TW200722929A - Fabrication method for photomask, fabrication method for device and monitoring method for photomask - Google Patents
Fabrication method for photomask, fabrication method for device and monitoring method for photomaskInfo
- Publication number
- TW200722929A TW200722929A TW095110297A TW95110297A TW200722929A TW 200722929 A TW200722929 A TW 200722929A TW 095110297 A TW095110297 A TW 095110297A TW 95110297 A TW95110297 A TW 95110297A TW 200722929 A TW200722929 A TW 200722929A
- Authority
- TW
- Taiwan
- Prior art keywords
- photomask
- fabrication method
- fabrication
- formed over
- pattern
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005360526A JP4843304B2 (ja) | 2005-12-14 | 2005-12-14 | フォトマスクの製造方法、デバイスの製造方法、及び、フォトマスクのモニタ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200722929A true TW200722929A (en) | 2007-06-16 |
TWI322328B TWI322328B (en) | 2010-03-21 |
Family
ID=36499574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095110297A TWI322328B (en) | 2005-12-14 | 2006-03-24 | Fabrication method for photomask, fabrication method for device and monitoring method for photomask |
Country Status (7)
Country | Link |
---|---|
US (1) | US7666553B2 (zh) |
EP (1) | EP1798595B1 (zh) |
JP (1) | JP4843304B2 (zh) |
KR (1) | KR100782489B1 (zh) |
CN (1) | CN1983025B (zh) |
DE (1) | DE602006001193D1 (zh) |
TW (1) | TWI322328B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI414881B (zh) * | 2009-10-14 | 2013-11-11 | ||
TWI497191B (zh) * | 2010-09-30 | 2015-08-21 | Hoya Corp | 光罩基底、轉印用光罩、轉印用光罩之製造方法及半導體裝置之製造方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101688218B (zh) | 2007-06-21 | 2012-10-31 | 国立大学法人名古屋大学 | 向具有细胞壁的细胞导入外来物质的方法 |
US7812370B2 (en) | 2007-07-25 | 2010-10-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Tunnel field-effect transistor with narrow band-gap channel and strong gate coupling |
JP2009128618A (ja) * | 2007-11-22 | 2009-06-11 | Fujitsu Microelectronics Ltd | フォトマスク及びその製造方法 |
KR100980060B1 (ko) | 2008-06-20 | 2010-09-03 | 주식회사 하이닉스반도체 | 포토마스크 검사방법 |
US7834345B2 (en) * | 2008-09-05 | 2010-11-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Tunnel field-effect transistors with superlattice channels |
US8587075B2 (en) * | 2008-11-18 | 2013-11-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Tunnel field-effect transistor with metal source |
JP5666218B2 (ja) * | 2009-10-06 | 2015-02-12 | Hoya株式会社 | マスクブランク、転写用マスク、および転写用マスクセット |
JP5573306B2 (ja) * | 2010-03-31 | 2014-08-20 | 凸版印刷株式会社 | フォトマスクブランクの製造方法 |
CN102509726A (zh) * | 2011-11-14 | 2012-06-20 | 上海宏力半导体制造有限公司 | 具有加密结构的ip模块及其制造方法 |
KR102145884B1 (ko) | 2012-12-24 | 2020-08-20 | 삼성디스플레이 주식회사 | 레티클, 이를 포함하는 노광 장치, 및 노광 방법 |
JP6189242B2 (ja) * | 2014-03-28 | 2017-08-30 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク及び表示装置の製造方法 |
KR102606308B1 (ko) * | 2016-06-28 | 2023-11-24 | 삼성전자주식회사 | 포토 마스크의 제조 방법, 패턴 형성 방법 및 반도체 장치의 제조 방법 |
KR102504179B1 (ko) * | 2017-12-21 | 2023-02-28 | 에스케이하이닉스 주식회사 | 쉐이딩층을 내장한 포토 마스크 및 이를 이용한 패턴 형성 방법 |
JP7214593B2 (ja) * | 2019-08-13 | 2023-01-30 | キオクシア株式会社 | フォトマスクの製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100215850B1 (ko) | 1996-04-12 | 1999-08-16 | 구본준 | 하프톤 위상 반전 마스크 및_그제조방법 |
US6440613B1 (en) | 1999-09-02 | 2002-08-27 | Micron Technology, Inc. | Method of fabricating attenuated phase shift mask |
JP3715189B2 (ja) | 2000-09-21 | 2005-11-09 | 株式会社ルネサステクノロジ | 位相シフトマスク |
JP4053723B2 (ja) | 2000-09-27 | 2008-02-27 | 株式会社東芝 | 露光用マスクの製造方法 |
JP2002323746A (ja) * | 2001-04-24 | 2002-11-08 | Matsushita Electric Ind Co Ltd | 位相シフトマスク及び、それを用いたホールパターン形成方法 |
JP3650055B2 (ja) * | 2001-10-12 | 2005-05-18 | Hoya株式会社 | ハーフトーン型位相シフトマスクの修正方法 |
JP2003344987A (ja) | 2002-05-24 | 2003-12-03 | Sony Corp | 位相シフトマスクのひさし量測定方法 |
JP3793147B2 (ja) * | 2002-12-04 | 2006-07-05 | 株式会社東芝 | レチクルセット、レチクルセットの設計方法、露光モニタ方法、レチクルセットの検査方法及び半導体装置の製造方法 |
JP2004212482A (ja) | 2002-12-27 | 2004-07-29 | Fujitsu Ltd | フォトマスクの製造方法 |
JP4450743B2 (ja) * | 2005-02-08 | 2010-04-14 | 富士通マイクロエレクトロニクス株式会社 | フォトマスク、フォトマスクの製造方法及び半導体装置の製造方法 |
-
2005
- 2005-12-14 JP JP2005360526A patent/JP4843304B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-21 US US11/384,240 patent/US7666553B2/en not_active Expired - Fee Related
- 2006-03-23 EP EP06005944A patent/EP1798595B1/en not_active Expired - Fee Related
- 2006-03-23 DE DE602006001193T patent/DE602006001193D1/de active Active
- 2006-03-24 TW TW095110297A patent/TWI322328B/zh not_active IP Right Cessation
- 2006-04-11 KR KR1020060032779A patent/KR100782489B1/ko not_active IP Right Cessation
- 2006-04-13 CN CN2006100736218A patent/CN1983025B/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI414881B (zh) * | 2009-10-14 | 2013-11-11 | ||
TWI497191B (zh) * | 2010-09-30 | 2015-08-21 | Hoya Corp | 光罩基底、轉印用光罩、轉印用光罩之製造方法及半導體裝置之製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070063397A (ko) | 2007-06-19 |
US20070134562A1 (en) | 2007-06-14 |
DE602006001193D1 (de) | 2008-06-26 |
KR100782489B1 (ko) | 2007-12-05 |
CN1983025B (zh) | 2011-07-27 |
JP4843304B2 (ja) | 2011-12-21 |
US7666553B2 (en) | 2010-02-23 |
TWI322328B (en) | 2010-03-21 |
JP2007163867A (ja) | 2007-06-28 |
EP1798595A1 (en) | 2007-06-20 |
EP1798595B1 (en) | 2008-05-14 |
CN1983025A (zh) | 2007-06-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |