TW200746966A - Method and equipment for manufacturing soldered package - Google Patents
Method and equipment for manufacturing soldered packageInfo
- Publication number
- TW200746966A TW200746966A TW096103599A TW96103599A TW200746966A TW 200746966 A TW200746966 A TW 200746966A TW 096103599 A TW096103599 A TW 096103599A TW 96103599 A TW96103599 A TW 96103599A TW 200746966 A TW200746966 A TW 200746966A
- Authority
- TW
- Taiwan
- Prior art keywords
- hot air
- camera module
- equipment
- manufacturing
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006047209A JP2007227663A (ja) | 2006-02-23 | 2006-02-23 | 半田付け実装構造の製造方法および製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200746966A true TW200746966A (en) | 2007-12-16 |
Family
ID=38437177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096103599A TW200746966A (en) | 2006-02-23 | 2007-01-31 | Method and equipment for manufacturing soldered package |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090020593A1 (zh) |
JP (1) | JP2007227663A (zh) |
CN (1) | CN101390455A (zh) |
TW (1) | TW200746966A (zh) |
WO (1) | WO2007097134A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5242201B2 (ja) * | 2008-03-13 | 2013-07-24 | 日本碍子株式会社 | 接合治具およびそれを用いた異種材料接合体の製造方法 |
FR2932945B1 (fr) * | 2008-06-18 | 2010-09-03 | Set | Dispositif pour l'assemblage de composants a plots de soudure metalliques |
CN101521995B (zh) * | 2009-03-26 | 2012-06-27 | 埃派克森微电子(上海)股份有限公司 | 光学指示装置电路板模组的制造方法 |
CN101931742B (zh) * | 2009-06-18 | 2013-04-24 | 鸿富锦精密工业(深圳)有限公司 | 影像感测模组及取像模组 |
US9282650B2 (en) * | 2013-12-18 | 2016-03-08 | Intel Corporation | Thermal compression bonding process cooling manifold |
US9609738B1 (en) | 2013-12-23 | 2017-03-28 | Flextronics Ap, Llc | Graphite sheet to redirect SMT components during thermal exposure |
US9149882B1 (en) * | 2014-12-09 | 2015-10-06 | Flextronics Ap, Llc | Thermal carrier |
CN105983739B (zh) * | 2015-01-27 | 2021-12-31 | 宁波舜宇光电信息有限公司 | 一种锡膏焊接装置及方法 |
US11998319B2 (en) | 2015-03-09 | 2024-06-04 | CoreSyte, Inc. | Device for measuring biological fluids |
US11883011B2 (en) * | 2015-03-09 | 2024-01-30 | CoreSyte, Inc. | Method for manufacturing a biological fluid sensor |
JP2019102702A (ja) * | 2017-12-05 | 2019-06-24 | 株式会社弘輝テック | はんだ付け装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06151032A (ja) * | 1992-10-30 | 1994-05-31 | Kyocera Corp | 電子回路基板への外部リードの半田付け方法 |
JPH09108828A (ja) * | 1995-10-19 | 1997-04-28 | Omron Corp | 接合方法及び装置 |
JP3656534B2 (ja) * | 2000-09-12 | 2005-06-08 | Tdk株式会社 | ヘッドジンバルアセンブリの製造方法及び接続部切断装置 |
JP3869643B2 (ja) * | 2000-10-26 | 2007-01-17 | 三洋電機株式会社 | 混成集積回路装置の製造方法 |
-
2006
- 2006-02-23 JP JP2006047209A patent/JP2007227663A/ja active Pending
-
2007
- 2007-01-12 US US12/224,296 patent/US20090020593A1/en not_active Abandoned
- 2007-01-12 CN CNA200780006267XA patent/CN101390455A/zh active Pending
- 2007-01-12 WO PCT/JP2007/050331 patent/WO2007097134A1/ja active Application Filing
- 2007-01-31 TW TW096103599A patent/TW200746966A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2007097134A1 (ja) | 2007-08-30 |
CN101390455A (zh) | 2009-03-18 |
US20090020593A1 (en) | 2009-01-22 |
JP2007227663A (ja) | 2007-09-06 |
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