TW200737371A - Resin sealing/molding apparatus - Google Patents
Resin sealing/molding apparatusInfo
- Publication number
- TW200737371A TW200737371A TW096103323A TW96103323A TW200737371A TW 200737371 A TW200737371 A TW 200737371A TW 096103323 A TW096103323 A TW 096103323A TW 96103323 A TW96103323 A TW 96103323A TW 200737371 A TW200737371 A TW 200737371A
- Authority
- TW
- Taiwan
- Prior art keywords
- unit
- molding apparatus
- resin
- resin sealing
- press
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title abstract 4
- 239000011347 resin Substances 0.000 title abstract 4
- 229920005989 resin Polymers 0.000 title abstract 4
- 238000007789 sealing Methods 0.000 title abstract 2
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/50—Removing moulded articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
- B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
- B29C2043/3621—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices a plurality of individual elements acting on the material in the same or diferent directions, e.g. making tubular T-joints, profiles
- B29C2043/3623—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices a plurality of individual elements acting on the material in the same or diferent directions, e.g. making tubular T-joints, profiles coupled on a support, e.g. plate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006076280A JP2007251094A (ja) | 2006-03-20 | 2006-03-20 | 半導体チップの樹脂封止成形装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200737371A true TW200737371A (en) | 2007-10-01 |
TWI346365B TWI346365B (zh) | 2011-08-01 |
Family
ID=38522264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096103323A TW200737371A (en) | 2006-03-20 | 2007-01-30 | Resin sealing/molding apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090162467A1 (zh) |
EP (1) | EP2006896A1 (zh) |
JP (1) | JP2007251094A (zh) |
KR (2) | KR20080078639A (zh) |
CN (1) | CN101405854B (zh) |
TW (1) | TW200737371A (zh) |
WO (1) | WO2007108228A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI563579B (en) * | 2013-11-28 | 2016-12-21 | Towa Corp | Method and apparatus for supplying resin material of compression molding apparatus |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101087625B1 (ko) * | 2008-06-25 | 2011-11-30 | 세크론 주식회사 | 전자 부품 몰딩 장치 |
KR101015586B1 (ko) * | 2008-07-23 | 2011-02-17 | 세크론 주식회사 | 전자 부품 몰딩 장치 |
JP5672652B2 (ja) * | 2009-03-17 | 2015-02-18 | 凸版印刷株式会社 | 半導体素子用基板の製造方法および半導体装置 |
TWI523164B (zh) * | 2010-11-25 | 2016-02-21 | 山田尖端科技股份有限公司 | 樹脂模塑裝置 |
JP5716227B2 (ja) * | 2010-12-17 | 2015-05-13 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP6039198B2 (ja) * | 2012-03-07 | 2016-12-07 | Towa株式会社 | 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置 |
JP5658308B2 (ja) * | 2013-05-21 | 2015-01-21 | Towa株式会社 | 圧縮成形方法 |
JP6104787B2 (ja) * | 2013-12-18 | 2017-03-29 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6071869B2 (ja) * | 2013-12-27 | 2017-02-01 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6169516B2 (ja) * | 2014-03-31 | 2017-07-26 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6491508B2 (ja) * | 2015-03-23 | 2019-03-27 | Towa株式会社 | 樹脂封止装置及び樹脂成形品の製造方法 |
NL2014802B1 (en) * | 2015-05-13 | 2016-12-30 | Besi Netherlands Bv | Modular system for moulding electronic components and kit-of-parts for assembling such a modular system. |
CN105172036B (zh) * | 2015-09-23 | 2017-04-26 | 歌尔股份有限公司 | 网布矫正顶出机构 |
JP6640003B2 (ja) * | 2016-04-05 | 2020-02-05 | Towa株式会社 | 樹脂封止装置及び樹脂封止方法 |
JP6994445B2 (ja) * | 2018-08-31 | 2022-01-14 | Towa株式会社 | 樹脂成形装置、離型フィルムの剥離方法、樹脂成形品の製造方法 |
KR20220125757A (ko) * | 2021-03-05 | 2022-09-14 | 삼성전자주식회사 | 오염원 검출 장치 및 이를 포함하는 모니터링 시스템 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9401930A (nl) * | 1994-11-18 | 1996-07-01 | Fico Bv | Modulaire omhulinrichting. |
JP3566426B2 (ja) * | 1995-10-30 | 2004-09-15 | Towa株式会社 | 電子部品の樹脂成形装置 |
TW509615B (en) * | 2000-04-21 | 2002-11-11 | Apic Yamada Corp | Resin molding machine and resin tablet feeding machine |
JP2005190077A (ja) * | 2003-12-25 | 2005-07-14 | Towa Corp | 処理装置及び処理装置用プログラム供給方法 |
JP4373237B2 (ja) * | 2004-02-13 | 2009-11-25 | Towa株式会社 | 半導体チップの樹脂封止成形方法および樹脂封止成形用金型 |
JP4688422B2 (ja) | 2004-02-26 | 2011-05-25 | Towa株式会社 | 樹脂成形装置 |
-
2006
- 2006-03-20 JP JP2006076280A patent/JP2007251094A/ja active Pending
-
2007
- 2007-01-26 KR KR1020087011326A patent/KR20080078639A/ko active Search and Examination
- 2007-01-26 US US12/084,791 patent/US20090162467A1/en not_active Abandoned
- 2007-01-26 CN CN2007800092389A patent/CN101405854B/zh active Active
- 2007-01-26 KR KR1020117004249A patent/KR101192547B1/ko active IP Right Grant
- 2007-01-26 EP EP07707466A patent/EP2006896A1/en not_active Withdrawn
- 2007-01-26 WO PCT/JP2007/051234 patent/WO2007108228A1/ja active Application Filing
- 2007-01-30 TW TW096103323A patent/TW200737371A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI563579B (en) * | 2013-11-28 | 2016-12-21 | Towa Corp | Method and apparatus for supplying resin material of compression molding apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP2006896A1 (en) | 2008-12-24 |
KR20110039359A (ko) | 2011-04-15 |
JP2007251094A (ja) | 2007-09-27 |
US20090162467A1 (en) | 2009-06-25 |
CN101405854B (zh) | 2010-10-06 |
KR20080078639A (ko) | 2008-08-27 |
WO2007108228A1 (ja) | 2007-09-27 |
TWI346365B (zh) | 2011-08-01 |
KR101192547B1 (ko) | 2012-10-17 |
CN101405854A (zh) | 2009-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200737371A (en) | Resin sealing/molding apparatus | |
EP2017306A4 (en) | THERMOPLASTIC COMPOSITION, MANUFACTURING METHOD AND FORM BODY | |
EP1997852A4 (en) | POLY (PHENYLENE SULFIDE) RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND MOLDED ARTICLE | |
EP1502730A4 (en) | PREPREG, METHOD FOR THE PRODUCTION THEREOF AND FORM PART | |
EP1862491A4 (en) | THERMOPLASTIC RESIN, MANUFACTURING METHOD AND MATERIAL | |
EP1693403A4 (en) | THERMOPLASTIC RESIN COMPOSITION FOR MASTER MIXTURE, PROCESS FOR PRODUCING MOLDING MATERIAL CONTAINING THE SAME, THERMOPLASTIC RESIN COMPOSITION OBTAINED USING THE SAME, AND PROCESS FOR PRODUCING THE SAME | |
EP1988118A4 (en) | FIBER-REINFORCED THERMOPLASTIC RESIN MOLDING MATERIAL, MOLDING MATERIAL AND METHOD FOR PRODUCING THE MOLDED ARTICLE | |
EP1967498A4 (en) | METHOD FOR THE PRODUCTION OF MOLDED BODIES, CLOSURE ELEMENT AND SHAPING EQUIPMENT THEREWITH | |
TW200736035A (en) | Molding-system platen | |
EP2020283A4 (en) | MOLDING TOOL FOR FORMING THERMOPLASTIC RESIN, CAVITY MOLDING TOOL AND METHOD FOR PRODUCING HOLLOW MOLDING TOOL | |
EP1867680A4 (en) | RESIN COMPOSITION, MOLDED BODIES MADE THEREFROM AND METHOD FOR PRODUCING THE COMPOSITION AND THE SUBJECT MATTER | |
TW200734156A (en) | Encapsulating fibrous inserts with molding material | |
EP1932884A4 (en) | BIODEGRADABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE USING SUCH COMPOSITION | |
TW200706281A (en) | Molding device for manufacturing V-engine blocks | |
EP1865482A4 (en) | MOLDING LABEL IN MOLD AND MOLDING PRODUCT USING SAME | |
PL1737634T3 (pl) | Stanowisko do rozformowywania | |
MY138604A (en) | Two-sides in-mold decoration molding die and method of manufacturing a molded product with such molding die | |
WO2009022491A1 (ja) | 光素子の樹脂封止成形方法およびそれに用いられる装置 | |
AU2003285310A1 (en) | Polyamide molding material, molded articles that can be produced therefrom and the use thereof | |
DE602005027303D1 (de) | Thermoplastische Harzzusammensetzung, daraus hergestellter Formkörper und äussere Ueberzugsplatte für Vehikel, die diese geformten Produkte benutzen | |
TW200514678A (en) | Apparatus for compression molding articles made of plastics | |
ATE356170T1 (de) | Zusammensetzung eines thermoplastischen elastomers zum pulversintern, pulver und daraus geformter gegenstand | |
ATE227203T1 (de) | Verfahren und spritzgiessmaschine zum herstellen von spritzlingen, insbesondere von zahnbürstenkörpern oder zahnbürsten | |
TWI367905B (en) | Polyester resin, polyester molded product made thereof and process for producing the polyester molded product | |
SG119146A1 (en) | Polypropylene-based resin composition process for producing the same and injection molded article |