R3, which is located between a placement region R1 of the light receiving element and a placement region R2 of the light emitting elements in a packaging substrate 10 forming the package 1, so that the light receiving element 110 is not subject to optical interference caused by the light emitting elements 120a to 120c.

Description

  The present invention relates to a semiconductor device, a manufacturing method thereof, and an electronic information device, and more particularly to a semiconductor device such as a small camera device in which a camera unit and a strobe unit are integrated, and a manufacturing method thereof. The present invention relates to an electronic information device provided with a simple semiconductor device.

  Conventionally, a small camera device (camera module) provided with a light receiving element does not have a built-in strobe because of a structure that requires miniaturization, and a mobile phone with such a small camera device built in a dark place. Although photography and night photography were not possible, the strobe was also downsized, so recent mobile phones and the like have used a strobe device in combination with a camera module (for example, Patent Document 1). ).

  7A and 7B are diagrams for explaining the mobile phone disclosed in Patent Document 1. FIG. 7A shows the appearance of the mobile phone, and FIG. 7B shows a partial sectional structure of the mobile phone. Is shown.

  In this cellular phone 81, as shown in FIG. 7 (a), an image sensor module 82 is arranged on the upper side of the liquid crystal screen 89 on the front surface side, and three image sensors are spaced around the image sensor module 82 at intervals of 120 degrees. An LED (light emitting diode) 85 is embedded. The image sensor module 82 is attached to an FPC (flexible printed circuit board) 83 a, and the FPC 83 a is connected to the main board 83 by an FPC connector 84.

  As described above, in a mobile phone in which the LED 85 is built in together with the image sensor module 82, shooting in a dark place or night shooting can be performed by illuminating the subject by light emission of the LED 85.

JP 2003-101836 A

  However, in a conventional mobile phone incorporating a strobe device such as an LED together with an image sensor module (camera module), the camera module and the strobe device are built in as separate parts. It is necessary to mount the camera module and the strobe device separately on the mounting board of the mobile phone, which is troublesome to mount. Furthermore, the camera module and the strobe device are arranged at a predetermined interval. Therefore, there is a problem that it is necessary to secure a space for the reduction in size and an obstacle to miniaturization.

  Also, if the strobe device is arranged in the camera module and the camera module and strobe device are integrated, the trouble of separately mounting the camera module and strobe device can be saved, but the light receiving element and light emitting element (LED) are bare chip. That is, if the semiconductor chips are mounted side by side, there is a problem that the light receiving element is subjected to optical interference due to light from the light emitting element.

  The present invention has been made in order to solve the above-described problems. The light receiving element and the light emitting element can be accommodated in the same package and optically separated from the light emitting element. As a result, it is possible to realize a camera module capable of flash emission, which can be reduced in size, reduced in the number of mounted components, and simplified in the mounting process, and without substantial optical interference of the light emitting element with respect to the light receiving element. It is an object of the present invention to obtain an apparatus, a manufacturing method thereof, and an electronic information device including such a semiconductor device.

  A semiconductor device according to the present invention is a semiconductor device in which a light receiving element and a light emitting element are accommodated in the same package, the package substrate constituting the package, the light receiving element mounted on the package substrate, and the package substrate. A light-emitting element mounted on the light-receiving element so as to be adjacent to the light-receiving element; and a package lid member made of a light-shielding member and mounted on the package substrate so as to cover the light-receiving element and the light-emitting element. The package lid member has a light shielding plate disposed between the light receiving element and the light emitting element so that the light receiving element is not subjected to optical interference by the light emitting element. The objective is achieved.

  According to the present invention, in the above semiconductor device, the package lid member has an integrated structure of a lid body that covers the light receiving element and the light emitting element, and a light shielding plate disposed between the light receiving element and the light emitting element. It is preferable that

  According to the present invention, in the semiconductor device, the lid body includes a light emitting surface facing portion of the top wall facing the light emitting surface of the light emitting element, and a light receiving surface of the top wall facing the light receiving surface of the light receiving element. A light emitting opening for emitting light emitted from the light emitting element to the outside of the package has a structure in which the height from the package substrate is different between the facing portion and the light emitting surface facing portion of the top wall. It is preferable that a light introduction opening for introducing light from the outside of the package into the light receiving element is located in the light receiving surface facing portion of the top wall.

  According to the present invention, in the semiconductor device, the package substrate is provided on a mounting surface on which the light emitting element and the light receiving element are mounted so as to be adjacent to the light receiving element, and is connected to a terminal of the light receiving element. An electrode, and a light emitting element electrode provided on the mounting surface so as to be adjacent to the light emitting element and connected to a terminal of the light emitting element, and the arrangement region of the light receiving element on the mounting surface of the package substrate And a light emitting element electrode group including one or more electrodes for the light receiving element and one or more light emitting elements for the light emitting element. It is preferable that the electrode groups for light emitting elements made of electrodes are alternately arranged.

  According to the present invention, in the semiconductor device, the light shielding plate is disposed so as to partition the light receiving element disposed region and the light emitting element disposed region, and the light receiving element electrode included in the light receiving element electrode group Is arranged so as to be positioned on the light receiving element arrangement region side with respect to the light shielding plate, and the light emitting element electrode included in the light emitting element electrode group is arranged with respect to the light shielding plate. It is preferable to arrange so as to be located on the side.

  In the semiconductor device, the light emitting element terminal array and the light emitting element electrode array connected to the light emitting element terminal are disposed to face each other, and the light emitting element terminal is connected to the light emitting element terminal. It is preferable that the connected electrode for the light emitting element is disposed between the light receiving element and the light emitting element.

  According to the present invention, in the semiconductor device, the light emitting element includes a terminal of the light emitting element arranged in a line, and an array of the terminals of the light emitting element and an array of the electrodes for the light emitting element connected to the terminals of the light emitting element. Are preferably arranged so as to face each other.

  In the semiconductor device, the terminal of the light emitting element and the electrode for the light emitting element are electrically connected by a wire, and the terminal of the light receiving element and the electrode for the light receiving element are electrically connected by a wire. The three adjacent light emitting elements in the arrangement region of the light emitting elements are each positioned at the apex of one triangle, and two of the three light emitting elements facing each other among the three light emitting elements. It is preferable that a wire connecting the terminal of the remaining one light emitting element and the electrode for the light emitting element pass between them.

  In the semiconductor device according to the present invention, it is preferable that the light receiving element is a CCD image sensor or a CMOS image sensor that captures an image of a subject, and the light emitting element is a light emitting diode.

  A method of manufacturing a semiconductor device according to the present invention is a method of manufacturing the above-described semiconductor device according to the present invention, wherein the light receiving element and the light emitting element are arranged adjacent to each other on the package substrate, A step of electrically connecting a terminal of the light receiving element and a terminal of the light emitting element to an electrode formed on the package substrate, and the package lid member covering the light receiving element and the light emitting element on the package substrate. The light shielding plate is fixed to the package substrate at the same time as the package lid member is fixed to the package substrate, thereby achieving the above object.

  An electronic information device according to the present invention is an electronic information device including an image pickup unit that picks up an image of a subject, and the image pickup unit is the above-described semiconductor device according to the present invention, whereby the above-described object is achieved. The

  Next, the operation will be described.

  In the present invention, in a semiconductor device having a light receiving element and a light emitting element, the light receiving element and the light emitting element are housed and integrated in the same package. Can be obtained, and the mounting process can be simplified.

  In addition, by combining the light receiving element and the light emitting element in one package, the optical axis centers of the light receiving element and the light emitting element are closer, thereby suppressing the occurrence of shadows due to the misalignment of the optical axis centers of both elements. Can do.

  In addition, since the package lid member constituting the package has a light shielding plate disposed between the light receiving element and the light emitting element so that the light receiving element is not subjected to optical interference by the light emitting element, It is possible to avoid image quality degradation of a captured image due to optical interference of the light emitting element with respect to the light receiving element.

  As a result, a camera module equipped with a strobe light emitting function can be reduced in size, the number of mounted parts can be reduced, and the mounting process can be simplified, and the light emitting element can be obtained without substantial optical interference with respect to the light receiving element. As a result, electronic information equipment equipped with such a semiconductor device as a camera module can be reduced in size and cost.

  In the present invention, since the lid body and the light shielding plate are integrated in the package lid member, the light shielding plate can be packaged simultaneously with the package lid member by positioning and attaching the package lid member to the package substrate. The light shielding plate can be positioned with respect to the package substrate. Therefore, alignment of the light shielding plate with respect to the package substrate is not necessary.

  Further, in the present invention, in the package lid member, the light emitting surface facing portion facing the light emitting surface of the light emitting element in which the light emitting opening of the top surface wall is formed, the light introducing opening of the top surface wall is located. Since the light receiving surface facing part facing the light receiving surface of the element is higher than the package substrate, the light emitted from the light emitting opening is prevented from entering the light receiving element from the light introducing opening due to irregular reflection or the like. Can do.

  Further, in the present invention, an intermediate region located between the light receiving element arrangement region and the light emitting element arrangement region on the mounting surface of the package substrate includes a light receiving element electrode group including one or more light receiving element electrodes, Since the light emitting element electrode groups including one or more light emitting element electrodes are alternately arranged, an intermediate region between the light receiving element arrangement region and the light emitting element arrangement region is defined as the light receiving element electrode and the light emitting element electrode. In other words, the light emitting element electrode is located in a space where the light receiving element electrode is not disposed, and the arrangement space occupied by the electrodes of both elements can be reduced. For this reason, it becomes possible to narrow the arrangement | positioning space | interval of a light receiving element and a light emitting element, Thereby, a mutual optical axis can be adjoined and the further miniaturization of the camera module incorporating a strobe is attained.

  Further, in the present invention, the plurality of light emitting elements are arranged in a line along one side of the light receiving element so that the terminals of these light emitting elements are arranged in a line. The dimension in the direction in which the light emitting element arrangement area and the light receiving element arrangement area are arranged can be reduced, and the camera module can be further downsized.

  Furthermore, in the present invention, the three light emitting elements in the light emitting element arrangement region are arranged so as to generate red light, green light, and blue light, respectively, so as to be positioned at the apex of the triangle. It is possible to improve color developability such as avoiding uneven color of light (for example, red light, green light, and blue light) from two light emitting elements.

  As described above, according to the present invention, the light receiving element and the light emitting element can be accommodated in the same package by optically separating the light receiving element from the light emitting element. As a module, it is possible to obtain a semiconductor device that can be miniaturized, reduced the number of mounted components, and simplified the mounting process, and can realize a module without substantial optical interference of the light emitting element with respect to the light receiving element. Furthermore, a method for manufacturing such a semiconductor device and an electronic information device including such a semiconductor device can be obtained.

FIG. 1 is a diagram for explaining a semiconductor device according to Embodiment 1 of the present invention. FIG. 1A is a diagram illustrating an appearance of a camera module as the semiconductor device, and FIG. FIG. 1C is a diagram of a cross-sectional structure of the camera module shown in a) taken along the plane parallel to the mounting surface of the package substrate including the Ib-Ib line, and FIG. 1C is a diagram of FIG. It is a figure which shows the structure of an Ic-Ic line cross section, FIG.1 (d) is a figure which shows the structure of the lens holder in this camera module. FIG. 2 is a view for explaining an example of the assembly order of the semiconductor device (camera module) according to Embodiment 1 of the present invention. FIG. 2A shows a lens holder on the package cover member of the camera module shown in FIG. FIG. 2B shows a process of attaching the package lid member with the lens holder attached to the package substrate. 3 is a view for explaining another example of the assembly order of the semiconductor device (camera module) according to Embodiment 1 of the present invention. FIG. 3 (a) shows the package cover member of the camera module shown in FIG. A process of attaching to the package substrate is shown, and FIG. 3B shows a process of attaching the lens holder to the package lid member attached to the package substrate. 4A and 4B are diagrams for explaining a semiconductor device according to Embodiment 2 of the present invention. FIG. 4A is a diagram showing an appearance of a camera module as the semiconductor device, and FIG. It is the figure which looked at the cross-section in the surface parallel to the mounting surface of the package board | substrate containing the IVb-IVb line in the camera module shown to a from the upper direction of the camera module. 5A and 5B are diagrams for explaining a semiconductor device according to Embodiment 3 of the present invention. FIG. 5A is a diagram showing an appearance of a camera module as the semiconductor device, and FIG. It is the figure which looked at the cross-section in the surface parallel to the mounting surface of the package board | substrate containing the Vb-Vb line | wire in the camera module shown to a) from the upper direction of the camera module. FIG. 6 is a block diagram illustrating a schematic configuration example of an electronic information device using the semiconductor device according to any one of Embodiments 1 to 3 as an imaging unit as Embodiment 4 of the present invention. 7A and 7B are diagrams for explaining the mobile phone disclosed in Patent Document 1. FIG. 7A shows the appearance of the mobile phone, and FIG. 7B shows a partial cross-sectional structure of the mobile phone. It shows.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
1A and 1B are diagrams for explaining a semiconductor device according to Embodiment 1 of the present invention. FIG. 1A is a diagram illustrating an appearance of a camera module as the semiconductor device, and FIG. The figure which looked at the cross-section in the surface parallel to the mounting surface of the package board | substrate containing the Ib-Ib line in the camera module shown to a from the camera module, FIG.1 (c) is FIG.1 (b). It is a figure which shows the structure of an Ic-Ic line cross section, and FIG.1 (d) is a figure which shows the structure of a lens holder.

  The camera module 100 according to the first embodiment includes a light receiving element 110 such as an image sensor chip and light emitting elements 120a to 120c such as LED (light emitting diode) chips, and the light receiving element 110 and the light emitting elements 120a to 120c. It is housed in the same package 1. As the image sensor chip, a solid-state image sensor chip that constitutes a CCD image sensor, a CMOS image sensor, or the like is used. These light emitting elements 120a, 120b, and 120c emit red light, green light, and blue light, respectively. These light emitting elements can emit light at the same time in order to generate white strobe light. In order to generate the light, the light can be emitted independently.

  The package 1 includes a package substrate 10 and a package lid member 20 called a holder, and the light receiving element 110 and the light emitting elements 120a to 120c are mounted on the package substrate 10 so as to be adjacent to each other. 10, a package lid member 20 is attached with an adhesive resin A1 so as to cover the light receiving element 110 and the light emitting elements 120a to 120c. This adhesive resin A1 is a resin having a light shielding property such as a black resin, for example, and fills a gap formed between the package substrate 10 and the lower end of the package lid member 20 to ensure the light shielding property of the package 1. have. As the material of the adhesive resin A1, a material capable of obtaining sufficient strength as the adhesive strength between the package substrate 10 and the package lid member 20 is used.

  Here, the package substrate 10 is a rectangular printed board, and a light receiving element 110 having a planar rectangular shape is formed in a light receiving element arrangement region R1 of the package substrate 10 by a die bond adhesive B1 for a light receiving element called a die bond paste. In the light emitting element arrangement region R2 of the package substrate 10, three planar square light emitting elements 120a to 120c are fixed by a die bond adhesive B2 for the light emitting element. For these die bond adhesives B1 and B2, an adhesive capable of making the adhesive layer for bonding the package substrate 10 and each element as thin as possible is used. These three light emitting elements 120a to 120c generate red light, green light, and blue light, respectively, and extend along one side (the light emitting element side) of the planar square light receiving element 110. They are arranged in a line. In FIG. 1 (b), the light receiving element 110 and the light emitting elements 120a to 120c have a rectangular shape, but the planar shape of these elements is not limited to a rectangular shape, and is a square shape. There may be.

  The package lid member 20 includes the lid body 20a that covers the light receiving element 110 and the light emitting elements 120a to 120c, and the optical interference between the light receiving element 110 and the light emitting elements 120a to 120c by the light emitting elements 120a to 120c. The lid body 20a and the light shielding plate 20b are integrally structured, and are formed by integral molding of a light shielding resin, for example, a black resin.

  The lid body 20a has a light emitting surface facing portion P2 of the top wall 21 facing the light emitting surface Ef of the light emitting elements 120a to 120c, and a light receiving surface facing the light receiving surface Rf of the light receiving element 110 of the top surface wall 21. The portion P1 has a structure in which the height from the package substrate 10 is different, and the light emitting surface facing portion P2 of the top wall 21 emits light emitted from the light emitting elements 120a to 120c to the outside of the package. A transparent cover member Cv made of a transparent member is attached to the light emission opening Ap2. The transparent cover member Cv has a lens function for expanding the light flux of the light from the light emitting element or making it a parallel light flux depending on the application. The light receiving surface facing portion P1 of the top wall 21 is formed with a component mounting hole 21a for mounting a lens holder Lh called a barrel holding the lens L. A lens holder Lh is screwed into the component mounting hole 21a, and a light introduction opening Ap1 for introducing light into the light receiving element 110 from the outside of the package is formed at the center of the lens holder Lh.

  Specifically, the light emitting surface facing portion P2 facing the light emitting surface Ef of the light emitting elements 120a to 120c in which the light emitting opening Ap2 of the top surface wall 21 is formed is the light introducing opening Ap1 of the top surface wall 21. Is higher than the light receiving surface facing portion P1 facing the light receiving surface Rf of the light receiving element 110 where is located with respect to the package substrate 10.

  The lens holder Lh and the component mounting hole 21a are fixed by pouring a low-viscosity adhesive (not shown) into these gaps. A lid glass Lg is attached to the lower end of the component mounting hole 21a as an infrared cut filter. The lens holder Lh is made of a light-shielding resin, and two lens members L1 and L2 are held on the lens holder Lh so as to overlap each other as shown in FIG. 1 (d). . The upper lens member L1 has a central portion curved upward and has a lens function at the central portion, and the lower lens member L2 has a central curved portion and a lens at the central portion. These two lens members L1 and L2 condense the light from the outside of the package onto the light receiving surface Rf of the light receiving element 110. Here, the entire lens members L1 and L2 are made of a transparent resin.

  However, the lens holder Lh is not limited to the structure shown in FIGS. 1C and 1D, and the number of lenses to be held and the shape of the lenses are designed in accordance with the application and the like. Lh is not limited to a structure that holds the lens L fixedly, and the lens holder may have a structure that holds the lens so that the lens can be moved. Used in cameras equipped with a focus function. In other words, in the present invention, the lens holder may be anything as long as it constitutes an optical system that guides light from the subject to the light receiving element 110.

  The package substrate 10 is provided on the mounting surface 10a on which the light receiving element 110 and the light emitting elements 120a to 120c are mounted so as to be adjacent to the light receiving element 110, and is connected to the terminal 111 of the light receiving element. A light emitting element electrode 12 is provided on the mounting surface 10a so as to be adjacent to the light emitting elements 120a to 120c and connected to the terminal 121 of the light emitting element. The light receiving element electrode 11 and the light emitting element electrode 12 are formed of a conductive layer formed on the surface of an insulating member constituting the package substrate 10 and having a surface plated with gold.

  The light receiving element electrode 11 is arranged along the arrangement of the terminals 11 of the light receiving element 110 so that the arrangement of the terminals 111 of the light receiving element 110 and the arrangement of the light receiving element electrodes 11 connected to the terminals 111 of the light receiving element face each other. The light emitting element electrode 12 emits light so that the arrangement of the terminals 121 of the light emitting elements 120a to 120c and the arrangement of the light emitting element electrodes 12 connected to the terminals 121 of the light emitting elements face each other. Arranged along the arrangement of the terminal 121 of the element. Here, the light receiving element terminal 111 and the light receiving element electrode 11 are connected by a wire W such as a gold wire, and the light emitting element terminal 121 and the light emitting element electrode 12 are similarly connected by a wire W such as a gold wire. Connected by.

  Furthermore, in the intermediate region R3 located between the light receiving element arrangement region R1 and the light emitting element arrangement region R2 on the mounting surface 10a of the package substrate 10, a light receiving element electrode group G1 including a plurality of light receiving element electrodes 11 and The light emitting element electrode groups G2 including the plurality of light emitting element electrodes 12 are alternately arranged. The number of light receiving element electrodes 11 included in the light receiving element electrode group G1 may be one, and the number of light emitting element electrodes 12 included in the light emitting element electrode group G2 may be one.

  Further, the light shielding plate 20b is arranged so as to partition the light receiving element arrangement region R1 and the light emitting element arrangement region R2, and the light receiving element electrode 11 included in the light receiving element electrode group G1 is arranged with respect to the light shielding plate 20b. The light emitting element electrode 12 included in the light emitting element electrode group G2 is disposed so as to be located on the light emitting element arranging region R2 side with respect to the light shielding plate 20b. ing.

  Next, a manufacturing method of the camera module according to the first embodiment will be described.

  FIG. 2 is a view for explaining an example of the assembly order of the semiconductor device (camera module) according to Embodiment 1 of the present invention. FIG. 2A shows a lens holder on the package cover member of the camera module shown in FIG. FIG. 2B shows a process of attaching the package lid member with the lens holder attached to the package substrate.

  First, a package lid member 20 having a lid body 20a and a light shielding plate 20b is formed by integral molding of a light shielding resin, and a lid glass Lg is fixed to the lower end side of the component mounting hole 21a of the package lid member 20, The transparent cover member Cv is attached to the light emission opening Ap2 of the member 20.

  Thereafter, as shown in FIG. 2A, a lens holder Lh incorporating the lens L is attached to the component mounting hole 21 a of the package lid member 20. The component mounting hole 21a is a screw hole in which a screw groove is formed on the inner surface, and the lens holder Lh has a structure in which a screw thread is formed on the outer peripheral side surface thereof. Is performed by screwing the lens holder Lh into the component mounting hole 21a so that the thread of the lens holder Lh is screwed into the thread groove of the component mounting hole 21a. However, in order to adjust the focal position in a later step, the lens holder Lh is in a state of being rotatable with respect to the component mounting hole 21a.

  On the other hand, the light receiving element 110 is fixed to the light receiving element arrangement region R1 of the package substrate 10 by the die bonding adhesive B1 for the light receiving element, and the light emitting elements 120a to 120c are used for die bonding for the light emitting element in the light emitting element arrangement region R2. It adheres with adhesive B2. At this time, these die bond adhesives B1 and B2 are applied to the light receiving element arrangement region R1 and the light emitting element arrangement region R2 of the package substrate immediately before the light receiving element 110 and the light emitting elements 120a to 120c are fixed to the package substrate 10, After disposing the light receiving element and the light emitting element in the corresponding regions, the light receiving element 110 and the light emitting elements 120a to 120c are fixed to the package substrate 10 by drying the die bonding adhesives B1 and B2. Thereafter, the terminal 111 of the light receiving element 110 is connected to the light receiving element electrode 11 formed on the mounting surface 10a of the package substrate 10 by a wire W such as a gold wire, and the terminals 121 of the light emitting elements 120a to 120c are further connected to the wire. By W, the light emitting element electrode 12 formed on the mounting surface 10a of the package substrate 10 is connected.

  Next, as shown in FIG. 2B, the package lid member 20 with the lid glass Lg and the lens holder Lh attached thereto is fixed to the package substrate 10 on which the light receiving element 110 and the light emitting elements 120a to 120c are mounted by an adhesive resin A1. To do. At this time, the adhesive resin A1 is applied to the lower end surface of the package lid member 20, and after the package lid member 20 is aligned and bonded to the package substrate 10, the adhesive resin A1 is dried and cured. The package lid member 20 is fixed to the package substrate 10. The adhesive resin A1 may be applied to the package substrate 10 instead of the package lid member 20.

  Thereafter, the lens holder Lh is rotated with respect to the component mounting hole 21a to move the lens holder Lh along the optical axis to the optimum focal position, and in this state, a low viscosity is formed in the gap between the lens holder Lh and the component mounting hole 21a. Then, the lens holder Lh and the component mounting hole 21a are fixed.

  Thereby, the camera module 100 in which the light receiving element 110 and the light emitting elements 120a to 120c are accommodated in the same package 1 can be obtained. Such a camera module 100 can be mounted on a flexible wiring board and incorporated in an electronic information device such as a mobile phone. In addition, the board | substrate which mounts a camera module is not limited to a flexible printed circuit board, A normal printed circuit board may be sufficient. As a mounting method, various existing mounting methods such as socket mounting, ACF mounting (mounting using an anisotropic conductive film), reflow mounting, and the like can be used.

  Note that the order of assembling the package 1 is not limited to the order shown in FIG. 2. For example, the lens holder Lh attaches the package lid member 20 to the package substrate 10 and then attaches the components of the package lid member 20. You may mount | wear with the hole 21a.

  FIG. 3 is a diagram illustrating another example of the assembly order of the semiconductor device (camera module) according to the first embodiment of the present invention.

  FIG. 3A shows a step of attaching the package lid member of the camera module shown in FIG. 1 to the package substrate, and FIG. 3B shows a step of attaching the lens holder to the package lid member attached to the package substrate. Show.

  First, similarly to the assembly method described with reference to FIG. 2, a package lid member 20 having a lid body 20a and a light shielding plate 20b is formed by integral molding of a light shielding resin, and a component mounting hole 21a of the package lid member 20 is formed. The lid glass Lg is fixed to the lower end side of the transparent cover member Cv, and the transparent cover member Cv is attached to the light emission opening Ap2 of the package lid member 20.

  Similarly to the assembly method described with reference to FIG. 2, the light receiving element 110 is mounted on the mounting surface 10 a of the package substrate 10 so as to be positioned in the light receiving element arrangement region R <b> 1, and is mounted on the mounting surface 10 a of the package substrate 10. The light emitting elements 120a to 120c are mounted so as to be positioned in the light emitting element arrangement region R2.

  Next, as shown in FIG. 3A, the package lid member 20 to which the lid glass Lg and the transparent cover member Cv are attached is fixed to the package substrate 10 on which the light receiving element 110 and the light emitting element 120 are mounted by an adhesive resin A1. . At this time, the adhesive resin A1 is applied to the lower end surface of the package lid member 20, and after the package lid member 20 is aligned and bonded to the package substrate 10, the adhesive resin A1 is dried and cured. The package lid member 20 is fixed to the package substrate 10. The adhesive resin A1 may be applied to the package substrate 10 instead of the package lid member 20.

  Thereafter, as shown in FIG. 3B, the lens holder Lh incorporating the lens L is screwed into the component mounting hole 21a of the package lid member 20a, and the lens holder Lh is rotated with respect to the component mounting hole 21a. The lens holder Lh is moved along the optical axis to the optimum focal position, and in this state, a low-viscosity adhesive is poured into the gap between the lens holder Lh and the component mounting hole 21a to move the lens holder Lh and the component mounting hole 21a. Stick.

  Thereby, the camera module 100 in which the light receiving element 110 and the light emitting elements 120a to 120c are accommodated in the same package 20 can be obtained.

  Next, the function and effect of the first embodiment will be described.

  In the first embodiment, since the camera module 100 has a structure in which the image sensor chip as the light receiving element 110 and the LED chips as the light emitting elements 120a to 120c are accommodated in the same package 1, the light emitting element is a camera module. The trouble of mounting separately can be saved. In addition, by combining the light receiving element 110 and the light emitting elements 120a to 120c in one package, the optical axis centers of the light receiving element and the light emitting element are closer to each other, thereby generating a shadow due to a deviation between the optical axis centers of both elements. Can be suppressed.

  Further, the package lid member 20 constituting the package 1 has a light shielding plate 20b disposed between the light receiving element 110 and the light emitting elements 120a to 120c so that the light receiving element is not subjected to optical interference by the light emitting element. Therefore, it is possible to avoid degradation of the image quality of the captured image due to optical interference of the light emitting element with respect to the light receiving element in the package.

  Further, in the package lid member 20, the lid body 20 a and the light shielding plate 20 b have an integral structure. Therefore, the light shielding plate 20 b can be appropriately attached to the package substrate 10 by positioning and attaching the package lid member 20 to the package substrate 10. Can be positioned at any position. That is, the light shielding plate 20b can be fixed to the package substrate 10 at the same time as the package lid member 20 is fixed to the package substrate 10, and the alignment of the light shielding plate 20b with respect to the package substrate 10 is not necessary. Furthermore, since the package cover member 20 is integrally formed with a portion covering the light receiving element 110 and a portion covering the light emitting elements 120a to 120c, the covering of both elements can be collectively performed by attaching the package cover member 20 to the package substrate 10. Can be done.

  Furthermore, in the package lid member 20, the light emitting surface facing portion P <b> 2 facing the light emitting surface Ef of the light emitting elements 120 a to 120 c in which the light emitting opening Ap <b> 2 of the top surface wall 21 is formed is the light introducing opening of the top surface wall 21. Since the light receiving surface facing portion P1 facing the light receiving surface Rf of the light receiving element 110 where Ap1 is located is higher than the package substrate 10, the light emitted from the light emitting aperture Ap2 is used for light introduction due to irregular reflection or the like. It is possible to prevent the light receiving element 110 from entering the opening Ap1.

  Further, in the intermediate region R3 located between the light receiving element arrangement region R1 and the light emitting element arrangement region R2 on the mounting surface 10a of the package substrate 10, a light receiving element electrode group G1 including a plurality of light receiving element electrodes 11 is provided. Since the light emitting element electrode groups G2 including the plurality of light emitting element electrodes 12 are alternately arranged, the region R3 between the light receiving element arrangement region R1 and the light emitting element arrangement region R2 is defined as the light receiving element electrode. It can be used effectively with the light emitting element electrode, that is, the light emitting element electrode 12 is located in a space where the light receiving element electrode 11 is not disposed, and the arrangement space of the electrodes of both elements can be reduced. It becomes.

  For this reason, it becomes possible to narrow the arrangement | positioning space | interval of the light receiving element 110 and the light emitting elements 120a-120c, and, thereby, a mutual optical axis can be adjoined. As a result, the camera module with a built-in strobe can be reduced in size.

As described above, in the camera module 100 according to the first embodiment, the light receiving element 110 and the light emitting elements 120a to 120c are accommodated in the same package 1 and optically separated from the light emitting elements 120a to 120c. Accordingly, the camera module 100 capable of strobe light emission having a reduced size, a reduced number of mounting components, and a simplified mounting process can substantially reduce optical interference between the light emitting elements 120a to 120c with respect to the light receiving element 110. In other words, it is possible to reduce the size and cost of an electronic information device equipped with such a semiconductor device as a camera module.
(Embodiment 2)
4A and 4B are diagrams illustrating a camera module that is a semiconductor device according to Embodiment 2 of the present invention. FIG. 4A is a diagram illustrating an appearance of the camera module as the semiconductor device, and FIG. FIG. 5 is a view of a cross-sectional structure taken along the plane parallel to the mounting surface of the package substrate including the IVb-IVb line in the camera module shown in FIG.

  Similar to the camera module 100 of the first embodiment, the camera module 200 of the second embodiment includes a light receiving element 210 such as an image sensor chip and light emitting elements 220a to 220c such as LEDs. The light receiving element 210 emits light. The elements 220a to 220c are accommodated in the same package 2.

  The package 2 includes a package substrate 30 and a package lid member 40, and the light receiving element 210 and the light emitting elements 220 a to 220 c are mounted on the package substrate 30 so as to be adjacent to each other. A package lid member 40 made of a light shielding member is attached with an adhesive resin A1 (see FIG. 1C) so as to cover the light receiving element 210 and the light emitting elements 220a to 220c.

  Here, the package substrate 30 is a printed board having a substantially rectangular shape in a plane, and the light receiving element arrangement region R1a of the package substrate 30 is planar rectangular by a die bond adhesive B1 for the light receiving element (see FIG. 1C). A light receiving element 210 having a shape is fixed, and in the light emitting element arrangement region R2a of the package substrate 30, three light emitting elements 220a having a planar square shape are formed by a die bond adhesive B2 (see FIG. 1C) for the light emitting element. ˜220c is fixed. These three light emitting elements 220a to 220c generate red light, green light, and blue light, respectively, and one side of the light receiving element 210 whose longitudinal direction is a square shape (side on the light emitting element side). Are arranged in a line along the side. In FIG. 4B, the light receiving element 210 and the light emitting elements 220a to 220c are shown to have a rectangular planar shape. However, the planar shape of these elements is not limited to a rectangular shape, but is a square shape. There may be.

  The package lid member 40 includes a lid body 40a that covers the light receiving element 210 and the light emitting elements 220a to 220c, and an optical interference between the light receiving element 210 and the light emitting elements 220a to 220c by the light emitting elements 220a to 220c. The lid body 40a and the light shielding plate 40b are integrated with each other.

  The lid body 40a is opposed to the light emitting surface facing portion P2 of the top surface wall 41 facing the light emitting surfaces (upper surface) of the light emitting elements 220a to 220c, and the light receiving surface (upper surface) of the light receiving element 210 of the top surface wall 41. The light receiving surface facing portion P1 is different in height from the package substrate 30, specifically, the light emitting surface facing portion P2 is higher than the light receiving surface facing portion P1, and the top surface wall 41 faces the light emitting surface. In the portion P2, a light emission opening Ap2 for emitting light emitted from the light emitting elements 220a to 220c to the outside of the package is formed. The light emission opening Ap2 has a transparent cover member Cv (FIG. 1 (FIG. 1)). c)) is attached. In addition, a component mounting hole 41a for mounting the lens holder Lh holding the lens L is formed in the light receiving surface facing portion P1 of the top wall 41. A lens holder Lh is screwed into the component mounting hole 41a, and a light introduction opening Ap1 for introducing light into the light receiving element 210 from the outside of the package is formed in the central portion of the lens holder Lh. The lens holder Lh and the component mounting hole 41a are fixed by pouring a low-viscosity adhesive (not shown) into these gaps.

  The package substrate 30 is provided on the mounting surface 30a on which the light receiving element 210 and the light emitting elements 220a to 220c are mounted so as to be adjacent to the light receiving element 210, and the light receiving element electrode 31 connected to the terminal 211 of the light receiving element; A light emitting element electrode 32 is provided on the mounting surface 30a so as to be adjacent to the light emitting elements 220a to 220c and connected to the terminal 221 of the light emitting element.

  The light receiving element electrode 31 follows the arrangement of the terminals 211 of the light receiving element 210 so that the arrangement of the terminals 211 of the light receiving element 210 and the arrangement of the light receiving element electrodes 31 connected to the terminals 211 of the light receiving element face each other. The light emitting element electrode 32 emits light so that the arrangement of the terminals 221 of the light emitting elements 220a to 220c and the arrangement of the light emitting element electrodes 32 connected to the terminals 221 of the light emitting elements face each other. Arranged along the arrangement of the terminal 221 of the element. Here, the terminal 211 of the light receiving element and the light receiving element electrode 31 are connected by a wire W such as a gold wire, and the terminal 221 of the light emitting element and the light emitting element electrode 32 are similarly connected by a wire W such as a gold wire. Connected by.

  Furthermore, in the intermediate region R3a located between the light receiving element arrangement region R1a and the light emitting element arrangement region R2a on the mounting surface 30a of the package substrate 30, a light receiving element electrode group G1a including a plurality of light receiving element electrodes 31 is provided. The light emitting element electrode groups G2a including a plurality of light emitting element electrodes 32 are alternately arranged. The light receiving element electrode 31 included in the light receiving element electrode group G1a may be one, and the light emitting element electrode 32 included in the light emitting element electrode group G2a may be one.

  Further, the light shielding plate 40b is arranged so as to partition the light receiving element arrangement region R1a and the light emitting element arrangement region R2a, and the light receiving element electrode 31 included in the light receiving element electrode group G1a is arranged with respect to the light shielding plate 40b. The light emitting element electrode 32 included in the light emitting element electrode group G2a is disposed so as to be located on the light emitting element arranging region R2a side with respect to the light shielding plate 40b. ing.

  The camera module 200 according to the second embodiment is manufactured as shown in FIGS. 2A and 2B, or FIGS. 3A and 3B. Done in the same way.

  Next, the function and effect will be described.

  As described above, in the camera module 200 of the second embodiment, similarly to the camera module 100 of the first embodiment, the light receiving element 210 and the light emitting elements 220a to 220c are in the same package 2, and the light receiving element 210 is the light emitting element 220a to 220a. The camera module 200 capable of strobe light emission, which can be optically separated from the housing 220c and thereby reduced in size, reduced number of mounting parts, and simplified in the mounting process, is a light emitting element for the light receiving element 210. There is an effect that can be realized while substantially avoiding optical interference of 220a to 220c.

Furthermore, in the camera module 200 according to the second embodiment, the light emitting elements 220a to 220c are arranged so that the longitudinal direction thereof is parallel to one side of the rectangular light receiving element 210 (side on the light emitting element side). Since the terminals 221 of the three light emitting elements 220a to 220c are arranged in a line along the side edge, the arrangement of the terminals 221 of the three light emitting elements 220a to 220c and the electrodes 32 of the light emitting element electrodes 32 are arranged. As a result, the light emitting element arrangement region R2a can be reduced in size in the direction in which the light emitting element arrangement region R2a and the light receiving element arrangement region R1a are arranged, thereby further reducing the size of the camera module. There is an effect that can be achieved.
(Embodiment 3)
FIG. 5 is a diagram illustrating a camera module that is a semiconductor device according to Embodiment 3 of the present invention. FIG. 5A is a diagram illustrating an appearance of the camera module as the semiconductor device, and FIG. FIG. 6 is a view of a cross-sectional structure taken along the plane parallel to the mounting surface of the package substrate including the Vb-Vb line in the camera module shown in FIG.

  The camera module 300 according to the third embodiment includes a light receiving element 310 such as an image sensor chip and light emitting elements 320a to 320c such as LED chips. The light receiving element 310 and the light emitting elements 320a to 320c are included in the same package 3. Is housed in.

  The package 3 includes a package substrate 50 and a package lid member 60, and the light receiving element 310 and the light emitting elements 320 a to 320 c are mounted on the package substrate 50 so as to be adjacent to each other. A package lid member 60 made of a light shielding member is attached with an adhesive resin A1 (see FIG. 1C) so as to cover the light receiving element 310 and the light emitting elements 320a to 320c.

  Here, the package substrate 50 is a printed circuit board having a substantially rectangular shape in a plane, and the light receiving element arrangement region R1b of the package substrate 50 is planar rectangular by a die bond adhesive B1 (see FIG. 1C) for the light receiving element. A light-receiving element 310 having a shape is fixed, and three light-emitting elements 320a each having a square shape are formed in the light-emitting element arrangement region R2b of the package substrate 50 by a die-bonding adhesive B2 for the light-emitting element (see FIG. 1C). ˜320c is fixed. These three light emitting elements 320a to 320c generate red light, green light, and blue light, respectively, and have an isosceles triangle whose base is parallel to one side of the light receiving element 310 (side on the light emitting element side). It is arranged to be located at the vertex. In FIG. 5 (b), the light receiving element 310 and the light emitting elements 320a to 320c have a rectangular shape, but the planar shape of these elements is not limited to a rectangular shape, and is a square shape. There may be.

  The package lid member 60 includes the lid body 60a covering the light receiving element 310 and the light emitting elements 320a to 320c, and the optical interference between the light receiving element 310 and the light emitting elements 320a to 320c by the light emitting elements 320a to 320c. The lid body 60a and the light shielding plate 60b are integrated with each other.

  The lid main body 60a is opposed to the light emitting surface facing portion P2 of the top wall 61 facing the light emitting surfaces (upper surface) of the light emitting elements 320a to 320c, and the light receiving surface (upper surface) of the light receiving element 310 of the top surface wall 61. The light receiving surface facing portion P1 is different in height from the package substrate 50, specifically, the light emitting surface facing portion P2 is higher than the light receiving surface facing portion P1, and the top surface wall 61 faces the light emitting surface. In the part P2, a light emission opening Ap2 for emitting light emitted from the light emitting elements 320a to 320c to the outside of the package is formed. The light emission opening Ap2 has a transparent cover member Cv (FIG. 1 (FIG. 1)). c)) is attached. In addition, a component mounting hole 61a for mounting the lens holder Lh holding the lens L is formed in the light receiving surface facing portion P1 of the top wall 61. A lens holder Lh is screwed into the component mounting hole 61a, and a light introduction opening Ap1 for introducing light into the light receiving element 310 from the outside of the package is formed at the center of the lens holder Lh. The lens holder Lh and the component mounting hole 61a are fixed by pouring a low-viscosity adhesive (not shown) into these gaps.

  The package substrate 50 is provided adjacent to the light receiving element 310 on the mounting surface 50a on which the light receiving element 310 and the light emitting elements 320a to 320c are mounted. The light receiving element electrode 51 connected to the terminal 311 of the light receiving element; A light emitting element electrode 52 is provided on the mounting surface 50a so as to be adjacent to the light emitting elements 320a to 320c and connected to a terminal 321 of the light emitting element.

  Here, the terminal 311 of the light receiving element 310 and the light receiving element electrode 51 are connected by a wire W such as a gold wire, and the terminal 321 of the light emitting element and the light emitting element electrode 52 are similarly wire such as a gold wire. Connected by W. The three light emitting elements 320a to 320c are arranged such that two of the three light emitting elements 320a to 320c are opposed to each other at both ends of the base of the isosceles triangle, and the remaining one is The light emitting element 320b is positioned at the apex facing the base of the isosceles triangle, and the terminal 321 of the remaining one light emitting element 320b and the light emitting element electrode 52 are connected between the two light emitting elements 320a and 320c. The arrangement is such that the wire W to be connected passes through.

  Further, in the intermediate region R3b positioned between the light receiving element arrangement region R1b and the light emitting element arrangement region R2b on the mounting surface 50a of the package substrate 50, a light receiving element electrode group G1b including a plurality of light receiving element electrodes 51 is provided. The light emitting element electrode groups G2b including the plurality of light emitting element electrodes 52 are alternately arranged. The number of light receiving element electrodes 51 included in the light receiving element electrode group G1b may be one, and the number of light emitting element electrodes 52 included in the light emitting element electrode group G2b may be one.

  Further, the light shielding plate 60b is arranged so as to partition the light receiving element arrangement region R1b and the light emitting element arrangement region R2b, and the light receiving element electrode 51 included in the light receiving element electrode group G1b is arranged with respect to the light shielding plate 60b. The light emitting element electrode 52 included in the light emitting element electrode group G2b is disposed so as to be positioned on the light emitting element arranging region R2b side with respect to the light shielding plate 60b. ing.

  The camera module 300 according to the third embodiment is manufactured as shown in FIGS. 2A and 2B, or FIGS. 3A and 3B. Done in the same way.

  Next, the function and effect will be described.

  As described above, in the camera module 300 of the third embodiment, similarly to the camera module 100 of the first embodiment, the light receiving element 310 and the light emitting elements 320a to 320c are included in the same package 3, and the light receiving element 310 is the light emitting element 320a to 320a. The camera module 300 capable of strobe light emission, which can be optically separated from the housing 320c and thereby reduced in size, reduced in the number of mounting parts, and simplified in the mounting process, is provided as a light emitting element for the light receiving element 310. There is an effect that can be realized while substantially avoiding the optical interference of 320a to 320c.

  Furthermore, in the camera module 300 according to the third embodiment, the three light emitting elements 320a to 320c generate red light, green light, and blue light, respectively, and are further positioned at the apex of one triangle. Since it is arranged, for example, it is possible to improve the color developability such that there is no color unevenness of the three colors of red light, green light, and blue light.

Furthermore, although not specifically described in the first to third embodiments, for example, a digital video camera or a digital still camera using at least one of the solid-state imaging devices of the first to third embodiments as an imaging unit. An electronic information device having an image input device, such as a digital camera, an image input camera, a scanner, a facsimile, and a camera-equipped mobile phone device will be briefly described below.
(Embodiment 4)
FIG. 6 is a block diagram illustrating a schematic configuration example of an electronic information device that uses at least one of the semiconductor devices (camera modules) of Embodiments 1 to 3 as an imaging unit as Embodiment 4 of the present invention.

  The electronic information device 90 according to the fourth embodiment of the present invention shown in FIG. 6 includes at least one of the semiconductor devices (camera modules) according to the first to third embodiments of the present invention as an imaging unit 91 that captures a subject. And a memory unit 92 such as a recording medium for recording data after high-quality image data obtained by photographing by such an imaging unit is subjected to predetermined signal processing for recording, and the image data is predetermined for display. A display unit 93 such as a liquid crystal display device that displays the signal on a display screen such as a liquid crystal display screen after the signal processing, and a communication unit 94 such as a transmission / reception device that performs communication processing after processing this image data for predetermined signal processing. And an image output unit 95 for printing (printing) and outputting (printing out) the image data.

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention can accommodate a light receiving element and a light emitting element optically separated from the light emitting element in the same package in the field of a semiconductor device and its manufacturing method, and electronic information equipment, As a result, a camera module capable of flash emission is reduced in size, the number of mounting parts is reduced, and the mounting process is simplified, and a semiconductor device without substantial optical interference of the light emitting element with respect to the light receiving element is realized. In addition, a method for manufacturing such a semiconductor device and an electronic information device including such a semiconductor device can be realized.

1-3 Package 10, 30, 50 Package substrate 11, 31, 51 Light receiving element electrode 12, 32, 52 Light emitting element electrode 20, 40, 60 Package lid member 20a, 40a, 60a Lid body 20b, 40b, 60b Light shielding Plate 21, 41, 61 Top wall 21a, 41a, 61a Component mounting hole 90 Electronic information device 91 Imaging unit 92 Memory unit 93 Display unit 94 Communication unit 95 Image output unit 100, 200, 300 Camera module 110, 210, 310 Light receiving element 120a to 120c, 220a to 220c, 320a to 320c Light emitting element 111, 211, 311 Light receiving element terminal 121, 221, 321 Light emitting element terminal Ap1 Light introducing opening Ap2 Light emitting opening B1 Die bond adhesive for light receiving element B2 Die bond adhesive for light emitting devices Cv Transparent Cover member Ef Light emitting surface G1, G1a, G1b Light receiving element electrode group G2, G2a, G2b Light emitting element electrode group L Lens Lg Lid glass Lh Lens holder P1 Light receiving surface facing part P2 Light emitting surface facing part R1, R1a, R1b Light receiving element Arrangement region R2, R2a, R2b Light emitting element arrangement region R3, R3a, R3b Intermediate region Rf Light receiving surface W Wire

Claims (11)

A semiconductor device that houses a light receiving element and a light emitting element in the same package,
A package substrate constituting the package;
A light receiving element mounted on the package substrate;
A light emitting device mounted on the package substrate so as to be adjacent to the light receiving device;
A package lid member made of a light-shielding member and mounted on the package substrate so as to cover the light-receiving element and the light-emitting element;
The package lid member includes a light shielding plate disposed between the light receiving element and the light emitting element so that the light receiving element is not subjected to optical interference by the light emitting element.   2. The package lid member according to claim 1, wherein the package lid member is an integral structure of a lid main body that covers the light receiving element and the light emitting element, and a light shielding plate disposed between the light receiving element and the light emitting element. Semiconductor device. The lid body includes a light emitting surface facing portion of the top wall facing the light emitting surface of the light emitting element and a light receiving surface facing portion of the top wall facing the light receiving surface of the light receiving element from the package substrate. Has a different height,
A light emitting opening for emitting emitted light from the light emitting element to the outside of the package is formed in the light emitting surface facing portion of the top wall.
3. The semiconductor device according to claim 1, wherein a light introduction opening for introducing light from the outside of the package into the light receiving element is located at a portion facing the light receiving surface of the top wall. The package substrate is:
A light receiving element electrode provided adjacent to the light receiving element on a mounting surface for mounting the light emitting element and the light receiving element, and connected to a terminal of the light receiving element;
A light emitting element electrode provided on the mounting surface so as to be adjacent to the light emitting element and connected to a terminal of the light emitting element;
An area located between the light receiving element arrangement area and the light emitting element arrangement area on the mounting surface of the package substrate is composed of one or more light receiving element electrodes along the longitudinal direction of the area. The semiconductor device according to claim 1, wherein the light receiving element electrode groups and the light emitting element electrode groups including one or more light emitting element electrodes are alternately arranged. The light shielding plate is arranged so as to partition the light receiving element arrangement region and the light emitting element arrangement region,
The light receiving element electrodes included in the light receiving element electrode group are arranged so as to be positioned on the light receiving element arrangement region side with respect to the light shielding plate,
5. The semiconductor device according to claim 4, wherein the light emitting element electrode included in the light emitting element electrode group is disposed so as to be positioned on the light emitting element arrangement region side with respect to the light shielding plate. The arrangement of the terminals of the light emitting element and the arrangement of the electrodes for the light emitting element connected to the terminals of the light emitting element are arranged to face each other.
The semiconductor device according to claim 5, wherein the light emitting element electrode connected to a terminal of the light emitting element is disposed between the light receiving element and the light emitting element.   The light emitting elements are arranged such that the terminals of the light emitting elements are arranged in a line, and the arrangement of the terminals of the light emitting elements and the arrangement of the electrodes for the light emitting elements connected to the terminals of the light emitting elements are opposed to each other. The semiconductor device according to claim 5. The terminal of the light emitting element and the electrode for the light emitting element are electrically connected by a wire, and the terminal of the light receiving element and the electrode for the light receiving element are electrically connected by a wire,
Three adjacent light emitting elements in the arrangement region of the light emitting elements are:
Each is located at the apex of one triangle, and between the two opposing light emitting elements of the three light emitting elements, the remaining one light emitting element terminal and the light emitting element electrode are connected. The semiconductor device according to claim 5, wherein the semiconductor device is arranged so that a wire to be passed through.   The semiconductor device according to claim 1, wherein the light receiving element is a CCD image sensor or a CMOS image sensor that captures an image of a subject, and the light emitting element is a light emitting diode. A method of manufacturing the semiconductor device according to claim 1,
Arranging the light receiving element and the light emitting element on the package substrate so as to be adjacent to each other, and electrically connecting the terminals of the light receiving element and the terminals of the light emitting element to the electrodes formed on the package substrate, respectively; When,
Fixing the package lid member so as to cover the light receiving element and the light emitting element on the package substrate,
The method of manufacturing a semiconductor device, wherein the light shielding plate is fixed to the package substrate simultaneously with fixing the package lid member to the package substrate. An electronic information device having an imaging unit for imaging a subject,
The electronic information device is the semiconductor device according to claim 1.