DE60214202D1 - Verfahren zum kleben von substraten unter verwendung einer uv-aktivierbaren klebfolie, sowie eine uv- bestrahlungsvorrichtung. - Google Patents

Verfahren zum kleben von substraten unter verwendung einer uv-aktivierbaren klebfolie, sowie eine uv- bestrahlungsvorrichtung.

Info

Publication number
DE60214202D1
DE60214202D1 DE60214202T DE60214202T DE60214202D1 DE 60214202 D1 DE60214202 D1 DE 60214202D1 DE 60214202 T DE60214202 T DE 60214202T DE 60214202 T DE60214202 T DE 60214202T DE 60214202 D1 DE60214202 D1 DE 60214202D1
Authority
DE
Germany
Prior art keywords
adhesive film
substrates
activated
irradiator
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60214202T
Other languages
English (en)
Other versions
DE60214202T2 (de
Inventor
Hiroaki Yamaguchi
Tetsu Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of DE60214202D1 publication Critical patent/DE60214202D1/de
Publication of DE60214202T2 publication Critical patent/DE60214202T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE60214202T 2001-06-19 2002-05-24 Verfahren zum kleben von substraten unter verwendung einer uv-aktivierbaren klebfolie, sowie eine uv- bestrahlungsvorrichtung. Expired - Lifetime DE60214202T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001185399 2001-06-19
JP2001185399A JP2003020452A (ja) 2001-06-19 2001-06-19 紫外線活性化型接着フィルムを用いた基材接着方法及び紫外線照射装置
PCT/US2002/016506 WO2002102911A1 (en) 2001-06-19 2002-05-24 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus

Publications (2)

Publication Number Publication Date
DE60214202D1 true DE60214202D1 (de) 2006-10-05
DE60214202T2 DE60214202T2 (de) 2007-08-23

Family

ID=19024989

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60214202T Expired - Lifetime DE60214202T2 (de) 2001-06-19 2002-05-24 Verfahren zum kleben von substraten unter verwendung einer uv-aktivierbaren klebfolie, sowie eine uv- bestrahlungsvorrichtung.

Country Status (7)

Country Link
EP (1) EP1425358B1 (de)
JP (1) JP2003020452A (de)
KR (1) KR100848410B1 (de)
CN (1) CN1279134C (de)
AT (1) ATE337380T1 (de)
DE (1) DE60214202T2 (de)
WO (1) WO2002102911A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235593B2 (en) * 2003-08-04 2007-06-26 Rensselaer Polytechnic Institute Command-cure adhesives
TWI268182B (en) 2006-01-27 2006-12-11 Daxon Tech Inc Optical coating equipment and ultraviolet irradiative device
DE102007033214B4 (de) * 2006-08-29 2017-09-14 Robert Bosch Gmbh Verfahren zur Herstellung eines Elektromotors
KR101014822B1 (ko) * 2010-07-09 2011-02-15 주식회사 애니 테이프 친환경 자외선 핫멜트 테이프 및 그 제조방법
CN102173250B (zh) * 2011-01-30 2013-03-13 焦作市卓立烫印材料有限公司 一种热转印导电箔及其制备方法
CN103842864B (zh) * 2011-10-04 2017-03-08 住友化学株式会社 偏振板的制造方法
JP5809123B2 (ja) * 2011-10-07 2015-11-10 住友化学株式会社 偏光板の製造方法
KR20150067219A (ko) * 2012-09-29 2015-06-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착제 조성물 및 접착 테이프
CN104910843A (zh) * 2014-03-12 2015-09-16 东莞新科技术研究开发有限公司 可阳离子固化的粘接剂及其应用
JP2016118804A (ja) * 2016-02-26 2016-06-30 住友化学株式会社 偏光板の製造方法
EP3252088B1 (de) 2016-05-31 2018-07-04 Henkel AG & Co. KGaA Durch mitteldruck-quecksilberglühlampen uv-gehärteter, kationischer druckempfindlicher haftkleber
CN111094486B (zh) * 2017-09-11 2022-10-04 昭和电工材料株式会社 粘接剂膜收纳组件及其制造方法
JP2020204700A (ja) * 2019-06-17 2020-12-24 日東電工株式会社 積層偏光フィルムの製造方法及び積層偏光フィルムの製造装置
CN114958073B (zh) * 2022-05-16 2023-03-24 深圳九星印刷包装集团有限公司 一种紫外辐射指示油墨及紫外辐射指示装置
CN117074423B (zh) * 2023-10-16 2023-12-12 江苏图恩视觉科技有限公司 一种薄膜缺陷检测系统及其工作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04150974A (ja) * 1990-10-09 1992-05-25 Three Bond Co Ltd 粘着層の形成方法
JPH11181391A (ja) * 1997-12-22 1999-07-06 Nippon Kayaku Co Ltd 接着剤組成物、接着体、接着方法及び光ディスクの製造方法
JP2000017242A (ja) * 1998-06-29 2000-01-18 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物、熱圧着性フィルムおよびホットメルト接着剤組成物を用いた接着方法
JP2001007128A (ja) * 1999-04-22 2001-01-12 Sharp Corp 基板間の接続方法及び基板間接続装置

Also Published As

Publication number Publication date
DE60214202T2 (de) 2007-08-23
JP2003020452A (ja) 2003-01-24
ATE337380T1 (de) 2006-09-15
KR20040030680A (ko) 2004-04-09
EP1425358B1 (de) 2006-08-23
KR100848410B1 (ko) 2008-07-28
CN1516727A (zh) 2004-07-28
WO2002102911A1 (en) 2002-12-27
EP1425358A1 (de) 2004-06-09
CN1279134C (zh) 2006-10-11

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