TW200746935A - Heat-radiating insulating resin composition and printed wiring board using the same - Google Patents

Heat-radiating insulating resin composition and printed wiring board using the same

Info

Publication number
TW200746935A
TW200746935A TW095143240A TW95143240A TW200746935A TW 200746935 A TW200746935 A TW 200746935A TW 095143240 A TW095143240 A TW 095143240A TW 95143240 A TW95143240 A TW 95143240A TW 200746935 A TW200746935 A TW 200746935A
Authority
TW
Taiwan
Prior art keywords
heat
resin composition
wiring board
printed wiring
same
Prior art date
Application number
TW095143240A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357783B (fr
Inventor
Yoshikazu Daigo
Shigeru Ushiki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200746935A publication Critical patent/TW200746935A/zh
Application granted granted Critical
Publication of TWI357783B publication Critical patent/TWI357783B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
TW095143240A 2006-01-17 2006-11-22 Heat-radiating insulating resin composition and printed wiring board using the same TW200746935A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006009196A JP5089885B2 (ja) 2006-01-17 2006-01-17 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
TW200746935A true TW200746935A (en) 2007-12-16
TWI357783B TWI357783B (fr) 2012-02-01

Family

ID=38447476

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143240A TW200746935A (en) 2006-01-17 2006-11-22 Heat-radiating insulating resin composition and printed wiring board using the same

Country Status (4)

Country Link
JP (1) JP5089885B2 (fr)
KR (1) KR100849585B1 (fr)
CN (1) CN101003690B (fr)
TW (1) TW200746935A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130158167A1 (en) * 2010-12-20 2013-06-20 Daicel Corporation Curable epoxy resin composition and optical semiconductor device using said resin composition
JP6024265B2 (ja) * 2011-10-14 2016-11-16 Jnc株式会社 放熱塗料組成物とそれを用いた放熱部材
JP6149498B2 (ja) * 2013-05-10 2017-06-21 パナソニックＩｐマネジメント株式会社 紫外線硬化性シート材料、紫外線硬化性ドライフィルム、紫外線硬化性ビルドアップ用絶縁材料
KR101687394B1 (ko) 2013-06-17 2016-12-16 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP6349543B2 (ja) * 2013-12-25 2018-07-04 パナソニックＩｐマネジメント株式会社 冷却構造体および冷却構造体の製造方法
CN107075258B (zh) * 2014-10-01 2020-03-06 纳美仕有限公司 树脂组合物
KR101792755B1 (ko) 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックＩｐマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
JP7142453B2 (ja) * 2018-03-30 2022-09-27 太陽インキ製造株式会社 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板
CN112823188B (zh) * 2018-11-20 2023-08-11 太阳控股株式会社 高耐电压散热绝缘性树脂组合物和使用其的电子部件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109753A (ja) * 1987-10-23 1989-04-26 Hitachi Ltd 半導体装置
JPH0362844A (ja) * 1989-02-27 1991-03-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH06167806A (ja) * 1992-11-30 1994-06-14 Sony Corp ソルダーレジストインキ組成物及びこれを用いたプリント配線基板
JPH0841294A (ja) * 1994-07-27 1996-02-13 Shin Etsu Chem Co Ltd 絶縁性樹脂ペースト及び半導体装置
KR100201223B1 (ko) 1996-09-16 1999-06-15 조규삼 원적외선 방사 열경화성 입상 수지 조성물
JP2002179763A (ja) 2000-11-28 2002-06-26 Sumitomo Bakelite Singapore Pte Ltd エポキシ樹脂組成物
JP2004027004A (ja) * 2002-06-25 2004-01-29 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2004217861A (ja) * 2003-01-17 2004-08-05 Hitachi Chem Co Ltd 耐熱性接着剤ならびにこの接着剤を用いた積層物、接着剤付き放熱板および接着剤付金属箔
JP2004256687A (ja) * 2003-02-26 2004-09-16 Polymatech Co Ltd 熱伝導性反応硬化型樹脂成形体及びその製造方法
JP4250996B2 (ja) * 2003-03-28 2009-04-08 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2005002283A (ja) * 2003-06-13 2005-01-06 Sekisui Chem Co Ltd 熱伝導性組成物及びプラズマディスプレイ表示装置

Also Published As

Publication number Publication date
TWI357783B (fr) 2012-02-01
CN101003690A (zh) 2007-07-25
KR20070076506A (ko) 2007-07-24
KR100849585B1 (ko) 2008-07-31
CN101003690B (zh) 2010-04-07
JP2007191519A (ja) 2007-08-02
JP5089885B2 (ja) 2012-12-05

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