TW200741194A - Apparatus and method for inspecting defects - Google Patents

Apparatus and method for inspecting defects

Info

Publication number
TW200741194A
TW200741194A TW096108107A TW96108107A TW200741194A TW 200741194 A TW200741194 A TW 200741194A TW 096108107 A TW096108107 A TW 096108107A TW 96108107 A TW96108107 A TW 96108107A TW 200741194 A TW200741194 A TW 200741194A
Authority
TW
Taiwan
Prior art keywords
inspection
defect
picture
defect portion
area
Prior art date
Application number
TW096108107A
Other languages
English (en)
Inventor
Hiroshi Okabe
Yoshihiro Kanetani
Toshihiko Matsumoto
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW200741194A publication Critical patent/TW200741194A/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW096108107A 2006-03-10 2007-03-09 Apparatus and method for inspecting defects TW200741194A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006065980A JP2007240432A (ja) 2006-03-10 2006-03-10 欠陥検査装置および欠陥検査方法

Publications (1)

Publication Number Publication Date
TW200741194A true TW200741194A (en) 2007-11-01

Family

ID=38050152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108107A TW200741194A (en) 2006-03-10 2007-03-09 Apparatus and method for inspecting defects

Country Status (6)

Country Link
US (1) US20070211242A1 (zh)
EP (1) EP1832867A1 (zh)
JP (1) JP2007240432A (zh)
KR (1) KR20070092607A (zh)
CN (1) CN101034069A (zh)
TW (1) TW200741194A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583942B (zh) * 2015-05-20 2017-05-21 Shimadzu Corp Check the device and check the method

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JP2009174931A (ja) * 2008-01-23 2009-08-06 Nippon Gijutsu Center:Kk 塗装検査用照射方法、塗装検査用照射装置、塗装検査装置
JP4719284B2 (ja) * 2008-10-10 2011-07-06 トヨタ自動車株式会社 表面検査装置
KR100975330B1 (ko) * 2008-12-26 2010-08-12 권오건 초음파 탐상 장치 시스템 및 그 제어 방법
JP5308212B2 (ja) * 2009-03-31 2013-10-09 株式会社日立ハイテクノロジーズ ディスク表面欠陥検査方法及び装置
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JP5561214B2 (ja) * 2011-03-15 2014-07-30 オムロン株式会社 画像処理装置および画像処理プログラム
JP5847176B2 (ja) * 2011-05-30 2016-01-20 ライオン株式会社 照明システム、検査システム及び制御システム
TWI484164B (zh) * 2012-05-11 2015-05-11 Machvision Inc Optical re - inspection system and its detection method
US9113088B2 (en) * 2012-12-06 2015-08-18 Samsung Electronics Co., Ltd. Method and apparatus for photographing an image using light from multiple light sources
JP2014116656A (ja) * 2012-12-06 2014-06-26 Samsung R&D Institute Japan Co Ltd 撮像装置、撮像方法及びプログラム
JP5904149B2 (ja) * 2013-03-26 2016-04-13 富士ゼロックス株式会社 画像検査システムおよびプログラム
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CN103604364A (zh) * 2013-10-29 2014-02-26 格林精密部件(苏州)有限公司 阀套内孔检测装置
TWI504886B (zh) * 2013-12-26 2015-10-21 Machvision Inc 印刷電路板之防焊層裂縫現象及異色現象的檢測方法及檢測設備
JP6370177B2 (ja) * 2014-09-05 2018-08-08 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
KR20160047360A (ko) * 2014-10-22 2016-05-02 동우 화인켐 주식회사 결함 검출 시스템 및 방법
JP2017049974A (ja) * 2015-09-04 2017-03-09 キヤノン株式会社 識別器生成装置、良否判定方法、およびプログラム
WO2018012192A1 (ja) * 2016-07-12 2018-01-18 吉野石膏株式会社 検査方法、検査・通知方法、該検査方法を含む製造方法、検査装置及び製造装置
CN106053484A (zh) * 2016-08-03 2016-10-26 常州驰网智能检测技术有限公司 一种液晶玻璃表面异物的检测设备及其检测方法
CN107110790A (zh) * 2017-01-24 2017-08-29 香港应用科技研究院有限公司 光学检测系统
US10887500B2 (en) * 2017-01-24 2021-01-05 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Optical inspection system
CN107980094B (zh) * 2017-03-31 2021-02-26 深圳配天智能技术研究院有限公司 一种视觉检测系统及方法
CN107945152A (zh) * 2017-10-27 2018-04-20 深圳市创科自动化控制技术有限公司 工业相机的缺陷检测控制系统及方法
CN109840984B (zh) * 2017-11-28 2020-12-25 南京造币有限公司 一种硬币表面质量检查系统、方法和装置
JP6954142B2 (ja) * 2018-01-17 2021-10-27 オムロン株式会社 画像検査装置および照明装置
US10634618B2 (en) 2018-01-23 2020-04-28 Hong Kong Applied Science and Technology Research Institute Company Limited Apparatus and a method for inspecting a light transmissible optical component
KR102267919B1 (ko) 2018-06-28 2021-06-23 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
CN110870401B (zh) * 2018-06-28 2022-02-11 株式会社高迎科技 确定贴装在基板部件的贴装不合格原因的电子装置及方法
KR102599207B1 (ko) * 2018-07-20 2023-12-15 삼성전자 주식회사 전자 디바이스의 표면 측정 장치 및 방법
US20210299879A1 (en) * 2018-10-27 2021-09-30 Gilbert Pinter Machine vision systems, illumination sources for use in machine vision systems, and components for use in the illumination sources
US11428644B2 (en) 2018-11-27 2022-08-30 Koh Young Technology Inc. Method and electronic apparatus for displaying inspection result of board
RU2764644C1 (ru) * 2018-11-30 2022-01-19 ДжФЕ СТИЛ КОРПОРЕЙШН Способ обнаружения дефектов поверхности, устройство обнаружения дефектов поверхности, способ производства стальных материалов, способ управления качеством стального материала, установка по производству стальных материалов, способ генерации моделей определения дефектов поверхности и модель определения дефектов поверхности
WO2020262593A1 (ja) * 2019-06-28 2020-12-30 日本電産株式会社 外観検査装置及び外観検査方法
DE102019128503A1 (de) * 2019-10-22 2021-04-22 Krones Aktiengesellschaft Verfahren und Vorrichtung zur optischen Inspektion von Behältern
JP2021067587A (ja) * 2019-10-25 2021-04-30 日本電産サンキョー株式会社 外観検査装置
CN111156932B (zh) * 2020-03-10 2021-08-27 凌云光技术股份有限公司 一种镜面材料平整度检测装置
JP7392582B2 (ja) * 2020-06-12 2023-12-06 オムロン株式会社 検査システムおよび検査方法
CN114705698A (zh) * 2022-06-02 2022-07-05 季华实验室 缺陷检测方法、装置、系统及存储介质
CN116500042B (zh) * 2023-05-09 2024-01-26 哈尔滨工业大学重庆研究院 缺陷检测方法、装置、系统及存储介质

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US6002792A (en) * 1993-11-16 1999-12-14 Hamamatsu Photonics Kk Semiconductor device inspection system
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JPH09311020A (ja) * 1996-05-23 1997-12-02 Nec Corp 突起部検査装置
US6917433B2 (en) * 2000-09-20 2005-07-12 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
JP3594026B2 (ja) * 2001-11-26 2004-11-24 オムロン株式会社 曲面体の表面状態検査方法および基板検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583942B (zh) * 2015-05-20 2017-05-21 Shimadzu Corp Check the device and check the method

Also Published As

Publication number Publication date
EP1832867A1 (en) 2007-09-12
JP2007240432A (ja) 2007-09-20
KR20070092607A (ko) 2007-09-13
CN101034069A (zh) 2007-09-12
US20070211242A1 (en) 2007-09-13

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