TW200740951A - Adhesive tape - Google Patents

Adhesive tape

Info

Publication number
TW200740951A
TW200740951A TW096114477A TW96114477A TW200740951A TW 200740951 A TW200740951 A TW 200740951A TW 096114477 A TW096114477 A TW 096114477A TW 96114477 A TW96114477 A TW 96114477A TW 200740951 A TW200740951 A TW 200740951A
Authority
TW
Taiwan
Prior art keywords
base
adhesive tape
tape
adhesive
peeling
Prior art date
Application number
TW096114477A
Other languages
English (en)
Inventor
Toshiyuki Yanagawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200740951A publication Critical patent/TW200740951A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/017—Antistatic agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW096114477A 2006-04-24 2007-04-24 Adhesive tape TW200740951A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006119084 2006-04-24
JP2006232554 2006-08-29

Publications (1)

Publication Number Publication Date
TW200740951A true TW200740951A (en) 2007-11-01

Family

ID=38655356

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096114477A TW200740951A (en) 2006-04-24 2007-04-24 Adhesive tape

Country Status (7)

Country Link
US (1) US20100021667A1 (zh)
EP (1) EP2017315A4 (zh)
JP (1) JP4715847B2 (zh)
KR (1) KR20090005209A (zh)
CN (1) CN102325430A (zh)
TW (1) TW200740951A (zh)
WO (1) WO2007125830A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2009304593B2 (en) * 2008-10-16 2015-04-23 Zephyros, Inc. Tape material and roll comprising pressure sensitive adhesive
CN102037615B (zh) * 2009-02-27 2013-08-28 日立化成株式会社 粘接材料卷轴
CN102176337B (zh) * 2011-01-06 2013-01-09 天津大学 各向异性导电胶膜用复合导电粒子及制备方法
KR200476229Y1 (ko) * 2013-05-02 2015-02-11 주식회사 케이아이씨 알루미늄 실링 테이프
JP5690910B2 (ja) * 2013-11-22 2015-03-25 リンテック株式会社 半導体ウエハ加工用接着シート
WO2016094395A1 (en) 2014-12-08 2016-06-16 Zephyros, Inc. Vertically lapped fibrous flooring
US10460715B2 (en) 2015-01-12 2019-10-29 Zephyros, Inc. Acoustic floor underlay system
CN107206732B (zh) 2015-01-20 2021-02-26 泽菲罗斯公司 镀铝表面的非纺织材料
JP6995621B2 (ja) * 2015-02-11 2022-01-14 アルファ・アセンブリー・ソリューションズ・インコーポレイテッド 電気接続テープ
WO2016187526A1 (en) 2015-05-20 2016-11-24 Zephyros, Inc. Multi-impedance composite
CN113119574B (zh) * 2019-12-31 2023-06-20 昊佰电子科技（上海）有限公司 一种大小头状模切卷料产品及其加工方法

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1286462A (en) * 1918-05-21 1918-12-03 Henry V Wesche Toy building-blocks.
US3648835A (en) * 1969-11-12 1972-03-14 Minnesota Mining & Mfg Marking tape
DE2404682A1 (de) * 1974-02-01 1975-08-07 Jackstaedt & Co Wilhelm Selbstklebefolie
US4007835A (en) * 1975-02-28 1977-02-15 Pellon Corporation Fuse and fold fabric
US4297403A (en) * 1980-02-06 1981-10-27 Monarch Marking Systems, Inc. Coreless pressure sensitive label supply roll
JPS62179365A (ja) * 1986-01-31 1987-08-06 Shiyoubee:Kk 複合食品
JPS6383186A (ja) * 1986-09-29 1988-04-13 Sekisui Chem Co Ltd 接着テ−プ
JPS6437449A (en) * 1987-08-03 1989-02-08 Sony Corp Production of synthetic granite
JPS6437449U (zh) * 1987-08-28 1989-03-07
JPH0339352A (ja) * 1989-07-06 1991-02-20 Toray Ind Inc 共重合ポリエステル組成物
US5234517A (en) * 1990-10-24 1993-08-10 Minnesota Mining And Manufacturing Company Composite laminate adhesive tape coiled in an endless roll form and process for forming the laminate adhesive tape roll
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
JP2509773B2 (ja) * 1991-12-05 1996-06-26 住友ベークライト株式会社 異方導電フィルムの製造方法
JP2769263B2 (ja) * 1992-06-22 1998-06-25 ケル株式会社 転写用異方性接着剤テープの作成方法および装置
ZA94394B (en) * 1993-01-21 1995-07-20 Mcneil Ppc Inc Absorbent product provided in roll form
JPH071053U (ja) * 1993-06-01 1995-01-10 横浜ゴム株式会社 切断部を備えた粘着テープ
US5453141A (en) * 1993-10-01 1995-09-26 Rodriguez; Peter A. Transfer tape and method for cutting and spooling a web of paper
JP3284283B2 (ja) * 1993-10-12 2002-05-20 大日本印刷株式会社 巻取紙の紙継ぎ準備方法およびその連結用テープ
JPH0871491A (ja) * 1994-09-01 1996-03-19 Casio Comput Co Ltd 異方導電性接着剤の転写方法およびその装置
JPH0912986A (ja) * 1995-06-30 1997-01-14 Asahi Corp 防水シート
US5712210A (en) * 1995-08-30 1998-01-27 Minnesota Mining And Manufacturing Company Nonwoven abrasive material roll
JP3928753B2 (ja) * 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
US5682607A (en) * 1996-11-15 1997-11-04 Klein; Jeffrey A. Skin applique to provide protection from ultraviolet light
USD421528S (en) * 1996-12-18 2000-03-14 Abdulla Y Shakora Roll of sanitary bath wipes
JP3039352U (ja) * 1997-01-07 1997-07-15 ニチバン株式会社 植物栽培容器の封緘用粘着シ−ト
JPH10195397A (ja) * 1997-01-14 1998-07-28 Sekisui Chem Co Ltd 気密性粘着テープ
US5763038A (en) * 1997-02-25 1998-06-09 Minnesota Mining And Manufacturing Company Progressively perforated tape roll
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
JP4465788B2 (ja) 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
US6772532B1 (en) * 2000-05-27 2004-08-10 Richard Honea Disposable tape measure system
DE10031214B4 (de) * 2000-06-27 2005-10-27 Silu Verwaltung Ag Montageklebeband zur verbesserten Fugenabdichtung und Montagebanddispenser
US6756102B1 (en) * 2001-07-12 2004-06-29 Stanko Galo Adhesive tape having serial segments with non-adherent gripping elements
USD472319S1 (en) * 2001-07-30 2003-03-25 Oltmann Brickley A Duct tape-type roll of medical bandages
JP3086384U (ja) * 2001-11-30 2002-06-14 大明商事株式会社 両面テープ
JP2003183601A (ja) * 2001-12-17 2003-07-03 Lintec Corp ミシン目入り再剥離性テープ
JP4032961B2 (ja) * 2002-12-20 2008-01-16 日立化成工業株式会社 接着材テープの接続方法
USD490855S1 (en) * 2003-03-18 2004-06-01 Kenichi Fujii Adhesive tape
USD492354S1 (en) * 2003-03-18 2004-06-29 Kenichi Fujii Adhesive tape
USD492353S1 (en) * 2003-03-18 2004-06-29 Kenichi Fujii Adhesive tape
USD490470S1 (en) * 2003-03-18 2004-05-25 Kenichi Fujii Adhesive tape
US6831049B1 (en) * 2003-05-21 2004-12-14 Juan Pablo Torres Moreno Ultra bright headlight and tail light cleaner
JP4289102B2 (ja) * 2003-09-26 2009-07-01 パナソニック株式会社 組立装置および組立方法ならびに端子洗浄装置
JP3947532B2 (ja) * 2004-07-08 2007-07-25 住友ベークライト株式会社 異方導電性接着剤フィルム
JP2006032335A (ja) * 2005-07-06 2006-02-02 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP3117147U (ja) * 2005-09-29 2006-01-05 日本ジッパーチュービング株式会社 電磁波シールド材個別分離型の剥離フィルム
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
USD572156S1 (en) * 2007-01-08 2008-07-01 Ron Payne Construction framing tape
USD625063S1 (en) * 2007-07-19 2010-10-05 Armaly Llc Sponge product
USD602988S1 (en) * 2008-04-17 2009-10-27 Leona Alicea Decorative imprinted adhesive
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD602989S1 (en) * 2008-10-22 2009-10-27 Leona Alicea Decorative imprinted adhesive
USD600284S1 (en) * 2009-03-26 2009-09-15 Plus Stationery Corp. Correction type tape with a security pattern
USD611541S1 (en) * 2009-03-26 2010-03-09 Plus Stationery Corp. Transparent correction type tape with a security pattern

Also Published As

Publication number Publication date
EP2017315A4 (en) 2011-05-25
JP4715847B2 (ja) 2011-07-06
KR20090005209A (ko) 2009-01-12
CN102325430A (zh) 2012-01-18
US20100021667A1 (en) 2010-01-28
JPWO2007125830A1 (ja) 2009-09-10
WO2007125830A1 (ja) 2007-11-08
EP2017315A1 (en) 2009-01-21

Similar Documents

Publication Publication Date Title
TW200740951A (en) Adhesive tape
MY154939A (en) Cover tape and method for manufacture
MY155905A (en) Carrier tapes having tear-initiated cover tapes and methods of making thereof
AU2003302719A1 (en) Superconductor material on a tape substrate
DE60300604D1 (de) Druckempfindliches Klebeband
AU2003226403A1 (en) Stretch releasable tape flag
TW200736361A (en) Pressure-sensitive adhesive sheet and process for producing electronic part therewith
MX2009000576A (es) Articulo abrasivo sin respaldo.
ATE383410T1 (de) Segmentierte härtbare transferbänder
MY157358A (en) Cover tape and method for manufacture
EP1591504A4 (en) SELF-ADHESIVE TAPE FOR GLUING A PLATE
DK1294820T3 (da) Montageklæbebånd til forbedret tætning af fuger, og montageklæbebåndsholder
AU2003230035A1 (en) Dual-surface flexible magnetic tape
EP1362881A3 (de) Folie und damit gebildetes Klebeband
DE602004031150D1 (de) Markierungsbaugruppe für die elektronische artikelsicherung
DE602006013555D1 (de) Bandrollenhalter
EP1149634A3 (de) Abdeckband und seine Verwendung
AU2003262521A1 (en) Foam with adhesive material tape
AU2003263225A8 (en) Method of altering the properties of a thin film and substrate implementing said method
TW200726305A (en) Conductive heating device
PT1246768E (pt) Dispositivo para transferir para um substrato um material transportado em forma de pelicula sobre uma fita de suporte
EP2072214A3 (en) Multi-layered molded article with EMI protection
WO2007034393A3 (en) Medical device adhesive backing having a multi-piece support
AU2003268904A1 (en) Support for substrates and compound comprising a support substrate and an extremely thin substrate
ATE458098T1 (de) Klebeband