TW200812776A - Disk substrate forming mold, mirror surface plate thereof, Disk substrate forming method and disk substrate - Google Patents
Disk substrate forming mold, mirror surface plate thereof, Disk substrate forming method and disk substrate Download PDFInfo
- Publication number
- TW200812776A TW200812776A TW96129444A TW96129444A TW200812776A TW 200812776 A TW200812776 A TW 200812776A TW 96129444 A TW96129444 A TW 96129444A TW 96129444 A TW96129444 A TW 96129444A TW 200812776 A TW200812776 A TW 200812776A
- Authority
- TW
- Taiwan
- Prior art keywords
- mold
- layer
- mirror panel
- metal
- disc substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 64
- 239000002184 metal Substances 0.000 claims abstract description 64
- 239000002826 coolant Substances 0.000 claims abstract description 44
- 239000007921 spray Substances 0.000 claims abstract description 42
- 238000000465 moulding Methods 0.000 claims description 51
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 8
- 238000001816 cooling Methods 0.000 abstract description 20
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 17
- 239000010935 stainless steel Substances 0.000 abstract description 16
- 238000012546 transfer Methods 0.000 abstract description 12
- 230000003139 buffering effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 181
- 230000002093 peripheral effect Effects 0.000 description 35
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 20
- 239000000463 material Substances 0.000 description 19
- 229910045601 alloy Inorganic materials 0.000 description 14
- 239000000956 alloy Substances 0.000 description 14
- 229910010293 ceramic material Inorganic materials 0.000 description 13
- 238000007747 plating Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 239000002245 particle Substances 0.000 description 10
- 229910009043 WC-Co Inorganic materials 0.000 description 9
- 239000012768 molten material Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 239000011651 chromium Substances 0.000 description 8
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 229910001120 nichrome Inorganic materials 0.000 description 8
- 229910000990 Ni alloy Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 238000005253 cladding Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010285 flame spraying Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000788 chromium alloy Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910000423 chromium oxide Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001235 nimonic Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006225154 | 2006-08-22 | ||
| JP2007188026A JP4223537B2 (ja) | 2006-08-22 | 2007-07-19 | ディスク基板の成形用金型およびその鏡面板ならびにディスク基板の成形方法およびディスク基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200812776A true TW200812776A (en) | 2008-03-16 |
| TWI327953B TWI327953B (enExample) | 2010-08-01 |
Family
ID=39346629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96129444A TW200812776A (en) | 2006-08-22 | 2007-08-09 | Disk substrate forming mold, mirror surface plate thereof, Disk substrate forming method and disk substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4223537B2 (enExample) |
| CN (1) | CN101152755B (enExample) |
| TW (1) | TW200812776A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI380891B (zh) * | 2008-04-01 | 2013-01-01 | Au Optronics Corp | 壓模及其製造方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5093809B2 (ja) * | 2008-04-21 | 2012-12-12 | 株式会社名機製作所 | ディスク基板成形機およびディスク基板成形方法 |
| JP5234640B2 (ja) * | 2009-02-02 | 2013-07-10 | 株式会社名機製作所 | 極薄導光板の成形金型および成形方法 |
| JP6252098B2 (ja) * | 2012-11-01 | 2017-12-27 | 信越化学工業株式会社 | 角形金型用基板 |
| CN104260297B (zh) * | 2014-08-25 | 2017-05-24 | 健大电业制品（昆山）有限公司 | 用于加工多孔工业连接器的塑胶模内镶针冷却装置 |
-
2007
- 2007-07-19 JP JP2007188026A patent/JP4223537B2/ja not_active Expired - Fee Related
- 2007-08-09 TW TW96129444A patent/TW200812776A/zh not_active IP Right Cessation
- 2007-08-17 CN CN2007101416758A patent/CN101152755B/zh not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI380891B (zh) * | 2008-04-01 | 2013-01-01 | Au Optronics Corp | 壓模及其製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101152755A (zh) | 2008-04-02 |
| TWI327953B (enExample) | 2010-08-01 |
| JP4223537B2 (ja) | 2009-02-12 |
| JP2008074088A (ja) | 2008-04-03 |
| CN101152755B (zh) | 2012-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |