KR101246690B1 - Apparatus for measuring thermal warpage - Google Patents

Abstract

PURPOSE: An apparatus for measuring the thermal deformation of a semiconductor packaging product is provided to improve the precision of inspection by using a multi lens array module. CONSTITUTION: A heating apparatus changes the thermal property of a semiconductor packaging product. An elevating device moves the semiconductor packaging product. A multi lens array module(40) changes the light emitted from an illuminating device(30) into a multi-point beam. The multi lens array module irradiates the multi-point beam to the semiconductor packaging product. A camera(50) produces an image by using the multi-point beam.

Description

 Apparatus for measuring thermal warpage of semiconductor packaging products

The present invention relates to an inspection apparatus for inspecting a change in temperature (heat) of a semiconductor packaging product, and more particularly, to inspect more areas at a time, thereby improving the speed of inspection, and yet having a high accuracy of the inspection. The present invention relates to an apparatus for inspecting reverse changes in semiconductor packaging products having a simple structure and excellent economic efficiency.

The life span of the products produced or intended to be produced in the high-tech industry is now beyond the physical life of the products, and the age of the reliability and high functionality of the products determines the life of the products.

In particular, in the case of Korea, which leads the global IT industry, the semiconductor industry has successfully launched since the 1980s.

Intensive technology investment or mass production of semiconductors led by DRAM and Flash memory has been developed in parallel with fab, packaging and test processes related to semiconductor manufacturing.

The experiences of the semiconductor economy cycle going back and forth through the poles are many, and the grievances of the semiconductor companies that need to predict and cope with the future development of the market and the companies that develop and sell semiconductor materials are indescribable.

In fact, Korea is undeniably leading the semiconductor market. On the other hand, in Korea's lack of global competitiveness in semiconductor materials and equipment, the analysis and technical analysis of materials applied to packaging, a semiconductor backend process, In recent years, the industry's efforts to break down the margins have been incessant.

The development of memory technology in semiconductors is progressing toward the technology of increasing the cost-performance ratio as the density of single chips increases and the area decreases, and the speed is enormous.

Recently, with the development of portable devices, the demand for thinner semiconductor components is taken for granted, and the number of components mounted in one substrate is gradually decreasing due to the trend of high integration and light and small size.

As a result, in order to implement a chip structure having various performances on a single chip, a system in package is being developed in which multiple chips having different functions from a system on chip are stacked on a single package substrate or a single single package is stacked on a single package. This SIP (System in package) technology is an extension of the multi chip module technology to be a small multi chip module (MMC) that has a special function by mounting a number of chips and passive devices.

Especially, Stack-CSP, a representative SIP, is used in PDAs, mobile phones, and the like as portable digital home appliances to maximize the efficiency of packages by increasing the stacking density in the thickness direction through thin chip or thin package stacking.

The chips used in this case are flash, SRAM, DRAM, analog devices, logic devices, DSPs, etc., which reduce the size and weight of portable electronic devices and provide low-cost mounting technology in product-to-performance ratio.

Examples of SIP use include combinations of DSP-SRAM-Flash, combinations of ASIC or ASSP-memory, graphic-memory, etc., especially -RF / Wireless communication, flash memory cards, image sensors for networking and computing camera modules. It is mainly applied to the field.

The advantage of this package is that the development period is short and it can be manufactured at low cost. The disadvantage is that the management of final yield is important because one of the many chips must discard other normal chips in case of abnormality during mounting.

Another important advantage of SIP is that it can use different types of semiconductor chips. That is, heterogeneous chips, such as Silicon, GaAs, Ge, and SiGe, which are difficult to implement on one chip, can be bundled into one package.

SOC (System On Chip) is a high-performance product, which is advantageous for products with long life cycles, and SIP is advantageous for products with short life cycles, such as digital appliances such as mobile phones and PDAs.

In order to solve this problem, semiconductor chip makers will ultimately find a way to solve the problem with One-Chip, and SIP, which can be quickly responded and transformed by assembly makers or field customers, will be a good alternative. In other words, although SOC is the ultimate goal, it is clear that the current trend is SIP.

Stack-CSP, a SIP mainly used in mobile phones, has various interfaces such as chip to chip and chip to substrate chip to wire-bond in terms of materials.In addition, stress concentration is intensified compared to single chip, resulting in Moisture Resistance Test and Temperature Cycling Test. This can cause problems with package reliability. Moreover, the high temperature soldering process by applying eco-friendly materials can exacerbate the reliability problem, and this problem can be solved by optimization of package design or material optimization.

As mentioned above, the semiconductor packaging company must package the chip made by the chip manufacturer's intention with materials that do not affect reliability or minimize the reliability even with changes in moisture resistance and thermal characteristics. will be.

In other words, by accurately analyzing the physical characteristics of semiconductor packaging products, it is important to improve the reliability of the product and to function as a product with a life expectancy.

The present invention examines the product change (warp-age) due to the thermal change among the physical characteristics factors that influence the lifetime and performance of the semiconductor packaging product, and allows the developer of the semiconductor packaging product to make a thermal change. The present invention relates to a thermal change inspection device for semiconductor packaging products that helps to produce a higher quality semiconductor packaging product using less material.

Among the physical characteristic factors that determine the lifetime and performance of semiconductor packaging products, US Pat. No. 5,601,364 "Thermal change inspection apparatus is a conventional technique for inspecting product changes (warp-age) due to thermal changes. (Method and apparatus for measuring thermal warpage) ".

1 is a view conceptually showing a technique according to the "thermal change inspection apparatus" of the US Patent No. 5,601,364,

Heating chamber (Thermal Enclosure) that can control the temperature by the built-in heater (Heating Element),

Grating with adjustable distance,

A light source that illuminates the specimen through a grid to form an interference fringe (shadow moire fringes) on the specimen,

It comprises a camera (Camera) for photographing the interference fringe formed on the surface of the specimen.

The "thermal change inspection apparatus" of the U.S. Patent No. 5,601,364 is a method of measuring the deformation caused by the heat by moving the test object in the vertical direction, and the fringe pattern of the grid pattern of the grid and the light from the light source according to the position change of the test object. Differences are generated and three or more phases artificially create a three-dimensional image of the curvature of the specimen microsurfaces. In other words, the thermal changes of the specimen are examined by evaluating images of the interference fringes photographed in relation to the temperature of the specimen.

In US Pat. No. 5,601,364, the " thermal change inspection device " requires that the specimen is placed in a plane while the light source is positioned at an angle of 45 degrees. This is because of the characteristics of the system where Moire measures the phase due to interference of light adjacent to each other, and it is possible to express the change of the interference fringe in 3D shape by using a specific technique called phase shift technology, which is one of the representative methods of 3D image processing technology. One.

Although the "thermal change inspection apparatus" of US Patent No. 5,601,364 is currently recognized as the most competitive inspection apparatus, there are the following problems.

First, the light source should be installed at about 45, and the third phase shift must be measured, and the accuracy of the inspection is determined by the grating density (basically 40 to 200 line / inch). There is a limit to secure the accuracy of the system, so additional equipment is needed to increase the accuracy of the inspection, and the additional equipment to increase the precision is expensive (about 300 million won in Hanwha).

Next, strong white light (100 Watts) should be used to recognize a black product due to the characteristics of a package (ie, an inspection body; a semiconductor packaging product).

In addition, there is a disadvantage that the action of the white light source is canceled by the semiconductor package compound, which requires the additional work of applying white spray to the package for the smooth measurement of white light.

In addition, it is difficult to process and maintain grating, so extra maintenance cost is consumed to reliably manage measurement accuracy of equipment.

In addition, it is difficult to process three or more disparity images instantaneously, so that the measurement time is relatively long (seconds) and the vibration is not suitable for the measurement of moving objects over time.

The present invention has been made in order to solve the problem of the thermal change inspection apparatus of the semiconductor packaging products according to the prior art as described above, the inspection of a larger area in one inspection is excellent in the quickness of inspection, multi-focus A beam is provided with a focus reinforcing plate having pinholes through which each beam passes, and an object of the present invention is to provide a thermal change inspection device for semiconductor packaging products that has excellent inspection accuracy and a simple structure, and is highly competitive. The purpose of the present invention is to provide an apparatus for inspecting thermal changes in semiconductor packaging products by allowing a developer of a product to use a material having excellent physical properties so that the life of the semiconductor packaging product is determined by the functional life of the semiconductor product rather than the physical life. do.

The thermal change inspection apparatus of the semiconductor packaging product according to the present invention for achieving the above object

Heating means for causing a thermal change in the semiconductor packaging product;

Lifting means for lifting up and down the semiconductor packaging product;

Light irradiator;

A multi-lens array module for converting light incident from the light irradiator into a multifocal beam to irradiate the semiconductor packaging product;

And a camera forming an image with a multifocal beam reflected from the semiconductor packaging product.

And a focus reinforcing plate having a plurality of pinholes through which the multifocal beam emitted from the multilens array module and the multifocal beam reflected from the semiconductor packaging product pass.

The heating means

With a transparent chamber,

A heater for heating the inside of the transparent chamber;

And an intake fan and an exhaust fan that intake and exhaust air in and out of the transparent chamber,

The lifting means is

A support plate provided inside the transparent chamber and supporting the semiconductor packaging product;

A lifting rod connected to the support plate and penetrating the transparent chamber;

A driving member for elevating the elevating rod;

It characterized in that it comprises a guide member for guiding the lifting of the elevating rod.

The thermal change inspection apparatus of the semiconductor packaging product according to the present invention having such a configuration has a larger area of focus beams, which are media for inspecting thermal changes of the test body (ie, semiconductor packaging product) in the present invention through the multi-lens array module. The inspection of the large area is performed at the same time, so that the inspection can be carried out at the same time, and the inspection speed is excellent. In other words, it is a very useful invention for industrial development as a thermal change inspection apparatus for semiconductor packaging products having high inspection precision, simple overall structure, low manufacturing cost, and excellent price competitiveness.

1 is a technical conceptual diagram of a moiré method of thermal change inspection apparatus according to the prior art.
2 is a block diagram of a thermal change inspection apparatus of a semiconductor packaging product according to the present invention.

Hereinafter, a thermal change inspection apparatus of a semiconductor packaging product according to the present invention will be described in more detail with reference to the accompanying drawings.

Before describing the present invention in more detail,

The present invention may be modified in various ways and may have various forms, and thus embodiments (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to the specific form disclosed, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

In the drawings, the same reference numerals are used for the same reference numerals, and in particular, the numerals of the tens and the digits of the digits, the digits of the tens, the digits of the digits and the alphabets are the same, Members referred to by reference numerals can be identified as members corresponding to these standards.

In addition, in the drawings, the components are exaggerated in size (or thickness), in size (or thickness), in size (or thickness), or in a simplified form or simplified in view of convenience of understanding. It should not be.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the term " comprising " or " consisting of ", or the like, refers to the presence of a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

As shown in FIG. 2, the apparatus for inspecting thermal changes of a semiconductor packaging product according to the present invention includes a heating means 10, a lifting means 20, a light irradiator 30, a multi-lens array module 40, and a camera 50. , The focus reinforcing plate 60, the controller 70 and the like.

The heating means 10 is a means for heating the test body P, that is, the semiconductor packaged product to a temperature necessary for the inspection.

The heating means 10

A transparent chamber 11 having a test body P embedded therein and allowing a multi-focus beam for inspection to be transmitted and irradiated to the test body P, and the light reflected and irradiated is transmitted again to be incident to the camera 50. )Wow,

A heater 13 for heating the inside of the transparent chamber 11,

It includes an intake fan 15 and an exhaust fan 17 to intake and exhaust air inside and outside to adjust the temperature inside the transparent chamber 11.

The transparent chamber 11 should be transparent to the top surface through which the multi focus beam is transmitted, but need not be transparent to the side and bottom surfaces. However, it may be preferable that the side (which may include the bottom surface) is also transparent so that the user can observe the inside.

The heater 13 preferably heats the entire inside of the transparent chamber 11 to a uniform temperature so that a specific part of the test body P does not have a different temperature from another part. For this purpose, the heater 13 is It is preferable to be spaced apart from the test object (P).

The intake fan 15 and the exhaust fan 17 are intended to inspect another specimen P after the inspection of the specimen P is completed, or after the inspection of a specific region of the specimen P. When inspecting other areas of the specimen P, it will be mainly used to cool the transparent chamber 11 so that the specimen P can be replaced or the position of the specimen P can be changed. It may be used to control the temperature inside the transparent chamber 11 quickly and precisely.

The lifting means 20 lifts or lowers the test object P, such that each of the multi-focus beams incident on the test object P is reflected in intensity and direction according to the lifting position of the test object P.

Light reflected in a direction different from the incident direction is blocked by the focus reinforcing plate 60 and is not transmitted to the camera 50, and light reflected in the same direction as the incident direction is transmitted to the camera 50. The transmitted light is incident on the camera 50 and its intensity varies depending on the position, and the fine shape of the surface of the test object P is inspected through the intensity of the light depending on the position.

The lifting means 20 is

A support plate 21 provided inside the transparent chamber 11 and supporting an inspection body P (that is, a semiconductor packaging product) mounted thereon;

A lifting rod 23 connected to a lower portion of the support plate 21 and penetrating the transparent chamber 11;

A driving member 25 for elevating and elevating the elevating rod 23;

It includes a guide member 27 for guiding the lifting rod 23 to be raised and lowered stably without inclination.

The support plate 21 and the elevating rod 23 disposed inside the transparent chamber 11 are heat resistant and are not affected by the temperature of the inside of the transparent chamber 11, that is, the ceramic material does not have deformation due to temperature. It is preferable to use.

The driving member 25 includes a fixed block 251 to which the lifting rod 23 is fixed, a screw block 253 for lifting up and down the fixed block 251 in a screw manner, and the screw block in a rotational motion. And a motor 255 for raising and lowering 253.

The guide member 27 includes a connection bar 271 connected to the fixed block 251 of the driving member 25, and a guide block 273 for guiding slides of both sides of the connection bar 271. .

Although not shown in the drawings, the clearance of the elevating rod 23 is smoothly minimized at the penetrating portion of the transparent chamber 11 through which the elevating rod 23 penetrates. It may be desirable to be provided with a ceramic wool to be made.

The light irradiator 30 generates and irradiates light that serves as a medium for inspecting deformation of the test object P.

The light (light) of the light irradiator 30 preferably uses a laser beam having a high linearity and high energy density.

In front of the light irradiator 30 is a diffusion lens 31 for diffusing a laser beam output from the light irradiator 30 and parallel to induce a laser beam incident from the diffuse lens 31 to diverge in parallel The induction lens 33 is disposed.

The multi-lens array module 40 focuses the light (that is, the laser beam) that is output from the light irradiator 30 so that the focus beam (that is, the focused laser beam) is irradiated onto the surface of the test object P. do. That is, the laser beam incident in parallel through the parallel induction lens 33 is focused so that the focus beam is output.

At this time, only one focus beam is output, and a plurality of focus beams are simultaneously output. That is, the laser beam that is guided in parallel and incident is converted into a multi-focus beam and output.

The multi-lens array module 40 has a plurality of focusing lenses 41 arranged at equal intervals for generating and outputting a multi-focus beam. Each of the focusing lenses 41 focuses and outputs a laser beam incident on it.

Although the multi-lens array module 40 irradiates a focus beam to the inspector P, the multi-lens array module 40 may pass the beam reflected from the inspector P to be irradiated to the camera 50. Pass the focus beam in the opposite direction on the extension line of the direction in which the focus beam is irradiated.

Thus, when the light irradiator 30 is disposed in a direction through which the focus beam passes, the light irradiator 30 prevents the reflected light passing through the focus beam from entering the camera 50, so that the light irradiator 30 is multi-viewed. Is disposed on the side of the lens array module 40 so as not to prevent the focus beam from entering the camera 50, the path of the laser beam output to the light irradiator 30 and the focus beam incident to the camera 50 The half mirror 80 is disposed at the intersection of the paths of the laser beams, such that the laser beam outputted to the light irradiator 30 disposed on the side surface is incident on the multi-lens array module 40 to be irradiated to the test object P. .

The half mirror 80 reflects all the laser beams output from the light irradiator 30 to be incident on the multi-lens array module 40, and is reflected from the inspection object P and is reflected by the multi-lens array module ( The focus beam incident through the 40 is bypassed as it is so as to be incident to the camera 50.

The focus reinforcing plate 60 is disposed under the multi-lens array module 40, and fine pinholes 61 are formed at each position that matches the plurality of focusing lenses 41.

The pinhole 61 passes a focus beam focused by each focusing lens 41 of the multi-lens array module 40, and a focus beam reflected by the inspection object P passes.

Only the focus beam properly focused while passing through the focusing lens 41 of the multi-lens array module 40 passes through the pinhole 61, and the focus beam (laser beam) not properly focused is focused on the reinforcement plate 60. The focal beam, which is not blocked by the light beam and is reflected in the incident direction from the focal beam reflected by the inspection object P, passes through the pinhole 61 and is reflected by the focal beam reflected in a direction different from the incident direction and transmitted. The focus beam that spreads around in the process of being blocked is not blocked by the focus reinforcing plate 60.

That is, the pinhole 61 passes only the focus beam necessary for inspecting the inspector P (that is, a focus beam properly focused and reflected in the incident direction), and the focus beam that obstructs the inspection is a focus reinforcing plate ( 60), it serves to increase the precision of the thermal change inspection of the test body (P).

A lower portion of the focus reinforcing plate 60 intersects two diffusing lenses 91 and 93 for diffusing an incident focal beam and an interfering focal beam disposed between the two diffusing lenses 91 and 93, that is, An inversion lens 95 is provided to invert an image (image) formed by the camera 50 by the focus beam. In addition to the function of inverting the image, the inversion lens 95 has a function of ensuring focus efficiently.

The camera 50 is reflected from the surface of the test object P, and receives the multi-focus beam passing through the pinhole 61 and the multi-lens array module 40 so that an image (image) corresponding thereto is photographed.

The camera 50 is an image element 51 formed by an incident light (that is, a multi focus beam) and a laser beam (that is, a focus beam) that is output to the light irradiator 30 and reflected from the inspection object P. A filter 59 for blocking light other than), two focus lenses 53 and 55 for forming a clear image on the image element 51 through the focus beam passing through the filter 59, and the two focal points. And a shutter 59 interposed between the lenses 53 and 55.

The controller 70 controls the light irradiator 30, the heating means 10, and the elevating means 20, and obtains information about an image from the image element 51 of the camera 50. The figure shows the change according to the temperature of the test body P.

In more detail, the controller 70 inspects the thermal change of the test object P. Then, the controller 70 causes the laser beam to be output from the light irradiator 30 or stops the output. At 10, the driving of the heater 13, the intake fan 15, and the exhaust fan 17 is controlled such that the temperature inside the transparent chamber 11 becomes a temperature according to the inspection, and the temperature in the transparent chamber 11 is controlled. Reaches the temperature required for inspection and controls the driving of the motor 255 of the elevating means 20 in a state in which the laser beam is output from the light irradiator 30, so that the test object P is gradually stepped up or down. To lower (e.g., lift or lower by 1um),

And the controller 70 changes the temperature according to the temperature of the test object P by using a signal for each of the multi-focus beams transmitted by the image element 51 whenever the test object P moves up or down step by step. Plot the information.

In more detail, the image element 51 converts each incident multi-focus beam into a digital signal according to its intensity so that the frame P is one frame at every moment of stepping up or down. After transmitting to the controller 70, the controller 70 stores the frames of every moment transmitted by the image element 51, and then extracts and extracts the frames with the strongest digital signal in each matching pixel of the frames. Synthesized the pixels to create a new frame.

In other words, each pixel of the frame corresponds one-to-one to each of the multi-focus beams, and the lifting or lowering of the inspection object P corresponding to the time when the intensity is strongest for each of the multi-focus beams incident on the camera 50 is increased. When the positional information is collected and synthesized into one frame, the information about the height (memory) of the surface of the test object P can be plotted and obtained. For reference, when the intensity of the focus beam incident on the camera 50 is the strongest, the focus beam of the focus beam is exactly coincident with the surface of the inspection object P. As the inspection object P moves out of or in the focal position of the focus beam, Its strength is weakened.

The controller 70 generates and provides frames for the newly reconstructed multi-focus beam for each temperature according to the inspection, so that the inspector can observe the change of the specimen P (ie, a semiconductor packaging product) according to the temperature. Make sure you understand.

In the above description of the present invention has been described with respect to the thermal change inspection apparatus of a semiconductor packaging product having a specific shape and structure with reference to the accompanying drawings, the present invention can be variously modified and changed by those skilled in the art, such variations and modifications Should be construed as falling within the protection scope of the present invention.

10: heating means
11: transparent chamber 13: heater
15: intake fan 17: exhaust fan
20: lifting means
21: support plate 23: lifting rod
25 drive member 27 guide member
30: light irradiator
31 Diffusion Lens 33 Parallel Induction Lens
40: multi lens array module 41: focusing lens
50: camera
51: image elements 53, 55: focus lens
57: shutter 59: filter
60: focus reinforcement plate 61: pinhole
70: controller
80: half mirror

Claims (4)

Heating means for causing a thermal change in the semiconductor packaging product;
Lifting means for lifting up and down the semiconductor packaging product;
Light irradiator;
A multi-lens array module for converting light incident from the light irradiator into a multi-focus beam and irradiating the semiconductor packaging product;
And a camera forming an image with a multi-focus beam reflected from the semiconductor packaging product. The method of claim 1,
And a focus reinforcing plate having a plurality of pinholes through which the multi-focus beam emitted from the multi-lens array module and the multi-focus beam reflected from the semiconductor packaging product pass. . 3. The method according to claim 1 or 2,
The heating means
A transparent chamber in which the semiconductor packaging product is embedded;
A heater for heating the inside of the transparent chamber;
And an intake fan and an exhaust fan for inhaling and exhausting air in and out of the transparent chamber. The method of claim 3, wherein
The rising /
A support plate provided inside the transparent chamber and supporting the semiconductor packaging product;
A lifting rod connected to the support plate and penetrating the transparent chamber;
A driving member for elevating the elevating rod;
And a guide member for guiding the lifting and lowering of the lifting rod.

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