TWI366668B - Method of inspecting a pattern defect, pattern defect inspecting apparatus, method of producing a photomask, and method of producing a substrate for a display device - Google Patents

Method of inspecting a pattern defect, pattern defect inspecting apparatus, method of producing a photomask, and method of producing a substrate for a display device

Info

Publication number
TWI366668B
TWI366668B TW096120947A TW96120947A TWI366668B TW I366668 B TWI366668 B TW I366668B TW 096120947 A TW096120947 A TW 096120947A TW 96120947 A TW96120947 A TW 96120947A TW I366668 B TWI366668 B TW I366668B
Authority
TW
Taiwan
Prior art keywords
producing
pattern defect
inspecting
photomask
substrate
Prior art date
Application number
TW096120947A
Other languages
Chinese (zh)
Other versions
TW200811431A (en
Inventor
Yamaguchi Noboru
Nakanishi Katsuhiko
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200811431A publication Critical patent/TW200811431A/en
Application granted granted Critical
Publication of TWI366668B publication Critical patent/TWI366668B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
TW096120947A 2006-06-20 2007-06-11 Method of inspecting a pattern defect, pattern defect inspecting apparatus, method of producing a photomask, and method of producing a substrate for a display device TWI366668B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006170470 2006-06-20
JP2007133169A JP4949928B2 (en) 2006-06-20 2007-05-18 Pattern defect inspection method, pattern defect inspection apparatus, photomask product manufacturing method, and display device substrate manufacturing method

Publications (2)

Publication Number Publication Date
TW200811431A TW200811431A (en) 2008-03-01
TWI366668B true TWI366668B (en) 2012-06-21

Family

ID=39117066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096120947A TWI366668B (en) 2006-06-20 2007-06-11 Method of inspecting a pattern defect, pattern defect inspecting apparatus, method of producing a photomask, and method of producing a substrate for a display device

Country Status (3)

Country Link
JP (1) JP4949928B2 (en)
KR (1) KR101320183B1 (en)
TW (1) TWI366668B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI661191B (en) * 2017-10-12 2019-06-01 Kabushiki Kaisha Nihon Micronics Display panel inspection device and method for the inspection of display panels

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009121628A2 (en) * 2008-04-04 2009-10-08 Nanda Technologies Gmbh Optical inspection system and method
JP5685833B2 (en) * 2010-05-28 2015-03-18 凸版印刷株式会社 Periodic pattern inspection method
KR101246690B1 (en) * 2012-11-02 2013-03-25 주식회사 씨이텍 Apparatus for measuring thermal warpage
JP6386898B2 (en) * 2014-12-15 2018-09-05 株式会社ニューフレアテクノロジー Inspection method and inspection apparatus
JP6270288B2 (en) * 2016-01-29 2018-01-31 レーザーテック株式会社 Inspection apparatus, inspection method, contamination prevention structure, and exposure apparatus
KR102118789B1 (en) * 2018-04-27 2020-06-04 스텍 코 엘티디 Boundary detector of an optical inspection machine

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634560A (en) * 1992-07-21 1994-02-08 Canon Inc Surface condition inspector
JPH06180294A (en) * 1992-12-11 1994-06-28 Nikon Corp Defect inspection apparatus
JPH09166519A (en) * 1995-12-18 1997-06-24 Dainippon Screen Mfg Co Ltd Surface observation optical system
JP3981895B2 (en) * 1997-08-29 2007-09-26 株式会社ニコン Automatic macro inspection device
JPH1172444A (en) * 1997-08-29 1999-03-16 Nikon Corp Automatic scanning inspection apparatus
JP4021235B2 (en) * 2002-04-16 2007-12-12 Ｈｏｙａ株式会社 Gray-tone mask defect inspection method and defect inspection apparatus, and photomask defect inspection method and defect inspection apparatus
JP2005291874A (en) * 2004-03-31 2005-10-20 Hoya Corp Unevenness defect inspection method and device of pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI661191B (en) * 2017-10-12 2019-06-01 Kabushiki Kaisha Nihon Micronics Display panel inspection device and method for the inspection of display panels

Also Published As

Publication number Publication date
KR20070120899A (en) 2007-12-26
KR101320183B1 (en) 2013-10-22
TW200811431A (en) 2008-03-01
JP2008026306A (en) 2008-02-07
JP4949928B2 (en) 2012-06-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees