TW200736837A - Positive-type photoresist composition for circuit board, positive-type dry film for circuit board, and manufacturing method of circuit board using the same - Google Patents

Positive-type photoresist composition for circuit board, positive-type dry film for circuit board, and manufacturing method of circuit board using the same

Info

Publication number
TW200736837A
TW200736837A TW095146417A TW95146417A TW200736837A TW 200736837 A TW200736837 A TW 200736837A TW 095146417 A TW095146417 A TW 095146417A TW 95146417 A TW95146417 A TW 95146417A TW 200736837 A TW200736837 A TW 200736837A
Authority
TW
Taiwan
Prior art keywords
circuit board
positive
type
manufacturing
dry film
Prior art date
Application number
TW095146417A
Other languages
English (en)
Inventor
Genji Imai
Toshikazu Murayama
Harufumi Hagino
Original Assignee
Kansai Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005359156A external-priority patent/JP2007163767A/ja
Priority claimed from JP2005359234A external-priority patent/JP2007163772A/ja
Application filed by Kansai Paint Co Ltd filed Critical Kansai Paint Co Ltd
Publication of TW200736837A publication Critical patent/TW200736837A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
TW095146417A 2005-12-13 2006-12-12 Positive-type photoresist composition for circuit board, positive-type dry film for circuit board, and manufacturing method of circuit board using the same TW200736837A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005359156A JP2007163767A (ja) 2005-12-13 2005-12-13 回路基板用ポジ型レジスト組成物、回路基板用ポジ型ドライフィルム、及び、それを用いた回路基板の製造方法
JP2005359234A JP2007163772A (ja) 2005-12-13 2005-12-13 回路基板用ポジ型レジスト組成物、回路基板用ポジ型ドライフィルム、及び、それを用いた回路基板の製造方法

Publications (1)

Publication Number Publication Date
TW200736837A true TW200736837A (en) 2007-10-01

Family

ID=38162893

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095146417A TW200736837A (en) 2005-12-13 2006-12-12 Positive-type photoresist composition for circuit board, positive-type dry film for circuit board, and manufacturing method of circuit board using the same

Country Status (2)

Country Link
TW (1) TW200736837A (zh)
WO (1) WO2007069585A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10108091B2 (en) 2013-12-18 2018-10-23 Fujifilm Corporation Photosensitive transfer material, pattern formation method, and etching method
US10533088B2 (en) 2018-02-08 2020-01-14 Industrial Technology Research Institute Copolymer and resin composition including the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6650696B2 (ja) 2014-09-08 2020-02-19 信越化学工業株式会社 ドライフィルム積層体の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5077174A (en) * 1990-04-10 1991-12-31 E. I. Du Pont De Nemours And Company Positive working dry film element having a layer of resist composition
JP2824188B2 (ja) * 1993-04-23 1998-11-11 関西ペイント株式会社 感光性組成物及びパターンの製造方法
JPH11286535A (ja) * 1998-02-03 1999-10-19 Taiyo Ink Mfg Ltd 感光性・熱硬化性樹脂組成物及びそれを用いた樹脂絶縁パターンの形成方法
JP2004053617A (ja) * 2001-07-09 2004-02-19 Mitsui Chemicals Inc ポジ型感光性レジスト組成物およびその用途
WO2003006407A1 (fr) * 2001-07-13 2003-01-23 Kyowa Yuka Co., Ltd. Procédé de production de composé d'éther
JP3844069B2 (ja) * 2002-07-04 2006-11-08 信越化学工業株式会社 レジスト材料及びパターン形成方法
JP2004054106A (ja) * 2002-07-23 2004-02-19 Mitsubishi Chemicals Corp ポジ型感光性組成物、ポジ型感光性画像形成材及びそれを用いたポジ画像形成方法
CN1980962A (zh) * 2003-03-10 2007-06-13 三井化学株式会社 酸感应性共聚物及其用途
JP2005091433A (ja) * 2003-09-12 2005-04-07 Mitsui Chemicals Inc ポジ型感光性樹脂組成物、およびその用途
JP2006003861A (ja) * 2004-05-19 2006-01-05 Mitsui Chemicals Inc ポジ型感光性レジスト組成物およびその製造方法
KR100900610B1 (ko) * 2004-07-22 2009-06-02 간사이 페인트 가부시키가이샤 근적외선 활성형 포지티브형 레지스트 조성물 및 그 패턴의 형성방법
JP2006178423A (ja) * 2004-11-25 2006-07-06 Kyowa Hakko Chemical Co Ltd 化学増幅ポジ型レジスト組成物
JPWO2006115117A1 (ja) * 2005-04-20 2008-12-18 関西ペイント株式会社 記録媒体原盤用ポジ型レジスト組成物、並びに、それを用いた記録媒体原盤の製造方法及びスタンパの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10108091B2 (en) 2013-12-18 2018-10-23 Fujifilm Corporation Photosensitive transfer material, pattern formation method, and etching method
TWI660237B (zh) * 2013-12-18 2019-05-21 富士軟片股份有限公司 感光性轉印材料、圖案形成方法及蝕刻方法
TWI666519B (zh) * 2013-12-18 2019-07-21 日商富士軟片股份有限公司 感光性轉印材料、圖案形成方法及蝕刻方法
US10533088B2 (en) 2018-02-08 2020-01-14 Industrial Technology Research Institute Copolymer and resin composition including the same

Also Published As

Publication number Publication date
WO2007069585A1 (ja) 2007-06-21

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