TW200739876A - Electrostatic discharge protection device - Google Patents

Electrostatic discharge protection device

Info

Publication number
TW200739876A
TW200739876A TW095136794A TW95136794A TW200739876A TW 200739876 A TW200739876 A TW 200739876A TW 095136794 A TW095136794 A TW 095136794A TW 95136794 A TW95136794 A TW 95136794A TW 200739876 A TW200739876 A TW 200739876A
Authority
TW
Taiwan
Prior art keywords
protection device
region
well
electrostatic discharge
esd
Prior art date
Application number
TW095136794A
Other languages
English (en)
Inventor
Fabrice Blanc
Frederic Barbier
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Publication of TW200739876A publication Critical patent/TW200739876A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/107—Substrate region of field-effect devices
    • H01L29/1075—Substrate region of field-effect devices of field-effect transistors
    • H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW095136794A 2005-10-06 2006-10-03 Electrostatic discharge protection device TW200739876A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05109282 2005-10-06

Publications (1)

Publication Number Publication Date
TW200739876A true TW200739876A (en) 2007-10-16

Family

ID=37834226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136794A TW200739876A (en) 2005-10-06 2006-10-03 Electrostatic discharge protection device

Country Status (6)

Country Link
US (1) US7986011B2 (zh)
EP (1) EP1943676A2 (zh)
JP (1) JP2009512184A (zh)
CN (1) CN101283452B (zh)
TW (1) TW200739876A (zh)
WO (1) WO2007039880A2 (zh)

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JP2007294613A (ja) * 2006-04-24 2007-11-08 Sanyo Electric Co Ltd 半導体装置及びその製造方法
JP5108250B2 (ja) * 2006-04-24 2012-12-26 オンセミコンダクター・トレーディング・リミテッド 半導体装置及びその製造方法
JP2007317869A (ja) * 2006-05-25 2007-12-06 Sanyo Electric Co Ltd 半導体装置及びその製造方法
DE102007013443A1 (de) 2007-03-21 2008-09-25 Nicolai, Karlheinz, Dipl.-Ing. (TU) Zugmittelgetriebe mit nierenformiger Form der Zugmittel
US8693148B2 (en) 2009-01-08 2014-04-08 Micron Technology, Inc. Over-limit electrical condition protection circuits for integrated circuits
CN102104048B (zh) * 2009-12-17 2012-05-30 中国科学院上海微系统与信息技术研究所 用于绝缘体上硅技术的mos型esd保护结构及其制作方法
CN102237341B (zh) * 2010-04-29 2013-06-05 普诚科技股份有限公司 静电放电保护元件及其制作方法
FR2960097A1 (fr) * 2010-05-11 2011-11-18 St Microelectronics Tours Sas Composant de protection bidirectionnel
CN101866922B (zh) * 2010-05-12 2015-01-07 上海华虹宏力半导体制造有限公司 一种用于esd保护电路的ggnmos器件
TWI416706B (zh) * 2010-12-20 2013-11-21 Univ Nat Chiao Tung 三維積體電路的靜電放電防護結構
US20120161235A1 (en) * 2010-12-22 2012-06-28 Richtek Technology Corporation, R.O.C. Electrostatic discharge protection device and manufacturing method thereof
CN102569355A (zh) * 2010-12-28 2012-07-11 立锜科技股份有限公司 静电防护元件及其制造方法
US8611058B2 (en) * 2011-08-23 2013-12-17 Micron Technology, Inc. Combination ESD protection circuits and methods
US8724268B2 (en) 2011-08-30 2014-05-13 Micron Technology, Inc. Over-limit electrical condition protection circuits and methods
EP2637211B1 (en) * 2012-03-09 2018-01-03 ams AG ESD protection semiconductor device
US9553011B2 (en) 2012-12-28 2017-01-24 Texas Instruments Incorporated Deep trench isolation with tank contact grounding
CN106158832A (zh) * 2015-04-01 2016-11-23 联华电子股份有限公司 半导体结构
US9871032B2 (en) * 2015-09-09 2018-01-16 Globalfoundries Singapore Pte. Ltd. Gate-grounded metal oxide semiconductor device
US10347621B2 (en) * 2016-10-12 2019-07-09 Texas Instruments Incorporated Electrostatic discharge guard ring with snapback protection
CN114121931A (zh) 2020-08-26 2022-03-01 长鑫存储技术有限公司 静电保护器件及静电保护电路
CN113192949B (zh) * 2021-04-27 2024-01-23 上海华虹宏力半导体制造有限公司 半导体器件

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US5021852A (en) * 1989-05-18 1991-06-04 Texas Instruments Incorporated Semiconductor integrated circuit device
US5281841A (en) * 1990-04-06 1994-01-25 U.S. Philips Corporation ESD protection element for CMOS integrated circuit
US5814869A (en) * 1992-01-28 1998-09-29 Thunderbird Technologies, Inc. Short channel fermi-threshold field effect transistors
US5571738A (en) * 1992-09-21 1996-11-05 Advanced Micro Devices, Inc. Method of making poly LDD self-aligned channel transistors
US5504362A (en) * 1992-12-22 1996-04-02 International Business Machines Corporation Electrostatic discharge protection device
US5663082A (en) * 1996-05-28 1997-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Electrostactic discharge protection structure for lightly doped CMOS integrated circuit process
JPH1050988A (ja) * 1996-07-31 1998-02-20 Sharp Corp 絶縁ゲート型電界効果トランジスタ及びその製造方法
US6171891B1 (en) * 1998-02-27 2001-01-09 Taiwan Semiconductor Manufacturing Company Method of manufacture of CMOS device using additional implant regions to enhance ESD performance
US5891792A (en) * 1998-08-14 1999-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. ESD device protection structure and process with high tilt angle GE implant
JP3237626B2 (ja) * 1998-10-02 2001-12-10 日本電気株式会社 半導体装置の製造方法
JP2001284540A (ja) * 2000-04-03 2001-10-12 Nec Corp 半導体装置およびその製造方法
US6528850B1 (en) * 2000-05-03 2003-03-04 Linear Technology Corporation High voltage MOS transistor with up-retro well
US6265251B1 (en) * 2000-05-08 2001-07-24 Chartered Semiconductor Manufacturing Ltd. Method to fabricate a thick oxide MOS transistor for electrostatic discharge protection in an STI process
US6627955B2 (en) * 2001-01-23 2003-09-30 Texas Instruments Incorporated Structure and method of MOS transistor having increased substrate resistance
JP3888912B2 (ja) * 2002-03-04 2007-03-07 ローム株式会社 半導体集積回路装置
CN1302547C (zh) * 2002-04-29 2007-02-28 联华电子股份有限公司 静电放电保护电路与其制造方法及半导体元件的制造方法
US6867103B1 (en) 2002-05-24 2005-03-15 Taiwan Semiconductor Manufacturing Company Method of fabricating an ESD device on SOI
US6882009B2 (en) * 2002-08-29 2005-04-19 Industrial Technology Research Institute Electrostatic discharge protection device and method of manufacturing the same
CN1591799A (zh) 2003-08-27 2005-03-09 上海宏力半导体制造有限公司 静电放电保护装置的晶体管制造方法
KR100645039B1 (ko) * 2003-12-15 2006-11-10 삼성전자주식회사 정전기 방전 보호 소자 및 그 제조방법

Also Published As

Publication number Publication date
CN101283452A (zh) 2008-10-08
JP2009512184A (ja) 2009-03-19
EP1943676A2 (en) 2008-07-16
US7986011B2 (en) 2011-07-26
WO2007039880A3 (en) 2007-07-05
CN101283452B (zh) 2010-05-19
US20080224220A1 (en) 2008-09-18
WO2007039880A2 (en) 2007-04-12

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