TW200735991A - Method and apparatus for bonding electronic elements to substrate using laser beam - Google Patents

Method and apparatus for bonding electronic elements to substrate using laser beam

Info

Publication number
TW200735991A
TW200735991A TW096109254A TW96109254A TW200735991A TW 200735991 A TW200735991 A TW 200735991A TW 096109254 A TW096109254 A TW 096109254A TW 96109254 A TW96109254 A TW 96109254A TW 200735991 A TW200735991 A TW 200735991A
Authority
TW
Taiwan
Prior art keywords
substrate
laser beam
electronic element
connecting medium
electronic elements
Prior art date
Application number
TW096109254A
Other languages
English (en)
Inventor
Gi-Jung Nam
No-Heung Kwak
Original Assignee
Jet Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jet Tech Ltd filed Critical Jet Tech Ltd
Publication of TW200735991A publication Critical patent/TW200735991A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/19—Arrangements of transmitters, receivers, or complete sets to prevent eavesdropping, to attenuate local noise or to prevent undesired transmission; Mouthpieces or receivers specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Semiconductor Lasers (AREA)
TW096109254A 2006-03-20 2007-03-19 Method and apparatus for bonding electronic elements to substrate using laser beam TW200735991A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060025205A KR100777575B1 (ko) 2006-03-20 2006-03-20 레이저를 이용한 전자부품의 접속 방법 및 장치

Publications (1)

Publication Number Publication Date
TW200735991A true TW200735991A (en) 2007-10-01

Family

ID=38516697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109254A TW200735991A (en) 2006-03-20 2007-03-19 Method and apparatus for bonding electronic elements to substrate using laser beam

Country Status (4)

Country Link
US (1) US20070215584A1 (zh)
JP (1) JP2007258699A (zh)
KR (1) KR100777575B1 (zh)
TW (1) TW200735991A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106507594A (zh) * 2016-11-24 2017-03-15 武汉华星光电技术有限公司 压合设备及基板与外接电路的绑定方法
CN108702845A (zh) * 2016-03-25 2018-10-23 迪睿合株式会社 连接结构体的制造方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5214345B2 (ja) * 2008-06-24 2013-06-19 ヤマハ発動機株式会社 レーザーリフロー方法および装置
CN103157860A (zh) * 2011-12-08 2013-06-19 祐旸股份有限公司 热压机多段压力控制方法
US9318134B2 (en) * 2012-06-01 2016-04-19 Seagate Technology Llc Attaching optical components using homogenized laser light
CN107409470B (zh) * 2015-03-26 2019-07-30 迪睿合株式会社 挠性安装模块体的制造方法
KR20180137888A (ko) * 2017-06-20 2018-12-28 주식회사 프로텍 반도체 칩 본딩 장치 및 반도체 칩 본딩 방법
KR102410948B1 (ko) 2017-09-29 2022-06-20 삼성전자주식회사 반도체 칩 접합용 지그, 이러한 지그를 포함하는 반도체 칩의 접합 장치 및 이 장치를 이용한 반도체 칩의 접합 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970365A (en) * 1989-09-28 1990-11-13 International Business Machines Corporation Method and apparatus for bonding components leads to pads located on a non-rigid substrate
US5500503A (en) * 1994-08-04 1996-03-19 Midwest Research Institute Simultaneous laser cutting and welding of metal foil to edge of a plate
DE19504967C2 (de) * 1995-02-15 2002-01-24 Fraunhofer Ges Forschung Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip
JP3285294B2 (ja) * 1995-08-08 2002-05-27 太陽誘電株式会社 回路モジュールの製造方法
JPH10209689A (ja) * 1997-01-20 1998-08-07 Taiyo Yuden Co Ltd 回路モジュールの製造方法
US5948286A (en) * 1997-02-06 1999-09-07 International Business Machines Corporation Diffusion bonding of lead interconnections using precise laser-thermosonic energy
KR100446052B1 (ko) * 1997-05-15 2004-10-14 스미도모쥬기가이고교 가부시키가이샤 다수의갈바노스캐너를사용한레이저빔가공장치
ATE192692T1 (de) * 1999-01-28 2000-05-15 Leister Process Tech Laserfügeverfahren und vorrichtung zum verbinden von verschiedenen werkstücken aus kunststoff oder kunststoff mit anderen materialien
KR20020051304A (ko) * 1999-08-28 2002-06-29 가나이 쓰도무 전자 회로 기판의 제조 장치
KR101012701B1 (ko) * 2002-11-25 2011-02-09 삼성테크윈 주식회사 반도체 패키지와 그의 제조방법
JP2005038891A (ja) * 2003-07-15 2005-02-10 Matsushita Electric Ind Co Ltd 半導体製品の製造方法および回路基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108702845A (zh) * 2016-03-25 2018-10-23 迪睿合株式会社 连接结构体的制造方法
CN108702845B (zh) * 2016-03-25 2021-04-06 迪睿合株式会社 连接结构体的制造方法
CN106507594A (zh) * 2016-11-24 2017-03-15 武汉华星光电技术有限公司 压合设备及基板与外接电路的绑定方法

Also Published As

Publication number Publication date
JP2007258699A (ja) 2007-10-04
KR100777575B1 (ko) 2007-11-16
KR20070095038A (ko) 2007-09-28
US20070215584A1 (en) 2007-09-20

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