TW200731335A - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method

Info

Publication number
TW200731335A
TW200731335A TW095138405A TW95138405A TW200731335A TW 200731335 A TW200731335 A TW 200731335A TW 095138405 A TW095138405 A TW 095138405A TW 95138405 A TW95138405 A TW 95138405A TW 200731335 A TW200731335 A TW 200731335A
Authority
TW
Taiwan
Prior art keywords
exposure apparatus
substrate
liquid
device manufacturing
gas
Prior art date
Application number
TW095138405A
Other languages
English (en)
Chinese (zh)
Inventor
Noriyasu Hasegawa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200731335A publication Critical patent/TW200731335A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095138405A 2005-10-18 2006-10-18 Exposure apparatus and device manufacturing method TW200731335A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302577 2005-10-18
JP2006219032A JP2007142366A (ja) 2005-10-18 2006-08-10 露光装置及びデバイス製造方法

Publications (1)

Publication Number Publication Date
TW200731335A true TW200731335A (en) 2007-08-16

Family

ID=37962610

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138405A TW200731335A (en) 2005-10-18 2006-10-18 Exposure apparatus and device manufacturing method

Country Status (5)

Country Link
US (1) US7907251B2 (https=)
JP (1) JP2007142366A (https=)
KR (1) KR20080022201A (https=)
TW (1) TW200731335A (https=)
WO (1) WO2007046523A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4677986B2 (ja) 2004-04-19 2011-04-27 株式会社ニコン ノズル部材、露光方法、露光装置及びデバイス製造方法
TWI439813B (zh) * 2006-05-10 2014-06-01 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
US8289497B2 (en) 2008-03-18 2012-10-16 Nikon Corporation Apparatus and methods for recovering fluid in immersion lithography
NL1036631A1 (nl) 2008-03-24 2009-09-25 Asml Netherlands Bv Immersion Lithographic Apparatus and Device Manufacturing Method.
WO2010103822A1 (ja) 2009-03-10 2010-09-16 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
JP5016705B2 (ja) 2009-06-09 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． 流体ハンドリング構造
NL2005089A (nl) 2009-09-23 2011-03-28 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2005655A (en) * 2009-12-09 2011-06-14 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2006054A (en) 2010-02-09 2011-08-10 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
EP2381310B1 (en) * 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
NL2007182A (en) * 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
EP2423749B1 (en) 2010-08-24 2013-09-11 ASML Netherlands BV A lithographic apparatus and device manufacturing method
NL2007453A (en) 2010-10-18 2012-04-19 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008199A (en) 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008979A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
US9256137B2 (en) * 2011-08-25 2016-02-09 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US20130050666A1 (en) * 2011-08-26 2013-02-28 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
NL2009271A (en) * 2011-09-15 2013-03-18 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009378A (en) 2011-10-07 2013-04-09 Asml Netherlands Bv Lithographic apparatus and method of cooling a component in a lithographic apparatus.
NL2009899A (en) * 2011-12-20 2013-06-24 Asml Netherlands Bv A pump system, a carbon dioxide supply system, an extraction system, a lithographic apparatus and a device manufacturing method.
CN107106938B (zh) 2014-12-19 2019-06-18 Asml荷兰有限公司 流体处理结构、光刻设备和器件制造方法
JP6503606B2 (ja) * 2015-10-29 2019-04-24 国立研究開発法人産業技術総合研究所 インプリント装置
KR102256686B1 (ko) 2016-12-14 2021-05-26 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10503085B2 (en) * 2017-11-16 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Lithography apparatus and method
JP7166089B2 (ja) * 2018-06-29 2022-11-07 東京エレクトロン株式会社 基板処理装置、基板処理システムおよび基板処理方法
CN114402263A (zh) 2019-09-13 2022-04-26 Asml荷兰有限公司 流体处置系统和光刻设备
CN112684665B (zh) * 2020-12-25 2024-06-25 浙江启尔机电技术有限公司 一种浸液供给回收装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN100370533C (zh) 2002-12-13 2008-02-20 皇家飞利浦电子股份有限公司 用于照射层的方法和用于将辐射导向层的装置
KR101345474B1 (ko) * 2003-03-25 2013-12-27 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR20110104084A (ko) * 2003-04-09 2011-09-21 가부시키가이샤 니콘 액침 리소그래피 유체 제어 시스템
EP1498778A1 (en) * 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352433B2 (en) * 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005183744A (ja) * 2003-12-22 2005-07-07 Nikon Corp 露光装置及びデバイス製造方法
CN1938646B (zh) * 2004-01-20 2010-12-15 卡尔蔡司Smt股份公司 曝光装置和用于投影透镜的测量装置
JP5040646B2 (ja) 2005-03-23 2012-10-03 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法

Also Published As

Publication number Publication date
US20090122283A1 (en) 2009-05-14
WO2007046523A1 (en) 2007-04-26
JP2007142366A (ja) 2007-06-07
US7907251B2 (en) 2011-03-15
KR20080022201A (ko) 2008-03-10

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