TW200746868A - Condenser microphone - Google Patents

Condenser microphone

Info

Publication number
TW200746868A
TW200746868A TW096106586A TW96106586A TW200746868A TW 200746868 A TW200746868 A TW 200746868A TW 096106586 A TW096106586 A TW 096106586A TW 96106586 A TW96106586 A TW 96106586A TW 200746868 A TW200746868 A TW 200746868A
Authority
TW
Taiwan
Prior art keywords
diaphragm
plate
condenser microphone
supports
fixed
Prior art date
Application number
TW096106586A
Other languages
English (en)
Inventor
Yukitoshi Suzuki
Toshihisa Suzuki
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006048252A external-priority patent/JP4737719B2/ja
Priority claimed from JP2006065402A external-priority patent/JP4737721B2/ja
Priority claimed from JP2006065263A external-priority patent/JP2007243757A/ja
Priority claimed from JP2006089679A external-priority patent/JP2007267049A/ja
Priority claimed from JP2006097305A external-priority patent/JP2007274334A/ja
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of TW200746868A publication Critical patent/TW200746868A/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
TW096106586A 2006-02-24 2007-02-16 Condenser microphone TW200746868A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006048252A JP4737719B2 (ja) 2006-02-24 2006-02-24 コンデンサマイクロホン
JP2006065402A JP4737721B2 (ja) 2006-03-10 2006-03-10 コンデンサマイクロホン
JP2006065263A JP2007243757A (ja) 2006-03-10 2006-03-10 コンデンサマイクロホン
JP2006089679A JP2007267049A (ja) 2006-03-29 2006-03-29 コンデンサマイクロホン
JP2006097305A JP2007274334A (ja) 2006-03-31 2006-03-31 コンデンサマイクロホン

Publications (1)

Publication Number Publication Date
TW200746868A true TW200746868A (en) 2007-12-16

Family

ID=38093390

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106586A TW200746868A (en) 2006-02-24 2007-02-16 Condenser microphone

Country Status (4)

Country Link
US (1) US20070201710A1 (zh)
KR (1) KR20080090555A (zh)
TW (1) TW200746868A (zh)
WO (1) WO2007100068A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553884B (zh) * 2013-06-05 2016-10-11 應美盛股份有限公司 具有內嵌式聲通道的電容感測結構及製造其之方法
US10993043B2 (en) 2019-09-09 2021-04-27 Shin Sung C&T Co., Ltd. MEMS acoustic sensor
TWI753298B (zh) * 2019-09-06 2022-01-21 南韓商申星集合科技股份有限公司 微機電系統聲學傳感器

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8121315B2 (en) * 2007-03-21 2012-02-21 Goer Tek Inc. Condenser microphone chip
US20090060232A1 (en) * 2007-08-08 2009-03-05 Yamaha Corporation Condenser microphone
GB2453105B (en) * 2007-09-19 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
EP2043385A2 (en) * 2007-09-28 2009-04-01 Yamaha Corporation Vibration transducer and manufacturing method therefor
US7795063B2 (en) * 2007-12-31 2010-09-14 Solid State System Co., Ltd. Micro-electro-mechanical systems (MEMS) device and process for fabricating the same
WO2009101757A1 (ja) * 2008-02-14 2009-08-20 Panasonic Corporation コンデンサマイクロホン及びｍｅｍｓデバイス
JP5332373B2 (ja) * 2008-07-25 2013-11-06 オムロン株式会社 静電容量型振動センサ
TWI449439B (zh) * 2008-09-02 2014-08-11 Ind Tech Res Inst 音訊感測元件及其製造方法
KR101065292B1 (ko) * 2008-12-22 2011-09-19 한국전자통신연구원 멤스 마이크로폰 및 그 제조 방법
IT1395550B1 (it) * 2008-12-23 2012-09-28 St Microelectronics Rousset Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione
JP2010155306A (ja) * 2008-12-26 2010-07-15 Panasonic Corp Ｍｅｍｓデバイス及びその製造方法
DE102009000416A1 (de) * 2009-01-27 2010-07-29 Robert Bosch Gmbh Mikromechanischer Drucksensor mit vertikaler Membranaufhängung
JP5260342B2 (ja) * 2009-01-30 2013-08-14 ローム株式会社 Ｍｅｍｓセンサ
GB2467777B (en) * 2009-02-13 2011-01-12 Wolfson Microelectronics Plc MEMS device and process
US8643128B2 (en) * 2009-02-24 2014-02-04 Pixart Imaging Incorporation Micro-electro-mechanical-system sensor and method for making same
US9247331B2 (en) * 2009-06-29 2016-01-26 Nokia Technologoies Oy Temperature compensated microphone
US9344805B2 (en) * 2009-11-24 2016-05-17 Nxp B.V. Micro-electromechanical system microphone
TWI404428B (zh) * 2009-11-25 2013-08-01 Ind Tech Res Inst 聲學感測器
KR101300749B1 (ko) * 2009-12-14 2013-08-28 한국전자통신연구원 음향 센서 및 이의 제조 방법
CN101841758A (zh) * 2010-03-08 2010-09-22 瑞声声学科技(深圳)有限公司 电容mems麦克风
US8368153B2 (en) * 2010-04-08 2013-02-05 United Microelectronics Corp. Wafer level package of MEMS microphone and manufacturing method thereof
CN101883307B (zh) * 2010-05-04 2012-12-12 瑞声声学科技(深圳)有限公司 电容mems麦克风振膜
JP5570010B2 (ja) * 2010-05-27 2014-08-13 株式会社オーディオテクニカ コンデンサマイクロホンユニット及びコンデンサマイクロホンの振動板組立体の製造方法
JP5872163B2 (ja) 2011-01-07 2016-03-01 オムロン株式会社 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン
US9380380B2 (en) 2011-01-07 2016-06-28 Stmicroelectronics S.R.L. Acoustic transducer and interface circuit
DE112011105008B4 (de) * 2011-03-04 2017-10-05 Tdk Corporation Mikrofon und Verfahren zum Positionieren einer Membran zwischen zwei Gegenelektroden
CN102158788B (zh) * 2011-03-15 2015-03-18 迈尔森电子（天津）有限公司 Mems麦克风及其形成方法
CN102164325A (zh) * 2011-05-16 2011-08-24 瑞声声学科技(深圳)有限公司 微型麦克风
US8503699B2 (en) 2011-06-01 2013-08-06 Infineon Technologies Ag Plate, transducer and methods for making and operating a transducer
CN103858446A (zh) * 2011-08-18 2014-06-11 美商楼氏电子有限公司 用于mems装置的灵敏度调整装置和方法
EP2565153B1 (en) * 2011-09-02 2015-11-11 Nxp B.V. Acoustic transducers with perforated membranes
US9148726B2 (en) 2011-09-12 2015-09-29 Infineon Technologies Ag Micro electrical mechanical system with bending deflection of backplate structure
US9031266B2 (en) * 2011-10-11 2015-05-12 Infineon Technologies Ag Electrostatic loudspeaker with membrane performing out-of-plane displacement
JP5914684B2 (ja) * 2011-11-14 2016-05-11 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ Ｍｅｍｓバックプレート、ｍｅｍｓバックプレートを備えたｍｅｍｓマイクロフォン、およびｍｅｍｓマイクロフォンの製造方法
TWI461657B (zh) 2011-12-26 2014-11-21 Ind Tech Res Inst 電容傳感器、其製造方法以及具此種電容傳感器的多功能元件
US8983097B2 (en) * 2012-02-29 2015-03-17 Infineon Technologies Ag Adjustable ventilation openings in MEMS structures
JP5951344B2 (ja) * 2012-04-27 2016-07-13 株式会社東芝 Ｍｅｍｓデバイスおよびその製造方法
KR101764226B1 (ko) * 2012-08-29 2017-08-04 한국전자통신연구원 멤스 음향 센서 및 그 제조 방법
CN103607684B (zh) * 2013-11-29 2019-01-18 上海集成电路研发中心有限公司 电容式硅麦克风及其制备方法
US9448126B2 (en) 2014-03-06 2016-09-20 Infineon Technologies Ag Single diaphragm transducer structure
US9344808B2 (en) * 2014-03-18 2016-05-17 Invensense, Inc. Differential sensing acoustic sensor
US20150296307A1 (en) * 2014-04-10 2015-10-15 Knowles Electronics, Llc. Dual diaphragm and dual back plate acoustic apparatus
KR101463429B1 (ko) * 2014-08-20 2014-11-20 한국지질자원연구원 초저주파 음파 감지 장치
US9400224B2 (en) 2014-09-12 2016-07-26 Industrial Technology Research Institute Pressure sensor and manufacturing method of the same
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US10023461B2 (en) 2014-10-31 2018-07-17 Stmicroelectronics S.R.L. Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof
KR101610129B1 (ko) * 2014-11-26 2016-04-20 현대자동차 주식회사 마이크로폰 및 그 제조방법
KR101619253B1 (ko) * 2014-11-26 2016-05-10 현대자동차 주식회사 마이크로폰 및 그 제조방법
CN106303868B (zh) * 2015-06-12 2024-01-16 钰太芯微电子科技（上海）有限公司 一种高信噪比传感器及麦克风
WO2017180670A2 (en) * 2016-04-11 2017-10-19 The Alfred E. Mann Foundation For Scientific Research Pressure sensors with tensioned membranes
EP3286927A1 (en) * 2016-06-30 2018-02-28 Cirrus Logic International Semiconductor Limited Mems device and process
GB2554470A (en) * 2016-09-26 2018-04-04 Cirrus Logic Int Semiconductor Ltd MEMS device and process
JP6930101B2 (ja) * 2016-12-12 2021-09-01 オムロン株式会社 音響センサ及び静電容量型トランスデューサ
GB2563090A (en) * 2017-05-31 2018-12-05 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
CN109429157B (zh) * 2017-08-28 2021-02-09 中芯国际集成电路制造(上海)有限公司 麦克风及其制造方法
DE112018005251T5 (de) * 2017-09-18 2020-06-18 Knowles Electronics, Llc System und verfahren zur optimierung von akustischen löchern
KR102486582B1 (ko) * 2018-07-10 2023-01-10 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
KR102121696B1 (ko) * 2018-08-31 2020-06-10 김경원 Mems 캐패시티브 마이크로폰
DE102019201889A1 (de) * 2019-02-13 2020-08-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. MEMS und Verfahren zum Herstellen desselben
US11119532B2 (en) * 2019-06-28 2021-09-14 Intel Corporation Methods and apparatus to implement microphones in thin form factor electronic devices
CN110958548A (zh) * 2019-12-02 2020-04-03 杭州士兰集成电路有限公司 Mems麦克风及其制造方法
CN112601169B (zh) * 2020-12-15 2021-09-24 武汉大学 一种宽频带高灵敏度谐振式压电mems麦克风
CN113873404A (zh) * 2021-09-29 2021-12-31 瑞声声学科技(深圳)有限公司 一种振膜及其制备方法、mems麦克风

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL281021A (zh) * 1961-07-19
FR2695787B1 (fr) * 1992-09-11 1994-11-10 Suisse Electro Microtech Centr Transducteur capacitif intégré.
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US6535460B2 (en) * 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US7023066B2 (en) * 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553884B (zh) * 2013-06-05 2016-10-11 應美盛股份有限公司 具有內嵌式聲通道的電容感測結構及製造其之方法
US9809451B2 (en) 2013-06-05 2017-11-07 Invensense, Inc. Capacitive sensing structure with embedded acoustic channels
TWI753298B (zh) * 2019-09-06 2022-01-21 南韓商申星集合科技股份有限公司 微機電系統聲學傳感器
US10993043B2 (en) 2019-09-09 2021-04-27 Shin Sung C&T Co., Ltd. MEMS acoustic sensor

Also Published As

Publication number Publication date
WO2007100068A1 (en) 2007-09-07
US20070201710A1 (en) 2007-08-30
KR20080090555A (ko) 2008-10-08

Similar Documents

Publication Publication Date Title
TW200746868A (en) Condenser microphone
TW200715896A (en) Capacitor microphone
EP3534206A3 (en) Panel vibration type sound generating display device
EP1796426A3 (en) Speaker and method of outputting acoustic sound
CN201682603U (zh) 一种耳机
TW200612110A (en) Acoustic wave sensor
TW200718926A (en) Oscillatory wave detecting apparatus
EP2150075A3 (en) Electronic device and electro-acoustic transducer thereof
DK1866048T3 (da) Sigteapparat og -fremgangsmåde
EP1892998A3 (en) Piezoelectric electroacoustic transducing device
TW200746867A (en) Piezoelectric speaker
EP1850631A3 (en) High frequency compensating
WO2011031794A3 (en) Inverse horn loudspeakers
FR2954274B1 (fr) Mecanisme amortisseur de vibrations, et appareil volant muni d'une structure porteuse et d'un rotor muni d'un tel mecanisme
TW200626273A (en) Resonator, ultrasonic bonding head, and ultrasonic bonding apparatus
ATE483329T1 (de) Akustisches sensorelement
ATE528930T1 (de) Elektroakustischer wandler
WO2011148778A8 (ja) 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン
EP1819193A3 (en) Electroacoustic transducing device
EP2884487A3 (en) Installation structure for acoustic transducer
ATE510416T1 (de) Mems-mikrofon
DE602007009827D1 (de) Lautsprecher mit verringerter wackeltendenz
RU2012101420A (ru) Громкоговоритель и способ формирования громкоговорителя
DK1720379T3 (da) Akustisk knogleledningstransducer
WO2008143463A3 (en) A sound converting apparatus