TW200739612A - Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure - Google Patents

Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure

Info

Publication number
TW200739612A
TW200739612A TW096106861A TW96106861A TW200739612A TW 200739612 A TW200739612 A TW 200739612A TW 096106861 A TW096106861 A TW 096106861A TW 96106861 A TW96106861 A TW 96106861A TW 200739612 A TW200739612 A TW 200739612A
Authority
TW
Taiwan
Prior art keywords
circuit
connection structure
connecting material
producing
same
Prior art date
Application number
TW096106861A
Other languages
English (en)
Chinese (zh)
Other versions
TWI348166B (ja
Inventor
Tetsuyuki Shirakawa
Jun Taketatsu
Masaru Tanaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200739612A publication Critical patent/TW200739612A/zh
Application granted granted Critical
Publication of TWI348166B publication Critical patent/TWI348166B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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TW096106861A 2006-02-27 2007-02-27 Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure TW200739612A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006050307 2006-02-27
JP2006204937 2006-07-27

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TWI452577B (zh) * 2007-10-22 2014-09-11 Nippon Chemical Ind Coated conductive powder, conductive adhesive and IC tag
TWI452110B (zh) * 2009-11-17 2014-09-11 Hitachi Chemical Co Ltd A circuit-connecting material, a connecting structure using it, and a method of temporarily pressing
TWI666657B (zh) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 安裝用導電性糊

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JP5304019B2 (ja) * 2008-05-14 2013-10-02 日立化成株式会社 回路接続材料
WO2010001900A1 (ja) * 2008-07-01 2010-01-07 日立化成工業株式会社 回路接続材料及び回路接続構造体
JP5375374B2 (ja) * 2009-07-02 2013-12-25 日立化成株式会社 回路接続材料及び回路接続構造体
CN111971757B (zh) * 2018-04-04 2023-03-14 积水化学工业株式会社 导电性粒子、其制造方法、导电材料及连接结构体
CN111902884B (zh) * 2018-04-04 2023-03-14 积水化学工业株式会社 导电性粒子、其制造方法、导电材料及连接结构体

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JP2737647B2 (ja) * 1994-03-10 1998-04-08 カシオ計算機株式会社 異方導電性接着剤およびそれを用いた導電接続構造
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JP4387175B2 (ja) * 2003-07-07 2009-12-16 積水化学工業株式会社 被覆導電性粒子、異方性導電材料及び導電接続構造体
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JP4380328B2 (ja) * 2004-01-07 2009-12-09 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452577B (zh) * 2007-10-22 2014-09-11 Nippon Chemical Ind Coated conductive powder, conductive adhesive and IC tag
TWI452110B (zh) * 2009-11-17 2014-09-11 Hitachi Chemical Co Ltd A circuit-connecting material, a connecting structure using it, and a method of temporarily pressing
TWI666657B (zh) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 安裝用導電性糊

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WO2007099965A1 (ja) 2007-09-07
KR20080106308A (ko) 2008-12-04
TWI348166B (ja) 2011-09-01
JPWO2007099965A1 (ja) 2009-07-23

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