TW200810657A - Method for manufacturing multilayer printed wiring board - Google Patents

Method for manufacturing multilayer printed wiring board Download PDF

Info

Publication number
TW200810657A
TW200810657A TW96120795A TW96120795A TW200810657A TW 200810657 A TW200810657 A TW 200810657A TW 96120795 A TW96120795 A TW 96120795A TW 96120795 A TW96120795 A TW 96120795A TW 200810657 A TW200810657 A TW 200810657A
Authority
TW
Taiwan
Prior art keywords
layer
hole
printed wiring
wiring board
substrate
Prior art date
Application number
TW96120795A
Other languages
English (en)
Chinese (zh)
Inventor
Fumihiko Matsuda
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200810657A publication Critical patent/TW200810657A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW96120795A 2006-07-03 2007-06-08 Method for manufacturing multilayer printed wiring board TW200810657A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006183292A JP2008016482A (ja) 2006-07-03 2006-07-03 多層プリント配線板の製造方法

Publications (1)

Publication Number Publication Date
TW200810657A true TW200810657A (en) 2008-02-16

Family

ID=38894356

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96120795A TW200810657A (en) 2006-07-03 2007-06-08 Method for manufacturing multilayer printed wiring board

Country Status (3)

Country Link
JP (1) JP2008016482A (ja)
TW (1) TW200810657A (ja)
WO (1) WO2008004382A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103260360A (zh) * 2012-02-17 2013-08-21 宏达国际电子股份有限公司 线路板及其构造单元与制作工艺
US8921703B2 (en) 2012-02-17 2014-12-30 Htc Corporation Circuit board, structural unit thereof and manufacturing method thereof
TWI613942B (zh) * 2016-07-05 2018-02-01 元太科技工業股份有限公司 電連接結構
US10103201B2 (en) 2016-07-05 2018-10-16 E Ink Holdings Inc. Flexible display device
CN109855687A (zh) * 2019-02-27 2019-06-07 中国工程物理研究院化工材料研究所 一种柔性温度-应变集成传感器阵列及制备方法
US10607932B2 (en) 2016-07-05 2020-03-31 E Ink Holdings Inc. Circuit structure

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8355259B2 (en) 2009-12-04 2013-01-15 International Business Machines Corporation Demountable dry connection for flexible circuits to circuit boards
CN102595797B (zh) * 2012-02-29 2014-05-28 博罗县精汇电子科技有限公司 利用阴阳板镀铜法制作多层软硬结合板的方法
CN103491724A (zh) * 2013-09-23 2014-01-01 惠州市金百泽电路科技有限公司 一种刚挠结合板的揭盖方法
CN110740591B (zh) * 2019-10-25 2021-06-25 珠海杰赛科技有限公司 一种多层印制板的盲孔加工方法
CN115633460A (zh) * 2022-12-19 2023-01-20 浙江万正电子科技股份有限公司 一种四次交叉盲孔的埋阻多层微波电路板的制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3799091B2 (ja) * 1995-12-20 2006-07-19 イビデン株式会社 プリント配線板の製造方法
JPH09246724A (ja) * 1996-03-04 1997-09-19 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JPH11186726A (ja) * 1997-12-19 1999-07-09 Ibiden Co Ltd 多層プリント配線板及びその製造方法
JP2003163458A (ja) * 2001-11-29 2003-06-06 Fujitsu Ltd 多層配線基板及びその製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103260360A (zh) * 2012-02-17 2013-08-21 宏达国际电子股份有限公司 线路板及其构造单元与制作工艺
US8921703B2 (en) 2012-02-17 2014-12-30 Htc Corporation Circuit board, structural unit thereof and manufacturing method thereof
TWI481322B (zh) * 2012-02-17 2015-04-11 Htc Corp 線路板及其構造單元與製程
CN103260360B (zh) * 2012-02-17 2017-07-14 宏达国际电子股份有限公司 线路板及其构造单元与制作工艺
TWI613942B (zh) * 2016-07-05 2018-02-01 元太科技工業股份有限公司 電連接結構
US10103201B2 (en) 2016-07-05 2018-10-16 E Ink Holdings Inc. Flexible display device
US10522597B2 (en) 2016-07-05 2019-12-31 E Ink Holdings Inc. Flexible display device
US10607932B2 (en) 2016-07-05 2020-03-31 E Ink Holdings Inc. Circuit structure
CN109855687A (zh) * 2019-02-27 2019-06-07 中国工程物理研究院化工材料研究所 一种柔性温度-应变集成传感器阵列及制备方法
CN109855687B (zh) * 2019-02-27 2021-05-11 中国工程物理研究院化工材料研究所 一种柔性温度-应变集成传感器阵列及制备方法

Also Published As

Publication number Publication date
JP2008016482A (ja) 2008-01-24
WO2008004382A1 (fr) 2008-01-10

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