TW200745959A - Memory card - Google Patents

Memory card

Info

Publication number
TW200745959A
TW200745959A TW096102982A TW96102982A TW200745959A TW 200745959 A TW200745959 A TW 200745959A TW 096102982 A TW096102982 A TW 096102982A TW 96102982 A TW96102982 A TW 96102982A TW 200745959 A TW200745959 A TW 200745959A
Authority
TW
Taiwan
Prior art keywords
circuit board
memory card
case
mounting part
major surface
Prior art date
Application number
TW096102982A
Other languages
English (en)
Other versions
TWI470556B (zh
Inventor
Hidenobu Nishikawa
Daido Komyoji
Hiroyuki Yamada
Yutaka Nakamura
Shuichi Takeda
Yasuharu Kikuchi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200745959A publication Critical patent/TW200745959A/zh
Application granted granted Critical
Publication of TWI470556B publication Critical patent/TWI470556B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Credit Cards Or The Like (AREA)
TW96102982A 2006-01-30 2007-01-26 Memory card TWI470556B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006020292A JP4730115B2 (ja) 2006-01-30 2006-01-30 メモリカード及びその製造方法
JP2006117588A JP4784376B2 (ja) 2006-01-30 2006-04-21 メモリカード

Publications (2)

Publication Number Publication Date
TW200745959A true TW200745959A (en) 2007-12-16
TWI470556B TWI470556B (zh) 2015-01-21

Family

ID=38309280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96102982A TWI470556B (zh) 2006-01-30 2007-01-26 Memory card

Country Status (5)

Country Link
US (1) US8125786B2 (zh)
JP (2) JP4730115B2 (zh)
CN (1) CN101371266B (zh)
TW (1) TWI470556B (zh)
WO (1) WO2007086494A1 (zh)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG106050A1 (en) * 2000-03-13 2004-09-30 Megic Corp Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
US9295816B2 (en) * 2009-12-09 2016-03-29 Osprey Medical, Inc. Catheter with distal and proximal ports
JP4880764B2 (ja) 2010-02-04 2012-02-22 シャープ株式会社 画像形成装置、画像形成システム、プログラム、記録媒体、および画像形成装置の制御方法
WO2012045201A1 (en) * 2010-10-04 2012-04-12 Sandisk Semiconductor (Shanghai) Co., Ltd. Pre-treatment of memory cards for ink jet printing
JP5736730B2 (ja) * 2010-10-29 2015-06-17 王子ホールディングス株式会社 粘着シート
TW201316349A (zh) * 2011-10-14 2013-04-16 Hon Hai Prec Ind Co Ltd 固態硬碟
KR101205212B1 (ko) * 2011-10-31 2012-11-27 진명기 착미 문구용품 및 이의 제조방법
US20130258576A1 (en) * 2012-03-29 2013-10-03 Gadi Ben-Gad Memory Card
JP2017508844A (ja) * 2014-03-07 2017-03-30 ザ プロクター アンド ギャンブル カンパニー 刺激剤を含む組成物
USD730910S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD730907S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD730908S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD729251S1 (en) * 2014-06-27 2015-05-12 Samsung Electronics Co., Ltd. Memory card
USD727912S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD730909S1 (en) * 2014-06-27 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD727911S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD727913S1 (en) * 2014-06-27 2015-04-28 Samsung Electronics Co., Ltd. Memory card
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736215S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736214S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD727910S1 (en) * 2014-07-02 2015-04-28 Samsung Electronics Co., Ltd. Memory card
US20150134893A1 (en) 2014-08-19 2015-05-14 Leef Technology LTD Flash drive shaped to utilize space behind a mobile device
USD773466S1 (en) * 2015-08-20 2016-12-06 Isaac S. Daniel Combined secure digital memory and subscriber identity module
USD798868S1 (en) * 2015-08-20 2017-10-03 Isaac S. Daniel Combined subscriber identification module and storage card
USD783621S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD783622S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD772232S1 (en) * 2015-11-12 2016-11-22 Samsung Electronics Co., Ltd. Memory card
USD773467S1 (en) * 2015-11-12 2016-12-06 Samsung Electronics Co., Ltd. Memory card
JP2019006985A (ja) * 2017-06-21 2019-01-17 株式会社リーダー 苦味催吐性塗膜
JP7093176B2 (ja) * 2017-12-06 2022-06-29 藤森工業株式会社 蓋材及び包装体
JP7205167B2 (ja) * 2018-11-01 2023-01-17 凸版印刷株式会社 トークンおよびその製造方法
US11355822B2 (en) * 2020-01-23 2022-06-07 Duracell U.S. Operations, Inc. Battery peel off assembly for exposing a safety feature comprising an aversive agent

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005038A (en) * 1974-04-15 1977-01-25 Peerless Paint And Varnish Corporation Paint composition containing denatonium benzoate or lignocaine benzyl octanoate with a latex resin binder for application over old paint films to prevent ingestion of poisons therefrom
JPH0321625U (zh) * 1989-07-11 1991-03-05
US5061845A (en) * 1990-04-30 1991-10-29 Texas Instruments Incorporated Memory card
US5182879A (en) * 1991-10-03 1993-02-02 Hopkins George I Crawling insect trap
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
JP3021625U (ja) * 1995-03-09 1996-02-27 株式会社タカラ 誤食防止物品
JPH0939469A (ja) * 1995-08-02 1997-02-10 Mitsubishi Pencil Co Ltd 筆記具
JPH0958175A (ja) * 1995-08-23 1997-03-04 Mitsubishi Pencil Co Ltd 筆記具
JP3024428U (ja) * 1995-11-08 1996-05-21 株式会社タカラ 誤食防止物品
JP3106120B2 (ja) * 1997-05-16 2000-11-06 三菱電機株式会社 携帯型電子機器
JPH1120349A (ja) * 1997-06-30 1999-01-26 Kyodo Printing Co Ltd 苦味催吐加工を施した媒体
JPH11233606A (ja) * 1998-02-10 1999-08-27 Kakizaki Mamufacuturing Co Ltd 樹脂製薄板収納容器
US6200046B1 (en) * 1998-08-20 2001-03-13 Kurt Marcus Rylander Chewable device
JP2000251049A (ja) * 1999-03-03 2000-09-14 Konica Corp カード及びその製造方法
CA2381994C (en) * 1999-08-16 2006-05-30 John R. Woods More controllable acoustic spray patch
JP2003303326A (ja) * 2002-04-10 2003-10-24 Murata Mfg Co Ltd カード型モジュールおよびその製造方法
CN2594881Y (zh) * 2003-01-06 2003-12-24 友鑫科技股份有限公司 记忆卡组装开窗式结构
JP2006003955A (ja) * 2004-06-15 2006-01-05 Sony Corp メモリカードおよびその製造方法
US7804163B2 (en) * 2004-08-06 2010-09-28 Supertalent Electronics, Inc. Seamless secured digital card manufacturing methods with male guide and female switch
US7131785B1 (en) * 2004-07-26 2006-11-07 Amir A Mansouri Chewable top for a wiring instrument

Also Published As

Publication number Publication date
JP4784376B2 (ja) 2011-10-05
CN101371266B (zh) 2011-12-14
JP2007293402A (ja) 2007-11-08
TWI470556B (zh) 2015-01-21
US8125786B2 (en) 2012-02-28
JP2007200178A (ja) 2007-08-09
CN101371266A (zh) 2009-02-18
JP4730115B2 (ja) 2011-07-20
WO2007086494A1 (ja) 2007-08-02
US20090009976A1 (en) 2009-01-08

Similar Documents

Publication Publication Date Title
TW200745959A (en) Memory card
HK1082364A1 (en) Implantable sensor processing system with integrated printed circuit board antenna
SG108931A1 (en) Mounting board and electronic device using the same
TW200635453A (en) Hybrid circuit board and display device having the same
TW556906U (en) Small electronic card structure
TW200708239A (en) Electronic system
TW200711443A (en) Electronic apparatus
DK1245006T3 (da) Elektronisk nøglelæser
HK1041102A1 (zh) 集成電路片、集成電路、印刷電路版及電子儀器
AU2003272831A8 (en) Circuit board threadplate
TW200746389A (en) Embedded capacitor device having a common coupling area
WO2003054790A8 (fr) Carte a puce a module de surface etendue
AU2003299686A8 (en) Circuit board stiffener
GB2377080B (en) Integrated circuit package and printed circuit board arrangement
GB2386729B (en) Electronic writing & reading board (com) system
GB2394365B (en) Circuit board constructions
AU2003254546A1 (en) Ironing board having an iron rest
TW200715439A (en) Align mark
AU2003264701A8 (en) Press assembly for electronic board testing
GB2415145B (en) Electronic board game (the 'I' board)
AU2002348869A8 (en) Integrated circuit with an amplifier
GB2393591B (en) Structure for mounting connector on board
GB0416958D0 (en) Circuit board that comprises one or more mounting pins
TW200718303A (en) Electronic device and circuit board thereof
AU150505S (en) An electronic computer

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees