TW200725767A - Wire bonding apparatus, recording media with connecting control program and the connecting method - Google Patents

Wire bonding apparatus, recording media with connecting control program and the connecting method

Info

Publication number
TW200725767A
TW200725767A TW095137271A TW95137271A TW200725767A TW 200725767 A TW200725767 A TW 200725767A TW 095137271 A TW095137271 A TW 095137271A TW 95137271 A TW95137271 A TW 95137271A TW 200725767 A TW200725767 A TW 200725767A
Authority
TW
Taiwan
Prior art keywords
adhering
connecting point
adhering test
procedure
type
Prior art date
Application number
TW095137271A
Other languages
English (en)
Chinese (zh)
Other versions
TWI369745B (ko
Inventor
Sen-Jie Zheng
Original Assignee
Shinkawa Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kabushiki Kaisha filed Critical Shinkawa Kabushiki Kaisha
Publication of TW200725767A publication Critical patent/TW200725767A/zh
Application granted granted Critical
Publication of TWI369745B publication Critical patent/TWI369745B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
TW095137271A 2005-12-28 2006-10-11 Wire bonding apparatus, recording media with connecting control program and the connecting method TW200725767A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005378451A JP4547330B2 (ja) 2005-12-28 2005-12-28 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法

Publications (2)

Publication Number Publication Date
TW200725767A true TW200725767A (en) 2007-07-01
TWI369745B TWI369745B (ko) 2012-08-01

Family

ID=38305233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137271A TW200725767A (en) 2005-12-28 2006-10-11 Wire bonding apparatus, recording media with connecting control program and the connecting method

Country Status (4)

Country Link
US (1) US7699209B2 (ko)
JP (1) JP4547330B2 (ko)
KR (1) KR100841263B1 (ko)
TW (1) TW200725767A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104037099A (zh) * 2013-03-04 2014-09-10 库利克和索夫工业公司 在焊线操作中未粘接状况下的自动返工过程
CN104813457A (zh) * 2012-11-16 2015-07-29 株式会社新川 打线装置以及打线方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
US7896218B2 (en) * 2007-06-28 2011-03-01 Western Digital Technologies, Inc. Apparatus and method for conductive metal ball bonding with electrostatic discharge detection
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
JP2010056106A (ja) * 2008-08-26 2010-03-11 Nec Electronics Corp ワイヤボンディング装置、これを用いたワイヤボンディング方法
US8096462B2 (en) * 2009-04-30 2012-01-17 International Business Machines Corporation Method of reworking electrical short in ultra sonic bonder
US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps
US9217759B2 (en) * 2011-12-23 2015-12-22 Sendyne Corporation Current shunt
US9314869B2 (en) * 2012-01-13 2016-04-19 Asm Technology Singapore Pte. Ltd. Method of recovering a bonding apparatus from a bonding failure
US20140076956A1 (en) * 2012-09-20 2014-03-20 Tyco Electronics Corporation Soldering machine and method of soldering
US9165842B2 (en) * 2014-01-15 2015-10-20 Kulicke And Soffa Industries, Inc. Short tail recovery techniques in wire bonding operations
US9461013B2 (en) * 2014-11-21 2016-10-04 Asm Technology Singapore Pte Ltd Wire spool system for a wire bonding apparatus
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
TWI639202B (zh) * 2016-03-25 2018-10-21 日商新川股份有限公司 打線裝置、打線裝置用電路及半導體裝置之製造方法
US10755988B2 (en) 2018-06-29 2020-08-25 Kulicke And Soffa, Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
CN113252699B (zh) * 2021-06-28 2021-11-30 武汉飞恩微电子有限公司 用于压力传感器的故障诊断方法、装置、设备及存储介质

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144531A (ja) * 1986-12-03 1988-06-16 ビユ−・エンジニアリング・インコ−ポレ−テツド 半導体装置の撮像検査装置
JPH0212932A (ja) 1988-06-30 1990-01-17 Mitsubishi Electric Corp ワイヤボンディング装置
JPH0294454A (ja) * 1988-09-30 1990-04-05 Hitachi Ltd ボンデイング検査方法
JP2617351B2 (ja) * 1989-05-15 1997-06-04 株式会社新川 ワイヤ接続不良検出方法
JP2914850B2 (ja) * 1993-07-16 1999-07-05 株式会社カイジョー ワイヤボンディング装置及びその方法
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3009564B2 (ja) * 1993-07-16 2000-02-14 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3178567B2 (ja) * 1993-07-16 2001-06-18 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3041812B2 (ja) 1993-09-21 2000-05-15 株式会社新川 ワイヤボンデイング装置
JP3370553B2 (ja) * 1997-05-07 2003-01-27 株式会社新川 ボンディング荷重の補正方法及びワイヤボンディング装置
JP3370556B2 (ja) * 1997-05-14 2003-01-27 株式会社新川 ワイヤボンディング装置及びその制御方法
JPH1114318A (ja) * 1997-06-23 1999-01-22 Murata Mfg Co Ltd 接触検査装置および接触検査方法
US6189765B1 (en) * 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
JP3566166B2 (ja) * 2000-02-10 2004-09-15 株式会社新川 ツール位置測定方法、オフセット測定方法、基準部材およびボンディング装置
TW522532B (en) * 2000-11-07 2003-03-01 Siliconware Precision Industries Co Ltd Schemes for detecting bonding status of bonding wire of semiconductor package
JP3813088B2 (ja) * 2001-12-28 2006-08-23 株式会社新川 ボンディング装置
US6808943B2 (en) * 2002-06-10 2004-10-26 Texas Instruments Incorporated Method of fabricating wire bond integrity test system
US7481351B2 (en) * 2003-12-23 2009-01-27 Samsung Electronics Co., Ltd. Wire bonding apparatus and method for clamping a wire
JP2005236103A (ja) * 2004-02-20 2005-09-02 Shinkawa Ltd ワイヤボンディング装置
JP4098274B2 (ja) * 2004-05-18 2008-06-11 株式会社カイジョー ワイヤボンディング装置
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104813457A (zh) * 2012-11-16 2015-07-29 株式会社新川 打线装置以及打线方法
CN104813457B (zh) * 2012-11-16 2017-08-04 株式会社新川 打线装置以及打线方法
CN104037099A (zh) * 2013-03-04 2014-09-10 库利克和索夫工业公司 在焊线操作中未粘接状况下的自动返工过程

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