TW200807783A - Application apparatus and application method - Google Patents

Application apparatus and application method Download PDF

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Publication number
TW200807783A
TW200807783A TW096112283A TW96112283A TW200807783A TW 200807783 A TW200807783 A TW 200807783A TW 096112283 A TW096112283 A TW 096112283A TW 96112283 A TW96112283 A TW 96112283A TW 200807783 A TW200807783 A TW 200807783A
Authority
TW
Taiwan
Prior art keywords
box
gas
supply
space
coating
Prior art date
Application number
TW096112283A
Other languages
English (en)
Chinese (zh)
Other versions
TWI333702B (ja
Inventor
Junichi Yoshida
Yukihiro Takamura
Masafumi Kawagoe
Mikio Masuichi
Hiroyuki Ueno
Matsuka Tsuyoshi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200807783A publication Critical patent/TW200807783A/zh
Application granted granted Critical
Publication of TWI333702B publication Critical patent/TWI333702B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
TW096112283A 2006-06-09 2007-04-09 Application apparatus and application method TW200807783A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006160671A JP4716509B2 (ja) 2006-06-09 2006-06-09 塗布装置および塗布方法

Publications (2)

Publication Number Publication Date
TW200807783A true TW200807783A (en) 2008-02-01
TWI333702B TWI333702B (ja) 2010-11-21

Family

ID=38926925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112283A TW200807783A (en) 2006-06-09 2007-04-09 Application apparatus and application method

Country Status (4)

Country Link
JP (1) JP4716509B2 (ja)
KR (1) KR100824883B1 (ja)
CN (1) CN101085438B (ja)
TW (1) TW200807783A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481540B (zh) * 2008-06-26 2015-04-21 Tokyo Ohka Kogyo Co Ltd 塗佈裝置及塗佈方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5342282B2 (ja) * 2009-03-17 2013-11-13 大日本スクリーン製造株式会社 塗布装置
CN102217787A (zh) * 2011-06-03 2011-10-19 河南卷烟工业烟草薄片有限公司 造纸法再造烟叶生产中涂布液的净化工艺
JP2013077502A (ja) * 2011-09-30 2013-04-25 Toppan Printing Co Ltd 塗布装置、塗布方法及び有機機能性素子の製造方法
EP3518276B1 (en) * 2012-11-30 2020-05-13 Kateeva, Inc. Gas enclosure assembly and system
WO2017026214A1 (ja) * 2015-08-11 2017-02-16 富士フイルム株式会社 機能性フィルムの製造方法及び製造装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3914502A1 (de) * 1989-05-02 1990-11-15 Goldschmidt Ag Th Verfahren zur erzielung und aufrechterhaltung einer sauerstoffarmen, inerten atmosphaere in einer behandlungskammer sowie vorrichtung zur durchfuehrung des verfahrens
JP3999330B2 (ja) * 1998-02-24 2007-10-31 東芝松下ディスプレイテクノロジー株式会社 塗布装置
US20030166311A1 (en) * 2001-09-12 2003-09-04 Seiko Epson Corporation Method for patterning, method for forming film, patterning apparatus, film formation apparatus, electro-optic apparatus and method for manufacturing the same, electronic equipment, and electronic apparatus and method for manufacturing the same
JP2003282246A (ja) 2002-03-20 2003-10-03 Seiko Epson Corp デバイスの製造方法及び製造装置、有機エレクトロルミネッセンス装置の製造方法及び製造装置、デバイス及び有機エレクトロルミネッセンス装置、電子機器
JP3828824B2 (ja) * 2002-03-28 2006-10-04 株式会社 日立インダストリイズ ペースト塗布機
JP2004230209A (ja) 2003-01-28 2004-08-19 Casio Comput Co Ltd 溶液噴出装置
JP4407164B2 (ja) * 2003-06-03 2010-02-03 セイコーエプソン株式会社 チャンバ装置およびこれを備えたワーク処理設備
JP2005218899A (ja) * 2004-02-03 2005-08-18 Toshiba Corp 塗布装置及びこれを備えた表示装置製造装置
JP4805555B2 (ja) * 2004-07-12 2011-11-02 株式会社東芝 塗布装置及び塗布方法
JP2006088067A (ja) * 2004-09-24 2006-04-06 Toshiba Corp インクジェット塗布装置、及びインクジェット塗布方法
JP4789652B2 (ja) * 2006-02-27 2011-10-12 大日本スクリーン製造株式会社 塗布装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481540B (zh) * 2008-06-26 2015-04-21 Tokyo Ohka Kogyo Co Ltd 塗佈裝置及塗佈方法

Also Published As

Publication number Publication date
TWI333702B (ja) 2010-11-21
JP2007326068A (ja) 2007-12-20
KR100824883B1 (ko) 2008-04-23
KR20070117997A (ko) 2007-12-13
JP4716509B2 (ja) 2011-07-06
CN101085438A (zh) 2007-12-12
CN101085438B (zh) 2010-06-02

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