KR20080022201A - 노광장치 및 디바이스의 제조방법 - Google Patents
노광장치 및 디바이스의 제조방법 Download PDFInfo
- Publication number
- KR20080022201A KR20080022201A KR1020087001419A KR20087001419A KR20080022201A KR 20080022201 A KR20080022201 A KR 20080022201A KR 1020087001419 A KR1020087001419 A KR 1020087001419A KR 20087001419 A KR20087001419 A KR 20087001419A KR 20080022201 A KR20080022201 A KR 20080022201A
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- liquid
- supply port
- gas supply
- exposure apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2005-00302577 | 2005-10-18 | ||
| JP2005302577 | 2005-10-18 | ||
| JP2006219032A JP2007142366A (ja) | 2005-10-18 | 2006-08-10 | 露光装置及びデバイス製造方法 |
| JPJP-P-2006-00219032 | 2006-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080022201A true KR20080022201A (ko) | 2008-03-10 |
Family
ID=37962610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087001419A Abandoned KR20080022201A (ko) | 2005-10-18 | 2006-10-17 | 노광장치 및 디바이스의 제조방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7907251B2 (https=) |
| JP (1) | JP2007142366A (https=) |
| KR (1) | KR20080022201A (https=) |
| TW (1) | TW200731335A (https=) |
| WO (1) | WO2007046523A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101256403B1 (ko) * | 2010-04-22 | 2013-04-25 | 에이에스엠엘 네델란즈 비.브이. | 유체 핸들링 구조, 리소그래피 장치 및 디바이스 제조 방법 |
| KR101476351B1 (ko) * | 2011-10-07 | 2014-12-24 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 리소그래피 장치의 구성요소를 냉각하는 방법 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4677986B2 (ja) | 2004-04-19 | 2011-04-27 | 株式会社ニコン | ノズル部材、露光方法、露光装置及びデバイス製造方法 |
| TWI439813B (zh) * | 2006-05-10 | 2014-06-01 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
| US8289497B2 (en) | 2008-03-18 | 2012-10-16 | Nikon Corporation | Apparatus and methods for recovering fluid in immersion lithography |
| NL1036631A1 (nl) | 2008-03-24 | 2009-09-25 | Asml Netherlands Bv | Immersion Lithographic Apparatus and Device Manufacturing Method. |
| WO2010103822A1 (ja) | 2009-03-10 | 2010-09-16 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
| JP5016705B2 (ja) | 2009-06-09 | 2012-09-05 | エーエスエムエル ネザーランズ ビー.ブイ. | 流体ハンドリング構造 |
| NL2005089A (nl) | 2009-09-23 | 2011-03-28 | Asml Netherlands Bv | Fluid handling structure, lithographic apparatus and device manufacturing method. |
| NL2005655A (en) * | 2009-12-09 | 2011-06-14 | Asml Netherlands Bv | A lithographic apparatus and a device manufacturing method. |
| NL2006054A (en) | 2010-02-09 | 2011-08-10 | Asml Netherlands Bv | Fluid handling structure, lithographic apparatus and device manufacturing method. |
| NL2007182A (en) * | 2010-08-23 | 2012-02-27 | Asml Netherlands Bv | Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method. |
| EP2423749B1 (en) | 2010-08-24 | 2013-09-11 | ASML Netherlands BV | A lithographic apparatus and device manufacturing method |
| NL2007453A (en) | 2010-10-18 | 2012-04-19 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| NL2008199A (en) | 2011-02-28 | 2012-08-29 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| NL2008979A (en) | 2011-07-11 | 2013-01-14 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| US9256137B2 (en) * | 2011-08-25 | 2016-02-09 | Nikon Corporation | Exposure apparatus, liquid holding method, and device manufacturing method |
| US20130050666A1 (en) * | 2011-08-26 | 2013-02-28 | Nikon Corporation | Exposure apparatus, liquid holding method, and device manufacturing method |
| NL2009271A (en) * | 2011-09-15 | 2013-03-18 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| NL2009899A (en) * | 2011-12-20 | 2013-06-24 | Asml Netherlands Bv | A pump system, a carbon dioxide supply system, an extraction system, a lithographic apparatus and a device manufacturing method. |
| CN107106938B (zh) | 2014-12-19 | 2019-06-18 | Asml荷兰有限公司 | 流体处理结构、光刻设备和器件制造方法 |
| JP6503606B2 (ja) * | 2015-10-29 | 2019-04-24 | 国立研究開発法人産業技術総合研究所 | インプリント装置 |
| KR102256686B1 (ko) | 2016-12-14 | 2021-05-26 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 디바이스 제조 방법 |
| US10503085B2 (en) * | 2017-11-16 | 2019-12-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography apparatus and method |
| JP7166089B2 (ja) * | 2018-06-29 | 2022-11-07 | 東京エレクトロン株式会社 | 基板処理装置、基板処理システムおよび基板処理方法 |
| CN114402263A (zh) | 2019-09-13 | 2022-04-26 | Asml荷兰有限公司 | 流体处置系统和光刻设备 |
| CN112684665B (zh) * | 2020-12-25 | 2024-06-25 | 浙江启尔机电技术有限公司 | 一种浸液供给回收装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049504A1 (fr) | 1998-03-26 | 1999-09-30 | Nikon Corporation | Procede et systeme d'exposition par projection |
| SG135052A1 (en) | 2002-11-12 | 2007-09-28 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| CN100370533C (zh) | 2002-12-13 | 2008-02-20 | 皇家飞利浦电子股份有限公司 | 用于照射层的方法和用于将辐射导向层的装置 |
| KR101345474B1 (ko) * | 2003-03-25 | 2013-12-27 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
| KR20110104084A (ko) * | 2003-04-09 | 2011-09-21 | 가부시키가이샤 니콘 | 액침 리소그래피 유체 제어 시스템 |
| EP1498778A1 (en) * | 2003-06-27 | 2005-01-19 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7352433B2 (en) * | 2003-10-28 | 2008-04-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2005183744A (ja) * | 2003-12-22 | 2005-07-07 | Nikon Corp | 露光装置及びデバイス製造方法 |
| CN1938646B (zh) * | 2004-01-20 | 2010-12-15 | 卡尔蔡司Smt股份公司 | 曝光装置和用于投影透镜的测量装置 |
| JP5040646B2 (ja) | 2005-03-23 | 2012-10-03 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
-
2006
- 2006-08-10 JP JP2006219032A patent/JP2007142366A/ja not_active Withdrawn
- 2006-10-17 WO PCT/JP2006/321001 patent/WO2007046523A1/en not_active Ceased
- 2006-10-17 KR KR1020087001419A patent/KR20080022201A/ko not_active Abandoned
- 2006-10-17 US US11/994,240 patent/US7907251B2/en not_active Expired - Fee Related
- 2006-10-18 TW TW095138405A patent/TW200731335A/zh unknown
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101256403B1 (ko) * | 2010-04-22 | 2013-04-25 | 에이에스엠엘 네델란즈 비.브이. | 유체 핸들링 구조, 리소그래피 장치 및 디바이스 제조 방법 |
| US9256136B2 (en) | 2010-04-22 | 2016-02-09 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply |
| US9846372B2 (en) | 2010-04-22 | 2017-12-19 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
| US10209624B2 (en) | 2010-04-22 | 2019-02-19 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
| US10620544B2 (en) | 2010-04-22 | 2020-04-14 | Asml Netherlands B.V. | Fluid handling structure, lithographic apparatus and device manufacturing method |
| KR101476351B1 (ko) * | 2011-10-07 | 2014-12-24 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 리소그래피 장치의 구성요소를 냉각하는 방법 |
| US9811007B2 (en) | 2011-10-07 | 2017-11-07 | Asml Netherlands B.V. | Lithographic apparatus and method of cooling a component in a lithographic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090122283A1 (en) | 2009-05-14 |
| WO2007046523A1 (en) | 2007-04-26 |
| JP2007142366A (ja) | 2007-06-07 |
| US7907251B2 (en) | 2011-03-15 |
| TW200731335A (en) | 2007-08-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |
St.27 status event code: A-2-2-U10-U14-oth-PC1904 St.27 status event code: N-2-6-B10-B12-nap-PC1904 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |