TW200731380A - Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus - Google Patents

Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus

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Publication number
TW200731380A
TW200731380A TW095112643A TW95112643A TW200731380A TW 200731380 A TW200731380 A TW 200731380A TW 095112643 A TW095112643 A TW 095112643A TW 95112643 A TW95112643 A TW 95112643A TW 200731380 A TW200731380 A TW 200731380A
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
sided grinding
double
wafer
periphery
Prior art date
Application number
TW095112643A
Other languages
English (en)
Chinese (zh)
Other versions
TWI353633B (enExample
Inventor
Kimiyasu Futamura
Original Assignee
Komatsu Denshi Kinzoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Denshi Kinzoku Kk filed Critical Komatsu Denshi Kinzoku Kk
Publication of TW200731380A publication Critical patent/TW200731380A/zh
Application granted granted Critical
Publication of TWI353633B publication Critical patent/TWI353633B/zh

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW095112643A 2005-05-25 2006-04-10 Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus TW200731380A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005152882A JP4798480B2 (ja) 2005-05-25 2005-05-25 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置

Publications (2)

Publication Number Publication Date
TW200731380A true TW200731380A (en) 2007-08-16
TWI353633B TWI353633B (enExample) 2011-12-01

Family

ID=37553665

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112643A TW200731380A (en) 2005-05-25 2006-04-10 Semiconductor wafer manufacturing method, semiconductor wafer double-sided grinding method, and semiconductor wafer double-sided grinding apparatus

Country Status (2)

Country Link
JP (1) JP4798480B2 (enExample)
TW (1) TW200731380A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422465B (zh) * 2008-02-14 2014-01-11 Shinetsu Handotai Kk Double - sided grinding of workpiece and double - sided grinding of workpiece
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114986381A (zh) * 2022-06-16 2022-09-02 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780142B2 (ja) * 2008-05-22 2011-09-28 信越半導体株式会社 ウェーハの製造方法
DE102009025243B4 (de) * 2009-06-17 2011-11-17 Siltronic Ag Verfahren zur Herstellung und Verfahren zur Bearbeitung einer Halbleiterscheibe aus Silicium
JP2011131284A (ja) * 2009-12-22 2011-07-07 Disco Abrasive Syst Ltd 研削装置
JP2013045909A (ja) * 2011-08-25 2013-03-04 Sumco Corp 半導体ウェーハの製造方法
JP5872947B2 (ja) 2012-04-05 2016-03-01 光洋機械工業株式会社 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤
CN109360852A (zh) * 2018-08-14 2019-02-19 上海芯石微电子有限公司 一种降低芯片减薄碎片率的硅片倒角结构及方法
CN114734319B (zh) * 2022-03-20 2023-08-22 深圳市陆和神州科技有限公司 一种半导体材料处理系统及方法
CN114770366B (zh) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 一种硅片双面研磨装置的静压板及硅片双面研磨装置
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN115972078A (zh) * 2022-12-27 2023-04-18 西安奕斯伟材料科技股份有限公司 一种用于对硅片进行双面研磨的装置及方法
CN120715743A (zh) * 2025-04-18 2025-09-30 浙江求是半导体设备有限公司 一种晶圆双面减薄方法和系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11154655A (ja) * 1997-11-21 1999-06-08 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法
JPH11267964A (ja) * 1998-03-20 1999-10-05 Speedfam Co Ltd 平面研磨装置及びそれに用いるキャリヤ
JP2000135670A (ja) * 1998-10-30 2000-05-16 Okamoto Machine Tool Works Ltd ウエハの化学機械研磨方法
JP3951496B2 (ja) * 1999-03-30 2007-08-01 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP2002217147A (ja) * 2001-01-16 2002-08-02 Tokyo Seimitsu Co Ltd ウェーハ研磨装置のウェーハ回収方法及び装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422465B (zh) * 2008-02-14 2014-01-11 Shinetsu Handotai Kk Double - sided grinding of workpiece and double - sided grinding of workpiece
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114986381A (zh) * 2022-06-16 2022-09-02 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法

Also Published As

Publication number Publication date
JP2006332281A (ja) 2006-12-07
JP4798480B2 (ja) 2011-10-19
TWI353633B (enExample) 2011-12-01

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