Μ268ΐ73^μ^Μ268ΐ73 ^ μ ^
\ .........................—J 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種貼合光碟所作成之擁有資訊區間 (area)的光碟基板、與擁有無資訊區間的光碟基板而成形的 光碟基板成形裝置。 【先前技術】 大部分的DVD等齡捕，都是用黏著舰合擁有資訊 區間的光碟基板、與擁有無資訊區間的光碟基板所製造而 成。在成形擁有前述資訊區間的光碟基板、與擁有無資訊區 間的光碟基板的成形裝置上，㈣成形擁錢職間之光碟 基板的成形賴具’是藉由外周壓模機支架(hQlder)盘内周 壓模機支架，安裝複印資訊的壓模機(st卿er)。由於内周壓 模機支架鳄部的部分朝凹槽(cavity)突出，在擁有成形資訊 區間的光碟基板中心開口附近則形成環狀溝。此外，關於成 形擁有無資訊區間之光碟基板的成形用模具方面，同屬昂貴 的仿真(dummy)壓模機，是透過外周壓模機支架與内周壓模機 支架以進行固定。由於固定仿真壓模機的内周壓模機支架 部部分也是朝凹槽突出，因此在同樣擁有無資訊區間的光 基板的位置上，則形成出環狀溝。 ” 特開平10-302317號公報（〇〇2〇、圖卜圖2) 特開平10-11821號公報（觀、圖卜圖2) 特開平11-120618號公報⑽28、圖3、圖4) M268173 外 r ? / 【新型内容】 一、所欲解決之技術問題： 在成形傳統貼合光碟的光碟基板成形裝置上，用以成形 擁有無資訊區間之光碟基板的成形用模具，則因如前述所: 安裝了昂貴的仿真壓模機，故造成模具製造成本偏高的; 因。此外，每當達到規定成形次數後，就必須執行消耗品（仿 真壓模機）的更換作業。而且藉由成形傳統貼合光碟的光碟 基板成形裝置，以貼合擁有成形資訊區間的光碟基板、及擁 有無資訊區間的光碟基板時，會在相同位置上形成毛邊，而 讓毛邊彼此接觸。如此一來，便無法在所定間隔上貼合光碟 基板，並在貼合前述光碟基板時所用的黏著劑出現氣泡 (bubble)問題。 本創作之目的在於，有鑑於這種狀況而提供得以用低成 本成形出擁有無資訊區間的光碟基板，且在貼合光碟時，不 發生貼合不良、且可擁有資訊區間的光碟基板、及擁有無資 訊區間之光碟基板的成形裝置。 二、解決問題之技術手段： 本新型如申請專利範圍第1項所述的光碟基板成形裝 置’屬於用於成形擁有資訊區間的光碟基板、及被貼合於資 訊區間而擁有無資訊區間之光碟基板的成形裝置；其特徵在 於：具備成形資訊區間的壓模機、支撐壓模機内周部的内周 M26U13(i 、】卩刀與自又置於鏡面板内侧構件的環狀突起部、且設 ΪΙ擁有無資賴間而成形光碟基板的第2成_模具、且 、言:第1成Α用模具上的内周壓模壓板鍔部外周端部位置、 成开/用模具上的環狀突起部夕卜周端部位置，彼此在徑 向上互為不同。 本新型如申請專利範圍第2項所述的光碟基板成形裝 置，其特徵在於··依據申請專利範圍第1項，對第1成形用 模具上的内顺模壓板鍔部外周端部位置而言，帛2成形用 模具上的環狀突起部外周端部位置，位於徑向外侧。 本新型如申請專利範圍第3項所述的光碟基板成形裝 置’其特徵在於··依據申請專利範圍第i項，在第2成形用 杈具上成形無資訊區間的鏡面板表面，塗佈至少一種虹、氣 化合物、碳化合物及碳化鶊、或直接在鏡面板表面進行粗面 加工。 三、對照先前技術之功效： 本新型效果在於，-鐵義合光_辆基板成形裝 置上，讓成形出擁有資訊區間之光碟基板的第丨成形用模具 的内周壓觀板觸賴端躲置、减雜有無資訊區間 之光碟基板的第2成形用模具上的環狀突起部外周端部位 置，彼此在徑向上互為不同、且因成形無資訊區間的凹槽面 是由鏡面板所構成，故得以用低成本成形出擁有無資訊區間 的光碟基板，而且在貼合成光碟時，並不會發生貼合不良。 M268t773v 【實施方式】 以下基於圖面所示詳細說明本新型實施形態。 圖1所示，為本實施形態光碟基板成形裝置上，成形擁 有無資訊區間之光碟基板的第2成形用模具縱剖面圖。圖2 所示，為本實施形悲的光碟基板成形裝置上，成形擁有資訊 區間之光碟基板的第1成形用模具、及成形擁有無資訊區間 之光碟基板的第2成形用模具重要部位剖面圖。圖3所示， 為藉由本實施形態光碟基板成形裝置，所成形之擁有資訊區 間的光碟基板、及貼合擁有無資訊區間之光碟基板光碟中心 開口附近的放大剖面圖。 如圖3所示的光碟4〇,是將擁有資訊區間41的光碟基板 42^以下稱為「資料細基板42」）、及擁有無資訊區間 之光碟基板44 (以下稱為「仿真光碟基板44」），相互對置後 再用黏著劑45予以貼合而成。資料光碟基板42，是藉由圖2 所不的光碟基板成形裝置9的第i成形用模具61所成形。資 料光碟基板42的#訊關41，訊讀米（submi_) 的凹凸坑(Pit) ’但是藉由第丨成形用模具61的壓模機犯進 形。賴辆基板42中心開σ46断的雜溝47, =面於圖2所示之前料丨成形賴具61的鏡面板 杰而以壓住壓模機62的内周壓模壓板64鳄部65所形 ί模述朗壓模壓板64的鳄部65相端部66、與 塗才吴機62之間的間隙，目丨|兹 區間41的資料光磾=板二灌人溶融樹脂，而在擁有資訊 碟基板42上，形成環狀溝47的半徑向外侧 M268K73 溝端48，且在與資訊區間41面呈直交的方向上，形成出毛邊 49 〇 仿真光碟基板44，是藉由圖2所示的光碟基板成形裝置 9的第2成形用模具12所成形。透過圖1詳細說明成形仿真 光碟基板44的第2成形用模具12後可得知，第2成形用模 具12是由固定模具1〇與活動模具11所構成。固定模具1〇 則由透過隔熱板14而被安裝於未揭示在圖面的射出成形機固 定盤上的固定模板13、及在固定模板13的隔熱板14反面上 透過固定内板15以形成出黏合仿真光碟基板44内面54的鏡鲁 面板16、固定模板13、被嵌插於固定内板15及鏡面板16中 心孔的母刀19、被嵌插於母刀19及固定模板13中心孔的澆 口套(sprue bush)18、接觸澆口套18端面而被黏合於固定模 板13中心孔的位置板17、被嵌插於固定内板15及鏡面板16 外周端面而被黏合於固定模板13的固定外周環2〇所構成。 活動模具11是由活動模板23、在活動模板23的固定模 具10侧面上透過活動内板21所黏合之仿真光碟基板44而形_ 成無資訊區間43的鏡面板22、被黏合於鏡面板22外周端部 而形成仿真光碟基板44外周端的外周環25、被嵌插於活動内 板21及鏡面板22中心孔的圓柱狀構件套管(sleeve)35、在 套管35内孔朝軸向滑動而突出仿真光碟基板44的喷射器 (eject〇r)29、及被嵌插於喷射器29内孔與朝軸向滑動的母 刀19扣合而在仿真光碟基板44上穿孔中心開口 5〇的公刀 30、因被嵌插於公刀30内孔且朝軸向滑動的中心開口 5〇而 9 ^已分離㈣sprue)的突出針3卜及魏插於活動内板 =鏡面板22外周端面而被黏合於活動模板烈的活動外周 =4所構成？定模具1〇與活動模具u，是在固定外周環 ”活動外周％ 24上接觸，觸由合膜㈣成凹槽％。 本實施形態的鏡面板22凹槽面26，並未安裝仿真壓模 鏡面板22的凹槽面26，_接前述鏡面板22内侧而形 ^出構件套管35凹槽面37的同時，也構成出成形無資訊區 間43侧的凹槽面。成形仿真辆基板44之第2成形用模具 2上的活動模具1卜比起成形資料光碟基板42的第i成形 用模具61，因未具備壓模機62、關壓模壓板64，而屬低成 本模具。 本實施形態上的鏡面板22，是採用不錢鋼。而且前述鏡 面板22的凹槽面26 ±，則有塗佈維克斯（Vickers)硬度 HvlOOO乃至Ην1400) TiN (氮化鈦），形成的厚度為1//m乃 至10//Π1。鏡面板22凹槽面26所塗佈的TiN，是在形成塗佈 膜後，使用鑽石膏等以進行精整加工。關於此則塗佈的精 整加工，也可用前述以外的方法進行物理表面處理，但精整 加工後的表面光潔度（十點平均粗度）為〇· 〇5“mRz乃至〇· 4 //mRz。再者，TiN與DLC (類鑽石碳模）相較之下，由於摩 擦係數及表面光潔度較大，因此在確保上述表面光潔度方面 較為有利。此外，鏡面板22凹槽面26上所塗佈的材料，除 了 TiN之外，也可塗佈TiCN、TiCRN、TiALN等鈦氮化合物、 SiN、S 等硅氮化合物、ALN、TAN、ZRN等其他氮化合物。 M268173 , 此外，還可塗佈SiC、Tie等碳化合物。此外，還能塗佈DIX (類鑽石碳模）。關於上述塗佈方面，厚度則約為乃至 10//m。此外，也可將WCC(碳化鎢塗佈）、硬質鉻等電鍍金屬、 氟樹脂（PTFE與PFA)厚度塗佈成0 03誦乃至1〇〇mm之厚。 再者，前述塗佈材也可塗佈數層種類不同的塗佈材。最好能 藉由塗佈，讓鏡面板22的凹槽面26表面光潔度為〇· 〇5//mRz 乃至〇· 4//mRz的方式進行加工。此外，由前述不銹鋼所構成 的鏡面板凹槽面，也可透過喷砂器（sand blast)、放電加工 荨方法’以直接進行粗面加工。 擊 如圖1所示，在第2成形用模具12上被嵌插於鏡面板22 中心孔的套管35，屬於多段口徑不同的圓柱狀構件，最大徑 部與中間徑部之間設有段部。套管35的最大徑部，則被嵌插 於活動模板23，中間徑部則被嵌插於鏡面板22内孔38。套 官35最小徑部與鏡面板22段狀内孔38之間，則設有環狀的 空氣吹出溝36，空氣吹出溝36則在凹槽32上呈開口。成形 時’套管35的最小徑部與鏡面板22之間的空氣吹出溝36上，籲 則有灌入熔融樹脂，與無資訊區間43面呈直交的方向上，則 形成出毛邊53。 如圖1、圖2所示，前述套管35的最小徑部凹槽面37 上’設有朝凹槽32突出的環狀突起部33。環狀突起部33則 在仿真光碟基板44中心開口 50附近，成形出環狀溝51。環 狀突起部33的剖面形狀，則呈梯形與半圓形，高度為0· 10刪 乃至0·40ιμ、底部寬度為1· 00腿乃至5.00mm。此外，在仿 11 ύ …〜叫:1,..,'M268^3l f\ .........................— J 8. Explanation of the new type: [Technical field to which the new type belongs] This creation is about a kind of laminated disc An optical disc substrate forming device having an information area (area) and an optical disc substrate having a non-information area are formed. [Previous technology] Most DVDs are produced by using an adhesive substrate and an optical disc substrate with an information interval, and an optical disc substrate with an informationless interval. In the forming device for forming a disc substrate having the aforementioned information section and a disc substrate having the non-information section, the forming mechanism for forming a disc substrate having a wealth of jobs is based on the inside of a peripheral mold holder (hQlder) disc. Around the stamper stand, a stamper for copying information is installed. Since the part of the crocodile of the inner mold holder protrudes toward the cavity, an annular groove is formed near the center opening of the disc substrate having the molding information section. In addition, as for a mold for forming an optical disc substrate having a non-information zone, the same expensive dummy die is fixed through the outer die holder and the inner die holder. Since the inner part of the die holder supporting the dummy die also protrudes toward the groove, an annular groove is formed at the position of the optical substrate which also has no information zone. Japanese Patent Application Laid-Open No. 10-302317 (0020, Figure 2) Japanese Patent Publication No. 10-11821 (View, Figure 2) Japanese Patent Application No. 11-120618 (28, Figure 3, and Figure 4) M268173 Outside r? / [New content] 1. The technical problem to be solved: On the forming device of the traditional optical disc substrate forming device, the forming mold for forming the optical disc substrate with no information zone is as described above. : An expensive simulation die is installed, which results in high mold manufacturing costs; In addition, every time the specified number of forming times is reached, replacement of consumables (simulation die) must be performed. And by forming The conventional disc substrate forming device for laminating optical discs, when laminating a disc substrate having a forming information section and a disc substrate having a non-information section, burrs will be formed at the same position, and the burrs will be in contact with each other. The optical disk substrate cannot be bonded at a predetermined interval, and the adhesive used when bonding the foregoing optical disk substrate has a problem of bubbles. The purpose of this creation is to provide in view of this situation. It is possible to form an optical disc substrate with a non-information interval at a low cost, and when the optical disc is bonded, a disc substrate that does not have poor bonding and can have an information interval, and a molding device having an optical disc substrate without an information interval. Technical means to solve the problem: The new optical disc substrate forming device described in item 1 of the scope of patent application belongs to an optical disc substrate having an information interval and an optical disc substrate that is attached to the information interval and has an informationless interval. Forming device, which is characterized by a stamper having a molding information section, an inner periphery M26U13 (i,) supporting the inner periphery of the stamper, a trowel and a ring-shaped protrusion that is placed on the inner member of the mirror panel, and is provided with ΪΙ Owning the 2nd mold of the disc substrate which can be used to form discs, and the wording: the position of the outer peripheral end of the 锷 part of the inner embossing platen on the mold of the 1st Α mold, and the annular protrusion on the mold The positions of the end portions of the parts are different from each other in the radial direction. The new optical disc substrate forming device described in item 2 of the scope of patent application is characterized in that it is based on the scope of the patent application One item is the position of the outer peripheral end portion of the 锷 portion of the inner-squeeze platen on the first forming die, and the position of the outer peripheral end portion of the annular protrusion on the 帛 2 forming die is located radially outward. The optical disc substrate forming apparatus according to the third item of the scope is characterized in that: according to the first patent application scope item i, the surface of the mirror panel having no information zone is formed on the second forming tool, and at least one rainbow and gas compound is coated. , Carbon compounds and thorium carbide, or rough surface processing directly on the surface of the mirror panel. 3. Contrast the effect of the prior art: The new effect is that-Tieyi Heguang _ on the substrate forming device, let the forming of the information area The position of the outer peripheral end portion of the annular protrusion on the second molding die of the optical disk substrate, where the contact end of the inner peripheral pressure plate of the optical disk substrate's first molding die is hidden, and the non-information interval is reduced, and mutually mutually in the radial direction. It is different, and because the groove surface of the non-information section is formed by a mirror panel, it is possible to form an optical disc substrate with an information-less section at a low cost. Bonding failure occurs. M268t773v [Embodiment] The following describes the embodiment of the present invention in detail based on the drawings. Fig. 1 is a longitudinal sectional view of a second molding die for molding a disc substrate having a non-information section in the disc substrate forming apparatus of this embodiment. FIG. 2 is a cross-sectional view of important parts of a first forming mold for forming an optical disc substrate having an information section and a second forming mold for forming an optical disc substrate having an informationless section in the disc substrate forming apparatus of this embodiment. . FIG. 3 is an enlarged cross-sectional view of the vicinity of the center opening of the disc substrate having the information area and the disc substrate having the non-information area formed by the disc substrate forming apparatus of this embodiment. The optical disc 40 shown in FIG. 3 is an optical disc substrate 42 having an information section 41 (hereinafter referred to as a "data thin substrate 42") and an optical disc substrate 44 having an informationless section (hereinafter referred to as a "simulated optical disc substrate 44"). "), And they are bonded together with the adhesive 45 after facing each other. The data disc substrate 42 is formed by the i-th molding die 61 of the disc substrate forming apparatus 9 shown in FIG. 2. It is noted that the #Communication 41 of the optical disc substrate 42 and the pit (Pit) of the submeter (submi_) are formed by a stamper of the mold 61 for forming. The ditch 47 broken by σ46 broken in the center of the base plate 42 is formed as shown in FIG. 2, and the mirror panel of the mold 61 is formed to press the inner periphery of the stamper 62 and the stamper 64 and the crook 65. The shape describes the gap 66 between the crocodile portion 65 phase end portion 66 of the Lang compression molding plate 64 and the Tucai Wu machine 62. The data in section 41 here = the plate two is filled with molten resin, and On the information disc substrate 42, the radius of the annular groove 47 is formed to the outside M268K73 groove end 48, and a burr 49 is formed in a direction orthogonal to the information interval 41 surface. The simulated disc substrate 44 is shown in FIG. 2 The second forming mold 12 of the optical disk substrate forming apparatus 9 is formed. The detailed description of the forming simulation of the second forming mold 12 of the optical disk substrate 44 will be made with reference to Fig. 1. It can be seen that the second forming mold 12 is composed of a fixed mold 10 and a movable mold 11. The fixed mold 10 is a fixed template 13 that is mounted on a fixed plate of an injection molding machine that is not shown in the drawing through a heat insulation plate 14 and a fixed inner plate 15 is penetrated on the reverse surface of the heat insulation plate 14 of the fixed template 13 to A mirror panel 16, a fixed template 13, which is bonded to the inner surface 54 of the simulated optical disc substrate 44, a female knife 19 inserted into the center hole of the fixed inner plate 15 and the mirror panel 16, and a female knife 19 and the fixed template 13 are inserted. Sprue bush 18 with holes, position plate 17 that is bonded to the center hole of fixed template 13 by contacting the end surface of gate sleeve 18, and is inserted into the fixed inner plate 15 and the outer end surface of mirror panel 16 and is fixed The template 13 is composed of a fixed peripheral ring 20. The movable mold 11 is formed by a movable template 23 and a fixed optical disc substrate 44 bonded to a movable inner plate 21 on the side of the fixed mold 10 of the movable template 23. A mirror panel 22 having no information section 43 is bonded to the mirror panel 22 The outer peripheral end forms a peripheral ring 25 that simulates the outer peripheral end of the optical disc substrate 44, a cylindrical member sleeve 35 inserted into the center hole of the movable inner plate 21 and the mirror panel 22, and the inner hole of the sleeve 35 slides axially. The ejector 29 protruding from the artificial disc substrate 44 and the female insert 19 which is inserted into the inner hole of the ejector 29 and slid in the axial direction are fastened to perforate the central opening 50 of the artificial disc substrate 44. Male knife 30. The protruding needle 3b which has been inserted into the inner hole of the male knife 30 and slides axially in the axial direction of the male knife 30 is separated from the outer edge of the movable inner plate = mirror plate 22. Constituted by the active perimeter of the activity template = 4? The fixed mold 10 and the movable mold u are in contact with the “movable outer periphery” 24 of the “fixed outer ring”, and the groove is formed by the contact film. The recessed surface 26 of the mirror panel 22 of this embodiment is not provided with a simulation stamper. The groove surface 26 of the mirror panel 22 is connected to the inside of the mirror panel 22 to form the groove surface 37 of the component sleeve 35, and also forms the groove surface on the side of the informationless section 43. The simulation vehicle substrate 44 is formed The movable mold 1 on the second molding mold 2 is a low-cost mold compared to the i-th molding mold 61 for molding the optical disc substrate 42 because it does not include the stamper 62 and the closing mold platen 64. Morphological mirror panel 22 is made of stainless steel. In addition, the groove surface 26 ± of the aforementioned mirror panel 22 is coated with Vickers hardness Hv1000 and Ην1400) TiN (titanium nitride) to form a thickness It is 1 // m or even 10 // Π1. The TiN coated on the recessed surface 26 of the mirror panel 22 is formed by using a diamond paste or the like after the coating film is formed. About the finishing of the coating Processing, physical surface treatment can be performed by methods other than the above, but the surface light after finishing processing Degree (ten-point average roughness) is square-〇5 "mRz even square · 4 // mRz. Furthermore, compared with DLC (Diamond-Like Carbon Mould), the friction coefficient and surface finish are large, so it is more advantageous in ensuring the above surface finish. In addition, the material coated on the groove surface 26 of the mirror panel 22 can be coated with titanium nitrogen compounds such as TiCN, TiCRN, TiALN, silicon nitrogen compounds such as SiN, S, and other materials other than TiN. Nitrogen compounds. M268173, In addition, carbon compounds such as SiC and Tie can also be coated. In addition, DIX (diamond-like carbon mold) can be applied. Regarding the above coating, the thickness is about 10 // m. In addition, WCC (tungsten carbide coating), hard chromium and other plated metals, fluororesin (PTFE and PFA) can be coated to a thickness of 0 to 100 mm. Furthermore, the coating material may be coated with several coating materials of different types. It is preferable that the surface finish of the grooved surface 26 of the mirror panel 22 be coated by coating so that the surface finish of the groove surface 26 is 0.5 / mRz or 0.4 / mRz. In addition, the concave surface of the mirror panel made of the aforementioned stainless steel can also be directly rough-processed by a sand blasting method or an electric discharge machining method. As shown in FIG. 1, the sleeve 35 which is inserted into the center hole of the mirror panel 22 on the second forming mold 12 belongs to a multi-section cylindrical member with a different diameter. A section is provided between the largest diameter portion and the middle diameter portion. unit. The largest diameter portion of the sleeve 35 is inserted into the movable template 23, and the middle diameter portion is inserted into the inner hole 38 of the mirror panel 22. A ring-shaped air blow-out groove 36 is provided between the minimum diameter portion of the sleeve 35 and the section-shaped inner hole 38 of the mirror panel 22, and the air blow-out groove 36 is opened in the groove 32. During molding, the air blown out of the groove 36 between the smallest diameter portion of the sleeve 35 and the mirror panel 22, and it is recommended that molten resin is poured in, and that the burr 53 is formed in a direction orthogonal to the 43-spaced surface. As shown in Figs. 1 and 2, an annular protrusion 33 protruding toward the groove 32 is provided on the groove surface 37 of the smallest diameter portion of the sleeve 35 described above. The annular protrusion 33 is formed in the vicinity of the center opening 50 of the dummy disc substrate 44 to form an annular groove 51. The cross-sectional shape of the ring-shaped protrusion 33 is trapezoidal and semicircular, with a height of 0 · 10 or even 0.40 µm, and a bottom width of 1 · 00 legs or even 5.00 mm. In addition, in imitation 11… ~ called: 1 ,, .., 'M268 ^ 3l f
1斯够•物J 二“二土板44上所设置之成形環狀溝μ半徑向外侧溝端 ⑽的衣狀大料33外周端部39直徑（套管35最小徑部的直 L次為22 3〇麵乃至22·50πωι。另一方面，如圖2所示，在成 ^貝料光碟基板42之第〗成形賴㈣的關顧屢板％ =所形成之鍔部65外周端部⑼的直徑為221〇麵乃至 〆· 4〇醜:而且’前述環狀突起部33上的外周端部39位置（半 徑们）’被設置於在前述内周壓模壓板64上，比鍔部65外周 端部66位置（半徑R2)，朝徑向外侧的〇·編乃至請麵 置―果為’在身料光碟基板42上重疊前述仿真光碟基 ^ 44時’仿真辆基板44的毛邊53，不得重疊於資料光碟 :板42毛邊49的相同位置。再者，將環狀突起部料周端 邛39直徑，縮小成比前述鍔部65外周端部6 乃至<UG_’溝端48、52及毛邊49、53,彼此可形成= 向不R的位置。此外，關於套管凹槽面與固定模具鏡面板凹 槽面，也可_前艇動模具鏡面板的_面—樣進行塗佈。 接下來，將依據本實施形態光碟基板成形裝置9，說明貼 合資料光魏板42、仿真絲基板44獻紅程、成形資料光 碟基板42、仿真光碟基板44之光碟4〇的製程。說明時是以 透過第2成形用模具12以成形仿真光碟基板乜為主並可 沿用於資料絲基板42的成形上。首先，讓未揭示在圖蝴 射出成形機的射出裝置，接觸第2成形用模具12澆口套π， 讓熔融樹脂通過澆口套18内部再射出到凹槽32。讓 ， 内朝放射線方向呈同心圓狀流動，填充於凹槽％的炫 1= 12 Μ268173^ ” 射出成形機的射出裝置，接觸第2成形用模具12澆口套i8， 讓炫融樹脂通過和套18内部再射㈣凹槽32。讓凹槽％ 内朝放射線方向呈同心圓狀流動，填充於凹槽32的溶轉 脂，則在冷卻、固化難中，藉由公刀3〇與母刀19穿孔中 心開口 50，以成形出仿真光碟基板44。 其後’活動模具11被固定模具10 _，再將空愿供應 給空氣吹出溝36。從空氣吹出溝36吹到凹槽32的空璧 因凹槽32放射線内侧方向有環狀突起部33,因此空氣阻抗較 大’依據放麟外側方向經過強财觸結果，可藉由塗佈 仿真光碟基板44,以更輕鬆且迅速從粗面加工鏡面板22凹槽 進行脫膜成开竭仿真光碟基板，則被搬運到銘蒸鑛 裝置，無資訊區間43則被進行銘蒸鐘。而且，在成形仿真光 碟土板44的同時’也藉由第i成形用模具6卜成形資料光碟 基板42，資料光碟基板42資訊關41上，則同樣進行銘蒸 鍍。 資料光碟底層塑膠基板42與仿真光碟底層塑膠基板 44各被運达至貼合裝置，資料光碟底層娜基板犯的資訊 區f曰U1上則塗佈黏著劑45後再重疊仿真光碟基板，、再 、=過紅轉W展延㈣轉劑45。此時，資料光絲板42盥仿 真光碟基板44，則因毛邊49、53位置並未位於相同位置上， 因此，光碟基板42與仿真光碟基板 44的間隔，並不會超 机二。此ΐ ’也鮮少發生因毛邊49、53彼此衝突所發生的 ^ 黏著劑45則越過毛邊49、53的部分，而不進入中 13 M268173 心開口 46、50附近的環狀溝47、51内。此外，黏著劑45上 並不會發生氣泡，因此可形成出外觀優美的光碟4〇。 本創作可基於熟習該項技術業者的知識，在各種變更、 修正、改良等態樣上予以實施。此外，這種實施態樣只要未 脫離本創作主旨，皆可囊括於本創作的範圍内。例如：也可 在固定模具安裝在光碟基板成形裝置上，成形仿真光碟基板 的第2成形用模具、及成形無資訊區間而擁有凹槽面的鏡面 板、及形成環狀突起部的套管。此外，關於在光碟基板成形 裝置上，成形資料光碟基板的第1成形用模具，也可將壓模 機安裝於固定模具。此外，也可縮小活動模具與固定模具鏡 面板中心孔的直徑，在鏡面板表面上成形無資訊區間的内側 部分上，也可如同前述般形成環狀突起部。此時，在環狀突 起部與成形鏡面板無資訊區間面之間，也可成形出空氣吹出 溝。再者，也可將在光碟基板成形裝置上，成形資料光碟基 板的第1成形用模具、及成形仿真光碟基板的第2成形用模 具，安裝於相同射出成形機上。此時，第丨成形用模具與第2 成形用模具，也可為一體成形用模具、或者也可為各自獨立 的模具。 【圖式簡單說明】 Q 1 ·在本實施开久態的光碟基板成形裝置上，成形擁有無資訊 區間之光碟基板的第2成形用模具縱剖面圖。 圖2 ·在本實施形態的光碟基板成形裝置上，成形擁有資訊區 14 ，M26§4T3(r 【圖式簡單說明】 圖1:在本實施形態的光碟基板成形裝置上，成形擁有無資訊 區間之光碟基板的第2成形用模具縱剖面圖。 圖2 :在本實施形態的光碟基板成形裝置上，成形擁有資訊區 間之光碟基板的第1成形用模具、及成形擁有無資訊 區間之光碟基板的第2成形用模具重要部位剖面圖。 圖3 ·藉由本實施形態的光碟基板成形裝置，所成形之擁有資 訊區間的光碟基板、及貼合擁有無資訊區間之光碟基 板的光碟中心開口附近的放大剖面圖。 【主要元件符號說明】 9光碟基板成形裝置 10固定模具 11活動模具 U第2成形用模具 16 5 22 ^ 63 鏡面板 26 ’ 37 凹槽面 33 環狀突起部 35 套管 36 空氣吹出溝 39 ’ 66 外周端部 40光碟 15 •M26S47i3^ 41 貧訊區間 42，44 光碟基板（資料光碟基板、仿真光碟基板） 43 無貧訊區間 45 黏著劑 46，50 中心開口 47，51 環狀溝 48，52 溝端 49，53 毛邊 61 第1成形用模具 62 壓模機 64 內周壓模壓板 65 鍔部1 sufficient material [2] The shaped annular groove set on the second soil plate 44. The outer shape of the garment-shaped material 33 with a radius of the outer groove end 33. The diameter of the outer peripheral end 39 of the smallest diameter of the sleeve 35 is 22 30, and even 22 · 50πωι. On the other hand, as shown in FIG. 2, the care of forming the substrate in the first stage of the optical disc substrate 42 is repeated. The diameter is 221 ° and even 〆40 °: and 'the position (radius) of the outer peripheral end portion 39 on the aforementioned annular projection 33' is provided on the aforementioned inner peripheral die-pressing plate 64, which is larger than the outer periphery of the 锷 65 Position 66 (radius R2) of the end portion, the radial direction of the outer edge of the knitting, or even the surface-if the 'simulated disc base ^ 44 is superimposed on the physical disc substrate 42', the burr 53 of the simulated vehicle substrate 44 must not be Overlapping on the same position on the data disc: the burr 49 of the plate 42. Furthermore, the diameter of the circumferential end 突起 39 of the ring-shaped protrusion is reduced to be smaller than the outer perimeter end 6 of the burr 65 and even the UG_ 'groove ends 48, 52 and the burr. 49,53, can form each other = position that does not R. In addition, regarding the groove surface of the sleeve and the groove surface of the fixed mold mirror panel, _ The mirror surface of the moving mold mirror panel is coated. Next, according to the embodiment of the optical disc substrate forming device 9, the lamination of the optical fiber substrate 42, the artificial silk substrate 44, and the forming of the optical disk substrate 42 will be described. 3. The manufacturing process of the optical disc 40 of the simulated optical disc substrate 44. In the description, the simulation of the optical disc substrate 乜 through the second forming mold 12 is mainly used and can be used for the formation of the data silk substrate 42. First, let's not reveal in the figure The injection device of the butterfly injection molding machine contacts the gate sleeve π of the second molding die 12 and allows the molten resin to be ejected into the groove 32 through the inside of the gate sleeve 18. Let the inside flow concentrically in a radial direction and fill the 1 = 12 μ268173 ^ ”injection molding machine injection molding machine, contact the second molding die 12 gate sleeve i8, let Xuan molten resin pass through the sleeve 18 and then shot the groove 32. Let the groove% The melt-transfer grease filled in the groove 32 flows concentrically in the direction of radiation, and in the cooling and solidification difficulty, the male knife 30 and the female knife 19 perforate the center opening 50 to form a simulated optical disc substrate 44. . Later 'event The tool 11 is fixed to the mold 10_, and then the air blow is supplied to the air blowing groove 36. The air blown from the air blowing groove 36 to the groove 32 has an annular protrusion 33 in the direction of the radiation inside the groove 32, so the air resistance is relatively low. According to the result of strong financial contact based on the direction of Fang Lin, the artificial optical disc substrate 44 can be coated more easily and quickly by removing the film from the groove of the rough-processed mirror panel 22 to open the artificial optical disc substrate, and then it is transported. In the Ming steaming device, the Ming information steaming section 43 is performed without information. In addition, while forming the artificial disc soil plate 44, the data disc substrate 42 and the data disc substrate 42 are also formed by the i-th forming mold 6. When the 41 is closed, the vapor deposition is similarly performed. The bottom plastic substrate 42 of the data disc and the bottom plastic substrate 44 of the emulation disc are each delivered to the bonding device. The information area f of the bottom substrate of the data disc f U1 is coated with an adhesive 45 and then the emulation disc substrate is superimposed. 、 = Red to W extension extension agent 45. At this time, the data optical fiber board 42 is similar to the real optical disc substrate 44, because the positions of the burrs 49 and 53 are not located at the same position. Therefore, the distance between the optical disc substrate 42 and the artificial optical disc substrate 44 does not exceed the second one. This ΐ 'rarely occurs due to the conflict between the burrs 49 and 53 ^ The adhesive 45 passes over the burrs 49 and 53 and does not enter the annular grooves 47 and 51 near the center opening 46 and 50 of M268173. . In addition, bubbles do not occur on the adhesive 45, so that an optical disc 40 having a beautiful appearance can be formed. This creation can be implemented in various changes, corrections, and improvements based on the knowledge of those skilled in the technology industry. In addition, this implementation form can be included in the scope of this creation as long as it does not depart from the main purpose of this creation. For example, a fixed mold can be mounted on an optical disc substrate forming device to form a second mold for simulating an optical disc substrate, a mirror plate having a grooved surface without an information section, and a sleeve forming an annular protrusion. In addition, as for the first forming mold for forming the data disc substrate in the disc substrate forming apparatus, a stamper may be mounted on the fixed mold. In addition, the diameter of the center hole of the mirror panel of the movable mold and the fixed mold can be reduced, and the inner portion of the non-information section can be formed on the surface of the mirror panel, and the annular protrusion can be formed as described above. At this time, an air blowing groove may be formed between the annular projection and the surface of the molding mirror panel without information. Furthermore, the first forming mold for forming the data optical disc substrate and the second forming mold for forming the dummy optical disc substrate may be mounted on the same injection molding machine in the optical disc substrate forming apparatus. In this case, the first and second molding dies may be integrated molding dies, or may be separate dies. [Brief description of the drawing] Q 1 · In the optical disc substrate forming apparatus of the present embodiment, a second molding die longitudinal sectional view for forming an optical disc substrate having a non-information interval is formed. Figure 2 · In the optical disk substrate forming apparatus of this embodiment, the molding information area 14 is formed, M26§4T3 (r [Schematic description] Figure 1: In the optical disk substrate forming apparatus of this embodiment, the molding has no information section Vertical sectional view of the second molding die for the optical disk substrate. Figure 2: In the optical disk substrate forming apparatus of this embodiment, the first molding mold for forming the optical disk substrate having the information interval and the optical disk substrate having the non-information interval are formed. Sectional view of important parts of the second molding die. Figure 3 · By the optical disc substrate forming apparatus of this embodiment, the optical disc substrate having the information section formed and the vicinity of the center opening of the optical disc bonded to the optical disc substrate having the non-information section are formed. Enlarged cross-section view. [Description of main component symbols] 9 Disc substrate forming device 10 Fixed mold 11 Movable mold U Second molding mold 16 5 22 ^ 63 Mirror panel 26 '37 Groove surface 33 Ring-shaped protrusion 35 Sleeve 36 Air Blow-out groove 39 '66 Outer peripheral end 40 Disc 15 • M26S47i3 ^ 41 Lean signal section 42, 44 Disc substrate (data disc substrate, simulation disc base ) 46, 50, central section 43 without hearing the poor adhesive opening 45 the annular groove 48, 52, 47, 51 49, 53 burr groove 61 of the first end of the forming mold 62 the inner periphery of the die press molding machine 64 press plate 65 flange portion